Wafer cleaning brush wheel and device

Abstract

The utility model belongs to the technical field of camera module production, and particularly relates to a wafer cleaning brush wheel and device, the wafer cleaning brush wheel comprises a wheel body and brush bristles, the outer circumferential surface of the wheel body is provided with a plurality of brush bristle areas at intervals along the length direction of the wheel body, and a blank area is arranged between every two adjacent brush bristle areas; bristles are uniformly arranged in the bristle area, and the position and the width of the bristle area are matched with the position and the width of a wafer on the wafer carrier jig. According to the utility model, the plurality of bristle areas are arranged on the wheel body, the blank areas are arranged among the bristle areas, and the positions and the widths of the bristle areas are matched with the positions and the widths of the wafers on the wafer carrier jig, so that the wafers can be ensured to be uniformly and completely cleaned, and the cleaning of unnecessary areas can be reduced; meanwhile, the bristles only clean the wafer area, abrasion of the bristles can be more uniform, the situation that the brush length is different after the brush wheel is used for a period of time is avoided, and the service life of the brush wheel is prolonged.

Description

Technical Field

[0001] The utility model belongs to the technical field of camera module production, and specifically relates to a wafer cleaning brush wheel and a device. Background Art

[0002] During the manufacturing process of the camera module, after the camera is built-in with a chip, the residual glue, debris and other adhesive substances on the chip need to be cleaned to ensure the cleanliness of the chip and reduce product defects caused by chip dirt. At present, a brush cleaning process is generally used, using a brush to press-in clean the surface of the product to remove easily removable particles, residual glue, small debris and other adhesive stains. The existing brush wheels have brushes evenly distributed on the overall contour of the brush wheel, and there is a certain distance between the chips on the chip carrier jig, resulting in the brush wheel having different lengths of brushes after cleaning the product for a period of time, and the brushes cannot be used any more, resulting in waste. Utility Model Content

[0003] In order to overcome the deficiencies of the above-mentioned prior art, the purpose of the utility model is to provide a wafer cleaning brush wheel and device, which can avoid the uneven length of the brush after the brush wheel has been used for a period of time, extend the service life of the brush wheel, and save production costs.

[0004] To achieve the above-mentioned purpose, the technical solution of the utility model is a chip cleaning brush wheel, including a wheel body and bristles, a plurality of bristle areas are arranged at intervals on the outer circumferential surface of the wheel body along the length direction of the wheel body, and blank areas are arranged between adjacent bristle areas; the bristles are evenly arranged on the brush areas, and the position and width of the brush areas match the position and width of the chip on the chip carrier jig.

[0005] As one of the implementation modes, blank areas are provided at both ends of the outer circumferential surface of the wheel body.

[0006] As one of the implementation modes, two brush areas are arranged on the outer circumferential surface of the wheel body.

[0007] As one of the implementation modes, the bristles in the bristle area are arranged in a staggered manner.

[0008] As one of the implementation modes, the roots of the bristles are implanted in the wheel body.

[0009] As one of the embodiments, the lengths of the bristles exposed from the outer circumferential surface of the wheel body are the same.

[0010] As one of the implementation modes, the wheel body is provided with a central axis hole for mounting the rotating shaft.

[0011] The utility model also provides a wafer cleaning device, comprising a mounting frame, a driving mechanism, a horizontal conveying mechanism for driving a wafer carrier fixture to move horizontally, and a wafer cleaning brush wheel as described in any one of the above items; the wafer cleaning brush wheel is arranged above the horizontal conveying mechanism, and the wafer cleaning brush wheel is rotatably mounted on the mounting frame; the driving mechanism is connected to the wafer cleaning brush wheel, and is used to drive the wafer cleaning brush wheel to rotate.

[0012] As one of the implementation modes, the wafer cleaning device further includes a lifting mechanism for driving the mounting frame to move in a vertical direction.

[0013] Compared with the prior art, the utility model has the following beneficial effects:

[0014] The utility model arranges multiple brush areas on the wheel body and blank areas between the brush areas, and the positions and widths of the brush areas match the positions and widths of the wafers on the wafer carrier jig, which not only ensures that the wafers can be cleaned evenly and fully, but also reduces the cleaning of unnecessary areas, saving production costs. At the same time, the bristles only clean the wafer area, the wear of the bristles will be more even, avoiding uneven lengths of the brush after the brush wheel has been used for a period of time, thereby extending the service life of the brush wheel. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0016] Figure 1 A three-dimensional diagram of a wafer cleaning brush wheel provided in an embodiment of the utility model;

[0017] Figure 2 A front view of a wafer cleaning brush wheel provided in an embodiment of the utility model;

[0018] In the figure: 1, wheel body; 2, bristle area; 3, blank area; 4, bristles; 5, center shaft hole. DETAILED DESCRIPTION

[0019] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0020] In the description of the present invention, it should be understood that the terms "center", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating directions or positional relationships, are based on the directions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific direction, be constructed and operated in a specific direction, and therefore should not be understood as a limitation on the present invention.

[0021] The terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features; in the description of the present utility model, unless otherwise specified, "plurality" means two or more.

[0022] like Figure 1-Figure 2 As shown, this embodiment provides a wafer cleaning brush wheel, including a wheel body 1 and bristles 4, wherein a plurality of bristle areas 2 are arranged at intervals along the length direction of the wheel body 1 on the outer circumferential surface of the wheel body 1, and a blank area 3 is arranged between adjacent bristle areas 2; the bristles 4 are evenly arranged on the bristle areas 2, and the position and width of the bristle areas 2 match the position and width of the wafer on the wafer carrier jig. In this embodiment, by arranging a plurality of bristle areas 2 on the wheel body 1 and arranging a blank area 3 between the bristle areas 2, when cleaning the wafer on the wafer carrier jig, the bristle areas 2 correspond to the wafer area on the wafer carrier jig, and the blank area 3 corresponds to the jig area on the wafer carrier jig, which not only ensures that the wafer can be cleaned evenly and fully, but also saves production costs, and at the same time, the bristles 4 only clean the wafer area, and the wear of the bristles 4 will be more uniform, avoiding the brush length being different after the brush wheel has been used for a period of time, thereby extending the service life of the brush wheel.

[0023] Furthermore, blank areas 3 are provided at both ends of the outer circumferential surface of the wheel body 1. Figure 1 and Figure 2 As shown, blank areas 3 are provided at both ends of the outer circumferential surface of the wheel body 1 and between adjacent brush areas 2, which can further reduce unnecessary cleaning areas, thereby reducing production costs.

[0024] In one embodiment, two bristle areas 2 are provided on the outer circumference of the wheel body 1. Figure 1 and Figure 2As shown, two brush areas 2 and three blank areas 3 are provided on the outer circumferential surface of the wheel body 1, and the brush areas 2 and the blank areas 3 are arranged alternately, and the positions and widths of the two brush areas 2 are matched with the two wafers on the wafer carrier jig, so that the brushing range of the brush is completely consistent with the wafer area on the wafer carrier jig, ensuring that when the wheel body 1 rotates, the two brush areas 2 can evenly clean the two wafers on the wafer carrier jig at the same time.

[0025] To optimize the above embodiment, the bristles 4 of the bristle area 2 are arranged in a staggered manner. Figure 1 and Figure 2 As shown, the brush area 2 is provided with multiple circles of bristles 4 at equal intervals along the length direction of the wheel body 1 to ensure that the surface of the wafer can be fully covered; and each circle of bristles 4 includes multiple / bundles of bristles 4 arranged at equal intervals along the circumferential direction, and two adjacent circles of bristles 4 are arranged in a staggered manner, which can not only improve the cleaning efficiency, improve the uniformity and stability of the cleaning process, but also reduce the friction and wear between the bristles 4, and extend the service life of the brush wheel. Among them, the bristles 4 can be made of pig bristles or horse bristles.

[0026] Furthermore, the roots of the bristles 4 are implanted in the wheel body 1, which can enhance the connection stability between the bristles 4 and the wheel body 1, ensure that the bristles 4 are not easy to fall off during the rotation of the wheel body 1, ensure the stability and continuity of the cleaning process, and reduce uneven cleaning caused by loose bristles 4.

[0027] Furthermore, the lengths of the bristles 4 exposed from the outer circumference of the wheel body 1 are the same, ensuring that the bristles 4 in the bristle area 2 can evenly contact the surface of the wafer, thereby improving the cleaning efficiency and effect.

[0028] In this embodiment, the wheel body 1 is provided with a central axis hole 5 for mounting a rotating shaft. Figure 1 As shown, the central shaft hole 5 is arranged along the central axis and passes through the wheel body 1. The rotating shaft can be fixed in the central shaft hole 5. By driving the rotating shaft to rotate, the wheel body 1 can be driven to rotate, thereby cleaning the surface of the wafer.

[0029] This embodiment also provides a wafer cleaning device, including a mounting frame, a driving mechanism, a horizontal transmission mechanism for driving a wafer carrier jig to move horizontally, and a wafer cleaning brush wheel as described in any one of the above; the wafer cleaning brush wheel is arranged above the horizontal transmission mechanism, and the wafer cleaning brush wheel is rotatably mounted on the mounting frame; the driving mechanism is connected to the wafer cleaning brush wheel, and is used to drive the wafer cleaning brush wheel to rotate. This embodiment drives the wafer carrier jig to move in the horizontal direction through the horizontal transmission mechanism, and the wafer cleaning brush wheel rotates through the driving mechanism, thereby brushing the surface of the wafer on the wafer carrier jig.

[0030] In this embodiment, the wafer cleaning brush wheel is installed across the top of the horizontal conveying mechanism, and the length direction of the wafer cleaning brush wheel is perpendicular to the conveying direction of the horizontal conveying mechanism; a rotating shaft is provided through the central axis hole 5 of the wheel body 1, and both ends of the rotating shaft are rotatably installed on the mounting frame through bearings. Specifically, the horizontal conveying mechanism can adopt a belt conveying mechanism, and the driving mechanism can adopt a rotary motor.

[0031] The above embodiment is optimized, and the wafer cleaning device also includes a lifting mechanism for driving the mounting frame to move in the vertical direction. The mounting frame and the wafer cleaning brush wheel thereon can be driven to move in the vertical direction by the lifting mechanism. When the bristles 4 of the wafer cleaning brush wheel are worn after a period of cleaning, resulting in a decrease in the contact area between the bristles 4 and the wafer surface, the wafer cleaning brush can be driven to move downward by a certain distance by the lifting mechanism to increase the contact area between the bristles 4 and the wafer surface, thereby improving the cleaning effect and extending the service life of the wafer cleaning brush. In one embodiment, mounting frames are provided on both sides of the horizontal conveying mechanism to support the two ends of the rotating shaft respectively, and a lifting mechanism is provided under each mounting frame to drive the wafer cleaning brush wheel to move up and down by the lifting mechanisms on both sides. Specifically, the lifting mechanism can adopt a hydraulic lifting mechanism.

[0032] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A wafer cleaning brush wheel, comprising a wheel body and bristles, characterized in that: A plurality of brush areas are arranged at intervals on the outer circumferential surface of the wheel body along the length direction of the wheel body, and blank areas are arranged between adjacent brush areas; the brush areas are evenly provided with bristles, and the positions and widths of the brush areas match the positions and widths of the wafers on the wafer carrier jig.

2. The wafer cleaning brush wheel according to claim 1, characterized in that: Both ends of the outer circumferential surface of the wheel body are provided with blank areas.

3. The wafer cleaning brush wheel according to claim 2, characterized in that: Two brush areas are arranged on the outer circumferential surface of the wheel body.

4. The wafer cleaning brush wheel according to claim 1, characterized in that: The bristles in the bristle area are arranged in a cross-staggered manner.

5. The wafer cleaning brush wheel according to claim 1, characterized in that: The roots of the bristles are implanted in the wheel body.

6. The wafer cleaning brush wheel according to claim 1, characterized in that: The lengths of the bristles exposed from the outer circumferential surface of the wheel body are the same.

7. The wafer cleaning brush wheel according to claim 1, characterized in that: The wheel body is provided with a central axis hole for installing the rotating shaft.

8. A wafer cleaning device, characterized in that: It includes a mounting frame, a driving mechanism, a horizontal conveying mechanism for driving a wafer carrier fixture to move horizontally, and a wafer cleaning brush wheel as described in any one of claims 1 to 7; the wafer cleaning brush wheel is arranged above the horizontal conveying mechanism, and the wafer cleaning brush wheel is rotatably mounted on the mounting frame; the driving mechanism is connected to the wafer cleaning brush wheel, and is used to drive the wafer cleaning brush wheel to rotate.

9. The wafer cleaning device according to claim 8, characterized in that: It also includes a lifting mechanism for driving the mounting frame to move in a vertical direction.

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