Electronic product glue pouring jig and electronic product glue sealing device applying same

Abstract

The utility model provides an electronic product glue pouring jig and an electronic product glue sealing device using the same. The electronic product glue pouring jig comprises a first die body, a second die body, a first sealing part and a second sealing part, wherein the first die body is provided with a first abdicating groove, a first cavity and a pair of chamfered inclined surfaces; the second die body is provided with a second avoiding groove and a second cavity; the connecting rod is matched with the first receding groove and the second receding groove in appearance, and the hinged end of the connecting rod is hinged into the second receding groove. The handle part is connected to the movable end of the connecting rod and matched with the pair of chamfering slopes, and the width of the handle part is larger than that of the first receding groove; the first butt joint end and the second butt joint end are in butt joint through a connecting piece, so that the first butt joint opening and the second butt joint opening, the first upper opening and the second upper opening and the first receding groove and the second receding groove are in butt joint respectively, and a glue sealing cavity is defined by the first cavity and the second cavity. The connecting rod is pulled to turn over close to the first receding groove until the handle part extrudes and crosses the pair of chamfering slopes, the first die body and the second die body are pressed for die assembly, and die assembly and die opening operation of the jig is more convenient.

Description

Technical Field

[0001] The utility model relates to the technical field of electronic product glue sealing, in particular to an electronic product glue filling fixture and an electronic product glue sealing device using the same. Background Art

[0002] When electronic products work in harsh environments or working conditions such as high humidity, high temperature, extreme cold, high radiation, high dust, high impact, and corrosion, their highly sensitive electronic devices and circuit boards are easily contaminated or corroded by external moisture, dust, radiation sources, and chemical substances, or damaged or failed due to high temperature, extreme cold or impact. Therefore, for equipment that needs to operate in harsh environments or working conditions, such as automobiles, ship electronic systems, aerospace equipment, etc., it is often necessary to pot the electronic devices and circuit boards of the electronic products of the equipment with protective glue to form a protective sealing layer wrapped around the key parts of the electronic devices and circuit boards, and to encapsulate, fix and protect the electronic devices and circuit boards, thereby improving the anti-vibration, insulation, thermal conductivity (heat resistance), cold resistance, dust resistance, impact resistance, radiation resistance, corrosion resistance and electromagnetic shielding performance of the electronic devices and circuit boards, thereby ensuring the operating stability, reliability and environmental adaptability of the electronic devices and circuit boards, and greatly extending their service life.

[0003] The existing electronic product glue potting jig (mold) has a complex connection structure for connecting the front mold and the rear mold, which makes the front and rear mold closing and opening operations very cumbersome and inconvenient, reducing the production efficiency of electronic product glue sealing; at the same time, the front mold and the rear mold are usually connected by positioning pins, which inevitably leads to a slight gap between the butt contact surfaces of the front and rear molds, making it difficult to keep the joints of the front and rear molds tightly fitted, which easily causes the uncured potting colloid in the cavity to overflow through the gap between the front and rear molds and leak glue in some positions in the cavity, ultimately resulting in more gaps in the potting colloid after curing, reducing the protective effect of the potting colloid after molding on electronic devices and circuit boards.

[0004] In addition, when the bottom surface of the electronic device is uneven or needs to be surrounded by the potting colloid for protection, the electronic device needs to be fixed in a certain position in the cavity in a certain posture (maintaining a certain distance from the inner wall of the cavity) so that the electronic device after the potting colloid is accurately positioned relative to the electronic product shell. Traditional electronic product potting jigs usually use a method of adding support rods or positioning pins in the cavity to fix the electronic device with an uneven bottom surface or the electronic device that needs to be surrounded by the potting colloid for protection. As a result, after demoulding, there will be gaps at the position where the electronic device contacts the support rods and positioning pins, causing the potting colloid to be unable to be completely sealed and thus reduce its protection performance. At the same time, the rigid connection between the support rods, positioning pins and the electronic device is also easy to cause damage to the electronic device; if the fixing method of support rods and positioning pins is not adopted and the electronic device is allowed to float in the potting colloid filled in the cavity, the relative position of the electronic device in the potting colloid is difficult to fix, resulting in the inability to accurately position the electronic device relative to the electronic product shell in the potting colloid that is solidified after demoulding, increasing the defective rate and production cost and reducing production efficiency. Utility Model Content

[0005] The utility model provides an electronic product glue pouring jig to solve the technical problem of inconvenient mold closing and opening operations of front and rear molds of the electronic product glue pouring jig in the prior art.

[0006] In order to solve the above problems, the technical solution adopted by the utility model is:

[0007] The utility model provides a glue filling fixture for electronic products, comprising:

[0008] A first mold body, a first clearance groove is provided in the middle of the top surface of the first mold body, and the first clearance groove passes through the first butt end of the first mold body and the other end opposite to the first butt end; the first butt end is provided with a first cavity on at least one side of the first clearance groove, the first cavity forms a first upper opening on the top surface of the first mold body, and the first cavity forms a first docking interface connected to the first upper opening at the first butt end; a pair of chamfered inclined surfaces are respectively provided on the top surface of the other end of the first mold body on both sides of the first clearance groove;

[0009] A second mold body, a second clearance groove matching the first clearance groove is provided in the middle of the top surface of the second mold body, and the second clearance groove runs through the second butt end of the second mold body and the other end opposite to the second butt end; a second cavity matching the first cavity is provided at the second butt end, the second cavity forms a second upper opening on the top surface of the second mold body, and the second cavity forms a second butt port communicating with the second upper opening at the second butt end;

[0010] A connecting rod, the shape of which matches the first and second clearance grooves, and one end of which is a hinged end hinged in the second clearance groove; a handle portion, which is connected to the movable end of the connecting rod opposite to the hinged end and matches a pair of chamfered inclined surfaces, and the width of the handle portion is greater than the width of the first clearance groove;

[0011] The first butt joint end and the second butt joint end are connected to each other through at least one connecting piece, so that the first butt joint and the second butt joint, the first upper opening and the second upper opening, the first make way groove and the second make way groove are matched and connected respectively, and the first cavity and the second cavity are surrounded by a glue-sealed cavity, and the first mold body and the second mold body are pressed and molded together by pulling the connecting rod to flip close to the first make way groove until the handle part squeezes and passes over a pair of chamfered inclined surfaces.

[0012] Preferably, the first docking end is provided with a first clamping portion surrounding the first docking interface, and the second docking end is provided with a second clamping portion surrounding the second docking interface and matching with the first clamping portion;

[0013] When the first butt joint end and the second butt joint end are butt jointed to form a glue-sealed cavity, the first clamping portion and the second clamping portion cooperate to achieve sealing of the glue-sealed cavity.

[0014] Furthermore, a convex column is coaxially arranged in the middle of the end surface of the movable end, the outer diameter of the convex column is smaller than the outer diameter of the connecting rod, and a mounting step is formed between the end surface of the movable end and the convex column; a limiting cap is arranged at the end of the convex column away from the connecting rod, and the outer diameter of the limiting cap is larger than the outer diameter of the convex column; the handle part is cylindrical, the inner diameter of the inner hole of the handle part matches the outer diameter of the convex column, and the handle part is sleeved on the outer side of the convex column through the inner hole; the electronic product glue filling fixture also includes:

[0015] A spring is sleeved on the convex column, one end of the spring abuts against the mounting step, and the other end of the spring abuts against the handle;

[0016] When the first butt joint end and the second butt joint end are connected to each other and the connecting rod is flipped close to the first clearance groove until the handle part squeezes the chamfered inclined surface, the handle part slides away from the connecting rod along the protruding column, and the spring is in a stretched state, so that the handle part can pass over the pair of chamfered inclined surfaces;

[0017] After the handle passes over a pair of chamfered surfaces, the handle slides along the protruding column close to the connecting rod under the restoring action of the spring until the handle is pressed against the first mold body to press the first mold body and the second mold body together.

[0018] Preferably, the inner side wall of the first chamber is provided with at least one first positioning groove extending perpendicularly to the bottom surface of the first chamber;

[0019] The inner side wall of the second chamber is provided with at least one second positioning groove extending perpendicularly to the bottom surface of the second chamber.

[0020] Preferably, the first chamber and the second chamber are both rectangular, the first docking interface and the second docking interface are both U-shaped, the first clamping portion is a U-shaped clamping groove matching the shape of the first docking interface, and the second clamping portion is a U-shaped clamping strip matching the shape of the second docking interface.

[0021] Preferably, the first butt end is provided with at least one first mounting hole, and the second butt end is provided with a second mounting hole matching the first mounting hole; the connecting member comprises:

[0022] A docking bushing, embedded in the second mounting hole;

[0023] A positioning pin, one end of which is embedded in the docking bushing;

[0024] The other end of the positioning pin is positioned and matched with the corresponding first mounting hole so that the first butt joint end and the second butt joint end are butted against each other.

[0025] Furthermore, a mounting groove is provided on the bottom surface of the second mold body, and a avoidance hole communicating with the second chamber is provided on the top surface of the mounting groove;

[0026] Electronic product glue filling fixtures also include:

[0027] An insert that matches the shape of the mounting slot;

[0028] The insert is detachably embedded in the installation groove and is used for closing the avoidance hole during glue sealing.

[0029] Preferably, the first butt end is provided with a pair of first chambers on both sides of the first clearance groove.

[0030] Preferably, the second mold body is provided with a pair of axial holes on both sides of the second clearance groove respectively, the hinged end is fixedly mounted on the hinged shaft, and the two ends of the hinged shaft are respectively hinged in the pair of axial holes.

[0031] The utility model also provides an electronic product glue sealing device, comprising the above-mentioned electronic product glue filling fixture, and a glue filling mechanism used for filling the electronic product glue filling fixture with protective glue material.

[0032] Compared with the prior art, the utility model has the following beneficial effects:

[0033] The electronic product glue potting jig provided by the utility model can quickly and conveniently realize the front and rear mold closing and mold opening operations of the first mold body and the second mold body by pulling the connecting rod with a resettable handle part at the end; the first clamping part and the second clamping part of the mold joint surface of the front and rear molds cooperate to realize the sealing of the glue sealing cavity to prevent glue leakage, and the reset effect of the spring and the pressing effect of the handle part 4 and the connecting rod 3 on the mold closing of the first mold body and the second mold body can realize the sealing of the glue sealing cavity, prevent a large amount of glue leakage of the potting colloid, and improve the protective effect of the potting colloid on the electronic product; at the same time, the positioning groove in the glue sealing cavity is used to clamp the exposed circuit board in front of the potting protective glue to improve the accuracy of the electronic device in the potting colloid and the product shell, so as to realize the precise positioning of the electronic device and the shell. BRIEF DESCRIPTION OF THE DRAWINGS

[0034] In order to more clearly illustrate the technical solution proposed by the utility model, it is described in detail below in combination with the embodiments and drawings. It should be understood that the drawings described below are only some embodiments of the utility model. For ordinary technicians in this field, these drawings can be changed under the concept of the utility model.

[0035] Figure 1 The overall assembly of the embodiment of the electronic product glue filling fixture provided by the utility model is a three-dimensional Figure 1 ;

[0036] Figure 2 for Figure 1 The overall exploded structure of the electronic product glue filling fixture in the stereogram;

[0037] Figure 3 The overall assembly of the embodiment of the electronic product glue filling fixture provided by the utility model is a three-dimensional Figure 2 ;

[0038] Figure 4 for Figure 3 The overall exploded structure of the electronic product glue filling fixture in the stereogram;

[0039] Figure 5 The overall assembly of the embodiment of the electronic product glue filling fixture provided by the utility model is a three-dimensional Figure 3 ;

[0040] Figure 6 for Figure 5 The overall exploded structure of the electronic product glue filling fixture in the stereogram;

[0041] Figure 7 This is a front view of the overall assembly of an embodiment of the electronic product glue filling fixture provided by the utility model;

[0042] Figure 8 This is a rear view of the overall assembly of an embodiment of the electronic product glue filling fixture provided by the utility model;

[0043] Fig. 9 This is a side view of the overall assembly of an embodiment of the electronic product glue filling fixture provided by the utility model;

[0044] Fig.10 This is a top view of the overall assembly of an embodiment of the electronic product glue filling fixture provided by the utility model;

[0045] Fig.11 The utility model is provided for an overall assembly bottom view of an embodiment of the electronic product glue filling fixture provided by the utility model.

[0046] Among them, the main marks of the drawings in the figure are as follows:

[0047] 1. First mold body; 11. First clearance groove; 12. First docking end; 121. First clamping part; 122. First mounting hole; 13. First chamber; 131. First upper opening; 132. First docking interface; 14. Chamfered slope; 133. Protrusion; 2. Second mold body; 21. Second clearance groove; 211. Axis hole; 22. Second docking end; 221. Second clamping part; 222. Second mounting hole; 23. Second chamber; 231. Second upper opening; 232. Second docking interface; 24. Mounting groove ; 241, avoidance hole; 242, threaded hole; 25, bottom step; 251, protrusion; 252, vertical through hole; 3, connecting rod; 31, hinged end; 311, hinged hole; 32, movable end; 33, boss; 331, fixing hole; 34, installation step; 35, limit cap; 351, screw through hole; 4, handle; 41, inner hole; 42, annular flange; 5, docking bushing; 51, locating pin; 6, hinged shaft; 7, insert; 71, connecting hole; 8, bottom mounting hole; 9, bottom bushing. DETAILED DESCRIPTION

[0048] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present invention more clearly understood, the following is a summary of the technical problems, technical solutions and beneficial effects to be solved by the present invention. Figure 1-11 And embodiments, the utility model is further described in detail.

[0049] Please also read Figure 1-6 The electronic product glue filling fixture provided by the utility model includes:

[0050] A first mold body 1, a first clearance groove 11 is provided in the middle of the top surface of the first mold body 1, and the first clearance groove 11 passes through the first docking end 12 of the first mold body 1 and the other end opposite to the first docking end 12; the first docking end 12 is provided with a first cavity 13 on at least one side of the first clearance groove 11, the first cavity 13 forms a first upper opening 131 on the top surface of the first mold body 1, and the first cavity 13 forms a first docking port 132 communicating with the first upper opening 131 at the first docking end 12; a pair of chamfered inclined surfaces 14 are respectively provided on the top surface of the other end of the first mold body 1 on both sides of the first clearance groove 11;

[0051] The second mold body 2 has a second paving groove 21 matching the first paving groove 11 in the middle of the top surface of the second mold body 2, and the second paving groove 21 passes through the second butt end 22 of the second mold body 2 and the other end opposite to the second butt end 22; the second butt end 22 has a second cavity 23 matching the first cavity 13, and the second cavity 23 forms a second upper opening 231 matching the first upper opening 131 on the top surface of the second mold body 2, and the second cavity 23 forms a second docking port 232 communicating with the second upper opening 231 and matching the first docking port 132 at the second butt end 22;

[0052] A connecting rod 3, the shape of which matches the first clearance groove 11 and the second clearance groove 21, and the length of which is greater than the sum of the lengths of the first clearance groove 11 and the second clearance groove 21; one end of the connecting rod 3 is a hinged end 31 hinged in the second clearance groove 21, and the connecting rod 3 hinged in the second clearance groove 21 extends out of the second clearance groove 21; a handle portion 4 is connected to a movable end 32 of the connecting rod 3 relative to the hinged end 31, and the handle portion 4 is connected to the position of the connecting rod 3 so that the distance between the handle portion 4 and the movable end 32 matches the position of a pair of chamfered inclined surfaces 14 when the first mold body 1 and the second mold body 2 are molded together and the first clearance groove 11 and the second clearance groove 21 are connected, and the width of the handle portion 4 is greater than the width of the first clearance groove 11;

[0053] The first docking end 12 and the second docking end 22 are connected to each other through at least one connecting piece, so that the first docking port 132 and the second docking port 232, the first upper opening 131 and the second upper opening 231, the first make way groove 11 and the second make way groove 21 are matched and docked respectively, and the first chamber 13 and the second chamber 23 are surrounded by a glue-sealed cavity, and the connecting rod 3 is driven to flip close to the first make way groove 11 (away from the second make way groove 21) by pulling the handle portion 4, until the movement trajectory of the handle portion 4 flipping around the hinged end 31 passes through a pair of chamfered inclined surfaces 14, and the handle portion 4 is further pulled in a direction away from the first mold body 1, so that the handle portion 4, which is wider than the first make way groove 11, is squeezed obliquely downward on its left and right sides and passes over the pair of chamfered inclined surfaces 14, so that the handle portion 4 abuts against the other end of the first mold body 1 away from the second mold body 2, and the first mold body 1 and the second mold body 2 are pressed and molded together through the handle portion 4 and the connecting rod 3 connected thereto.

[0054] Please also read Figure 1-6 In this embodiment, the first mold body 1 is in a rectangular parallelepiped shape, and the first mold body 1 serves as a front mold of the electronic product glue-filling fixture, and the horizontal bottom surface of the first mold body 1 serves as its support surface. The first clearance groove 11 is provided in the middle of the horizontal top surface of the first mold body 1, and the first clearance groove 11 horizontally penetrates the first docking end 12 of the first mold body 1 and the other end opposite to the first docking end 12 in the front-to-back direction; the first docking end 12 is the vertical rear end of the first mold body 1, and the first cavity 13 forms a first upper opening 131 on the horizontal top surface of the first mold body 1, and the first cavity 13 forms a first docking interface 132 on the vertical rear end surface of the first docking end 12, and the top of the first docking interface 132 is connected to the rear of the first upper opening 131;

[0055] The second mold body 2 is in a rectangular parallelepiped shape matching the shape of the first mold body 1, and the second mold body 2 serves as the rear mold of the electronic product glue filling fixture, and the horizontal bottom surface of the second mold body 2 serves as its support surface. The second make way groove 21 is arranged in the middle of the horizontal top surface of the second mold body 2, and the second make way groove 21 horizontally penetrates the second docking end 22 of the second mold body 2 and the other end opposite to the second docking end 22 in the front-to-back direction; the second docking end 22 is the vertical front end of the second mold body 2, and the second cavity 23 forms a second upper opening 231 on the horizontal top surface of the second mold body 2, and the second cavity 23 forms a second docking interface 232 on the vertical front end surface of the second docking end 22, and the top of the second docking interface 232 is connected to the front of the second upper opening 231.

[0056] In other embodiments, the first mold body 1 may also be used as a rear mold of the electronic product glue-potting jig, and the second mold body 2 may be used as a front mold of the electronic product glue-potting jig accordingly.

[0057] Please also read Figure 1-6In this embodiment, the first docking end 12 is provided with a first clamping portion 121 surrounding the first docking port 132, and the second docking end 22 is provided with a second clamping portion 221 surrounding the second docking port 232 and matching the first clamping portion 121;

[0058] When the first butt end 12 and the second butt end 22 are butt-jointed to form a glue-sealed cavity, the first clamping portion 121 and the second clamping portion 221 cooperate with each other, and the resetting effect of the spring and the pressing effect of the handle portion 4 and the connecting rod 3 on the mold are combined to achieve sealing of the glue-sealed cavity, thereby preventing a large amount of leakage of the potting colloid and improving its protective effect.

[0059] Please also read Figure 1-6 In this embodiment, the first chamber 13 and the second chamber 23 are both rectangular (rectangular), the first docking port 132 and the second docking port 232 are both U-shaped, the first clamping portion 121 is a U-shaped clamping groove that matches the shape of the first docking port 132, one end of the U-shaped clamping groove extends upward from one side of the first docking port 132 to the top surface of the first mold body 1, and forms a notch at the connection between the top surface of the first mold body 1 and the first docking end 12 (the edge of the top surface); the other end of the U-shaped clamping groove surrounds the first docking port 132, and then extends upward from the other side of the first docking port 132 to the top surface of the first mold body 1, and forms another notch at the connection between the top surface of the first mold body 1 and the first docking end 12 (the edge of the top surface);

[0060] The second clamping portion 221 is a U-shaped clamping strip that matches the shape of the second docking port 232. One end of the U-shaped clamping strip extends upward from one side of the second docking port 232 to the top surface of the second mold body 2, and is flush with the top surface (edge ​​of the top surface) of the first mold body 1; the other end of the U-shaped clamping strip surrounds the second docking port 232, and then extends upward from the other side of the second docking port 232 to the top surface of the second mold body 2, and is flush with the top surface (edge ​​of the top surface) of the first mold body 1.

[0061] In other embodiments, the first clamping portion 121 may also be a first clamping strip, and correspondingly, the second clamping portion 221 is a second clamping groove matching the first clamping strip.

[0062] Please also read Figure 1-6In this embodiment, a boss 33 is coaxially arranged with the connecting rod 3 at the middle of the end face of the movable end 32 away from the hinged end 31, and the boss 33 is used as an extension of the connecting rod 3 at the movable end 32, so that the length of the connecting rod 3 plus the boss 33 is greater than the total length after the first clearance groove 11 and the second clearance groove 21 are connected; the outer diameter of the boss 33 is smaller than the outer diameter of the connecting rod 3, and a mounting step 34 is formed between the end face of the movable end 32 and the boss 33; a limiting cap 35 is arranged at the end of the boss 33 away from the connecting rod 3, and the outer diameter of the limiting cap 35 is greater than the outer diameter of the boss 33; the handle part 4 is cylindrical, and the inner diameter of the inner hole 41 of the handle part 4 matches the outer diameter of the boss 33. The handle part 4 is sleeved on the outer side of the boss 33 through the inner hole 41, and the limiting cap 35 limits the sliding stroke of the handle part 4 along the boss 33 away from the connecting rod 3 to prevent the handle part 4 from falling off the boss 33; the electronic product glue filling fixture also includes:

[0063] A spring (not shown) is sleeved on the boss 33, with one end of the spring abutting against the mounting step 34 and the other end of the spring abutting against the handle portion 4;

[0064] When the first butt end 12 and the second butt end 22 are butted against each other, and the connecting rod 3 is flipped close to the first clearance groove 11 until the handle portion 4 presses the chamfered inclined surface 14, the handle portion 4 is pushed by the reaction force of the chamfered inclined surface 14 and slides along the protrusion 33 away from the connecting rod 3. At this time, the spring is in a stretched state, so that the handle portion 4 can pass over the pair of chamfered inclined surfaces 14.

[0065] After the handle portion 4 passes over the pair of chamfered slopes 14, the handle portion 4 is no longer affected by the chamfered slopes 14 because it is separated from the chamfered slopes 14, so that the handle portion 4 is reset and slid along the protruding column 33 close to the connecting rod 3 under the restoring action of the spring, and at the same time, the handle portion 4 is pulled to continue to approach the other end of the first mold body 1 away from the second mold body 2 and flip until the handle portion 4 is pressed against the other end of the first mold body 1 away from the second mold body 2, so that the connecting rod 3 and the handle portion 4 transmit the pressing force under the action of the restoring pressure of the spring, thereby conveniently and quickly realizing the operation of pressing and closing the first mold body 1 and the second mold body 2.

[0066] When the first mold body 1 and the second mold body 2 need to be opened, the handle portion 4 only needs to be pulled in the opposite direction in the direction close to the second mold body 2 (away from the first mold body 1), thereby driving the connecting rod 3 to flip close to the second clearance groove 21, until the handle portion 4 presses the chamfered inclined surface 14 obliquely upward, and the handle portion 4 is pushed by the reaction force of the chamfered inclined surface 14 and slides away from the connecting rod 3 along the protrusion 33. At this time, the spring is in a stretched state, so that the handle portion 4 can pass over the pair of chamfered inclined surfaces 14;

[0067] After the handle portion 4 passes over the pair of chamfered slopes 14, the handle portion 4 is no longer affected by the chamfered slopes 14 due to its separation from the chamfered slopes 14, so that the handle portion 4 is reset and slid along the boss 33 close to the connecting rod 3 under the reset action of the spring, and at the same time, the handle portion 4 is pulled to continue to approach the second mold body 2 and flip. At this time, since the handle portion 4 has been separated from the first mold body 1, the handle portion 4 and the connecting rod 3 no longer have a pressing effect on the first mold body 1 and the second mold body 2, and the first mold body 1 and the second mold body 2 can be easily pulled relative to each other to release the connection of the connecting piece, thereby conveniently and quickly realizing the front and rear mold opening operation of the electronic product glue filling fixture.

[0068] Please also read Figure 1-6 In this embodiment, a fixing hole 331 is provided on the end face of the boss 33 away from the connecting rod 3, and the limiting cap 35 is a hexagonal gasket. A screw through hole 351 matching the fixing hole 331 is provided in the middle of the hexagonal gasket. A screw (not shown in the figure) passes through the screw through hole 351 and the fixing hole 331, so that the hexagonal gasket is detachably connected to the end of the boss 33 away from the connecting rod 3, so that when the hexagonal gasket is removed from the end of the boss 33, the handle part 4 and the spring can be disassembled and assembled on the boss 33.

[0069] Please also read Figure 1-6 In this embodiment, an annular flange 42 surrounding the handle portion 4 is provided at the end circumferential side of the handle portion 4 away from the connecting column, so that the operator can hold the annular flange 42 when pulling the handle portion 4, thereby facilitating the operation of applying force to the handle portion 4.

[0070] Please also read Figure 1-6 In this embodiment, the inner side wall of the first chamber 13 is provided with at least one first positioning groove (not shown in the figure) extending perpendicularly to the bottom surface of the first chamber 13; the inner side wall of the second chamber 23 is provided with at least one second positioning groove (not shown in the figure) extending perpendicularly to the bottom surface of the second chamber 23.

[0071] After the first mold body 1 and the second mold body 2 are closed and the first cavity 13 and the second cavity 23 are surrounded by a sealing cavity, the electronic product (not shown in the figure) before being potted with protective glue is placed in the sealing cavity through its vertically arranged exposed circuit board, and the horizontal bottom surface of the circuit board is supported on the horizontal bottom surface of the sealing cavity, and the horizontal two side surfaces of the circuit board are embedded in the corresponding first positioning groove and / or second positioning groove of the inner wall of the first cavity 13 and / or the second cavity 23. Therefore, when the lower bottom surface of the electronic device is uneven or needs to be surrounded and protected by the potting glue on all sides, the electronic device can be kept fixed in a certain position in the cavity in a certain posture (keeping a certain distance from the inner wall of the cavity), so that the electronic device after the potting glue is completed can be accurately positioned relative to the electronic product shell, thereby improving the accuracy of the inner cavity profiling of the electronic product shell after the potting glue is cured and formed, facilitating the subsequent rapid and accurate assembly of the electronic product and its potting glue with the electronic product shell, reducing the defective rate and production cost and improving production efficiency.

[0072] At the same time, the use of the electronic product glue potting jig provided by the utility model can also avoid the problem that the traditional electronic product glue potting jig uses a method of adding support rods or positioning pins 51 in the cavity to fix the electronic device, resulting in gaps at the contact positions of the electronic device and the support rods and positioning pins 51 after demolding, causing the potting colloid to be unable to be completely sealed and thus reducing its protection performance, and the problem that the rigid connection between the support rods, positioning pins 51 and the electronic device is likely to cause damage to the electronic device.

[0073] Please also read Figure 1-6 In this embodiment, at least one protrusion 133 is provided on the inner side wall of the first cavity 13 and / or the second cavity 23, and the position and shape of the protrusion 133 match the corresponding inner surface protrusion structure of the electronic product shell. By providing the protrusion 133 on the inner side wall of the first cavity 13 and / or the second cavity 23, after the first mold body 1 and the second mold body 2 are opened and the potting colloid is cured and formed, the potting colloid can form a concave structure matching the protrusion 133 during subsequent assembly, so that the concave structure avoids the corresponding protrusion structure on the inner surface of the electronic product shell, thereby reducing the assembly interference between the electronic product and the shell.

[0074] Please also read Figure 1-6 In this embodiment, the first butt end 12 is provided with at least one first mounting hole 122, and the second butt end 22 is provided with a second mounting hole 222 matching the first mounting hole 122; the connecting member includes:

[0075] The docking bushing 5 is embedded in the second mounting hole 222; the positioning pin 51, one end of which is embedded in the docking bushing 5;

[0076] The other end of the positioning pin 51 is positioned and matched with the corresponding first mounting hole 122, so that the first docking end 12 and the second docking end 22 are connected to each other, thereby improving the positioning and docking matching accuracy of the glue-sealed cavity surrounded by the first mold body 1 and the second mold body 2, the first docking end 12 and the second docking end 22, the first docking interface 132 and the second docking interface 232, the first upper opening 131 and the second upper opening 231, the first make way groove 11 and the second make way groove 21, and the first cavity 13 and the second cavity 23, thereby improving the matching accuracy of the outer shape of the potting colloid after curing and the inner cavity shape of the electronic product shell.

[0077] Please also read Figure 1-6 In this embodiment, the first docking end 12 is provided with a pair of first mounting holes 122 on both sides of the first make way groove 11, and correspondingly, the second docking end 22 is provided with a pair of second mounting holes 222 matching the first mounting holes 122 on both sides of the second make way groove 21, and a pair of docking bushings 5 ​​are respectively embedded in the pair of second mounting holes 222; one ends of a pair of locating pins 51 are respectively embedded in the pair of docking bushings 5, and the other ends of the pair of locating pins 51 are respectively positioned and matched with the pair of first mounting holes 122.

[0078] Please also read Figure 1-6 In this embodiment, the first docking end 12 is provided with a pair of first cavities 13 on both sides of the first make way groove 11, and correspondingly, the second docking end 22 is provided with a pair of second cavities 23 matching the first cavities 13 on both sides of the second make way groove 21, so that after the first mold body 1 and the second mold body 2 are molded together, the pair of first cavities 13 and the second cavity 23 can respectively and simultaneously enclose a pair of glue sealing cavities, and the electronic product glue filling fixture can form a pair of electronic product filling colloids at one time.

[0079] In another embodiment (not shown in the figure), the first docking end 12 is provided with a single first cavity 13 only on one side of the first clearance groove 11, and correspondingly, the second docking end 22 is provided with a second cavity 23 matching the first cavity 13 only on one side of the second clearance groove 21, so that after the first mold body 1 and the second mold body 2 are molded together, the single first cavity 13 and the single second cavity 23 only form one glue sealing cavity, and the electronic product glue filling fixture only molds the filling colloid of one electronic product at a time.

[0080] In other embodiments (not shown in the figures), the first docking end 12 is provided with at least two first chambers 13 on one side of the first give way groove 11, and the first docking end 12 is provided with at least one first chamber 13 on the other side of the first give way groove 11. Correspondingly, the second docking end 22 is provided with at least two second chambers 23 matching the first chamber 13 on one side of the second give way groove 21, and the second docking end 22 is provided with at least one second chamber 23 matching the first chamber 13 on the other side of the second give way groove 21, so that after the first mold body 1 and the second mold body 2 are molded together, the multiple first chambers 13 and the multiple second chambers 23 only surround one glue sealing cavity, and the electronic product glue filling fixture can form the sealing colloids of multiple electronic products at one time.

[0081] Please also read Figure 1-6 In this embodiment, the second mold body 2 is provided with a pair of axial holes 211 on both sides of the second clearance groove 21, and the hinged end 31 is hinged to the hinge shaft 6, and the two ends of the hinge shaft 6 are fixedly connected to the pair of axial holes 211 respectively.

[0082] Please also read Figure 1-6 As a preferred implementation of this embodiment, a pair of axial holes 211 are coaxially arranged on both sides of the second clearance groove 21, and the hinged end 31 of the connecting rod 3 is provided with a hinged hole 311 that transversely penetrates the connecting rod 3 and matches the pair of axial holes 211. The hinged end 31 of the connecting rod 3 is hinged (rotatably sleeved) on the outer side of the hinge shaft 6 through the hinged hole 311, and the two ends of the hinge shaft 6 are respectively fixedly connected to the pair of axial holes 211, so that when the first mold body 1 and the second mold body 2 are molded together and the handle part 4 is pulled, the connecting rod 3 can be driven to rotate relative to the hinge shaft 6 (relative to the second mold body 2), so that the handle part 4 and the connecting rod 3 are turned up and down around the hinged end 31 of the connecting rod 3 (forward near the first clearance groove 11 or backward near the second clearance groove 21).

[0083] Please also read Figure 1-6 In this embodiment, a bottom step 25 extending horizontally away from the second yielding end is provided at the bottom of the other end of the second mold body 2 away from the second yielding end (away from the first mold body 1), and a pair of protrusions 251 connected to the second mold body 2 are arranged at intervals in the middle of the bottom step 25. The end of the second yielding groove 21 away from the second yielding end extends horizontally to above the middle of the pair of bottom steps 25 and between the protrusions 251, and a pair of axial holes 211 are respectively arranged corresponding to the pair of protrusions 251.

[0084] In this embodiment, a vertical through hole 252 extending vertically downward is provided at the top of the protrusion 251. The vertical through hole 252 extends vertically and is connected to the shaft hole 211, and the vertical through hole 252 is a threaded hole with an internal thread on the inner wall. When it is necessary to improve the tightness of the connection between the hinge shaft 6 and the shaft hole 211 and prevent the hinge shaft 6 from loosening or the hinge shaft 6 has already loosened, a locking screw (not shown in the figure) can be threaded into the vertical through hole 252, so that the locking screw can be screwed in until it is tight against the hinge shaft 6, thereby preventing the hinge shaft 6 from rotating and fastening it in the shaft hole 211.

[0085] Please also read Figure 1-6 11. In this embodiment, the bottom surface of the second mold body 2 is provided with a mounting groove 24, and the top surface of the mounting groove 24 is provided with an escape hole 241 connected to the second chamber 23. The escape hole 241 is used to allow the corresponding contacts of the electronic device of the electronic product to extend into the hole during the glue sealing, so as to prevent the contacts from being sealed by glue and causing failure when the glue sealing cavity is filled with glue. The electronic product glue filling fixture also includes:

[0086] An insert 7, the insert 7 matches the shape of the mounting groove 24;

[0087] The insert 7 is detachably embedded in the installation groove 24 to close the avoidance hole 241 during glue sealing to prevent the colloid from flowing out of the electronic product glue filling fixture from the avoidance hole 241 when the glue sealing cavity is filled with colloid, causing glue leakage, thereby ensuring the molding of the potting colloid.

[0088] Please also read Figure 1-6 11. As a preferred implementation of this embodiment, the mounting groove 24 is in a T-shape with a certain thickness, the avoidance hole 241 is in a T-shape facing in the opposite direction to the T-shaped vertical side of the mounting groove 24, and the avoidance hole 241 is provided on the corresponding top surface of the T-shaped horizontal side of the mounting groove 24, and the corresponding top surface (step surface) of the T-shaped vertical side of the mounting groove 24 is provided with a threaded hole 242;

[0089] The insert 7 is a T-shaped block with a certain thickness that matches the shape of the mounting groove 24. The T-shaped vertical side of the insert 7 is provided with a connecting hole 71 that matches the above-mentioned threaded hole 242. A screw (not shown in the figure) is passed through its connecting hole 71 and threadedly connected to the corresponding threaded hole 242, so that the insert 7 can be detachably embedded in the corresponding mounting groove 24.

[0090] In another embodiment (not shown in the figure), the mounting groove 24 may also be disposed on the bottom surface of the first mold body 1 , and correspondingly, the avoidance hole 241 is disposed on the top surface of the mounting groove 24 and communicates with the first chamber 13 .

[0091] In other embodiments (not shown in the figures), the mounting groove 24 may also be provided on the bottom surfaces of the first mold body 1 and the second mold body 2 at the same time, and at least two mounting grooves 24 may also be provided on the bottom surfaces of the first mold body 1 and the second mold body 2 .

[0092] Please also read Figure 1-6 , 11. In this embodiment, a avoidance hole 241 is provided on the top surface of the mounting groove 24.

[0093] In other embodiments (not shown in the figures), at least two avoidance holes 241 may be provided at intervals on the top surface of the mounting groove 24 .

[0094] Please also read Figure 1-6 11. In this embodiment, the horizontal bottom surfaces of the first mold body 1 and the second mold body 2 are further provided with bottom mounting holes 8, and the electronic product glue filling fixture further includes:

[0095] The bottom bushing 9 is embedded in the bottom mounting hole 8 of the horizontal bottom surface of the first mold body 1 and the second mold body 2 .

[0096] When the first mold body 1 and the second mold body 2 are opened, the mold opening pins are respectively inserted into the bottom bushings 9 arranged on the horizontal bottom surfaces of the first mold body 1 and the second mold body 2 through the mold opening mechanism, so that the first mold body 1 and the second mold body 2 are respectively connected to the mold opening mechanism, and then the mold opening mechanism drives the first mold body 1 and the second mold body 2 to separate from each other to realize the opening of the electronic product glue filling fixture.

[0097] The utility model also provides an electronic product glue sealing device (not shown in the figure), which applies the above-mentioned electronic product glue filling fixture.

[0098] In this embodiment, the electronic product sealing device includes a glue potting mechanism (not shown in the figure) for potting the above-mentioned electronic product glue potting fixture with protective glue material, a glue potting platform (not shown in the figure) for supporting the first mold body 1 and the second mold body 2, and the above-mentioned mold opening mechanism.

[0099] The above are only preferred embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A glue filling fixture for electronic products, characterized in that: include: A first mold body, wherein a first clearance groove is provided in the middle of the top surface of the first mold body, and the first clearance groove runs through the first butt end of the first mold body and the other end opposite to the first butt end; The first butt joint end is provided with a first cavity on at least one side of the first clearance groove, the first cavity forms a first upper opening on the top surface of the first mold body, and the first cavity forms a first butt joint end communicating with the first upper opening; the top surface of the other end of the first mold body is provided with a pair of chamfered inclined surfaces on both sides of the first clearance groove respectively; A second mold body, wherein a second make way groove matching the first make way groove is provided in the middle of the top surface of the second mold body, and the second make way groove runs through the second butt end of the second mold body and the other end opposite to the second butt end; a second cavity matching the first cavity is provided at the second butt end, and the second cavity forms a second upper opening on the top surface of the second mold body, and the second cavity forms a second butt port communicating with the second upper opening at the second butt end; A connecting rod, the shape of which matches the first clearance groove and the second clearance groove, and one end of the connecting rod is a hinged end hinged in the second clearance groove; A handle portion connected to the movable end of the connecting rod opposite to the hinge end and matched with the pair of chamfered inclined surfaces, and the width of the handle portion is greater than the width of the first clearance groove; The first butt joint end and the second butt joint end are connected to each other through at least one connecting piece, so that the first butt joint and the second butt joint, the first upper opening and the second upper opening, the first make way groove and the second make way groove are matched and connected respectively, and the first cavity and the second cavity are surrounded by a glue-sealed cavity, and the first mold body and the second mold body are pressed and molded together by pulling the connecting rod to flip close to the first make way groove until the handle part squeezes and passes over a pair of chamfered inclined surfaces.

2. The electronic product glue filling fixture as claimed in claim 1, characterized in that: The first docking end is provided with a first clamping portion surrounding the first docking port, and the second docking end is provided with a second clamping portion surrounding the second docking port and matching with the first clamping portion; When the first butt joint end and the second butt joint end are butt jointed to form the glue-sealing cavity, the first clamping portion and the second clamping portion cooperate to achieve sealing of the glue-sealing cavity.

3. The electronic product glue filling fixture as claimed in claim 2, characterized in that: A convex column is coaxially arranged at the middle of the end surface of the movable end, the outer diameter of the convex column is smaller than the outer diameter of the connecting rod, and a mounting step is formed between the end surface of the movable end and the convex column; a limiting cap is arranged at the end of the convex column away from the connecting rod, and the outer diameter of the limiting cap is larger than the outer diameter of the convex column; the handle part is cylindrical, the inner diameter of the inner hole of the handle part matches the outer diameter of the convex column, and the handle part is sleeved on the outer side of the convex column through the inner hole; the electronic product glue filling fixture also includes: A spring is sleeved on the convex column, one end of the spring abuts against the mounting step, and the other end of the spring abuts against the handle; When the first butt joint end and the second butt joint end are butted against each other and the connecting rod is flipped close to the first clearance groove until the handle part squeezes the chamfered inclined surface, the handle part slides away from the connecting rod along the protruding column, and the spring is in a stretched state, so that the handle part can pass over the pair of chamfered inclined surfaces; After the handle passes over a pair of chamfered surfaces, the handle slides along the protruding column close to the connecting rod under the restoring action of the spring until the handle is pressed against the first mold body to press the first mold body and the second mold body together.

4. The electronic product glue filling fixture as claimed in claim 3, characterized in that: The inner side wall of the first chamber is provided with at least one first positioning groove extending perpendicularly to the bottom surface of the first chamber; The inner side wall of the second chamber is provided with at least one second positioning groove extending perpendicularly to the bottom surface of the second chamber.

5. The electronic product glue filling fixture as claimed in claim 2, characterized in that: The first chamber and the second chamber are both rectangular, the first interface and the second interface are both U-shaped, the first clamping portion is a U-shaped clamping groove matching the shape of the first interface, and the second clamping portion is a U-shaped clamping strip matching the shape of the second interface.

6. The electronic product glue filling fixture according to any one of claims 1 to 5, characterized in that: The first butt joint end is provided with at least one first mounting hole, and the second butt joint end is provided with a second mounting hole matching the first mounting hole; the connecting member comprises: A docking bushing, embedded in the second mounting hole; A positioning pin, one end of which is embedded in the docking bushing; The other end of the positioning pin is positioned and matched with the corresponding first mounting hole so that the first butt end and the second butt end are butted against each other.

7. The electronic product glue filling fixture according to any one of claims 1 to 5, characterized in that: The bottom surface of the second mold body is provided with a mounting groove, and the top surface of the mounting groove is provided with an avoidance hole communicating with the second chamber; The electronic product glue filling fixture also includes: an insert matching the shape of the mounting slot; The insert is detachably embedded in the installation groove and is used to close the avoidance hole during glue sealing.

8. The electronic product glue filling fixture according to any one of claims 1 to 5, characterized in that: The first butt end is provided with a pair of the first chambers on both sides of the first clearance groove.

9. The electronic product glue filling fixture according to any one of claims 1 to 5, characterized in that: The second mold body is provided with a pair of axial holes on both sides of the second clearance groove respectively. The hinged end is hinged to the hinge shaft, and the two ends of the hinge shaft are fixedly connected to the pair of axial holes respectively.

10. An electronic product sealing device, characterized in that: It comprises the electronic product glue pouring jig as described in any one of claims 1 to 9, and a glue pouring mechanism for pouring protective glue material into the electronic product glue pouring jig.

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