Compact ceramic substrate with high heat-conducting property
By setting a heat dissipation alloy layer, a thermally conductive metal layer, a thermally conductive channel and a thermally conductive medium on the ceramic substrate to increase the heat dissipation area and path, the problem of poor thermal conductivity of the ceramic substrate is solved, and the application needs of fast heat dissipation and high-power density electronic equipment are achieved.
Patent Information
- Application Number
- CN202323512040.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2023-12-22
- Publication Date
- 2024-12-27
- Estimated Expiration
- 2033-12-22
AI Technical Summary
Traditional ceramic substrates have poor thermal conductivity, which limits their application in high-power density electronic devices and requires a long time to stand to reduce the temperature of the ceramic substrate.
The heat dissipation alloy layer is installed on the surface of the ceramic substrate, and the heat dissipation protrusions are formed and the heat dissipation grooves are opened on the surface, the thermally conductive metal layer and the heat-conducting channel are set, and the heat-conducting medium is filled to increase the heat dissipation area and the heat-conducting path, and the thermally conductive metal layer and heat-conducting. The medium improves thermal conductivity, uses thermal conductivity square grooves and heat dissipation aluminum foil strips to increase the thermal conductivity area, and combines micro-radiation fins and enclosing edges to enhance heat dissipation efficiency.
By improving the thermal conductivity of ceramic substrates, heat can be quickly transferred to the external environment, meeting the needs of high-power density electronic equipment, enhancing heat dissipation effect, and improving the overall stability and thermal conductivity of the substrate.
Smart Images
Figure CN222263401U_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the technical field of ceramic substrates, and in particular to a dense ceramic substrate with high thermal conductivity. Background Art
[0002] Ceramic substrate refers to a special process board in which copper foil is directly bonded to the surface (single or double sides) of an alumina (Al2O3) or aluminum nitride (AlN) ceramic substrate at high temperature.
[0003] Ceramic substrates have excellent electrical insulation properties, high thermal conductivity, excellent soft solderability and high adhesion strength. They can be etched with various patterns like PCB boards and have great current carrying capacity. Therefore, ceramic substrates have become the basic materials for power electronic circuit structure technology and interconnection technology.
[0004] With the rapid development of electronic technology, ceramic substrates, as an important electronic component, have been widely used in various electronic devices; however, traditional ceramic substrates often have the problem of poor thermal conductivity, and it takes a long time to stand still to reduce the temperature of the ceramic substrate, which limits its application in high power density electronic devices, so it needs to be improved. Utility Model Content
[0005] In order to solve the problem of poor thermal conductivity of traditional ceramic substrates, the present application provides a dense ceramic substrate with high thermal conductivity.
[0006] The present application provides a dense ceramic substrate with high thermal conductivity, which adopts the following technical solution:
[0007] A dense ceramic substrate with high thermal conductivity comprises a ceramic substrate, a heat dissipation alloy layer is arranged on the surface of the ceramic substrate, a plurality of heat dissipation protrusions for increasing the heat dissipation area are arranged at one end of the heat dissipation alloy layer away from the ceramic substrate, a plurality of heat dissipation grooves are also opened on the surface of the heat dissipation alloy layer, a plurality of the heat dissipation protrusions and a plurality of heat dissipation grooves are arranged in sequence on the surface of the heat dissipation alloy layer, a heat conductive metal layer is arranged between the heat dissipation alloy layer and the ceramic substrate, a heat conductive channel is arranged in the heat conductive metal layer, and a heat conductive medium is filled in the heat conductive channel.
[0008] Since traditional ceramic substrates often have the problem of poor thermal conductivity, they need to be left still for a long time to reduce the temperature of the ceramic substrate, which limits their application in high-power density electronic devices. By adopting the above technical solution, the heat dissipation alloy layer is arranged on the surface of the ceramic substrate, the heat dissipation alloy layer surface is integrally formed with heat dissipation protrusions and heat dissipation grooves, a heat-conducting metal layer is arranged between the heat dissipation alloy layer and the ceramic substrate, a heat-conducting channel is opened in the heat-conducting metal layer, and a heat-conducting medium is filled in the heat-conducting channel. By setting the heat dissipation alloy layer and the heat-conducting metal layer, a heat dissipation alloy layer is added to the surface of the traditional ceramic substrate, the thermal conductivity of the substrate is improved, the heat dissipation protrusion increases the heat dissipation area, and the heat dissipation groove guides the air flow, which can quickly transfer heat to the external environment. At the same time, the heat-conducting metal layer further improves the thermal conductivity. The heat-conducting medium usually has a high thermal conductivity, which effectively transfers heat from the ceramic substrate to the heat dissipation alloy layer, so that it can meet the needs of high-power density electronic devices.
[0009] Optionally, a plurality of heat-conducting square grooves are formed on a side of the ceramic substrate away from the heat-conducting metal layer, each of the heat-conducting square grooves is arranged in a width direction of the ceramic substrate, and the plurality of heat-conducting square grooves are arranged in sequence along a length direction of the ceramic substrate.
[0010] By adopting the above technical solution, a plurality of heat-conducting square grooves are opened on the ceramic substrate, and the heat-conducting square grooves are arranged in sequence; by setting a plurality of heat-conducting square grooves, the heat-conducting area of the ceramic substrate can be increased, the thermal conductivity can be improved, the heat can be better transferred, and the heat dissipation effect can be further enhanced.
[0011] Optionally, a heat dissipation aluminum foil strip is provided in each of the heat-conducting square grooves, the heat-dissipation aluminum foil strip is filled in the heat-conducting square groove, and the thickness of the heat-dissipation aluminum foil strip is slightly greater than the groove depth of the heat-conducting square groove.
[0012] By adopting the above technical solution, the heat dissipation aluminum foil strip is embedded in the heat-conducting square groove; through the setting of the heat dissipation aluminum foil strip, the heat dissipation aluminum foil strip has a higher thermal conductivity, can increase the thermal conductivity area of the ceramic substrate, and further improve the thermal conductivity performance.
[0013] Optionally, the side walls of the ceramic substrate, the thermally conductive metal layer and the heat dissipation alloy layer are jointly provided with a surrounding edging for enhancing the stability of the substrate, the width of the surrounding edging is the total thickness of the ceramic substrate, the thermally conductive metal layer and the heat dissipation alloy layer, and the surrounding edging is arranged along the circumferential direction of the ceramic substrate.
[0014] By adopting the above technical solution, the surrounding edging is arranged outside the ceramic substrate, the thermally conductive metal layer and the heat dissipation alloy layer; through the setting of the surrounding edging, the connection between the ceramic substrate, the thermally conductive metal layer and the heat dissipation alloy layer can be strengthened, the overall stability of the substrate is improved, and the deformation or cracking of the substrate during use is reduced.
[0015] Optionally, the surrounding edging surface is provided with a plurality of micro heat sink fins for heat dissipation, and the plurality of micro heat sink fins are sequentially arranged along the arrangement direction of the surrounding edging.
[0016] By adopting the above technical solution, a number of micro-heating fins are installed in sequence along the arrangement direction of the surrounding edging; through the arrangement of the micro-heating fins, the heat dissipation area can be increased and the heat dissipation efficiency can be improved. The surface of the micro-heating fins is in contact with the air, and the heat can be transferred to the air through natural convection and radiation heat dissipation, further enhancing the heat dissipation effect.
[0017] Optionally, a plurality of the micro heat sink fins are arranged obliquely on the surrounding edging surface, the inclination angle of the micro heat sink fins ranges from 10 to 20 degrees, and adjacent micro heat sink fins are arranged at intervals.
[0018] By adopting the above technical solution, adjacent micro-heating fins are arranged at intervals, and the inclination angle of the micro-heating fins ranges from 10 to 20 degrees; by setting the arrangement of the micro-heating fins, the design of the inclination angle enables the micro-heating fins to better contact with the air, thereby accelerating heat transfer, and at the same time, the interval arrangement can form an air channel, increase air circulation, and further improve the heat dissipation effect.
[0019] Optionally, the heat-conducting channel is spirally arranged in the heat-conducting metal layer, and a center line of the heat-conducting channel coincides with a center line of the heat-conducting metal layer.
[0020] By adopting the above technical solution, the heat conduction channel is spirally arranged in the heat conduction metal layer; through the setting of the heat conduction channel arrangement, the spiral arrangement can increase the length and area of the heat conduction path, improve the heat conduction efficiency, and further enhance the heat dissipation effect.
[0021] Optionally, one end of the thermally conductive metal layer is bonded to the ceramic substrate, one end of the thermally conductive metal layer is provided with a convex strip, the convex strip is arranged along the length direction of the thermally conductive metal layer, and the surface of the heat dissipation alloy layer is provided with a groove matching the convex strip.
[0022] By adopting the above technical solution, a convex strip is integrally formed on the thermally conductive metal layer, and when the thermally conductive metal layer is matched with the heat dissipation alloy layer, the convex strip is adapted to the groove on the heat dissipation alloy layer; by setting the convex strip and the groove, the connection between the thermally conductive metal layer and the heat dissipation alloy layer is strengthened, making the connection more stable, and reducing the possibility of deformation or falling off when subjected to external force.
[0023] In summary, the present application includes at least one of the following beneficial technical effects:
[0024] By setting the heat dissipation alloy layer and the heat conductive metal layer, a heat dissipation alloy layer is added to the surface of the traditional ceramic substrate, which improves the thermal conductivity of the substrate. The heat dissipation protrusion increases the heat dissipation area, and the heat dissipation groove guides the air flow, which can quickly transfer heat to the external environment. At the same time, the heat conductive metal layer further improves the thermal conductivity. The heat conductive medium usually has a high thermal conductivity, which effectively transfers heat from the ceramic substrate to the heat dissipation alloy layer, so that it can meet the needs of high power density electronic equipment.
[0025] By setting a plurality of heat-conducting square grooves, the heat-conducting area of the ceramic substrate can be increased, the heat-conducting performance can be improved, the heat can be better transferred out, and the heat dissipation effect can be further enhanced;
[0026] By setting up micro-heat sink fins, the heat sink area can be increased and the heat sink efficiency can be improved. The surface of the micro-heat sink fins is in contact with the air, and the heat can be transferred to the air through natural convection and radiation heat dissipation, further enhancing the heat dissipation effect. BRIEF DESCRIPTION OF THE DRAWINGS
[0027] Figure 1 It is a structural schematic diagram of a dense ceramic substrate with high thermal conductivity in an embodiment of the present application.
[0028] Figure 2 It is a cross-sectional view of a dense ceramic substrate with high thermal conductivity in an embodiment of the present application.
[0029] Figure 3 It is a schematic diagram of the structure of the ceramic substrate and the heat dissipation aluminum foil strip in the embodiment of the present application.
[0030] Figure 4 It is a structural schematic diagram used to reflect the heat conduction channel and the heat conduction medium in the embodiment of the present application.
[0031] Explanation of the reference numerals: 1. Ceramic substrate; 2. Heat dissipation alloy layer; 21. Heat dissipation protrusion; 22. Heat dissipation groove; 23. Recess; 3. Heat-conducting metal layer; 31. Heat-conducting channel; 32. Heat-conducting medium; 33. Raised strip; 4. Heat-conducting square groove; 41. Heat-dissipating aluminum foil strip; 5. Surrounding edging; 51. Micro heat-dissipating fins. Implementation
[0032] The following is combined with Figure 1-4 This application is described in further detail.
[0033] The present application discloses a dense ceramic substrate with high thermal conductivity. Figure 1 and Figure 2A dense ceramic substrate with high thermal conductivity includes a ceramic substrate 1, a thermally conductive metal layer 3 is arranged on the surface of the ceramic substrate 1, and a heat dissipation alloy layer 2 is arranged on the side of the thermally conductive metal layer 3 away from the ceramic substrate 1. In this embodiment, the thermally conductive metal layer 3 and the heat dissipation alloy layer 2 can be connected to the ceramic substrate 1 by adhesive bonding or welding process. The thermally conductive metal layer 3 can be made of metal materials with good thermal conductivity such as copper, aluminum, nickel, etc., and the heat dissipation alloy layer 2 can be made of alloy materials such as copper alloy, aluminum alloy, nickel alloy, etc.
[0034] Reference Figure 1 and Figure 2 The ceramic substrate 1, the thermally conductive metal layer 3 and the heat dissipation alloy layer 2 have the same size, and the ceramic substrate 1, the thermally conductive metal layer 3 and the heat dissipation alloy layer 2 have the same size and are jointly covered with a surrounding edging 5 on the side wall. The surrounding edging 5 is arranged along the circumferential direction of the ceramic substrate 1. In this embodiment, the width of the surrounding edging 5 is the total thickness of the ceramic substrate 1, the thermally conductive metal layer 3 and the heat dissipation alloy layer 2. The surrounding edging 5 can be made of aluminum alloy to strengthen the connection between the ceramic substrate 1, the thermally conductive metal layer 3 and the heat dissipation alloy layer 2, improve the overall stability of the substrate, and reduce deformation or cracking of the substrate during use.
[0035] Reference Figure 1 and Figure 2 A plurality of micro heat sink fins 51 are integrally formed on the surface of the surrounding edging 5, and the plurality of micro heat sink fins 51 are arranged obliquely on the surface of the surrounding edging 5, and the plurality of micro heat sink fins 51 are arranged in sequence and spaced apart along the arrangement direction of the surrounding edging 5, and the inclination angle range of each micro heat sink fin 51 is 10-20°, so as to increase the heat dissipation area and improve the heat dissipation efficiency. The surface of the micro heat sink fin 51 is in contact with the air, and can transfer heat to the air through natural convection and radiation heat dissipation, thereby further enhancing the heat dissipation effect.
[0036] Reference Figure 2 and Figure 3 A plurality of heat-conducting square grooves 4 are provided on one side of the ceramic substrate 1 away from the heat-conducting metal layer 3, and each heat-conducting square groove 4 is arranged in the width direction of the ceramic substrate 1. The plurality of heat-conducting square grooves 4 are arranged in sequence along the length direction of the ceramic substrate 1, and a heat-dissipating aluminum foil strip 41 is glued and fixed in each heat-conducting square groove 4. In this embodiment, the thickness of the heat-dissipating aluminum foil strip 41 is slightly greater than the groove depth of the heat-conducting square groove 4, so as to increase the heat-conducting area of the ceramic substrate 1, improve the heat-conducting performance, and better transfer the heat.
[0037] Reference Figure 2 and Figure 4A heat-conducting channel 31 is formed inside the heat-conducting metal layer 3. The heat-conducting channel 31 is spirally arranged in the heat-conducting metal layer 3. In this embodiment, the cross-section of the heat-conducting channel 31 is similar to a mosquito coil. The center line of the heat-conducting channel 31 coincides with the center line of the heat-conducting metal layer 3. The heat-conducting channel 31 is filled with a heat-conducting medium 32. In this embodiment, the heat-conducting medium 32 can be heat-conducting silica gel, heat-conducting paste, heat-conducting sheet, etc. The heat-conducting medium 32 usually has a high thermal conductivity and effectively transfers heat from the ceramic substrate 1 to the heat dissipation alloy layer 2, so that it can meet the needs of high power density electronic equipment.
[0038] Reference Figure 2 A convex strip 33 is integrally formed on one side of the heat-conducting metal layer 3 away from the ceramic substrate 1. The convex strip 33 is arranged along the length direction of the heat-conducting metal layer 3. A groove 23 is provided on the surface of the heat-dissipating alloy layer 2. The convex strip 33 cooperates with the groove 23. In this embodiment, the number of the convex strip 33 and the groove 23 can be multiple groups, so as to strengthen the connection between the heat-conducting metal layer 3 and the heat-dissipating alloy layer 2, make the connection more stable, and reduce the possibility of deformation or falling off when subjected to external force.
[0039] Reference Figure 2 A plurality of heat dissipation protrusions 21 are integrally formed on one end of the heat dissipation alloy layer 2 away from the heat conductive metal layer 3, and a plurality of heat dissipation grooves 22 are opened on the heat dissipation alloy layer 2. In this embodiment, the heat dissipation protrusions 21 and the heat dissipation grooves 22 are arranged in sequence on the heat dissipation alloy layer 2. The heat dissipation protrusions 21 increase the heat dissipation area, and the heat dissipation grooves 22 guide the air flow, so as to quickly transfer the heat to the external environment.
[0040] The implementation principle of a dense ceramic substrate with high thermal conductivity in the embodiment of the present application is as follows: during the preparation process of the ceramic substrate, the formed ceramic substrate 1, the thermally conductive metal layer 3 and the heat dissipation alloy layer 2 are sequentially bonded and connected through a process, and then the surrounding edge 5 is coated on the ceramic substrate 1, the thermally conductive metal layer 3 and the heat dissipation alloy layer 2 to finally form a ceramic substrate; by setting the heat dissipation alloy layer 2 and the thermally conductive metal layer 3, the heat dissipation alloy layer 2 is added to the surface of the traditional ceramic substrate 1, the thermal conductivity of the substrate is improved, the heat dissipation protrusion 21 increases the heat dissipation area, and the heat dissipation groove 22 guides the air flow, which can quickly transfer heat to the external environment, and at the same time, the thermally conductive metal layer 3 further improves the thermal conductivity, and the thermally conductive medium 32 usually has a high thermal conductivity, which effectively transfers heat from the ceramic substrate 1 to the heat dissipation alloy layer 2, so that it can meet the needs of high power density electronic equipment.
[0041] The above are all preferred embodiments of the present application, and the protection scope of the present application is not limited thereto. Therefore, any equivalent changes made according to the structure, shape, and principle of the present application should be included in the protection scope of the present application.
Claims
1. A dense ceramic substrate with high thermal conductivity, comprising a ceramic substrate (1), characterized in that: A heat dissipation alloy layer (2) is provided on the surface of the ceramic substrate (1); a plurality of heat dissipation protrusions (21) for increasing the heat dissipation area are provided at one end of the heat dissipation alloy layer (2) away from the ceramic substrate (1); a plurality of heat dissipation grooves (22) are also provided on the surface of the heat dissipation alloy layer (2); the plurality of heat dissipation protrusions (21) and the plurality of heat dissipation grooves (22) are sequentially arranged on the surface of the heat dissipation alloy layer (2); a heat conductive metal layer (3) is provided between the heat dissipation alloy layer (2) and the ceramic substrate (1); a heat conductive channel (31) is provided in the heat conductive metal layer (3); and a heat conductive medium (32) is filled in the heat conductive channel (31).
2. A dense ceramic substrate with high thermal conductivity according to claim 1, characterized in that: A plurality of heat-conducting square grooves (4) are provided on a side of the ceramic substrate (1) away from the heat-conducting metal layer (3), each of the heat-conducting square grooves (4) is arranged in the width direction of the ceramic substrate (1), and the plurality of heat-conducting square grooves (4) are arranged in sequence along the length direction of the ceramic substrate (1).
3. A dense ceramic substrate with high thermal conductivity according to claim 2, characterized in that: A heat dissipation aluminum foil strip (41) is arranged in each of the heat-conducting square grooves (4). The heat-dissipation aluminum foil strip (41) is filled in the heat-conducting square groove (4), and the thickness of the heat-dissipation aluminum foil strip (41) is slightly greater than the groove depth of the heat-conducting square groove (4).
4. A dense ceramic substrate with high thermal conductivity according to claim 1, characterized in that: The side walls of the ceramic substrate (1), the heat-conducting metal layer (3) and the heat-dissipating alloy layer (2) are jointly provided with a surrounding edging (5) for enhancing the stability of the substrate; the width of the surrounding edging (5) is equal to the total thickness of the ceramic substrate (1), the heat-conducting metal layer (3) and the heat-dissipating alloy layer (2); and the surrounding edging (5) is arranged along the circumferential direction of the ceramic substrate (1).
5. A dense ceramic substrate with high thermal conductivity according to claim 4, characterized in that: A plurality of micro heat dissipation fins (51) for dissipating heat are arranged on the surface of the surrounding edging (5), and the plurality of micro heat dissipation fins (51) are arranged in sequence along the arrangement direction of the surrounding edging (5).
6. A dense ceramic substrate with high thermal conductivity according to claim 5, characterized in that: The plurality of micro heat dissipation fins (51) are arranged obliquely on the surface of the surrounding edging (5), the inclination angle of the micro heat dissipation fins (51) ranges from 10 to 20 degrees, and adjacent micro heat dissipation fins (51) are arranged at intervals.
7. The dense ceramic substrate with high thermal conductivity according to claim 1, characterized in that: The heat-conducting channel (31) is arranged in a spiral shape inside the heat-conducting metal layer (3), and the center line of the heat-conducting channel (31) coincides with the center line of the heat-conducting metal layer (3).
8. A dense ceramic substrate with high thermal conductivity according to claim 7, characterized in that: One end of the heat-conducting metal layer (3) is in contact with the ceramic substrate (1), one end of the heat-conducting metal layer (3) is provided with a convex strip (33), the convex strip (33) is arranged along the length direction of the heat-conducting metal layer (3), and a groove (23) matching the convex strip (33) is provided on the surface of the heat-dissipating alloy layer (2).