Glue uniformizing device for semiconductor processing

Abstract

The utility model relates to the technical field of semiconductor processing, and discloses a glue uniformizing device for semiconductor processing, which comprises a glue uniformizing main machine, a driver is arranged at the top of the glue uniformizing main machine, a limiting ring is arranged on the outer side of the driver, a glue collecting pot is arranged between the driver and the limiting ring, a glue uniformizing lining is arranged in the glue collecting pot, and the glue uniformizing lining is arranged in the glue collecting pot. The glue collecting pot and the glue uniformizing lining are provided with insertion ports corresponding to the driver, a first substrate support is inserted into the insertion ports, four limiting blocks are arranged at the top of the first substrate support, and a second substrate support is inserted into the tops of the four limiting blocks. According to the glue uniformizing device for semiconductor processing, the two substrates are placed in the inner ring of the top of the first substrate support and the top of the second substrate support respectively, the second substrate support is driven to rotate together while the first substrate support is rotated through the driver, the glue uniformizing device can complete glue coating of the two substrates at the same time through one-time operation, and the production efficiency is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor processing, in particular to a glue spreading device for semiconductor processing. Background Art

[0002] A glue spreader is a device that drips various types of glue on a high-speed rotating substrate and uses centrifugal force to evenly coat the glue dripped on the substrate. The thickness of the film depends on the rotation speed of the glue spreader and the viscosity of the sol. For example, CN215390507U disclosed on the Chinese patent website is a glue spreader device and a glue spreader, including: a circular rotating platform for carrying a workpiece to be coated with glue, the rotating platform is provided with a circular guide rail concentric with the rotating platform; a driving mechanism, the driving mechanism drives the rotating platform to rotate; and a limit assembly, the limit assembly includes at least two fixed support rods, the support ends of the support rods are provided with rollers that cooperate with the circular guide rail, the rollers rotate on the circular guide rail as the rotating platform rotates, and at least two support rods are evenly distributed on the circular guide rail to form a limit support for the rotating platform. The cooperation between the roller and the rotating stage forms a guide limit for the rotation of the rotating stage, thereby reducing the shaking amplitude of the rotating stage during rotation and ensuring the smooth rotation of the wafer workpiece on the rotating stage. This can improve the uniformity of the thickness of the photoresist coated on the surface of the wafer and improve the quality of the product. However, the conventional coating machine can only complete the coating of one substrate each time, and the processing efficiency is low. Therefore, a coating device for semiconductor processing is proposed. Utility Model Content

[0003] In view of the deficiencies in the prior art, the utility model provides a glue coating device for semiconductor processing, which has the advantages of completing glue coating on two substrates in one operation, thereby improving production efficiency, etc., and solves the problem that conventional glue coating machines can only complete glue coating on one substrate in each operation, resulting in low processing efficiency.

[0004] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a glue spreading device for semiconductor processing, comprising a glue spreading main machine, a driver is arranged on the top of the glue spreading main machine, a limiting ring is arranged on the outside of the driver, a glue collecting pot is arranged between the driver and the limiting ring, a glue spreading lining is arranged inside the glue collecting pot, the glue collecting pot and the glue spreading lining are provided with plug-in interfaces at the positions corresponding to the driver, a No. 1 substrate holder is plugged into the plug-in interfaces, four limit blocks are arranged on the top of the No. 1 substrate holder, and a No. 2 substrate holder is plugged into the tops of the four limit blocks.

[0005] Preferably, the bottom of the No. 1 substrate holder is plugged into the plug interface, and the bottom is connected to a driver, so that the No. 1 substrate holder is rotated by the driver while the No. 2 substrate holder is driven to rotate together.

[0006] Preferably, the positions of the four limit blocks are designed to be at the outer circle of the top of the No. 1 substrate holder, and the inner circle of the top of the No. 1 substrate holder and the top of the No. 2 substrate holder are used to place substrates.

[0007] Preferably, the tops of the four limit blocks are each provided with a fixing groove, and the bottom of the No. 2 substrate holder is provided with a fixed support block at the position corresponding to the four limit blocks, and the No. 1 substrate holder and the No. 2 substrate holder are assembled into one by inserting the four fixed support blocks into the fixing grooves of the limit blocks.

[0008] Preferably, the sides of the four limiting blocks and the four fixed support blocks are provided with reinforcement openings, and the reinforcement openings of the limiting blocks are communicated with the fixing grooves.

[0009] Preferably, when the fixed support block is inserted into the fixed groove, the positions of the two reinforcement openings coincide, and rubber plugs are inserted into the reinforcement openings of the fixed support block and the limit block. By inserting the rubber plugs into the reinforcement openings of the fixed support block and the limit block, the connection between the No. 1 substrate holder and the No. 2 substrate holder is reinforced.

[0010] Compared with the prior art, the utility model provides a semiconductor processing glue spreading device, which has the following beneficial effects:

[0011] 1. The glue spreading device for semiconductor processing places two substrates into the inner circle of the top of substrate holder No. 1 and the top of substrate holder No. 2 respectively, and rotates substrate holder No. 1 through a driver while driving substrate holder No. 2 to rotate together, so that the device can complete glue coating of two substrates at the same time in one operation, thereby improving production efficiency.

[0012] 2. The semiconductor processing glue spreading device inserts four fixed support blocks into the fixed groove of the limit block, so that the No. 1 substrate holder and the No. 2 substrate holder are assembled into one body, and the connection between the No. 1 substrate holder and the No. 2 substrate holder is reinforced by inserting a rubber plug into the reinforced openings of the fixed support block and the limit block. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1 This is a schematic diagram of the overall cross-sectional structure of the utility model;

[0014] Figure 2 This is a schematic diagram of the structure of substrate holder No. 1 of the utility model;

[0015] Figure 3 This is a schematic diagram of the structure of substrate holder No. 2 of the utility model.

[0016] Among them: 1. Glue spreading main unit; 2. Driver; 3. Limiting ring; 4. Glue collecting pot; 5. Glue spreading lining; 6. Plug interface; 7. No. 1 substrate holder; 8. Limiting block; 9. No. 2 substrate holder; 10. Fixing groove; 11. Fixed support block; 12. Reinforced opening; 13. Rubber plug. DETAILED DESCRIPTION

[0017] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0018] See also Figure 1-3 The utility model provides the following technical solutions: a glue-splitting device for semiconductor processing, comprising a glue-splitting main machine 1, a driver 2 is arranged on the top of the glue-splitting main machine 1, a limiting ring 3 is arranged on the outside of the driver 2, a glue-collecting pot 4 is arranged between the driver 2 and the limiting ring 3, a glue-splitting lining 5 is arranged inside the glue-splitting pot 4, and a plug-in interface 6 is provided on the glue-splitting lining 5 at the position corresponding to the driver 2, a No. 1 substrate holder 7 is plugged into the plug-in interface 6, four limit blocks 8 are arranged on the top of the No. 1 substrate holder 7, and a No. 2 substrate holder 9 is plugged into the top of the four limit blocks 8;

[0019] The bottom of the No. 1 substrate holder 7 is plugged into the plug port 6, and the bottom is connected to the driver 2. The No. 1 substrate holder 7 is rotated by the driver 2, and the No. 2 substrate holder 9 is driven to rotate together;

[0020] The positions of the four limit blocks 8 are designed at the outer circle of the top of the No. 1 substrate holder 7, and the inner circle of the top of the No. 1 substrate holder 7 and the top of the No. 2 substrate holder 9 are used to place substrates;

[0021] The tops of the four limit blocks 8 are all provided with fixing grooves 10, and the bottom of the second substrate holder 9 is provided with fixing support blocks 11 at positions corresponding to the four limit blocks 8, and the first substrate holder 7 and the second substrate holder 9 are assembled into one by inserting the four fixing support blocks 11 into the fixing grooves 10 of the limit blocks 8;

[0022] The sides of the four limit blocks 8 and the four fixed support blocks 11 are all provided with reinforcement openings 12, and the reinforcement openings 12 of the limit blocks 8 are connected to the fixed grooves 10;

[0023] When the fixed support block 11 is inserted into the fixed groove 10, the positions of the two reinforcement openings 12 coincide, and rubber plugs 13 are inserted into the reinforcement openings 12 of the fixed support block 11 and the limit block 8. By inserting the rubber plug 13 into the reinforcement openings 12 of the fixed support block 11 and the limit block 8, the connection between the No. 1 substrate holder 7 and the No. 2 substrate holder 9 is reinforced.

[0024] When in use, the No. 1 substrate holder 7 and the No. 2 substrate holder 9 are assembled into one by inserting the four fixed support blocks 11 into the fixed groove 10 of the limit block 8, and the connection between the No. 1 substrate holder 7 and the No. 2 substrate holder 9 is reinforced by inserting the rubber plug 13 into the reinforcement opening 12 of the fixed support block 11 and the limit block 8. The two substrates are respectively placed in the inner circle of the top of the No. 1 substrate holder 7 and the top of the No. 2 substrate holder 9, and the No. 1 substrate holder 7 is rotated by the driver 2 while the No. 2 substrate holder 9 is driven to rotate together, so that the device can complete the gluing of two substrates at the same time in one operation, thereby improving production efficiency.

[0025] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A coating device for semiconductor processing, comprising a coating main machine (1), characterized in that: A driver (2) is arranged on the top of the glue-splitting main machine (1), a limiting ring (3) is arranged on the outer side of the driver (2), a glue collecting pot (4) is arranged between the driver (2) and the limiting ring (3), a glue-splitting lining (5) is arranged inside the glue collecting pot (4), and a plug-in interface (6) is provided between the glue collecting pot (4) and the glue-splitting lining (5) at a position corresponding to the driver (2), a substrate holder (7) is plugged into the plug-in interface (6), four limit blocks (8) are arranged on the top of the substrate holder (7), and a substrate holder (9) is plugged into the top of the four limit blocks (8).

2. The semiconductor processing coating device according to claim 1, characterized in that: The bottom of the first substrate holder (7) is plugged into the plug interface (6), and the bottom is connected to the driver (2).

3. The semiconductor processing coating device according to claim 1, characterized in that: The positions of the four limit blocks (8) are designed at the outer circle of the top of the No. 1 substrate holder (7), and the inner circle of the top of the No. 1 substrate holder (7) and the top of the No. 2 substrate holder (9) are used to place substrates.

4. The semiconductor processing coating device according to claim 1, characterized in that: The tops of the four limit blocks (8) are each provided with a fixing groove (10), and the bottom of the second substrate holder (9) is provided with a fixing support block (11) at positions corresponding to the four limit blocks (8).

5. The semiconductor processing coating device according to claim 1, characterized in that: The sides of the four limit blocks (8) and the four fixed support blocks (11) are all provided with reinforcement openings (12), and the reinforcement openings (12) of the limit blocks (8) are in communication with the fixed grooves (10).

6. The semiconductor processing coating device according to claim 4, characterized in that: When the fixed support block (11) is inserted into the fixed groove (10), the positions of the two reinforcement openings (12) coincide with each other, and rubber plugs (13) are inserted into the reinforcement openings (12) of the fixed support block (11) and the limit block (8).

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