Air cooling heat dissipation structure of VPX reinforcing module
By setting cold plates and mezzanine cold plates on the upper and lower surfaces of the daughter board of the VPX module, and hollowing out the position on the carrier board to increase the area of the mezzanine cold plate, the problem of air duct heat cascade in the air cooling and heat dissipation of the VPX module is solved, and the air duct heat cascade is realized More effective heat dissipation effect.
Patent Information
- Application Number
- CN202420929171.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-04-30
- Publication Date
- 2024-12-27
- Estimated Expiration
- 2034-04-30
AI Technical Summary
The air-cooled heat dissipation of the VPX module has an air duct cascade, resulting in unsatisfactory heat dissipation effect.
The daughter plate and the mezzanine cold plate are respectively arranged on the upper and lower surfaces of the daughter plate, and the carrier plate is connected through the connector to form an upper and lower air duct to avoid thermal cascade. At the same time, hollowing out the cover position on the carrier plate to increase the mezzanine cold plate Heat dissipation area.
Effectively isolate the air duct heat dissipation, improve the heat dissipation effect on the upper and lower surfaces of the daughter board, avoid heat cascade, and enhance the heat dissipation effect by increasing the heat dissipation area of the interlayer cold plate and using heat dissipation liner.
Smart Images
Figure CN222263465U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the field of air cooling and heat dissipation, in particular to an air cooling and heat dissipation structure of a VPX reinforcement module. Background Art
[0002] Chapter 5 and Chapter 6 of VITA46.0, the basic specification of VPX, stipulate the functional module sizes of 3U and 6U, of which the 6U board size is 160mm×233.35mm, which is relatively large in the specification. The application scenarios of modules that meet the VPX specification are increasing, and the functional types of modules are increasing, including but not limited to general computing modules, switching modules, heterogeneous computing modules, storage modules, etc.
[0003] The VPX modules currently installed in electronic devices can be divided into three types according to different heat dissipation methods: one is a conduction-cooled VPX module, one is an air-cooled VPX module, and one is a liquid-cooled VPX module.
[0004] Due to the continuous demand for module functions and performance improvement, multiple high-heat main chips are usually designed in one module and arranged on the same side of the module PCB. Limited by the area of the module PCB, it is difficult to completely displace the layout of each high-heat main chip in the air duct, thus forming a heat dissipation cascade, that is, the air inlet temperature of the downwind chip in the air cooling is the air outlet temperature of the upwind chip, and there is a situation where the upwind chip heats the downwind chip, which is very unfavorable for the heat dissipation of the downwind chip.
[0005] As mentioned above, there are many different VPX functional modules, but each module also has common designs, such as the VPX standard dimensions, backplane definition, module health management, power access, CPU and access interface. If these common designs are extracted and made into carrier boards, and special function main chips are made into functional sub-boards, the design of functional modules can be simplified by using carrier boards and sub-boards in combination. In this case, module function upgrades only upgrade the functional sub-boards, and module function replacement only replaces the functional sub-boards, while common carrier boards can be reused, including hardware reuse and software reuse.
[0006] Therefore, a structural method is proposed to change the module function by replacing the aforementioned functional sub-board and solve the heat cascade of the air duct of the high-heat-generating chip. Utility Model Content
[0007] The technical problem to be solved by the utility model is that the existing VPX module air-cooling heat dissipation has air duct thermal cascade, and the heat dissipation effect is not ideal.
[0008] The utility model arranges a sub-board cold plate and a sandwich cold plate on the upper and lower surfaces of the sub-board respectively, thereby avoiding the problem of heat cascade in the air duct and improving the heat dissipation effect.
[0009] The technical solution adopted is: a wind-cooled heat dissipation structure of a VPX reinforced module, the module includes a daughterboard cold plate, a daughterboard with a double-sided mounted heating device, a sandwich cold plate and a carrier board, the daughterboard is mounted on the carrier board, the daughterboard and the carrier board are connected by a connector, the top of the daughterboard is covered with a daughterboard cold plate for dissipating heat to the upper surface of the daughterboard, thereby forming an upper air duct that is convenient for dissipating heat to the upper surface of the daughterboard, a sandwich cold plate for dissipating heat to the lower surface of the daughterboard and the carrier board is provided between the daughterboard and the carrier board, thereby forming a lower air duct that is convenient for dissipating heat to the lower surface of the daughterboard, and the position on the carrier board covered by the projection of the daughterboard is hollowed out to facilitate the installation of the sandwich cold plate while increasing the heat dissipation effect of the sandwich cold plate.
[0010] The utility model dissipates heat to the sub-board with heating devices mounted on both sides through the sub-board cold plate and the interlayer cold plate respectively, while avoiding the problem of heat cascade in the air duct, and hollows out the projection covering position of the sub-board on the carrier board to increase the heat dissipation area of the interlayer cold plate, thereby enhancing the heat dissipation effect.
[0011] In a further preferred embodiment of the technical solution of the utility model, the number of the sub-boards is one or more, and the number of the sub-board cold plates is also one or more corresponding to the sub-boards, so that the carrier board can be used to install multiple sub-boards or one sub-board according to the functions to be realized.
[0012] In a further optimization of the technical solution of the utility model, the daughter board cold plate is provided with daughter board cold plate heat dissipation fins for enhancing heat dissipation, which are used to enhance the heat dissipation effect of the upper surface of the daughter board.
[0013] Further optimization of the technical solution of the utility model is that a sandwich cold plate heat dissipation fin is provided in the uncovered area of the sub-board on the upper surface of the sandwich cold plate, the top of the sandwich cold plate heat dissipation fin is flush with the top of the sub-board heat dissipation fin, and the sandwich cold plate heat dissipation fin is aligned with the sub-board heat dissipation fin, so as to reduce wind resistance, and is used to increase the heat dissipation effect without affecting the use of the overall module. At the same time, the carrier board can also dissipate heat through the sandwich cold plate.
[0014] In a further optimization of the technical solution of the utility model, interlayer cold plate heat dissipation fins are also provided at the relative position between the lower surface of the interlayer cold plate and the hollowed-out area of the carrier plate, so as to enhance the heat dissipation effect of the interlayer cold plate on the lower surface of the sub-plate.
[0015] In a further preferred embodiment of the technical solution of the utility model, a heat dissipation pad is provided between the heating device on the daughter board and the interlayer cold plate and the daughter board cold plate, for transferring the heat generated by the heating device on the daughter board to the interlayer cold plate and the daughter board cold plate through heat conduction.
[0016] In a further preferred embodiment of the technical solution of the utility model, the heat dissipation pad arranged between the heat generating device on the daughter board and the interlayer cold plate and the daughter board cold plate has a certain compression amount, so as to fill the gap between the heat generating device on the daughter board and the interlayer cold plate and the daughter board cold plate.
[0017] Compared with the prior art, the utility model has the following beneficial effects:
[0018] 1. In the present invention, the upper surface and the lower surface of the daughter board are in contact with the daughter board cold plate and the interlayer cold plate respectively, which is beneficial for the heat dissipation of the upper and lower surface devices of the daughter board through the isolation air duct to avoid thermal cascading.
[0019] 2. In the present invention, a heat dissipation pad with a certain amount of compression is installed between the heating device on the sub-board and the sub-board cold plate and the interlayer cold plate, so as to better transfer the heat generated by the heating device on the sub-board to the sub-board cold plate and the interlayer cold plate for heat dissipation.
[0020] 3. The interlayer cold plate of the utility model is also provided with interlayer cold plate heat dissipation fins at the relative position between the lower surface of the interlayer cold plate and the hollowed-out area of the carrier plate, so as to increase the heat dissipation area of the interlayer cold plate and thus enhance the heat dissipation effect of the interlayer cold plate on the lower surface of the sub-plate. BRIEF DESCRIPTION OF THE DRAWINGS
[0021] Figure 1 It is an exploded view of the overall structure of this embodiment;
[0022] Figure 2 It is a front view of this embodiment;
[0023] Explanation of the reference numerals: 10 - sub-board cold plate, 20 - sub-board, 30 - sandwich cold plate, 40 - carrier board, 50 - upward heat dissipation fins, 60 - downward heat dissipation fins. DETAILED DESCRIPTION
[0024] In order to make the purpose, technical solutions and advantages of the present invention more clearly understood, the present invention is further described in detail below in conjunction with the accompanying drawings and embodiments. Example 1
[0025] like Figure 1-2 As shown, an air-cooled heat dissipation structure of a VPX reinforcement module of the present embodiment, the module includes a daughter board cold plate 10, a daughter board 20 with a double-sided mounted heating device, a sandwich cold plate 30 and a carrier board 40, the sandwich cold plate 30 is installed between the daughter board 20 and the carrier board 40 to cover the entire carrier board 40, and is used for heat dissipation of the heat dissipation device on the lower surface of the daughter board 20 and the carrier board 40, the daughter board cold plate 10 is arranged on the daughter board 20 to cover the entire daughter board 20, and is used for heat dissipation of the heating device on the upper surface of the daughter board 20.
[0026] The carrier board 40 includes a PCB board of the standardized size of the VPX module. A connector connected to the daughter board 20 is also installed on the carrier board 40 to realize high-speed signal, power supply and general signal connection between the carrier board 40 and the daughter board 20. A connector for plugging with the connector on the carrier board 40 is also provided at a position relative to the connector on the carrier board 40 on the daughter board 20. The position on the interlayer cold plate 30 relative to the connector of the daughter board 20 and the carrier board 40 is hollowed out to facilitate the plugging of the connector on the carrier board 40 with the connector on the daughter board 20.
[0027] like Figure 1 As shown, the position on the carrier board 40 that is covered by the projection of the daughter board 20 is hollowed out, so as to facilitate the installation of the interlayer cold plate 30 and increase the heat dissipation effect of the interlayer cold plate 30.
[0028] The design size of the daughter board 20 matches the carrier board 40 and the interlayer cold plate 30 , and a plurality of heating devices are mounted on the upper surface and the lower surface of the daughter board 20 , respectively, which meets the diverse requirements of the daughter board.
[0029] like Figure 1 and Figure 2 As shown, in this embodiment, an upward heat dissipation fin 50 is provided in the uncovered area of the sub-plate 20 on the upper surface of the sandwich cold plate 30, and a downward heat dissipation fin 60 is provided in the hollowed-out area of the carrier plate 40 corresponding to the lower surface of the sandwich cold plate 30. The heat dissipation fins on the lower surface pass through the hollowed-out area of the carrier plate 40 to form double-sided heat dissipation fins, which jointly promote heat dissipation. The height of the heat dissipation fins on the upper and lower surfaces of the sandwich cold plate 30 is limited to not extending to the edge of the preset plate thickness, and the height of the fins is designed to be maximized, thereby increasing the heat dissipation area of the sandwich cold plate 30 and improving the heat dissipation effect.
[0030] like Figure 1 and Figure 2 As shown, in this embodiment, the upper surface of the daughter board cold plate 10 is also provided with upward heat dissipation fins 50, and the top height of the heat dissipation fins on the daughter board cold plate 10 is consistent with the top height of the heat dissipation fins on the upper surface of the interlayer cold plate 30, which is convenient for reducing the thickness of the entire VPX module. At the same time, the setting position of the heat dissipation fins on the daughter board cold plate 10 is aligned with the position of the heat dissipation fins on the upper surface of the interlayer cold plate 30, which is convenient for reducing wind resistance and accelerating heat dissipation.
[0031] In this embodiment, the interlayer cold plate 30 is fixed to the carrier plate 40 by screws, which reinforces the entire module. Then the sub-board 20 is installed on the combination formed by the interlayer cold plate 30 and the carrier plate 40 by screws. Finally, the sub-board cold plate 10 is fixed to the interlayer cold plate 30 and the sub-board 20 by screws.
[0032] like Figure 1 and Figure 2As shown, the two air ducts formed by the heat dissipation fins on the upper surface of the interlayer cold plate 30 and the heat dissipation fins on the upper surface of the daughter board cold plate 10 and the heat dissipation fins on the lower surface of the interlayer cold plate 30 are parallel, so there is no heating effect of the upstream on the downstream. At the same time, the heating devices on the daughter board 20 are placed on different surfaces of the daughter board 20, which can achieve isolation of the heat dissipation air ducts, thereby solving the problem of thermal cascade.
[0033] In this embodiment, a thermally conductive pad is further provided on the contact surface between the heat generating device on the daughter board 20 and the daughter board cold plate 10 and the interlayer cold plate 30. After the entire module is installed, the thermally conductive pad is compressed to a certain extent, which is conducive to the thermally conductive pad filling the gap between the heat generating device on the daughter board 20 and the daughter board cold plate 10 and the interlayer cold plate 30, thereby dissipating the heat generated by the heat generating device on the daughter board 20 to the interlayer cold plate 30 and the daughter board cold plate 10 through heat conduction.
[0034] The method for using the air-cooling heat dissipation structure of a VPX reinforced module in the present embodiment is as follows: before use, the daughter board 20, daughter board cold plate 10, and interlayer cold plate 30 that are to realize corresponding functions are installed on the carrier board 40 to form the entire module, and the module is inserted into the air-cooled VPX chassis. When the entire module is working, the heating devices on the upper and lower surfaces of the daughter board 20 begin to emit heat, and the heat is transferred to the daughter board cold plate 10 and the interlayer cold plate 30 respectively through the thermal conductive pad, the heat on the daughter board cold plate 10 is transferred to the heat dissipation fins of the daughter board cold plate 10, and the heat of the interlayer cold plate 30 is transferred to the heat dissipation fins of the interlayer cold plate 30. At the same time, part of the heat generated on the carrier board 40 is also transferred to the heat dissipation fins of the interlayer cold plate 30 through the interlayer cold plate 30, and the cold air in the air-cooled chassis passes through the heat dissipation fins of the daughter board cold plate 10 and the interlayer cold plate 30, thereby taking away the heat and completing the heat dissipation.
[0035] The above embodiments are only for illustrating the technical idea of the present utility model, and cannot be used to limit the protection scope of the present utility model. Any changes made on the basis of the technical solution in accordance with the technical idea proposed by the present utility model shall fall within the protection scope of the present utility model.
Claims
1. An air-cooling heat dissipation structure of a VPX reinforcement module, characterized in that: The module comprises a sub-board cold plate (10), a sub-board (20) with a double-sided mounted heating device, a sandwich cold plate (30) and a carrier (40); the carrier (40) is mounted with the sub-board (20); the sub-board (20) and the carrier (40) are connected via a connector; the top of the sub-board (20) is respectively covered with a sub-board cold plate (10) for dissipating heat from the upper surface of the sub-board (20), thereby forming an upper air duct that facilitates heat dissipation from the upper surface of the sub-board (20); a sandwich cold plate (30) is provided between the sub-board (20) and the carrier (40) for dissipating heat from the lower surface of the sub-board (20) and the carrier (40), thereby forming a lower air duct that facilitates heat dissipation from the lower surface of the sub-board (20); the position on the carrier (40) that is covered by the projection of the sub-board (20) is hollowed out, thereby facilitating the installation of the sandwich cold plate (30) and increasing the heat dissipation effect of the sandwich cold plate (30).
2. The air-cooling heat dissipation structure of a VPX reinforcement module according to claim 1 is characterized in that: The number of the sub-boards (20) is one or more, and the number of the sub-board cold plates (10) is also one or more, corresponding one to one with the sub-boards (20).
3. The air-cooling heat dissipation structure of the VPX reinforcement module according to claim 1 is characterized in that: The sub-board cold plate (10) is provided with heat dissipation fins of the sub-board cold plate (10) for enhancing heat dissipation.
4. The air-cooling heat dissipation structure of a VPX reinforcement module according to claim 1, characterized in that: The upper surface of the interlayer cold plate (30) is provided with a heat dissipation fin of the interlayer cold plate (30) in an area not covered by the sub-plate (20), the top of the heat dissipation fin of the interlayer cold plate (30) is flush with the top of the heat dissipation fin of the sub-plate (20), and the heat dissipation fin of the interlayer cold plate (30) is aligned with the heat dissipation fin of the sub-plate (20), thereby reducing wind resistance.
5. The air-cooling heat dissipation structure of a VPX reinforcement module according to claim 1, characterized in that: The interlayer cold plate (30) heat dissipation fins are also provided at a position relative to the hollowed-out area of the carrier plate (40) on the lower surface of the interlayer cold plate (30).
6. The air-cooling heat dissipation structure of a VPX reinforcement module according to claim 1, characterized in that: A heat dissipation pad is provided between the heat generating device on the sub-board (20), the interlayer cold plate (30) and the sub-board cold plate (10).
7. The air-cooling heat dissipation structure of a VPX reinforcement module according to claim 1, characterized in that: The heat-generating device arranged on the sub-board (20) and the heat-dissipating pad between the interlayer cold plate (30) and the sub-board cold plate (10) have a certain amount of compression.