Chip packaging module

Abstract

The utility model relates to the technical field of semiconductors, and provides a chip packaging module, which comprises a substrate, a plastic packaging layer, an electronic component and a radiating fin, the electronic component is arranged on the substrate, the plastic packaging layer is positioned on the surface of one side of the substrate, which is provided with the electronic component, and the radiating fin is arranged on the plastic packaging layer. The plastic packaging layer is arranged on the substrate, the plastic packaging layer is located at the position, where the electronic component is not installed, of the substrate, the cooling fin covers the electronic component and the plastic packaging layer, and the cooling fin is connected with the plastic packaging layer and is in heat conduction connection with the electronic component; according to the utility model, the radiating fins can be effectively prevented from crushing elements of electronic components or generating conductive faults with the elements, so that the packaging quality of the chip packaging module is improved; the radiating fins are in contact connection with the electronic component, so that heat generated in the working process of the electronic component is effectively and quickly diffused out, and the radiating effect on the electronic component is achieved.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductors, and in particular to a chip packaging module. Background Art

[0002] Chip packaging modules such as system-level packaging (SIP packaging for short) integrate multiple functional wafers such as processors and memories into one package based on application scenarios, number of packaging substrate layers and other factors to form a single standard package that can achieve certain functions.

[0003] Among them, the chip packaging module mainly includes a substrate, a heat sink cover and electronic components. The electronic components are fixedly connected to the substrate. The heat sink cover includes an integrated heat sink and supporting feet. The supporting feet are arranged at the bottom edge of the heat sink. The supporting feet are connected to the substrate. The heat sink is located above the electronic components such as the chip and is in contact with the top of the chip for dissipating heat to the chip.

[0004] However, since the heat dissipation cover is made of a metal material with conductive properties, when components and cables of electronic components are arranged in the area on the substrate connected to the metal support feet, the metal support feet can easily crush the components and cables, or cause conductive failures with the components, thereby affecting the packaging quality of the chip packaging module. Utility Model Content

[0005] The problem solved by the utility model is how to improve the packaging quality of the radiator and the electronic components in the chip packaging module.

[0006] To solve the above problems, the utility model provides a chip packaging module, comprising a substrate, a plastic sealing layer, electronic components and a heat sink, wherein the electronic components are mounted on the substrate, the plastic sealing layer is located on a side surface of the substrate on which the electronic components are arranged, and the plastic sealing layer is located at a position on the substrate where the electronic components are not mounted, the heat sink covers the electronic components and the plastic sealing layer, and the heat sink is connected to the plastic sealing layer and is thermally connected to the electronic components.

[0007] Optionally, the height of the plastic packaging layer is consistent with the height of the highest point of the electronic component.

[0008] Optionally, the chip packaging module further includes a first heat dissipation adhesive and a third heat dissipation adhesive, the electronic component includes a first chip and a second chip, the height of the second chip is less than the height of the first chip; the first heat dissipation adhesive is arranged on a side of the first chip away from the substrate, the third heat dissipation adhesive is arranged on a side of the plastic packaging layer away from the substrate, and the surfaces of the first heat dissipation adhesive and the third heat dissipation adhesive on a side away from the substrate are flush and both are in contact with and connected to the heat sink;

[0009] The chip packaging module further includes a second heat dissipation adhesive, which is disposed between the second chip and the heat sink; and / or the chip packaging module further includes a thermally conductive pad, which is disposed between the second chip and the heat sink.

[0010] Optionally, the chip packaging module further includes a fixing glue, and the fixing glue is arranged between the plastic packaging layer and the substrate.

[0011] Optionally, the chip packaging module further includes a conductive adhesive layer, and the conductive adhesive layer is arranged between the electronic component and the substrate.

[0012] Optionally, the conductive adhesive layer is solder paste or thermal conductive glue.

[0013] Optionally, the plastic encapsulation layer covers an edge of the substrate.

[0014] Optionally, the edge of the heat sink is aligned with the outer edge of the plastic packaging layer.

[0015] Optionally, a fin structure is provided on a side of the heat sink away from the substrate.

[0016] Optionally, the chip packaging module further includes a cable, wherein the cable is electrically connected to the electronic component, and at least a portion of the cable is located between the plastic packaging layer and the substrate.

[0017] Compared with the prior art, the chip packaging module of the utility model mainly includes a substrate, a plastic layer, electronic components and a heat sink, wherein the substrate provides an installation foundation for the installation of the electronic components, the plastic layer is located on a side surface of the substrate where the electronic components are arranged, and the plastic layer is located at a position on the substrate where the electronic components are not installed, when the heat sink is installed above the substrate, the heat sink is connected to the plastic layer, so as to support the heat sink from below through the plastic layer, in other words, the plastic layer is equivalent to the support foot of the heat sink at this time, so as to prevent the heat sink from crushing the electronic components; specifically, when the electronic components are arranged in the area connected to the plastic layer on the substrate, the plastic layer replacing the support foot of the radiator of the prior art can effectively prevent the heat sink from crushing the components and cables of the electronic components, or generating conductive faults with the components, so as to improve the packaging quality of the chip packaging module. The heat sink is thermally connected to the electronic components through the heat sink, so as to effectively and quickly diffuse the heat generated during the operation of the electronic components, so as to achieve the heat dissipation effect on the electronic components. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 It is a structural schematic diagram of a chip packaging module in the prior art;

[0019] Figure 2This is one of the structural schematic diagrams of the chip packaging module in the embodiment of the utility model;

[0020] Figure 3 This is one of the partial structural schematic diagrams of the chip packaging module in the embodiment of the utility model;

[0021] Figure 4 This is the second partial structural diagram of the chip packaging module in the embodiment of the utility model;

[0022] Figure 5 This is the second structural schematic diagram of the chip packaging module in the embodiment of the utility model.

[0023] Description of reference numerals:

[0024] 1'-base plate; 2'-heat dissipation cover; 21'-heat sink; 22'-supporting feet; 3'-electronic components;

[0025] 1-substrate; 2-plastic sealing layer; 3-electronic components; 31-first chip; 32-second chip; 4-heat sink; 5-first heat dissipation glue; 6-second heat dissipation glue; 7-third heat dissipation glue; 8-fixing glue; 9-conductive adhesive layer; 10-injection mold. DETAILED DESCRIPTION

[0026] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and understandable, the specific embodiments of the present invention are described in detail below with reference to the accompanying drawings.

[0027] It should be noted that in the coordinate system XZ provided herein, the positive direction of the X axis represents the right, the reverse direction of the X axis represents the left, the positive direction of the Z axis represents the top, and the reverse direction of the Z axis represents the bottom. At the same time, it should be noted that the terms "first", "second", etc. in the specification and claims of the utility model and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence. It should be understood that the data used in this way can be interchanged where appropriate, so that the embodiments of the utility model described herein can be implemented in an order other than those illustrated or described herein.

[0028] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "set", "install", "connect", and "connect" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0029] In the description of this specification, the description with reference to the terms "embodiment", "one embodiment" and "one implementation" etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or implementation are included in at least one embodiment or implementation of the utility model. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or implementation. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or implementations in a suitable manner.

[0030] Chip packaging modules such as system-level packaging (SIP packaging for short) integrate multiple functional wafers such as processors and memories into one package based on application scenarios, number of packaging substrate layers and other factors to form a single standard package that can achieve certain functions.

[0031] Among them, combined Figure 1 As shown, the chip packaging module mainly includes a substrate 1', a heat dissipation cover 2' and an electronic component 3'. The electronic component 3' is fixedly connected to the substrate 1'. The heat dissipation cover 2' includes a heat sink 21' and supporting feet 22' of an integrated structure. The supporting feet 22' are arranged at the bottom edge of the heat sink 21'. The supporting feet 22' are connected to the substrate 1'. The heat sink 21' is located above the electronic component 3', such as a chip, and is in contact with the top of the chip for dissipating heat from the chip.

[0032] However, since the heat dissipation cover 2' is made of a metal material with conductive properties, when components and cables of the electronic components 3' are arranged in the area on the substrate 1' connected to the metal support feet 22', the metal support feet 22' may easily crush the components and cables, or cause conductive failures with the components, thereby affecting the packaging quality of the chip packaging module.

[0033] In order to solve the above technical problems, Figure 2 As shown, an embodiment of the utility model provides a chip packaging module, including a substrate 1, a plastic sealing layer 2, electronic components 3 and a heat sink 4, wherein the electronic components 3 are installed on the substrate 1, the plastic sealing layer 2 is located on a side surface of the substrate 1 on which the electronic components 3 are arranged, and the plastic sealing layer 2 is located at a position on the substrate 1 where the electronic components 3 are not installed, the heat sink 4 covers the electronic components 3 and the plastic sealing layer 2, and the heat sink 4 is connected to the plastic sealing layer 2, and is thermally connected to the electronic components 3.

[0034] It should be noted that the plastic sealing layer 2 can be a plastic sealing material, a heat conductive adhesive or other adhesive with bonding and curing properties, which is not specifically limited here. The heat sink 4 is used to dissipate heat from the electronic components 3. The thermal connection can be direct contact or bonding by means of a heat conductive adhesive, a heat dissipation adhesive or the like. Figure 2The positive direction of the Z axis of the coordinate system is above the substrate 1. Figure 2 The upward direction of the Z-axis of the central coordinate system is the bottom of the substrate 1 .

[0035] The chip packaging module of this embodiment mainly includes a substrate 1, a plastic sealing layer 2, electronic components 3 and a heat sink 4, wherein the substrate 1 provides an installation basis for the installation of the electronic components 3, and the plastic sealing layer 2 covers a side surface of the substrate 1 on which the electronic components 3 are arranged, and the plastic sealing layer 2 is located at a position on the substrate 1 where the electronic components 3 are not installed. When the heat sink 4 is installed above the substrate 1, the heat sink is connected to the plastic sealing layer 2 so as to support the heat sink 4 from below through the plastic sealing layer 2. In other words, at this time, the plastic sealing layer 2 is equivalent to the support foot of the heat sink 4 to prevent the heat sink 4 from crushing the electronic components 3; specifically, when the electronic components 3 are arranged in the area connected to the plastic sealing layer 2 on the substrate 1, the plastic sealing layer 2 replacing the support foot of the radiator in the prior art can effectively prevent the heat sink 4 from crushing the components and cables of the electronic components 3, or causing conductive faults with the components, so as to improve the packaging quality of the chip packaging module. The heat sink 4 is thermally connected to the electronic component 3 , so that the heat generated by the electronic component 3 during operation can be effectively and quickly diffused to achieve a heat dissipation effect on the electronic component 3 .

[0036] In one embodiment of the present invention, Figure 3 As shown, the electronic component 3 includes a first chip 31 , and the height of the first chip 31 matches that of the plastic packaging layer 2 .

[0037] It should be noted that the plastic sealing layer 2 is used to support the heat sink 4. The height of the plastic sealing layer 2 is consistent with the highest point height of the electronic component 3, which can ensure the flatness of the heat sink 4 and avoid the heat sink 4 being partially concave or convex due to the plastic sealing layer 2 being too high or too low.

[0038] "Height consistency" means that the heights are roughly the same, and a certain error can be allowed.

[0039] For example, the electronic component 3 includes a first chip 31. Since the height of the first chip 31 matches that of the plastic packaging layer 2, when the heat sink 4 is installed above the substrate 1, the plastic packaging layer 2 supports the heat sink 4 from the bottom edge of the heat sink 4, and the first chip 31 is in or basically in the middle area of ​​the substrate 1, so that the first chip 31 supports the heat sink 4 from the bottom middle area of ​​the heat sink 4, thereby not only achieving stable installation of the heat sink 4, but also preventing the heat sink 4 from deforming and bending downward or upward, so as to further improve the packaging quality of the chip packaging module.

[0040] Combination Figure 4As shown, the plastic encapsulation layer 2 can be arranged on the surface of the substrate 1 having the electronic components 3 in the following manner. For example, an injection mold 10 can be placed on the edges around the substrate 1, and then glue is injected into the injection mold 10, and the injection height of the glue can be controlled to be about 50um. Then, a plastic encapsulation material with a curing property is injected into the injection mold 10 so that the height of the plastic encapsulation material is level with the highest point of the first chip 31. After the plastic encapsulation material is cured to form the plastic encapsulation layer 2, the plastic encapsulation material and glue can be placed in an oven for pressurization and heating for curing, and then the injection molds 10 around them are removed.

[0041] In one embodiment of the present invention, Figure 4 As shown, the chip packaging module further includes a first heat dissipation adhesive 5 and a third heat dissipation adhesive 7, the electronic component 3 includes a first chip 31 and a second chip 32, and the height of the second chip 32 is less than the height of the first chip 31;

[0042] The first heat dissipation adhesive 5 is arranged on a side of the first chip 31 away from the substrate 1, and the third heat dissipation adhesive 7 is arranged on a side of the plastic packaging layer 2 away from the substrate 1. The surfaces of the first heat dissipation adhesive 5 and the third heat dissipation adhesive 7 away from the substrate 1 are flush and both are in contact with and connected to the heat sink 4.

[0043] The chip packaging module further includes a second heat dissipation adhesive 6 , which is disposed between the second chip 32 and the heat sink 4 ; and / or the chip packaging module further includes a thermally conductive pad, which is disposed between the second chip 32 and the heat sink 4 .

[0044] It should be noted that, according to the design requirements of the chip, the electronic component 3 may include at least one first chip 31 and at least one second chip 32, wherein the chip with the highest height in the electronic component 3 is defined as the first chip 31, and the others with heights smaller than the first chip 31 are defined as second chips 32, so the number of second chips 32 can be at least one, and the heights of multiple second chips 32 can be different or equal.

[0045] Taking the installation of electronic components 3 on the top of substrate 1 as an example, the first chip 31 can be arranged in the middle area above substrate 1, and at least one second chip 32 can be arranged around the outside of the first chip 31; when the first chip 31 and the second chip 32 are installed on substrate 1, a first heat dissipation adhesive 5 can be arranged above the first chip 31, and a third heat dissipation adhesive 7 can be arranged above the plastic layer 2, and the first heat dissipation adhesive 5 and the third heat dissipation adhesive 7 are flush with the side surface away from the substrate 1, that is, the upper surface, so that when the heat sink 4 is installed on the top of substrate 1, the first chip 31 is in close contact with the bottom of the heat sink 4 through the first heat dissipation adhesive 5 and the plastic layer 2 through the third heat dissipation adhesive 7, which is equivalent to increasing the contact area with the heat sink 4 to improve the connection stability of the heat sink 4 installed on the plastic layer 2, and also improve the heat dissipation effect of the first chip 31 and the second chip 32. Among them, the first heat dissipation adhesive 5 and the third heat dissipation adhesive 7 can be adhesives made of thermal conductive interface materials.

[0046] The second chip 32 can be thermally connected to the heat sink 4 in the following three ways. For example, in the first way, a second heat dissipation adhesive 6 is set between the second chip 32 and the heat sink 4 above; in the second way, a thermal pad is set between the second chip 32 and the heat sink 4 above. Since the height of the second chip 32 is different, the number of the thermal pad can be one or more. The number of thermal pads can be reasonably selected according to the second chips 32 of different heights and the spacing between the second chip 32 and the heat sink 4; in the third way, a second heat dissipation adhesive 6 and a thermal pad can be set between the second chip 32 and the heat sink 4 above, wherein the positional relationship between the second heat dissipation adhesive 6 and the thermal pad as well as the number and height of each can be flexibly arranged according to the design process of the chip, and no specific limitation is made here. Through the above three ways, the heat of the second chip 32 can be quickly transferred to the heat sink 4, thereby achieving the heat dissipation operation of the second chip 32.

[0047] In addition, in the second and third modes, the thermal pad can not only provide good heat dissipation for the second chip 32, but also provide better support for the heat sink 4 from below. The thermal pad can be a bump or pad structure with good thermal conductivity, which is not specifically limited here.

[0048] In one embodiment of the present invention, Figure 5 As shown, the chip packaging module further includes a fixing glue 8 , and the fixing glue 8 is arranged between the plastic packaging layer 2 and the substrate 1 .

[0049] It should be noted that by providing a fixing glue 8 between the plastic encapsulation layer 2 and the substrate 1, the connection stability between the plastic encapsulation layer 2 and the substrate 1 can be strengthened by the fixing glue 8 to prevent the plastic encapsulation layer 2 from separating from the substrate 1; wherein the fixing glue 8 can be various colloids with adhesive properties.

[0050] In addition, if the encapsulation material forming the encapsulation layer 2 has adhesive properties, the fixing glue 8 does not need to be added between the encapsulation layer 2 and the substrate 1. Therefore, the fixing glue 8 can be selectively set between the encapsulation layer 2 and the substrate 1 according to whether the encapsulation layer 2 has adhesive properties.

[0051] In one embodiment of the present invention, Figure 5 As shown, the chip packaging module further includes a conductive adhesive layer 9 , which is disposed between the electronic component 3 and the substrate 1 .

[0052] It should be noted that, by providing a conductive adhesive layer 9 between the electronic component 3, such as the first chip 31, and the substrate 1, when the electronic component 3 is soldered to the substrate 1 by soldering, the conductive adhesive layer 9 is first melted and then cooled and solidified to form a solder joint between the electronic component 3 and the substrate 1, thereby realizing stable soldering of the electronic component 3 to the substrate 1; in addition, the conductive adhesive layer 9 is in the same plane on the surface away from the substrate 1, and when the electronic component 3 is soldered to the substrate 1 through the conductive adhesive layer 9, the bottoms of the multiple chips or elements in the electronic component 3 are in a horizontal state, so as to ensure the installation quality of the electronic component 3. Similarly, the second chip 32 can also be fixed to the substrate 1 through the conductive adhesive layer 9.

[0053] In one embodiment of the present invention, the conductive adhesive layer 9 is solder paste or thermal conductive glue.

[0054] It should be noted that when the conductive adhesive layer 9 is solder paste, the conductive adhesive layer 9 using solder paste can help to smoothly solder the electronic component 3 to the substrate 1; when the conductive adhesive layer 9 is conductive glue, the electronic component 3 can be bonded to the substrate 1 through the thermal conductive glue, which not only achieves the fixed installation of the electronic component 3 on the substrate 1, but also the electronic component 3 can also quickly transfer the heat generated during its own work to the substrate 1 through the thermal conductive glue, and the heat sink 4 is in contact and connected with the electronic component 3 to further improve the heat dissipation effect of the electronic component 3.

[0055] In an embodiment of the present invention, the plastic encapsulation layer 2 covers the edge of the substrate 1 .

[0056] It should be noted that the plastic encapsulation layer 2 can be covered on the substrate 1 in the following manner, for example, the surface edge of the substrate 1 having the electronic components 3. For example, if the substrate 1 has a rectangular structure on the upper surface or the lower surface, when the plastic encapsulation layer 2 is arranged on the substrate 1, the plastic encapsulation layer 2 can be distributed circumferentially around the first chip 31 and the second chip 32 in the electronic component 3, so the plastic encapsulation layer 2 can be a rectangular ring structure. When the heat sink 4 is installed on the plastic encapsulation layer 2, the heat sink 4 is connected to the plastic encapsulation layer 2 in the rectangular ring structure, so that the electronic components 3 are encapsulated circumferentially in the cavity surrounded by the heat sink 4, the plastic encapsulation layer 2 and the substrate 1, so as to realize the packaging operation of the electronic components 3.

[0057] In one embodiment of the present invention, Figures 2 to 5 As shown, the edge of the heat sink 4 is aligned with the outer edge of the plastic packaging layer 2 .

[0058] It should be noted that since the edge of the heat sink 4 is aligned with the outer edge of the plastic layer 2, wherein the outer edge of the plastic layer 2 can also be aligned with the outer edge of the substrate 1, and since the plastic layer 2 can be formed by heating and curing a fluid plastic material, the plastic layer 2 can be quickly arranged on the upper edge of the substrate 1 with the aid of the injection mold 10, so as to improve the processing efficiency of setting the plastic layer 2 on the substrate 1, and can also improve the external neatness of the chip packaging module after packaging, so as to correspondingly improve the packaging quality.

[0059] In an embodiment of the present invention, a fin structure is provided on a side of the heat sink 4 away from the substrate 1 .

[0060] It should be noted that by providing a fin structure on the side of the heat sink 4 away from the substrate 1 , for example, on the upper side, the larger contact area between the fin structure and the outside world can be utilized to further improve the heat dissipation effect on the electronic components 3 .

[0061] In an embodiment of the present invention, the electronic component 3 includes an element, the element is mounted on the substrate 1, and the plastic packaging layer 2 covers the element.

[0062] It should be noted that the electronic component 3 may include at least one element, and at least one element may be arranged at different positions on the substrate 1 according to the chip packaging design. Some elements are arranged at the edge of the upper surface of the substrate 1, for example, between the plastic layer 2 and the substrate 1. When the plastic layer 2 is arranged on the substrate 1, the plastic layer 2 can cover the element from above, or wrap the element, and the plastic layer 2 forms an integral structure with the element after curing. When the plastic encapsulation material forms a solid plastic encapsulation layer 2 after heating and curing, the heat sink 4 is installed on the upper part of the plastic encapsulation layer 2. At this time, the plastic encapsulation layer 2 can support the heat sink 4 from the bottom. In other words, the heat sink 4 will not directly contact the element, thereby not only preventing the heat sink 4 from crushing the element of the electronic component 3, but also because the plastic encapsulation layer 2 is formed by heating and curing the plastic encapsulation material, the plastic encapsulation layer 2 has insulating properties, so that the plastic encapsulation layer 2 and the heat sink 4 will not cause conductive failures with the element, further improving the packaging quality of the chip packaging mold.

[0063] The element, the first chip 31 and the second chip 32 are all components of the electronic component 3 . The element may be an electronic element such as a resistor or a capacitor, which is not specifically limited here.

[0064] In an embodiment of the present invention, the chip packaging module further includes a cable, the cable is electrically connected to the electronic component 3 , and at least a portion of the cable is located on a side of the plastic packaging layer 2 facing the substrate 1 .

[0065] It should be noted that in the related art, the cables connected to the electronic components 3 may extend toward the edge of the chip. In other words, according to design requirements, some of the above cables may be arranged at the support feet of the radiator. When the radiator is installed on the substrate, the support feet of the radiator will crush the cables. At this time, the size of the entire substrate must be increased, thereby correspondingly increasing the size of the entire chip packaging module, causing an increase in manufacturing cost; therefore, in the present application, the electronic components 3 are arranged on the upper part of the substrate 1 as an example for explanation, by arranging at least part of the cable on the side of the plastic layer 2 facing the substrate 1, for example, the entire cable can be below the plastic layer 2, or part of the cable is below the plastic layer 2, or the plastic layer 2 is wrapped around part of the cable, so that the plastic layer 2 and the cable below it are solidified into an integral structure, thereby not only ensuring the normal arrangement of the cable at the upper edge of the substrate 1, but also preventing the cable from being crushed by the heat sink 4, and there is no need to increase the size of the substrate 1, thereby correspondingly reducing the manufacturing cost of the entire chip packaging module.

[0066] The cable includes a cable connected to the first chip 31 , the second chip 32 and at least one element in the electronic component 3 .

[0067] Although the utility model is disclosed as above, the protection scope of the utility model is not limited thereto. Those skilled in the art may make various changes and modifications without departing from the spirit and scope of the utility model, and these changes and modifications will fall within the protection scope of the utility model.

Claims

1. A chip packaging module, characterized in that: The invention comprises a substrate (1), a plastic sealing layer (2), an electronic component (3) and a heat sink (4), wherein the electronic component (3) is mounted on the substrate (1), the plastic sealing layer (2) is located on a side surface of the substrate (1) on which the electronic component (3) is arranged, and the plastic sealing layer (2) is located at a position on the substrate (1) where the electronic component (3) is not mounted, the heat sink (4) covers the electronic component (3) and the plastic sealing layer (2), and the heat sink (4) is connected to the plastic sealing layer (2) and is thermally connected to the electronic component (3).

2. The chip packaging module according to claim 1, characterized in that: The height of the plastic sealing layer (2) is consistent with the height of the highest point of the electronic component (3).

3. The chip packaging module according to claim 2, characterized in that: It also comprises a first heat dissipation adhesive (5) and a third heat dissipation adhesive (7); the electronic component (3) comprises a first chip (31) and a second chip (32); the height of the second chip (32) is less than the height of the first chip (31); the first heat dissipation adhesive (5) is arranged on a side of the first chip (31) away from the substrate (1); the third heat dissipation adhesive (7) is arranged on a side of the plastic sealing layer (2) away from the substrate (1); the surfaces of the first heat dissipation adhesive (5) and the third heat dissipation adhesive (7) on a side away from the substrate (1) are flush and both are in contact with and connected to the heat sink (4); The chip packaging module further comprises a second heat dissipation adhesive (6), wherein the second heat dissipation adhesive (6) is arranged between the second chip (32) and the heat sink (4); and / or the chip packaging module further comprises a thermally conductive pad, wherein the thermally conductive pad is arranged between the second chip (32) and the heat sink (4).

4. The chip packaging module according to claim 1, characterized in that: It also includes a fixing glue (8), wherein the fixing glue (8) is arranged between the plastic sealing layer (2) and the substrate (1).

5. The chip packaging module according to claim 1, characterized in that: It also comprises a conductive adhesive layer (9), wherein the conductive adhesive layer (9) is arranged between the electronic component (3) and the substrate (1).

6. The chip packaging module according to claim 5, characterized in that: The conductive adhesive layer (9) is solder paste or thermally conductive glue.

7. The chip packaging module according to claim 1, characterized in that: The plastic sealing layer (2) covers the edge of the substrate (1).

8. The chip packaging module according to claim 7, characterized in that: The edge of the heat sink (4) is aligned with the outer edge of the plastic sealing layer (2).

9. The chip packaging module according to claim 1, characterized in that: A fin structure is provided on a side of the heat sink (4) away from the base plate (1).

10. The chip packaging module according to any one of claims 1 to 9, characterized in that: It also comprises a cable, the cable being electrically connected to the electronic component (3), and at least a portion of the cable being located between the plastic packaging layer (2) and the substrate (1).

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