Drilling module for improving drilling quality

By designing the combination of substrate, carrier table and drilling needle, using dry film body filling and adhesive layer structure, the problems of copper skin strain and edge penetration during circuit board drilling are solved, the drilling quality is improved and the cost is controlled .

CN222263139UActive Publication Date: 2024-12-27SUNSHINE GLOBAL CIRCUITS CO LTD +1
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Patent Information

Application Number
CN202420532317.9
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-03-15
Publication Date
2024-12-27
Estimated Expiration
2034-03-15

AI Technical Summary

Technical Problem

During the production of circuit boards, grooves of the copper foil layer are prone to appear after pressing the substrate, resulting in copper skin strain and edge penetration problems during drilling, affecting the quality of the drilling.

Method used

A drilling module including a substrate, a carrier table and a drilling needle is designed, with the first and second grooves arranged on the substrate and the dry film body filled, drilling holes for the inlay module by drilling, using an adhesive layer and the inlay module. Fixed structure to improve drilling stability and quality.

Benefits of technology

It effectively reduces the problems of drilling strains and pendant pendant, improves the quality of drilling, and can effectively control costs.

✦ Generated by Eureka AI based on patent content.

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  • Figure CN222263139U_ABST
    Figure CN222263139U_ABST
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Abstract

The utility model discloses a drilling module capable of improving drilling quality. The drilling module comprises a base plate, a bearing table and a drill point. The substrate comprises a first copper foil layer, a main board body and a second copper foil layer; the first copper foil layer is located above the second copper foil layer, and the main board body is arranged between the first copper foil layer and the second copper foil layer; a plurality of first grooves are formed in one end, far away from the main board body, of the first copper foil layer, and each first groove is filled with a first filling body; a plurality of second grooves are formed in one end, far away from the main plate body, of the second copper foil layer, and each second groove is filled with a second filling body; a first inlaying module and a second inlaying module are arranged on the substrate; the bearing table is used for placing a substrate; and the drill point is used for drilling holes in the first inlaying module and the second inlaying module. According to the utility model, the problems of copper sheet straining and flashing during drilling can be effectively improved, so that the drilling quality is improved.
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Description

Technical Field

[0001] The utility model relates to a drilling module for improving drilling quality. Background Art

[0002] In the process of making circuit boards, after the steps of lamination, outer layer dry film lamination, exposure (i.e. polymerization reaction through light imaging), and development (i.e. image display), it is often necessary to drill holes in the substrate to drill holes that need to conduct the inner layer circuits.

[0003] However, since the substrate is laminated using a three-in-one overmolding, it is easy to form multiple first grooves on the first copper foil layer of the substrate and multiple second grooves on the second copper foil layer of the substrate. In the actual drilling process, it is easy to cause the copper skin on the surface of the substrate to be scratched, resulting in serious drilling flash. Utility Model Content

[0004] In order to overcome the deficiencies of the prior art, the purpose of the utility model is to provide a drilling module for improving the drilling quality, which can effectively improve the problems of copper tearing and flashing caused by drilling.

[0005] The purpose of the utility model is achieved by the following technical solutions:

[0006] A drilling module for improving drilling quality comprises a substrate, a carrier and a drill needle; the substrate comprises a first copper foil layer, a main board body and a second copper foil layer; the first copper foil layer is located above the second copper foil layer, and the main board body is arranged between the first copper foil layer and the second copper foil layer; a plurality of first grooves are arranged at one end of the first copper foil layer away from the main board body, and each first groove is filled with a first filling body; a plurality of second grooves are arranged at one end of the second copper foil layer away from the main board body, and each second groove is filled with a second filling body; a first inlay module and a second inlay module are arranged on the substrate; the carrier is used for placing the substrate; and the drill needle is used for drilling holes in the first inlay module and the second inlay module.

[0007] The substrate is provided with a first embedding groove, the upper end of the first embedding groove penetrates the first copper foil layer, and the lower end of the first embedding groove penetrates the second copper foil layer, and the first inlay module is fixed in the first embedding groove.

[0008] The main board body is provided with a second embedding groove, and the second embedding module is fixed in the second embedding groove.

[0009] The main board body comprises an upper copper layer, a substrate and a lower copper layer; the upper copper layer is arranged above the substrate, and the lower copper layer is arranged below the substrate.

[0010] The second embedded groove extends from the upper copper layer to the lower copper layer.

[0011] A first adhesive layer is arranged between the first copper foil layer and the main board body.

[0012] A second adhesive layer is arranged between the second copper foil layer and the main board body.

[0013] The first embedding groove sequentially penetrates the first copper foil layer, the first adhesive layer, the main board body, the second adhesive layer and the second copper foil layer.

[0014] The first filling body is a first dry film body, an end surface of the first copper foil layer away from the main board body is formed as a first external end surface, and the first dry film body filled in the first groove is flush with the first external end surface.

[0015] The second filling body is a second dry film body, an end surface of the second copper foil layer away from the main board body is formed as a second external end surface, and the second dry film body filled in the second groove is flush with the second external end surface.

[0016] Compared with the prior art, the beneficial effects of the present invention are:

[0017] The utility model provides a drilling module for improving drilling quality. The utility model adopts a combined design of a substrate, a supporting platform and a drill needle, and reasonably arranges the substrate. The first groove is filled with a first filling body, and the second grooves are filled with a second filling body. At the same time, the drill needle is used to drill the first inlay module and the second inlay module, which can effectively improve the problems of copper skin tearing and burring caused by drilling, so as to improve the drilling quality; moreover, it can also effectively control the cost. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 It is a schematic diagram of the structure of the utility model;

[0019] Figure 2 is a schematic diagram of the structure of the substrate;

[0020] Among them, 10, the supporting platform; 11, the first air avoidance groove; 12, the second air avoidance groove; 20, the drill needle; 30, the substrate; 31, the first copper foil layer; 32, the second copper foil layer; 33, the first groove; 34, the first filling body; 35, the second groove; 36, the second filling body; 37, the first embedding groove; 38, the second embedding groove; 40, the main body; 41, the upper copper layer; 42, the substrate; 43, the lower copper layer; 51, the first inlay module; 52, the second inlay module; 61, the first adhesive layer; 62, the second adhesive layer. DETAILED DESCRIPTION

[0021] The present invention is further described below in conjunction with the accompanying drawings and specific implementation methods. It should be noted that, under the premise of no conflict, the various embodiments or technical features described below can be arbitrarily combined to form a new embodiment.

[0022] like Figure 1-2 As shown, a drilling module for improving drilling quality includes a substrate 30, a carrier 10 and a drill needle 20; the substrate 30 includes a first copper foil layer 31, a main board 40 and a second copper foil layer 32; the first copper foil layer 31 is located above the second copper foil layer 32, and the main board 40 is arranged between the first copper foil layer 31 and the second copper foil layer 32; a plurality of first grooves 33 are arranged at one end of the first copper foil layer 31 away from the main board 40, and each first groove 33 is filled with a first filling body 34; a plurality of second grooves 35 are arranged at one end of the second copper foil layer 32 away from the main board 40, and each second groove 35 is filled with a second filling body 36; a first inlay module 51 and a second inlay module 52 are arranged on the substrate 30; the carrier 10 is used for placing the substrate 30; and the drill needle 20 is used for drilling holes in the first inlay module 51 and the second inlay module 52.

[0023] The utility model provides a drilling module for improving drilling quality, which adopts a combined design of a substrate 30, a carrier platform 10 and a drill needle 20, and through reasonable arrangement of the substrate 30, the first groove 33 is filled with a first filling body 34, and the second grooves 35 are filled with a second filling body 36. When the substrate 30 is placed on the carrier platform 10 for drilling, the board surface can be prevented from being suspended or shaking. On this basis, the drill needle 20 is used to drill the first inlay module 51 and the second inlay module 52, which can reduce the problems of copper sheet tearing and burring caused by drilling, so as to improve the drilling quality; moreover, the cost can be effectively controlled.

[0024] The substrate 30 is provided with a first embedding groove 37, the upper end of which penetrates the first copper foil layer 31, and the lower end of which penetrates the second copper foil layer 32, and the first inlay module 51 is fixed in the first embedding groove 37. The above structure is convenient for manufacturing.

[0025] The main body 40 is provided with a second embedding groove 38, and the second embedding module 52 is fixed in the second embedding groove 38. By adopting the above arrangement, it is convenient to manufacture.

[0026] In this embodiment, the first inlay module 51 is a first embedded copper block, and the second inlay module 52 is a second embedded copper block.

[0027] Of course, in addition to this, the first inlay module 51 and the second inlay module 52 can adopt various existing inlay modules on the market according to actual needs, but the first inlay module 51 adopts the first embedded copper block and the second inlay module 52 adopts the second embedded copper block, which is the most preferred embodiment of the utility model and can reduce costs.

[0028] The main body 40 includes an upper copper layer 41, a substrate 42 and a lower copper layer 43; the upper copper layer 41 is disposed above the substrate 42, and the lower copper layer 43 is disposed below the substrate 42. The second embedding groove 38 extends from the upper copper layer 41 to the lower copper layer 43.

[0029] A first adhesive layer 61 is disposed between the first copper foil layer 31 and the main board body 40 , so as to bond the first copper foil layer 31 and the main board body 40 via the first adhesive layer 61 .

[0030] A second adhesive layer 62 is disposed between the second copper foil layer 32 and the main board body 40 , so as to bond the first copper foil layer 31 and the main board body 40 via the first adhesive layer 61 .

[0031] The first adhesive layer 61 and the second adhesive layer 62 are prepregs or the like.

[0032] The first embedding groove 37 sequentially penetrates the first copper foil layer 31, the first adhesive layer 61, the main body 40, the second adhesive layer 62 and the second copper foil layer 32. By adopting the above structure, the first embedding groove 37 can be easily manufactured.

[0033] Specifically, the first adhesive layer 61 covers the upper part of the second embedding groove 38 , and the second adhesive layer 62 is disposed under the second embedding groove 38 .

[0034] The first filling body 34 is a first dry film body, and the end surface of the first copper foil layer 31 away from the main board body 40 is formed as a first external end surface, and the first dry film body filled in the first groove 33 is flush with the first external end surface. By adopting the above arrangement, the stability of the substrate 30 placed on the carrier 10 for drilling can be improved, and the stability of the filling of the first filling body 34 can be ensured.

[0035] The second filling body 36 is a second dry film body, and the end surface of the second copper foil layer 32 away from the main body 40 is formed as a second external end surface, and the second dry film body filled in the second groove 35 is flush with the second external end surface. By adopting the above arrangement, the stability of the substrate 30 placed on the carrier 10 for drilling can be improved, and the stability of the filling of the second filling body 36 can be ensured.

[0036] Preferably, a first avoidance groove 11 and a second avoidance groove 12 are also provided on the supporting platform 10, wherein the first avoidance groove 11 corresponds to the first inlay module 51, and the second avoidance groove 12 corresponds to the second inlay module 52, so that when the drill needle 20 drills a hole in the first inlay module 51, the drill needle 20 can be avoided through the first avoidance groove 11, and when the drill needle 20 drills a hole in the second inlay module 52, the drill needle 20 can be avoided through the second avoidance groove 12.

[0037] The above-mentioned implementation modes are only preferred implementation modes of the present invention, and cannot be used to limit the protection scope of the present invention. Any non-substantial changes and substitutions made by technicians in this field on the basis of the present invention shall fall within the scope of protection required by the present invention.

Claims

1. A drilling module for improving drilling quality, characterized in that: It comprises a substrate, a carrier and a drill needle; the substrate comprises a first copper foil layer, a main board body and a second copper foil layer; the first copper foil layer is located above the second copper foil layer, and the main board body is arranged between the first copper foil layer and the second copper foil layer; a plurality of first grooves are arranged at one end of the first copper foil layer away from the main board body, and each first groove is filled with a first filling body; a plurality of second grooves are arranged at one end of the second copper foil layer away from the main board body, and each second groove is filled with a second filling body; a first inlay module and a second inlay module are arranged on the substrate; the carrier is used for placing the substrate; the drill needle is used for drilling holes in the first inlay module and the second inlay module.

2. The drilling module for improving drilling quality according to claim 1, characterized in that: The substrate is provided with a first embedding groove, the upper end of the first embedding groove penetrates the first copper foil layer, and the lower end of the first embedding groove penetrates the second copper foil layer, and the first inlay module is fixed in the first embedding groove.

3. The drilling module for improving drilling quality according to claim 2, characterized in that: The main board body is provided with a second embedding groove, and the second embedding module is fixed in the second embedding groove.

4. The drilling module for improving drilling quality according to claim 3, characterized in that: The main board body comprises an upper copper layer, a substrate and a lower copper layer; the upper copper layer is arranged above the substrate, and the lower copper layer is arranged below the substrate.

5. The drilling module for improving drilling quality according to claim 4, characterized in that: The second embedded groove extends from the upper copper layer to the lower copper layer.

6. The drilling module for improving drilling quality according to claim 5, characterized in that: A first adhesive layer is arranged between the first copper foil layer and the main board body.

7. The drilling module for improving drilling quality according to claim 6, characterized in that: A second adhesive layer is arranged between the second copper foil layer and the main board body.

8. The drilling module for improving drilling quality according to claim 7, characterized in that: The first embedding groove sequentially penetrates the first copper foil layer, the first adhesive layer, the main board body, the second adhesive layer and the second copper foil layer.

9. The drilling module for improving drilling quality according to claim 1, characterized in that: The first filling body is a first dry film body, an end surface of the first copper foil layer away from the main board body is formed as a first external end surface, and the first dry film body filled in the first groove is flush with the first external end surface.

10. The drilling module for improving drilling quality according to claim 1, characterized in that: The second filling body is a second dry film body, an end surface of the second copper foil layer away from the main board body is formed as a second external end surface, and the second dry film body filled in the second groove is flush with the second external end surface.