Negative-pressure automatic scrap suction device for punching machine
The automatic waste chip suction device for punch presses addresses the inefficiency of manual cleaning by using a chip collection system to adapt to the punch press's movement, ensuring timely waste removal and enhancing production quality and efficiency.
Patent Information
- Application Number
- CN202420983388.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-05-08
- Publication Date
- 2024-12-31
- Estimated Expiration
- 2034-05-08
AI Technical Summary
Existing punch pressing machines lack an efficient and timely mechanism for removing residual waste and debris, leading to defective products and die damage, necessitating manual cleaning that is inefficient and costly.
A negative pressure automatic waste chip suction device comprising a chip collection main unit, upper and lower die chip collection modules, and hoses that adapt to the movement of the punch press to automatically clean residual waste and debris during production.
Enables efficient and timely removal of residual waste and debris, protecting the die and improving production efficiency while reducing manual labor and defects.
Smart Images

Figure CN222268480U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the field of cleaning waste chips, in particular to a negative pressure automatic waste chip suction device for a punch press. Background Art
[0002] Punching machine refers to a stamping press, which is a commonly used equipment in industrial production. It can produce stamping parts and other products used in various fields by stamping plates with dies. In the production process, stamping usually produces a lot of residual waste and debris. If these residual waste and debris are not cleaned up in time, they will adhere to the workpiece during the stamping process to cause defective products, or adhere to the die to cause damage to the die during stamping. At the same time, the stamped product will become a defective product due to the damage to the die. If the punching machine continues to work, a large number of defective products will be continuously produced, causing huge losses.
[0003] In the prior art, such punching machines are not equipped with waste chip removal devices. Users usually need extra manpower and time to clean up residual waste and debris during production. Not only is the cleaning not timely and thorough, but the efficiency is also low. Therefore, an independent automatic waste chip removal device is needed. It can be installed on various types of punching machines according to user needs to achieve the function of cleaning residual waste and debris simultaneously with the punching machine production operation. Utility Model Content
[0004] The utility model aims to overcome the shortcomings of the prior art and provides a negative pressure automatic waste suction device for a punch press, which realizes the function of synchronously removing residual waste and debris after punching during production operations through negative pressure.
[0005] The purpose of this utility model is achieved through the following technical solutions:
[0006] A negative pressure automatic waste chip suction device for a punch press comprises a waste chip suction device, which is composed of a chip collection main unit, an upper die chip collection module, and a lower die chip collection module. The upper die chip collection module comprises an upper die chip collection head, an upper die hard tube, and an upper die hose. One end of the upper die chip collection head is open and the other end is provided with a hollow tubular protrusion. The upper die chip collection head is connected to the upper die hose, and the upper die hose is sleeved with the tubular protrusion of the upper die chip collection head and fixed with a throat clamp. The upper die hose is connected to the upper die hard tube, and the upper die hose is sleeved with the upper die hard tube and fixed with a throat clamp. The upper die hard tube is connected to the chip collection main unit, and the upper die hard tube is sleeved with the hard tube on the chip collection main unit and fixed with a pipe clamp. The lower die chip collection module comprises a lower die chip collection head, a lower die chip collection head lifting device, a lower die hard tube, and a lower die hose. One end of the lower die chip collection head is open and the other end is provided with a hollow tubular protrusion. The lower die chip collection head is connected to the lower die The chip collecting head lifting device is connected, and the lower die chip collecting head lifting device includes a lower die chip collecting head lifting cylinder, the lower die chip collecting head lifting cylinder is provided with a tubular protrusion of the chip collecting head cylinder, the tubular protrusion of the lower die chip collecting head passes through the tubular protrusion of the chip collecting head cylinder and is fixed with a pipe clamp, the lower die chip collecting head is connected to the lower die hose, the lower die hose is sleeved with the tubular protrusion of the lower die chip collecting head and fixed with a throat clamp, the lower die hose is connected to the lower die hard tube, the lower die hose is sleeved with the lower die hard tube and fixed with a throat clamp, the lower die hard tube is connected to the chip collecting main machine, the lower die hard tube is sleeved with the hard tube extended from the chip collecting main machine and fixed with a pipe clamp, the upper die hose and the lower die hose are corrugated hoses, the corrugated hoses are deformed and expanded when subjected to force, and maintain the shape when not subjected to force, the upper die hard tube and the lower die hard tube are steel tubes, the steel tubes are not easy to deform, and the upper die hard tube and the hard tube extended from the chip collecting main machine can maintain a horizontal suspended shape after being fixed.
[0007] In one embodiment, the waste scrap suction device is installed in a punch press, which is a stamping press, and includes a punching die set, a punching mainframe, a punching loading workbench, a punching control console, a punching X-axis guide rail, a punching X-axis guide rail driver, a punching Z-axis guide rail, a punching Z-axis guide rail driver, a punching loading suction cup, and a punching unloading suction cup. The punching die set includes a stamping upper die, a stamping lower die, a stamping lower die base, and a stamping hydraulic cylinder. The punch lower die is arranged above the punch lower die base, the punch upper die is arranged below the punch hydraulic cylinder, the punch loading suction cup and the punch unloading suction cup are arranged on the punch X-axis guide rail, and the punch X-axis guide rail driver causes the punch loading suction cup, the punch unloading suction cup and the lower die chip collecting head on the punch X-axis guide rail to move along the X-axis, the punch lower die base is arranged on the punch Z-axis guide rail, and the punch Z-axis guide rail driver causes the punch lower die on the punch Z-axis guide rail to move along the Z-axis The upper die of the punch press is moved, and the stamping upper die is arranged under the stamping hydraulic cylinder and can be lifted and lowered. The stamping bracket supports and protects the stamping die set. A plate is placed above the loading workbench of the punch press, and the plate can be sucked up by the loading suction cup of the punch press and placed above the stamping lower die. After the plate is placed on the stamping lower die, the stamping lower die base is displaced to the bottom of the stamping upper die along the Z-axis guide rail of the punch press, and then the stamping hydraulic cylinder drives the stamping upper die to descend and stamp the plate into a specified product. After that, the stamping upper die rises, and the stamping lower die base returns along the Z-axis guide rail of the punch press. At this time, the upper die chip collecting head sweeps over the stamping upper die to clean up the residual waste and debris of the stamping upper die. After that, the punch press unloading suction cup sucks up the formed plate and displaces it to the right along the X-axis guide rail of the punch press to unload the material. At this time, the lower die chip collecting head descends in height through the lower die chip collecting head lifting cylinder, and displaces to the right along the X-axis guide rail of the punch press to sweep over the stamping lower die where no plate is placed to clean up the residual waste and debris of the stamping lower die, thereby realizing automatic and timely residual waste and debris cleaning.
[0008] In one of the embodiments, the lower die chip collecting head lifting device includes a lower die chip collecting head lifting cylinder and a lower die chip collecting head mounting plate, the lower die chip collecting head lifting cylinder is fixed on the lower die chip collecting head mounting plate, the lower die chip collecting head mounting plate is connected to the X-axis guide rail of the punch press, the lower die chip collecting head can move left and right along the X-axis guide rail of the punch press, the lower die chip collecting head is connected to the lower die chip collecting head lifting cylinder, the lower die chip collecting head can be lifted up and down, the lower die chip collecting head opens downward, the lower die hose connected to the lower die chip collecting head is a corrugated hose, the lower die hose can follow the movement of the lower die chip collecting head, and vacuum through the negative pressure of the chip collection main machine, and the downward opening is close to the stamping lower die to clean the residual waste and debris on the stamping lower die.
[0009] In one of the embodiments, the lower die chip collecting head lifting cylinder is provided with a tubular protrusion of the chip collecting head cylinder, one end of the lower die chip collecting head passes through the tubular protrusion of the chip collecting head cylinder and is fixed by the lower die chip collecting head pipe clamp, a fixed protrusion is provided on the side of the lower die chip collecting head lifting cylinder, and the fixed protrusion is provided with a tubular protrusion for fixing the chip collecting head. The lower die chip collecting head is fixed to the lower die chip collecting head lifting cylinder by using the pipe clamp to realize the lifting function of the lower die chip collecting head.
[0010] In one embodiment, the lower die base is connected to the Z-axis guide rail of the punch press, and the upper die chip collection head is fixed above the lower die base of the stamping press. The upper die chip collection head can move forward and backward along the Z-axis guide rail of the punch press. The upper die chip collection head opens upward, and the upper die hose connected to the upper die chip collection head is a corrugated hose. The upper die hose can move with the upper die chip collection head, and vacuum through the negative pressure of the chip collection main machine. The upward opening is close to the stamping upper die to clean the residual waste and debris on the stamping upper die.
[0011] In one embodiment, the upper mold hose is a corrugated hose, one end of which is sleeved with one end of the upper mold hard tube and fixed with an upper mold throat clamp. The upper mold hard tube is used to adapt to the punching machine shaping, and the upper mold hose is used to follow the movement of the upper mold chip collection head.
[0012] In one embodiment, the lower mold hose is a corrugated hose, one end of which is sleeved with one end of the lower mold hard tube and fixed with a lower mold throat clamp. The lower mold hard tube is used to adapt to the punch press molding, and the lower mold hose is used to follow the movement of the lower mold chip collection head.
[0013] In one of the embodiments, a support frame is provided on the outside of the waste chip suction device, and the support frame protects the punch press and the waste chip suction device. The support frame can also provide a fixed support position for the pipeline of the waste chip suction device to facilitate better adaptation.
[0014] In one of the embodiments, the lower die chip collecting head mounting plate is displaced along the X-axis guide rail of the punch press to above the stamping lower die, and the lower die chip collecting head lifting cylinder installed on the chip collecting head mounting plate and the lower die chip collecting head are displaced together to above the stamping lower die, and the lower die chip collecting head is lowered close to the stamping lower die by the lower die chip collecting head lifting cylinder.
[0015] In one embodiment, the stamping lower die base is displaced along the Z-axis guide rail of the punch press to below the stamping upper die, and the upper die chip collecting head installed on the stamping lower die base is moved together to below the stamping upper die, and the upper die chip collecting head is close to the stamping upper die.
[0016] Beneficial effects of the utility model:
[0017] The utility model adopts the above-mentioned technical scheme, and is installed in the waste chip suction device of various types of punching machines, so that the function of cleaning up the residual waste and debris after stamping can be realized while the punching machine is producing. Extra special time and manpower are no longer needed to manually clean up the residual waste and debris. It is not only efficient but also timely to clean up, effectively protecting the product and the stamping die, ensuring the quality and improving the yield rate, while saving manpower and operation time, and greatly improving the industrial production efficiency. BRIEF DESCRIPTION OF THE DRAWINGS
[0018] In order to more clearly illustrate the technical solutions of the embodiments of the utility model, the drawings required for use in the embodiments will be briefly introduced below. It should be understood that the following drawings only show certain embodiments of the utility model and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other relevant drawings can be obtained based on these drawings without paying creative work.
[0019] Figure 1 It is a three-dimensional diagram of the utility model.
[0020] Figure 2 It is the front view of the utility model.
[0021] Figure 3 It is the lifting device for the lower die chip collecting head.
[0022] Figure 4 For punch frame three-dimensional Figure 1 .
[0023] Figure 5 For punch frame three-dimensional Figure 2 .
[0024] Figure 6 This is the front view of the punch press.
[0025] Figure 7 It is the right side view of the punch press.
[0026] Figure 8 It is a top view of the punch press.
[0027] Fig. 9 For punch press Figure 1 .
[0028] Fig.10 For punch press Figure 2 .
[0029] The numbers in the figure represent: waste chip suction device 1, punch press 2, chip collection main unit 3, upper die chip collection head 4, upper die hard tube 5, upper die throat clamp 6, upper die hose 7, lower die chip collection head 8, lower die hard tube 9, lower die throat clamp 10, lower die hose 11, lower die chip collection head lifting cylinder 12, lower die chip collection head mounting plate 13, lower die chip collection head pipe clamp 14, chip collection head cylinder tubular protrusion 15, stamping upper die 16, stamping lower die 17, stamping lower die base 18, stamping hydraulic cylinder 19, punch loading workbench 20, punch press main unit 21, punch press control console 22, punch press X-axis guide rail 23, punch press X-axis guide rail driver 24, punch press Z-axis guide rail 25, punch press Z-axis guide rail driver 26, punch press loading suction cup 27, punch press unloading suction cup 28, support frame 29. DETAILED DESCRIPTION
[0030] In order to facilitate the understanding of the present invention, the present invention will be described more comprehensively with reference to the relevant drawings. The drawings provide preferred embodiments of the present invention. However, the present invention can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the present invention more thoroughly and comprehensively understood.
[0031] It should be noted that when an element is referred to as being "fixed to" another element, it may be directly on the other element or there may be a central element. When an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time. The terms "vertical", "horizontal", "left", "right" and similar expressions used herein are for illustrative purposes only and do not represent the only implementation method.
[0032] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art in the technical field of the present invention. The terms used herein in the specification of the present invention are only for the purpose of describing specific implementations and are not intended to limit the present invention. The term "and / or" used herein includes any and all combinations of one or more related listed items.
[0033] This utility model please refer to Figure 1-10 :
[0034] The punch press negative pressure automatic waste chip suction device comprises a waste chip suction device 1, which is composed of a chip collection main unit 3, an upper die chip collection module, and a lower die chip collection module. The upper die chip collection module comprises an upper die chip collection head 4, an upper die hard tube 5, and an upper die hose 7. The upper die chip collection head 4 is connected to the upper die hose 7, the upper die hose 7 is connected to the upper die hard tube 5, the upper die hard tube 5 is connected to the chip collection main unit 3, the lower die chip collection module comprises a lower die chip collection head 8, a lower die chip collection head lifting device, a lower die hard tube 9, and a lower die hose 11. The lower die chip collection head 8 is connected to the lower die chip collection head lifting device, the lower die chip collection head 8 is connected to the lower die hose 11, the lower die hose 11 is connected to the lower die hard tube 9, and the lower die hard tube 9 is connected to the chip collection main unit 3.
[0035] By adopting the above technical scheme, a negative pressure automatic waste chip suction device 1 that can be installed next to different types of punching machines 2 is manufactured. The waste chip suction device 1 is composed of a chip collection main unit 3, an upper die chip collection module, and a lower die chip collection module. The upper die chip collection module includes an upper die chip collection head 4, an upper die hard tube 5, and an upper die hose 7. The upper die chip collection head 4 is open at one end and is provided with a hollow tubular protrusion at the other end. The upper die hose 7 is sleeved with the tubular protrusion of the upper die chip collection head 4 and fixed with a throat clamp. The upper die hose 7 is sleeved with the upper die hard tube 5 and fixed with a throat clamp. The upper die hard tube 5 is sleeved with the hard tube on the chip collection main unit 3 and fixed with a tube clamp. The lower die chip collection module includes a lower die chip collection head 8, a lower die chip collection head lifting device, a lower die hard tube 9, and a lower die hose 11. The lower die chip collection head 8 is open at one end and is provided with a hollow Tubular protrusion, the lower die chip collecting head lifting device includes a lower die chip collecting head lifting cylinder 12, the lower die chip collecting head lifting cylinder 12 is provided with a chip collecting head cylinder tubular protrusion 15, the tubular protrusion of the lower die chip collecting head 8 passes through the chip collecting head cylinder tubular protrusion 15 and is fixed with a pipe clamp, the lower die hose 11 is sleeved with the tubular protrusion of the lower die chip collecting head 8 and fixed with a throat clamp, the lower die hose 11 is sleeved with the lower die hard tube 9 and fixed with a throat clamp, the lower die hard tube 9 is sleeved with the hard tube extended from the chip collecting main machine 3 and fixed with a pipe clamp, the upper die hose 7 and the lower die hose 11 are corrugated hoses, the corrugated hoses are deformed and expanded when subjected to force, and maintain the shape when not subjected to force, the upper die hard tube 5 and the lower die hard tube 9 are steel tubes, the steel tubes are not easy to deform, and the upper die hard tube 5 can maintain a horizontal suspended shape after being fixed to the hard tube extended from the chip collecting main machine 3.
[0036] Preferably, the waste chip suction device 1 is installed in a punch press 2, which is a stamping press. The punch press 2 includes a punching die set, a punching main machine 21, a punching loading workbench 20, a punching control console 22, a punching X-axis guide 23, a punching X-axis guide driver 24, a punching Z-axis guide 25, a punching Z-axis guide driver 26, a punching loading suction cup 27, and a punching unloading suction cup 28. The punching die set includes a stamping upper die 16, a stamping lower die 17, a stamping lower die base 18, and a stamping hydraulic cylinder 19. The stamping lower die 17 is arranged above the stamping lower die base 18, and the stamping upper die 16 is arranged below the stamping hydraulic cylinder 19.
[0037] By adopting the above technical scheme, the waste chip suction device 1 only needs to install the chip collecting head according to the upper and lower die positions of the punch press 2, and connect the chip collecting head with a hose to adapt to a variety of different types of punch presses 2. The punch press 2 is a stamping press, the stamping lower die 17 is arranged above the stamping lower die base 18, the stamping upper die 16 is arranged below the stamping hydraulic cylinder 19, the punch feed suction cup 27 and the punch feed suction cup 28 are arranged on the punch X-axis guide rail 23, and the punch X-axis guide rail driver 24 makes the punch feed suction cup 27, the punch feed suction cup 28, and the lower die chip collecting head 8 on the punch X-axis guide rail 23 move along the X-axis, the stamping lower die base 18 is arranged on the punch Z-axis guide rail 25, and the punch Z-axis guide rail driver 26 makes the stamping lower die 17 on the punch Z-axis guide rail 25 move along the Z-axis, the stamping upper die 16 is arranged below the stamping hydraulic cylinder 19 to rise and fall, the stamping bracket supports and protects the stamping die set, and the punch feed suction cup 27, the punch feed suction cup 28, and the lower die chip collecting head 8 on the punch X-axis guide rail 23 move along the X-axis. A plate is placed above the workbench 20. The plate is sucked up by the punch loading suction cup 27 and placed above the stamping lower die 17. After that, the stamping lower die base 18 moves along the punch Z-axis guide 25 to the bottom of the stamping upper die 16. Then, the stamping hydraulic cylinder 19 drives the stamping upper die 16 to descend and punch the plate to form a specified product. Then, the stamping upper die 16 rises, and the stamping lower die base 18 returns along the punch Z-axis guide 25. At this time, the upper die chip collecting head 4 sweeps over the stamping upper die 16 to clean up the residual waste and debris of the stamping upper die 16. Then, the punch unloading suction cup 28 sucks up the formed plate and moves to the right along the punch X-axis guide 23 to unload the material. At this time, the lower die chip collecting head 8 descends in height through the lower die chip collecting head lifting cylinder 12, and moves to the right along the punch X-axis guide 23 to sweep over the stamping lower die 17 where no plate is placed to clean up the residual waste and debris of the stamping lower die 17, thereby realizing automatic and timely residual waste and debris cleaning.
[0038] Preferably, the lower die chip collecting head lifting device includes a lower die chip collecting head lifting cylinder 12 and a lower die chip collecting head mounting plate 13, the lower die chip collecting head lifting cylinder 12 is fixed on the lower die chip collecting head mounting plate 13, the lower die chip collecting head mounting plate 13 is connected to the X-axis guide rail 23 of the punch press, the lower die chip collecting head 8 is connected to the lower die chip collecting head lifting cylinder 12, and the lower die chip collecting head 8 opens downward.
[0039] By adopting the above technical scheme, the lower die chip collecting head lifting cylinder 12 of the lower die chip collecting head lifting device is fixed on the lower die chip collecting head mounting plate 13, and the lower die chip collecting head mounting plate 13 is connected to the X-axis guide rail 23 of the punch press, so that the lower die chip collecting head 8 can move left and right along the X-axis guide rail 23 of the punch press, and the lower die chip collecting head 8 is connected to the lower die chip collecting head lifting cylinder 12 so that the lower die chip collecting head 8 can be lifted up and down. The lower die hose 11 connected to the lower die chip collecting head 8 is a corrugated hose, and the lower die hose 11 can move with the lower die chip collecting head 8, and through the negative pressure suction of the chip collection main machine 3, the downward opening of the lower die chip collecting head 8 is close to the stamping lower die 17 to clean the residual waste and debris on the stamping lower die 17.
[0040] Preferably, the lower die chip collecting head lifting cylinder 12 is provided with a chip collecting head cylinder tubular protrusion 15 , and one end of the lower die chip collecting head 8 passes through the chip collecting head cylinder tubular protrusion 15 and is fixed by the lower die chip collecting head pipe clamp 14 .
[0041] By adopting the above-mentioned technical scheme, the lower die chip collecting head lifting cylinder 12 is provided with a chip collecting head cylinder tubular protrusion 15, and one end of the lower die chip collecting head 8 passes through the chip collecting head cylinder tubular protrusion 15 and is fixed by the lower die chip collecting head pipe clamp 14. A fixed protrusion is provided on the side of the lower die chip collecting head lifting cylinder 12, and the fixed protrusion is provided with a tubular protrusion for fixing the chip collecting head. The lower die chip collecting head 8 is fixed to the lower die chip collecting head lifting cylinder 12 by using the pipe clamp to realize the lifting function of the lower die chip collecting head 8.
[0042] Preferably, the lower die base is connected to the punch press Z-axis guide rail 25, and the upper die chip collecting head 4 is fixed above the punch lower die base 18, and the upper die chip collecting head 4 opens upward.
[0043] By adopting the above technical solution, the lower die base is connected to the Z-axis guide rail 25 of the punch press, and the upper die chip collection head 4 is fixed above the stamping lower die base 18, so that the upper die chip collection head 4 can move back and forth along the Z-axis guide rail 25 of the punch press. The upper die hose 7 connected to the upper die chip collection head 4 is a corrugated hose, and the upper die hose 7 can move with the upper die chip collection head 4. Through the negative pressure suction of the chip collection main unit 3, the upward opening of the upper die chip collection head 4 is close to the stamping upper die 16 to clean the residual waste and debris on the stamping upper die 16.
[0044] Preferably, the upper mold hose 7 is a corrugated hose, and one end of the upper mold hose 7 is sleeved with one end of the upper mold hard tube 5 and fixed with an upper mold throat clamp 6.
[0045] By adopting the above technical solution, the function of the waste chip suction device 1 being adapted to a variety of different punching machines 2 is achieved. One end of the upper mold hose 7 is sleeved with one end of the upper mold hard tube 5 and fixed with the upper mold throat clamp 6. The upper mold hard tube 5 is used to adapt to the shaping of the punching machine 2, and the upper mold hose 7 is used to follow the movement of the upper mold chip collection head 4.
[0046] Preferably, the lower mold hose 11 is a corrugated hose, and one end of the lower mold hose 11 is sleeved with one end of the lower mold hard tube 9 and fixed with a lower mold throat clamp 10.
[0047] By adopting the above technical solution, the function of the waste chip suction device 1 being adapted to a variety of different punching machines 2 is achieved. One end of the lower die hose 11 is sleeved with one end of the lower die hard tube 9 and fixed with the lower die throat clamp 10. The lower die hard tube 9 is used to adapt to the shaping of the punching machine 2, and the lower die hose 11 is used to follow the movement of the lower die chip collection head 8.
[0048] Preferably, a support frame 29 is provided on the outer side of the waste suction device 1 .
[0049] By adopting the above technical solution, the support frame 29 outside the waste chip suction device 1 protects the punching machine 2 and the waste chip suction device 1. The support frame 29 can also provide a fixed support position for the pipeline of the waste chip suction device 1, which is convenient for better adaptation.
[0050] Preferably, the lower die chip collecting head mounting plate 13 is displaced to above the stamping lower die 17 along the punch press X-axis guide rail 23 , and the lower die chip collecting head 8 is lowered close to the stamping lower die 17 by the lower die chip collecting head lifting cylinder 12 .
[0051] By adopting the above technical solution, when the lower die chip collecting head mounting plate 13 is displaced to above the stamping lower die 17 along the X-axis guide rail 23 of the punch press, the lower die chip collecting head lifting cylinder 12 and the lower die chip collecting head 8 installed on the chip collecting head mounting plate are displaced together to above the stamping lower die 17. At this time, the lower die chip collecting head 8 is lowered by the lower die chip collecting head lifting cylinder 12 to approach the stamping lower die 17 to clean up residual waste and debris.
[0052] Preferably, the stamping lower die base 18 is displaced to below the stamping upper die 16 along the punch press Z-axis guide rail 25 , and the upper die chip collecting head 4 is close to the stamping upper die 16 .
[0053] By adopting the above technical solution, when the stamping lower die base 18 moves to the bottom of the stamping upper die 16 along the Z-axis guide rail 25 of the punch press, the upper die chip collection head 4 installed on the stamping lower die base 18 moves to the bottom of the stamping upper die 16 together. At this time, the upper die chip collection head 4 is close to the stamping upper die 16 to clean up residual waste and debris.
[0054] Working principle: A chip collecting device 1 which can be installed in various types of punching machines 2 is manufactured by using a chip collecting main machine 3, a hard pipe, a hose, a chip collecting head, and a chip collecting head lifting device. The hose is used to follow the chip collecting head, and the chip collecting head is installed on the original track firmware of the punching machine 2 to realize the function of automatically cleaning residual waste and debris. There is no need to manually clean the residual waste and debris. It is not only efficient but also timely, which well protects the upper and lower molds, reduces the defective rate, and greatly improves the industrial production efficiency.
[0055] When in use, the user bends the hard tube as needed, and uses the soft tube where it needs to be moved. Finally, the chip collection head is installed on the original track firmware of the punch press 2 and aligned with the upper and lower dies to complete the installation.
[0056] The above-mentioned embodiments only express several implementation methods of the utility model, and the description is relatively specific and detailed, but it cannot be understood as limiting the scope of the utility model patent. It should be pointed out that for ordinary technicians in this field, several modifications and improvements can be made without departing from the concept of the utility model, which all belong to the protection scope of the utility model. Therefore, the protection scope of the utility model patent shall be based on the attached claims.
Claims
1. A negative pressure automatic waste chip suction device for a punch press, comprising a waste chip suction device (1), the waste chip suction device (1) comprising a chip collection main unit (3), an upper die chip collection module, and a lower die chip collection module, wherein the upper die chip collection module comprises an upper die chip collection head (4), an upper die hard tube (5), and an upper die soft tube (7), the upper die chip collection head (4) is connected to the upper die soft tube (7), the upper die soft tube (7) is connected to the upper die hard tube (5), and the upper die hard tube (7) is connected to the upper die hard tube (5). The tube (5) is connected to the chip collection main machine (3); the lower die chip collection module comprises a lower die chip collection head (8), a lower die chip collection head lifting device, a lower die hard tube (9), and a lower die hose (11); the lower die chip collection head (8) is connected to the lower die chip collection head lifting device; the lower die chip collection head (8) is connected to the lower die hose (11); the lower die hose (11) is connected to the lower die hard tube (9); and the lower die hard tube (9) is connected to the chip collection main machine (3).
2. The punch press negative pressure automatic waste suction device according to claim 1 is characterized in that: The waste scrap suction device (1) is installed in a punch press (2). The punch press (2) is a punching press. The punch press (2) comprises a punching die set, a punching main machine (21), a punching feed workbench (20), a punching control console (22), a punching X-axis guide rail (23), a punching X-axis guide rail driver (24), a punching Z-axis guide rail (25), a punching Z-axis guide rail driver (26), a punching feed suction cup (27), and a punching feed suction cup (28). The punching die set comprises a punching upper die (16), a punching lower die (17), a punching lower die base (18), and a punching hydraulic cylinder (19). The punching lower die (17) is arranged above the punching lower die base (18), and the punching upper die (16) is arranged below the punching hydraulic cylinder (19).
3. The punch press negative pressure automatic waste scrap suction device according to claim 2 is characterized in that: The lower die chip collecting head lifting device comprises a lower die chip collecting head lifting cylinder (12) and a lower die chip collecting head mounting plate (13); the lower die chip collecting head lifting cylinder (12) is fixed on the lower die chip collecting head mounting plate (13); the lower die chip collecting head mounting plate (13) is connected to the punch press X-axis guide rail (23); the lower die chip collecting head (8) is connected to the lower die chip collecting head lifting cylinder (12); and the lower die chip collecting head (8) opens downward.
4. The punch press negative pressure automatic waste scrap suction device according to claim 3 is characterized in that: The lower die chip collecting head lifting cylinder (12) is provided with a chip collecting head cylinder tubular protrusion (15), and one end of the lower die chip collecting head (8) passes through the chip collecting head cylinder tubular protrusion (15) and is fixed by the lower die chip collecting head pipe clamp (14).
5. The punch press negative pressure automatic waste scrap suction device according to claim 2, characterized in that: The lower die base is connected to the punching machine Z-axis guide rail (25), the upper die chip collecting head (4) is fixed above the punching lower die base (18), and the upper die chip collecting head (4) opens upward.
6. The punch press negative pressure automatic waste scrap suction device according to claim 1, characterized in that: The upper mold hose (7) is a corrugated hose, one end of which is sleeved with one end of the upper mold hard tube (5) and fixed by an upper mold throat clamp (6).
7. The punch press negative pressure automatic waste scrap suction device according to claim 1, characterized in that: The lower die hose (11) is a corrugated hose, one end of which is sleeved with one end of the lower die hard tube (9) and fixed with a lower die throat clamp (10).
8. The punch press negative pressure automatic waste scrap suction device according to claim 1, characterized in that: A support frame (29) is provided on the outside of the waste scrap suction device (1).
9. The punch press negative pressure automatic waste scrap suction device according to claim 3, characterized in that: The lower die chip collecting head mounting plate (13) is displaced along the punch press X-axis guide rail (23) to above the stamping lower die (17), and the lower die chip collecting head (8) is lowered to approach the stamping lower die (17) via the lower die chip collecting head lifting cylinder (12).
10. The punch press negative pressure automatic waste scrap suction device according to claim 5, characterized in that: The stamping lower die base (18) is displaced along the punching machine Z-axis guide rail (25) to below the stamping upper die (16), and the upper die chip collecting head (4) is close to the stamping upper die (16).