Texturing groove

Abstract

The utility model provides a texturing groove which comprises a groove body, and a silicon wafer accommodating cavity is formed in the groove body. The liquid adding pipe assembly comprises a plurality of liquid adding pipes, the plurality of liquid adding pipes are arranged in the silicon wafer accommodating cavity at intervals, each liquid adding pipe comprises a main pipe and a plurality of branch pipes, the main pipe comprises a liquid inlet and a liquid outlet, and the plurality of branch pipes are connected with the liquid outlet; and the bubbler is arranged at the bottom of the silicon wafer accommodating cavity. Therefore, after entering the main pipe of the liquid adding pipe, the texturing liquid medicine enters the silicon wafer accommodating cavity through the plurality of branch pipes, so that the texturing liquid medicine can be quickly and uniformly dispersed in the silicon wafer accommodating cavity, the texturing liquid medicine and silicon wafers in the silicon wafer accommodating cavity are uniformly subjected to chemical reaction, and the uniformity of a textured surface is improved.

Description

Technical Field

[0001] The present application relates to the field of solar cells, and in particular, to a texturing tank. Background Art

[0002] The quality of the velvet surface of solar crystalline silicon cells is very important. The velvet surface quality includes the morphology and size uniformity of the velvet surface. The velvet surface quality not only affects light trapping, but also affects passivation and contact. The morphology of the velvet surface can be controlled by the formula of the velvet making solution, while the uniformity of the velvet surface is mainly determined by the structural design of the velvet making tank. The velvet surface uniformity produced by the velvet making tank in the related art is low. Utility Model Content

[0003] The utility model aims to solve one of the technical problems in the related art at least to a certain extent.

[0004] In one aspect of the utility model, a texturing tank is proposed, comprising: a tank body, a silicon wafer accommodating cavity is formed inside the tank body; a liquid adding tube assembly, the liquid adding tube assembly comprises a plurality of liquid adding tubes, the plurality of liquid adding tubes are arranged at intervals in the silicon wafer accommodating cavity, the liquid adding tube comprises a main tube and a plurality of branch tubes, the main tube comprises a liquid inlet and a liquid outlet, and the plurality of branch tubes are connected to the liquid outlet; a bubbler, the bubbler is arranged at the bottom of the silicon wafer accommodating cavity. Thus, after the texturing liquid enters the main tube of the liquid adding tube, it enters the silicon wafer accommodating cavity through the plurality of branch tubes, so that the texturing liquid can be quickly and evenly dispersed in the silicon wafer accommodating cavity, so that the texturing liquid and the silicon wafer in the silicon wafer accommodating cavity can react chemically evenly, thereby improving the uniformity of the velvet surface.

[0005] According to some embodiments of the present invention, the branch pipe includes a first branch pipe and a second branch pipe, and the first branch pipe and the second branch pipe are arranged on both sides of the extension direction of the main pipe.

[0006] According to some embodiments of the present utility model, the liquid adding tube includes a first liquid adding tube and a second liquid adding tube, and the first liquid adding tube and the second liquid adding tube are arranged at two ends of the silicon wafer accommodating cavity along the first direction and are symmetrically distributed.

[0007] According to some embodiments of the utility model, the bubbler includes: a connecting rod, a gas channel is formed inside the connecting rod; a first bubble tube, the first bubble tube is arranged at one end of the connecting rod along the second direction, the first bubble tube includes a first tube wall, the first tube wall extends along the first direction, and the first direction and the second direction intersect; a second bubble tube, the second bubble tube is arranged at the other end of the connecting rod along the second direction, the second bubble tube includes a second tube wall, and the second tube wall extends along the first direction; wherein, the first tube wall and the second tube wall are both constructed in a cylindrical shape, and a plurality of first through holes are provided on the first tube wall and the second tube wall.

[0008] According to some embodiments of the utility model, the first cylinder wall includes a first area and a second area, and the first area and the second area are arranged on both sides of the first cylinder wall along the second direction; the second cylinder wall includes a third area and a fourth area, and the third area and the fourth area are arranged on both sides of the second cylinder wall along the second direction, wherein the first through holes in the first area and the second area are arranged alternately, and the first through holes in the third area and the fourth area are arranged alternately.

[0009] According to some embodiments of the present invention, the bubbler is configured in plurality, and the plurality of bubblers are arranged at intervals in the second direction.

[0010] According to some embodiments of the present invention, the texturing tank further includes: a flow balancing plate, which is arranged on a side of the bubbler facing the liquid adding tube, and a plurality of second through holes are arranged on the flow balancing plate.

[0011] According to some embodiments of the present invention, the current balancing plate includes a plurality of sub-current balancing plates, each of which extends along the first direction and is arranged in the second direction, two adjacent sub-current balancing plates are fixedly connected, and two adjacent sub-current balancing plates are not arranged in the same plane.

[0012] According to some embodiments of the utility model, the trough body includes a bottom wall and a side wall, and the bottom wall and the side wall define the silicon wafer accommodating cavity; a third through hole, a plurality of the third through holes are arranged on the bottom wall and / or the side wall, and the through hole includes a first opening close to the silicon wafer accommodating cavity and a second opening away from the silicon wafer accommodating cavity, and the size of the first opening is larger than the size of the second opening.

[0013] According to some embodiments of the present invention, both the first opening and the second opening are circular in shape. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] The above and / or additional aspects and advantages of the present invention will become apparent and easily understood from the description of the embodiments in conjunction with the following drawings, in which:

[0015] Figure 1 A schematic structural diagram of a texturing tank according to an embodiment of the utility model is shown;

[0016] Figure 2 Shows Figure 1 Schematic diagram of the structure of the bubbler;

[0017] Figure 3 Shows Figure 1 Schematic diagram of the structure of the middle molecular baffle;

[0018] Figure 4 Shows Figure 1 A schematic diagram of the structure of the third through hole;

[0019] Figure 5 A schematic diagram showing a velvet surface produced by a velvet-making tank proposed in the present application;

[0020] Figure 6 A schematic diagram showing a velvet surface produced by a velvet-making tank in the related art.

[0021] Reference numerals:

[0022] 1: texturing tank; 11: tank body; 12: silicon wafer accommodating chamber; 13: liquid adding tube; 131: first liquid adding tube; 132: second liquid adding tube; 1311: main tube; 1312: first branch tube; 1313: second branch tube; 14: bubbler; 141: connecting tube; 142: air inlet; 143: first bubbler tube; 1431: first tube wall; 144: second bubbler tube; 1441: second tube wall; 10: first through hole; 20: second through hole; 30: third through hole; 15: flow equalizing plate; 151: sub-flow equalizing plate; 31: first opening; 32: second opening. DETAILED DESCRIPTION

[0023] The embodiments of the present invention are described in detail below. The embodiments described below are exemplary and are only used to explain the present invention, and should not be construed as limiting the present invention. If no specific techniques or conditions are specified in the embodiments, the techniques or conditions described in the literature in this field or the product instructions are used. If the manufacturer of the reagents or instruments used is not specified, they are all conventional products that can be obtained commercially.

[0024] In one aspect of the present invention, a velvet making tank 1 is proposed, referring to Figure 1The texturing tank 1 comprises: a tank body 11, wherein a silicon wafer receiving chamber 12 is formed inside the tank body 11; a liquid adding pipe assembly, wherein the liquid adding pipe assembly comprises a plurality of liquid adding pipes 13, wherein the plurality of liquid adding pipes 13 are arranged at intervals in the silicon wafer receiving chamber 12, wherein the liquid adding pipe 13 comprises a main pipe 1311 and a plurality of branch pipes, wherein the main pipe 1311 comprises a liquid inlet and a liquid outlet, and the plurality of branch pipes are connected to the liquid outlet; and a bubbler 14, wherein the bubbler 14 is arranged at the bottom of the silicon wafer receiving chamber 12. Specifically, the silicon wafer receiving chamber 12 comprises a silicon wafer rack to fix the silicon wafer, and during the texturing process of the silicon wafer, the silicon wafer receiving chamber 12 comprises a texturing liquid, and the texturing liquid reacts chemically with the silicon wafer to perform texturing. In order to maintain the content of the texturing liquid in the silicon wafer receiving chamber 12, during the texturing process, the texturing liquid enters the silicon wafer receiving chamber 12 through the liquid adding pipe 13 to replenish the consumed texturing liquid. The texturing tank 1 proposed in the present application, the liquid adding pipe 13 includes a main pipe 1311 and a plurality of branch pipes, the texturing liquid in the main pipe 1311 enters the silicon wafer receiving chamber 12 through the plurality of branch pipes, so that the texturing liquid can be quickly and evenly dispersed in the silicon wafer receiving chamber 12, so that the texturing liquid and the silicon wafer in the silicon wafer receiving chamber 12 can react chemically evenly, thereby improving the uniformity of the velvet surface. The bubbles blown out by the bubbler 14 can make the texturing liquid in the silicon wafer receiving chamber 12 more evenly distributed, thereby further improving the uniformity of the velvet surface.

[0025] According to some embodiments of the present invention, the number and arrangement of the multiple liquid adding tubes 13 are not limited. For example, the number of the liquid adding tubes 13 can be two, three or more, and the multiple liquid adding tubes 13 can be arranged in an orderly or disorderly manner in the silicon wafer receiving cavity 12.

[0026] According to some embodiments of the utility model, the same liquid adding pipe 13 may include multiple branch pipes, where the multiple may be two, three or more, and the multiple branch pipes are all connected to the liquid outlet of the main pipe 1311. Specifically, the multiple branch pipes may be arranged in a straight line on both sides of the main pipe 1311, or the multiple branch pipes may be arranged around the main pipe 1311.

[0027] According to some embodiments of the present invention, reference Figure 1 , the branch pipe may only include a first branch pipe 1312 and a second branch pipe 1313, and the first branch pipe 1312 and the second branch pipe 1313 are arranged on both sides of the extension direction of the main pipe 1311. Specifically, when the liquid adding pipe assembly includes a plurality of liquid adding pipes 13, the plurality of liquid adding pipes 13 may be orderly arranged along the first direction in the silicon wafer receiving cavity 12. The texturing liquid in the main pipe 1311 enters the silicon wafer receiving cavity 12 through the first branch pipe 1312 and the second branch pipe 1313 respectively, so as to improve the uniformity of the texturing liquid in the silicon wafer receiving cavity 12, avoid excessive concentration of the texturing liquid in local areas, and improve the uniformity of the velvet surface.

[0028] According to some embodiments of the present invention, reference Figure 1 The liquid adding pipe 13 may only include a first liquid adding pipe 131 and a second liquid adding pipe 132, and the first liquid adding pipe 131 and the second liquid adding pipe 132 are arranged at both ends of the silicon wafer receiving chamber 12 along the first direction and are symmetrically distributed. Thus, while improving the uniformity of the texturing liquid in the silicon wafer receiving chamber 12, the structure inside the texturing tank 1 is simplified, and only the outlets of the main pipe 1311 of the liquid adding pipe 13 need to be reserved at both ends of the texturing tank 1 along the first direction.

[0029] According to some embodiments of the present invention, reference Figure 2 The bubbler 14 may include: a connecting rod 141, a gas channel is formed inside the connecting rod 141; a first bubble tube 143, the first bubble tube 143 is arranged at one end of the connecting rod 141 along the second direction, the first bubble tube 143 includes a first tube wall 1431, the first tube wall 1431 extends along the first direction, and the first direction and the second direction intersect; a second bubble tube 144, the second bubble tube 144 is arranged at the other end of the connecting rod 141 along the second direction, the second bubble tube 144 includes a second tube wall 1441, and the second tube wall 1441 extends along the first direction; wherein the first tube wall 1431 and the second tube wall 1441 are both constructed as cylindrical, and a plurality of first through holes 10 are provided on the first tube wall 1431 and the second tube wall 1441. Specifically, the connecting rod 141 is provided with an air inlet 142, and the gas enters the gas channel through the air inlet 142 and then enters the first bubble tube 143 and the second bubble tube 144 to form bubbles. Since the first bubble tube 143 and the second bubble tube 144 are both cylindrical, compared with the flat bubbler 14, more first through holes 10 can be provided on the first bubble tube 143 and the second bubble tube 144 to improve the bubbling efficiency.

[0030] According to some embodiments of the present invention, reference Figure 2, the first barrel wall 1431 includes a first area and a second area, the first area and the second area are arranged on both sides of the first barrel wall 1431 along the second direction; the second barrel wall 1441 includes a third area and a fourth area, the third area and the fourth area are arranged on both sides of the second barrel wall 1441 along the second direction, wherein the first through holes 10 in the first area and the second area are arranged alternately, and the first through holes 10 in the third area and the fourth area are arranged alternately. Specifically, when the first through holes 10 are only arranged in the first area and the second area of ​​the first barrel wall 1431 and the third area and the fourth area of ​​the second barrel wall 1441, the first area and the second area are symmetrically distributed, and the third area and the fourth area are symmetrically distributed. Compared with the first through holes 10 being arranged on both sides of the first barrel wall 1431 facing the silicon wafer accommodating cavity 12 and the second barrel wall 1441 facing the silicon wafer accommodating cavity 12, the bubbles are more uniform, so that the texturing liquid in the silicon wafer accommodating cavity 12 is more evenly distributed, thereby improving the uniformity of the velvet surface.

[0031] According to some embodiments of the present invention, the bubbler 14 is configured as a plurality of bubblers 14, and the plurality of bubblers 14 are arranged at intervals in the second direction. Specifically, the number of bubblers 14 can be two, three or more. Thus, the plurality of bubblers 14 can evenly emit bubbles, so that the texturing liquid in the silicon wafer receiving cavity 12 is more evenly distributed, thereby improving the uniformity of the suede surface.

[0032] According to some embodiments of the present invention, reference Figure 1 and Figure 3 The texturing tank 1 may also include: a flow equalizing plate 15, the flow equalizing plate 15 is arranged on the side of the bubbler 14 facing the liquid adding tube 13, and a plurality of second through holes 20 are arranged on the flow equalizing plate 15. Specifically, during the texturing process, the texturing liquid in the silicon wafer receiving cavity 12 is continuously consumed, and the circulation system continuously replenishes the texturing liquid into the silicon wafer receiving cavity 12. After the texturing liquid enters the silicon wafer receiving cavity 12, it is first diverted through the second through holes 20 on the flow equalizing plate 15 to make it contact with the silicon wafer evenly, thereby improving the uniformity of texturing. In addition, the bubbles blasted out of the bubbler 14 can also pass through the second through holes 20 on the flow equalizing plate 15, so that the bubbles move more evenly to the silicon wafer receiving cavity 12, thereby improving the uniformity of the texturing liquid in the silicon wafer receiving cavity 12 and improving the uniformity of the velvet surface.

[0033] According to some embodiments of the utility model, the current balancing plate 15 may include a plurality of sub-current balancing plates 151, each of the sub-current balancing plates 151 extends along the first direction and is arranged along the second direction, two adjacent sub-current balancing plates 151 are fixedly connected, and two adjacent sub-current balancing plates 151 are arranged in a non-coplanar manner. Specifically, the plurality of sub-current balancing plates 151 are arranged along the second direction, the plurality of sub-current balancing plates 151 may be integrally formed, or the plurality of sub-current balancing plates 151 may be detachably connected, and two adjacent sub-current balancing plates 151 are arranged in a non-coplanar manner, so that the current balancing plate 15 is in a wavy shape as a whole, which increases the flow balancing area, further improves the uniformity of the contact between the velvet-making solution and the silicon wafer, and improves the uniformity of the velvet surface. In addition, the wavy current balancing plate 15 is conducive to the rapid separation of bubbles.

[0034] According to some embodiments of the present invention, reference Figure 1 and Figure 4 , the trough body 11 may include a bottom wall and a side wall, the bottom wall and the side wall define the silicon wafer accommodating cavity 12; a third through hole 30, a plurality of the third through holes 30 are arranged on the bottom wall and / or the side wall, the through hole includes a first opening 31 close to the silicon wafer accommodating cavity 12 and a second opening 32 away from the silicon wafer accommodating cavity 12, the size of the first opening 31 is larger than the size of the second opening 32. Specifically, the trough body 11 forms a accommodating cavity with an opening, in order to prevent the texturing liquid from being contaminated during the texturing process, the texturing tank 1 may also include an upper wall (not shown in the figure), the upper wall is suitable for sealing the opening to prevent the silicon wafer accommodating cavity 12 from communicating with the external environment. During the texturing process, the circulation system needs to replenish the heated texturing liquid into the silicon wafer accommodating cavity 12 to keep the temperature and concentration of the texturing liquid in the silicon wafer texturing tank 1 stable. A plurality of third through holes 30 are arranged on the bottom wall and / or the side wall. When the circulation system replenishes the texturing liquid into the silicon wafer accommodation chamber 12, the texturing liquid enters the silicon wafer accommodation chamber 12 through the third through holes 30. Since the size of the first opening 31 is larger than the size of the second opening 32, the flow rate of the texturing liquid decreases after flowing out of the third through holes 30, which can improve the efficiency of heat exchange and reduce the damage to the silicon wafer due to excessive flow rate. The plurality of third through holes 30 divert the texturing liquid, which can improve the uniformity of the contact between the texturing liquid and the silicon wafer and improve the uniformity of the velvet surface.

[0035] It should be noted that when the third through holes 30 are arranged on the bottom wall and / or the side wall, the arrangement and specific shape of the third through holes 30 are not particularly limited, and those skilled in the art may design them according to actual needs.

[0036] According to some embodiments of the present invention, the first opening 31 and the second opening 32 are both circular. When the first opening 31 and the second opening 32 are circular, the radius of the first opening 31 is greater than the radius of the second opening 32, and the third through hole 30 is horn-shaped (refer to Figure 4 ). Thus, the flow rate of the texturing liquid into the silicon wafer receiving cavity 12 is reduced, the efficiency of heat exchange is improved, the damage to the silicon wafer caused by the excessive flow rate of the texturing liquid is reduced, the uniformity of the contact between the texturing liquid and the silicon wafer is improved, and the uniformity of the velvet surface is improved. Figure 5 and Figure 6 By comparison, it can be seen that the morphology and size of the velvet surface prepared by the velvet-making tank 1 proposed in the present application are more uniform.

[0037] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.

[0038] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present utility model, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0039] In the present invention, unless otherwise clearly specified and limited, the terms "install", "connect", "connect", "fix" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0040] In the present utility model, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may mean that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Moreover, a first feature being "above", "above" or "above" a second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. A first feature being "below", "below" or "below" a second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

[0041] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the utility model. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art may combine and combine the different embodiments or examples described in this specification and the features of the different embodiments or examples, without contradiction.

[0042] Although the embodiments of the present invention have been shown and described above, it can be understood that the above embodiments are exemplary and cannot be understood as limitations of the present invention. Ordinary technicians in the field can change, modify, replace and modify the above embodiments within the scope of the present invention.

Claims

1. A velvet making tank, characterized in that: include: A tank body, wherein a silicon wafer accommodating cavity is formed inside the tank body; A liquid adding pipe assembly, the liquid adding pipe assembly comprising a plurality of liquid adding pipes, the plurality of liquid adding pipes being arranged at intervals in the silicon wafer containing chamber, the liquid adding pipe comprising a main pipe and a plurality of branch pipes, the main pipe comprising a liquid inlet and a liquid outlet, and the plurality of branch pipes being connected to the liquid outlet; A bubbler is arranged at the bottom of the silicon wafer containing cavity.

2. The texturing tank according to claim 1, characterized in that: The branch pipe only includes a first branch pipe and a second branch pipe, and the first branch pipe and the second branch pipe are arranged on both sides of the extending direction of the main pipe.

3. The texturing tank according to claim 1 or 2, characterized in that: The liquid adding pipe comprises a first liquid adding pipe and a second liquid adding pipe, and the first liquid adding pipe and the second liquid adding pipe are arranged at two ends of the silicon wafer accommodating cavity along a first direction and are symmetrically distributed.

4. The texturing tank according to claim 3, characterized in that: The bubbler comprises: A connecting rod, wherein a gas passage is formed inside the connecting rod; A first bubbling tube, the first bubbling tube is arranged at one end of the connecting rod along the second direction, the first bubbling tube comprises a first tube wall, the first tube wall extends along the first direction, and the first direction and the second direction intersect; A second bubbling tube, the second bubbling tube is arranged at the other end of the connecting rod along the second direction, the second bubbling tube comprises a second tube wall, and the second tube wall extends along the first direction; wherein The first cylinder wall and the second cylinder wall are both cylindrical in shape, and a plurality of first through holes are provided on the first cylinder wall and the second cylinder wall.

5. The texturing tank according to claim 4, characterized in that: The first tube wall includes a first area and a second area, and the first area and the second area are arranged on both sides of the first tube wall along the second direction; the second tube wall includes a third area and a fourth area, and the third area and the fourth area are arranged on both sides of the second tube wall along the second direction, wherein, The first through holes in the first area and the second area are arranged alternately, and the first through holes in the third area and the fourth area are arranged alternately.

6. The texturing tank according to claim 5, characterized in that: The bubblers are configured in plurality, and the plurality of bubblers are arranged at intervals in the second direction.

7. The texturing tank according to claim 4, characterized in that: The texturing tank further includes: a flow balancing plate, which is arranged on a side of the bubbler facing the liquid adding tube, and a plurality of second through holes are arranged on the flow balancing plate.

8. The texturing tank according to claim 7, characterized in that: The current balancing plate includes a plurality of sub-current balancing plates, each of which extends along the first direction and is arranged along the second direction, two adjacent sub-current balancing plates are fixedly connected, and two adjacent sub-current balancing plates are arranged in a non-coplanar manner.

9. The texturing tank according to claim 1, characterized in that: The trough body comprises a bottom wall and a side wall, and the bottom wall and the side wall define the silicon wafer accommodating cavity; A third through hole, a plurality of the third through holes are arranged on the bottom wall and / or the side wall, the through hole comprises a first opening close to the silicon wafer accommodating cavity and a second opening away from the silicon wafer accommodating cavity, and the size of the first opening is larger than the size of the second opening.

10. The texturing tank according to claim 9, characterized in that: The first opening and the second opening are both configured in a circular shape.

Images