Positioning and heating mechanism of automatic semiconductor film tearing machine

Abstract

According to the positioning and heating mechanism of the automatic semiconductor film tearing machine, the adjusting knob is arranged to control the first sliding piece and the second sliding piece to be close to the middle, and strips on the jig disc tend to be matched with the width direction of the jig disc under the action of the first sliding piece and the second sliding piece; the first moving part and the second moving part are manually adjusted, so that the strip on the jig disc tends to be matched with the length direction of the jig disc, the size of the strip is matched with the size of the jig disc, meanwhile, flatness detection is conducted on the strip placed on the jig disc, the warping and deformation conditions of the strip are detected, and the detection accuracy is improved. The heating platform heats the strip through the jig disc, so that the adhesion between the strip and the film is reduced, the problem that film tearing is abnormal and a clamping hand is inconvenient to clamp due to the position difference problem of the strip is solved, the strip is aligned with the position of a subsequent conveying platform in parallel, the strip with the buckling deformation problem is screened out, and the production efficiency is improved. And the positioning piece made of the elastic material also protects the strip from being damaged.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor manufacturing equipment, in particular to a positioning and heating mechanism of a semiconductor automatic film tearing machine. Background Art

[0002] Semiconductor is a material based on conductors and insulators at room temperature. It is often used in science and technology fields such as aviation, automobiles, artificial intelligence and communication systems. Common semiconductor materials include silicon, germanium, gallium arsenide, etc., among which silicon is the most influential one. However, semiconductor is also one of the more sophisticated materials. In the daily semiconductor processing technology, in order to prevent the semiconductor panel from contacting foreign objects, wire bonding process, stable lead process, sealing and panel scratches, etc., which may cause damage to the semiconductor panel, in order to meet different process requirements, a layer of film with different process requirements is usually covered on the semiconductor material. After completing the above processing technology, the protective film needs to be removed.

[0003] The traditional film tearing machine has the problem that the position of the film strip is not fixed during the clamping process of the robot, which makes it inconvenient to operate during clamping. It cannot match the subsequent conveying platform well, resulting in deviation in the film tearing position, affecting the film tearing process. At the same time, there are abnormal conditions such as incomplete film tearing and residue in the film tearing process, resulting in a low product qualification rate. In addition, it is impossible to screen out the warped and deformed strips, and there are also abnormalities in the subsequent film tearing of the warped and deformed strips. Utility Model Content

[0004] In order to solve the above problems, an adjusting knob is set to control the first sliding member and the second sliding member to move closer to the middle. The first sliding member and the second sliding member make the strip placed on the jig disk tend to coincide with the width direction of the jig disk. By manually adjusting the first movable member and the second movable member, the strip placed on the jig disk tends to coincide with the length direction of the jig disk. The size of the strip matches the size of the jig disk, so that the position of the strip adapts to the requirements of subsequent processes. At the same time, the positioning member is made of elastic material to protect the strip from damage. The heating platform heats the strip through the jig disk, so that the adhesion between the strip and the film is reduced. , solve the film tearing anomaly in the film tearing process, and at the same time, the first flatness detection and the second flatness detection are adjusted up or down according to the thickness of the product strips placed on the fixture disk. The first flatness detection and the second flatness detection cooperate with the amplifier to detect the warping and deformation of the strips on the fixture disk to avoid the subsequent abnormal film tearing of the deformed strips. The above settings solve the problem of inconvenience in clamping caused by the position difference of the strips, so that it is parallel to the position of the subsequent conveying platform for easy grasping, and the problem of warping and deformation of the strips. At the same time, the film tearing anomaly is solved and the strips are protected from damage.

[0005] The technical solution of the utility model: a positioning and heating mechanism of a semiconductor automatic film tearing machine comprises a main platform, comprising a first platform, a first supporting column is fixedly arranged at the bottom of the first platform, an amplifier is fixedly arranged on one side of the first supporting column, a second supporting column, a first side plate, a second side plate and a third supporting column are arranged on the first platform, the second supporting column is fixedly connected with the heating platform and the second slide rail as a whole, a second moving part and a second flatness detection are arranged on the second slide rail, the third supporting column is fixedly connected with the heating platform and the first slide rail as a whole, a first moving part and a first flatness detection are arranged on the first slide rail, the heating platform is connected with the temperature detection, an electric heating wire is arranged in the heating platform, the heating platform is connected with the fixture disk, the first side plate and the second side plate are connected through the driving shaft, the first sliding shaft and the second sliding shaft, the driving shaft, the first sliding shaft and the second sliding shaft are slidably connected with the through holes arranged on the first sliding part and the second sliding part, a first positioning part is arranged on the first sliding part, a second positioning part is arranged on the second sliding part, and the driving shaft is connected with the adjusting knob through a pulley.

[0006] As a further solution of the utility model, the first flatness detection and the second flatness detection are adjusted up or down according to the thickness of the product strip placed on the jig disk. The first flatness detection and the second flatness detection are coordinated with the amplifier to detect the warping and deformation of the strip on the jig disk.

[0007] As a further solution of the utility model, the first slide rail cooperates with the first movable member, and the second movable member cooperates with the second flatness detection member. By manually adjusting the first movable member and the second movable member, the strip placed on the jig disk tends to coincide with the length direction of the jig disk.

[0008] As a further solution of the utility model, the driving shaft cooperates with the first sliding member, the second sliding member, the first side plate and the second side plate. By adjusting the adjusting knob, the positive rotation of the adjusting knob corresponds to the first sliding member and the second sliding member approaching the middle, and the reverse rotation of the adjusting knob corresponds to the first sliding member and the second sliding member moving away from each other. The first sliding shaft and the second sliding shaft stabilize the movement of the first sliding member and the second sliding member along the direction of the driving shaft. The action of the first sliding member and the second sliding member makes the strips placed on the jig disk tend to coincide with the width direction of the jig disk.

[0009] As a further solution of the utility model, the heating platform heats the fixture disk, and the fixture disk transfers the heat to the strip. The heating platform can replace different fixture disks according to the specifications of the strip. The temperature detection detects the temperature of the contact surface between the heating platform and the fixture disk.

[0010] As a further solution of the utility model, the size of the fixture plate matches the size of the strip placed on the fixture plate.

[0011] As a further solution of the utility model, the contact positioning members of the first moving member and the second moving member limiting strip are made of elastic material, and the first positioning member and the second positioning member are made of elastic material.

[0012] Beneficial effects of the utility model

[0013] The positioning and heating mechanism of the semiconductor automatic film tearing machine of the utility model controls the first sliding member and the second sliding member to approach the middle by setting an adjusting knob. The first sliding member and the second sliding member make the strip placed on the fixture disk tend to coincide with the width direction of the fixture disk. By manually adjusting the first moving member and the second moving member, the strip placed on the fixture disk tends to coincide with the length direction of the fixture disk. The size of the strip matches the size of the fixture disk, so that the position of the strip meets the requirements of subsequent processes. At the same time, the positioning member is made of elastic material to protect the strip from damage. The heating platform heats the strip through the fixture disk. Heating reduces the adhesion between the strip and the film, solving the abnormal film tearing process. At the same time, the first flatness detection and the second flatness detection are adjusted up or down according to the thickness of the product strip placed on the fixture disk. The first flatness detection and the second flatness detection cooperate with the amplifier to detect the warping and deformation of the strip on the fixture disk, avoiding the abnormal film tearing of the deformed strip in the subsequent deformation. The above settings solve the problem of inconvenience in clamping due to the position difference of the strip, and the problem of warping and deformation of the strip, while solving the abnormal film tearing and protecting the strip from damage. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] In order to more clearly illustrate the technical solution of the embodiment of the utility model, a brief description of the drawings is given, but the drawings do not constitute any limitation to the utility model. For ordinary technicians in this field, other drawings can be obtained based on the following drawings without paying any creative work.

[0015] Description of reference numerals:

[0016] Figure 1 The three-dimensional Figure 1 ;

[0017] Figure 2 The utility model is a three-dimensional Figure 2 ;

[0018] Figure 3 It is the decomposition of the utility model Figure 1 ;

[0019] Figure 4 It is the decomposition of the utility model Figure 2 ;

[0020] 1. First support column, 2. First platform, 3. Second support column, 4. First side plate, 5. First sliding member, 6. Active shaft, 7. First sliding shaft, 8. Second sliding shaft, 9. First slide rail, 10. First moving member, 11. First flatness detection, 12. Heating platform, 13. First positioning member, 14. Second positioning member, 15. Second sliding member, 16. Temperature detection, 17. Fixture plate, 18. Amplifier, 19. Second moving member, 20. Second slide rail, 21. Second flatness detection, 22. Pulley, 23. Adjustment knob, 24. Second side plate, 25. Third support column. DETAILED DESCRIPTION

[0021] The utility model is further described below in conjunction with the accompanying drawings and embodiments.

[0022] like Figure 1-4 As shown, the positioning and heating mechanism of the semiconductor automatic film tearing machine is characterized in that: it includes a first platform 2, a first support column 1 is fixedly arranged at the bottom of the first platform 2, an amplifier 18 is fixedly arranged on one side of the first support column 1, a second support column 3, a first side plate 4, a second side plate 24 and a third support column 25 are arranged on the first platform 2, the second support column 3 is integrally fixedly connected with the heating platform 12 and the second slide rail 20, the second slide rail 20 is provided with a second moving part 19 and a second flatness detection 21, the third support column 25 is integrally fixedly connected with the heating platform 12 and the first slide rail 9, and the first slide rail 9 is provided with a second moving part 19 and a second flatness detection 21. A moving part 10 and a first flatness detection 11, the heating platform 12 is connected to the temperature detection 16, the heating platform 12 is equipped with a heating wire, the heating platform 12 is connected to the fixture disk 17, the first side plate 4 and the second side plate 24 are connected through the active shaft 6, the first sliding shaft 7 and the second sliding shaft 8, the active shaft 6, the first sliding shaft 7 and the second sliding shaft 8 are slidably connected with the through holes set on the first sliding member 5 and the second sliding member 15, the first sliding member 5 is provided with a first positioning member 13, the second sliding member 15 is provided with a second positioning member 14, and the active shaft 6 is connected to the adjusting knob 23 through a pulley 22.

[0023] The first flatness detection 11 and the second flatness detection 21 are adjusted up or down according to the thickness of the product strip placed on the jig plate 17 . The first flatness detection 11 and the second flatness detection 21 cooperate with the amplifier 18 to detect the warping and deformation of the strip on the jig plate 17 .

[0024] The first slide rail 9 cooperates with the first movable member 10 , and the second movable member 19 cooperates with the second flatness detection member 21 . By manually adjusting the first movable member 10 and the second movable member 19 , the strip placed on the jig plate 17 tends to coincide with the length direction of the jig plate 17 .

[0025] The driving shaft 6 cooperates with the first sliding member 5, the second sliding member 15, the first side plate 4 and the second side plate 24. By adjusting the adjusting knob 23, the positive rotation of the adjusting knob 23 corresponds to the first sliding member 5 and the second sliding member 15 approaching the middle, and the reverse rotation of the adjusting knob 23 corresponds to the first sliding member 5 and the second sliding member 15 moving away from each other. The first sliding shaft 7 and the second sliding shaft 8 stabilize the movement of the first sliding member 5 and the second sliding member 15 along the direction of the driving shaft 6. The action of the first sliding member 5 and the second sliding member 15 makes the strips placed on the jig plate 17 tend to coincide with the width direction of the jig plate 17.

[0026] The heating platform 12 heats the fixture disk 17, and the fixture disk 17 transfers the heat to the strip. The heating platform 12 can replace different fixture disks 17 according to the specifications of the strip. The temperature detection 16 detects the temperature of the contact surface between the heating platform 12 and the fixture disk 17.

[0027] The size of the fixture plate 17 matches the size of the strip placed on the fixture plate 17 .

[0028] The contact positioning members of the first moving member 10 and the second moving member 19 limiting the strip are made of elastic material, and the first positioning member 13 and the second positioning member 14 are made of elastic material.

[0029] Working principle: The positioning and heating mechanism of the semiconductor automatic film tearing machine of the utility model controls the first sliding member 5 and the second sliding member 15 to approach the middle by setting the adjusting knob 23. The first sliding member 5 and the second sliding member 15 make the strip placed on the fixture disk 17 tend to coincide with the width direction of the fixture disk 17. By manually adjusting the first moving member 10 and the second moving member 19, the strip placed on the fixture disk 17 tends to coincide with the length direction of the fixture disk. The size of the strip matches the size of the fixture disk 17, so that the position of the strip meets the requirements of the subsequent process. At the same time, the positioning member is made of elastic material to protect the strip from damage. The heating platform 12 passes through the fixture. The disk 17 heats the film strip to reduce the adhesion between the film strip and the film, thereby solving the film tearing anomaly in the film tearing process. At the same time, the first flatness detection 11 and the second flatness detection 21 are adjusted up or down according to the thickness of the product film strip placed on the jig disk 17. The first flatness detection 11 and the second flatness detection 21 cooperate with the amplifier 18 to detect the warping and deformation of the film strip on the jig disk 17 to avoid subsequent film tearing anomalies of the deformed film strip. The above settings solve the problem of inconvenience in clamping due to the position difference of the film strip, as well as the problem of warping and deformation of the film strip, while solving the film tearing anomaly and protecting the film strip from damage.

[0030] The embodiments of the present invention are described in detail above in conjunction with the accompanying drawings, but the present invention is not limited to the above embodiments, and various changes can be made within the knowledge scope of those skilled in the art without departing from the purpose of the present invention.

Claims

1. The positioning and heating mechanism of the semiconductor automatic film tearing machine is characterized by: The invention comprises a first platform (2), a first support column (1) being fixedly arranged at the bottom of the first platform (2), an amplifier (18) being fixedly arranged on one side of the first support column (1), a second support column (3), a first side plate (4), a second side plate (24) and a third support column (25) being arranged on the first platform (2), the second support column (3) being integrally fixedly connected with the heating platform (12) and the second slide rail (20), the second slide rail (20) being provided with a second moving part (19) and a second flatness detection device (21), the third support column (25) being integrally fixedly connected with the heating platform (12) and the first slide rail (9), the first slide rail (9) being provided with a first moving part (10) and a first flatness detection device ( 11), the heating platform (12) is connected to the temperature detector (16), the heating platform (12) is provided with a heating wire, the heating platform (12) is connected to the fixture disk (17), the first side plate (4) and the second side plate (24) are connected through the driving shaft (6), the first sliding shaft (7) and the second sliding shaft (8), the driving shaft (6), the first sliding shaft (7) and the second sliding shaft (8) are slidably connected with the through holes provided on the first sliding member (5) and the second sliding member (15), the first sliding member (5) is provided with a first positioning member (13), the second sliding member (15) is provided with a second positioning member (14), and the driving shaft (6) is connected to the adjusting knob (23) through a pulley (22).

2. The positioning and heating mechanism of the semiconductor automatic film tearing machine according to claim 1 is characterized in that: The first flatness detection (11) and the second flatness detection (21) are adjusted upward or downward according to the thickness of the product strip placed on the jig plate (17). The first flatness detection (11) and the second flatness detection (21) cooperate with the amplifier (18) to detect the warping and deformation of the strip on the jig plate (17).

3. The positioning and heating mechanism of the semiconductor automatic film tearing machine according to claim 1 is characterized in that: The first slide rail (9) cooperates with the first movable member (10), and the second movable member (19) cooperates with the second flatness detector (21). By manually adjusting the first movable member (10) and the second movable member (19), the strip placed on the fixture plate (17) tends to coincide with the length direction of the fixture plate (17).

4. The positioning and heating mechanism of the semiconductor automatic film tearing machine according to claim 1 is characterized in that: The active shaft (6) cooperates with the first sliding member (5), the second sliding member (15), the first side plate (4) and the second side plate (24). By adjusting the adjusting knob (23), the positive rotation of the adjusting knob (23) corresponds to the first sliding member (5) and the second sliding member (15) approaching the middle, and the reverse rotation of the adjusting knob (23) corresponds to the first sliding member (5) and the second sliding member (15) moving away from each other. The first sliding shaft (7) and the second sliding shaft (8) play a stabilizing role in the movement of the first sliding member (5) and the second sliding member (15) along the active shaft (6). The first sliding member (5) and the second sliding member (15) make the strip placed on the fixture plate (17) tend to coincide with the width direction of the fixture plate (17).

5. The positioning and heating mechanism of the semiconductor automatic film tearing machine according to claim 1 is characterized in that: The heating platform (12) heats the fixture disk (17), and the fixture disk (17) transfers the heat to the sheet strip. The heating platform (12) can replace different fixture disks (17) according to the specifications of the sheet strip. The temperature detector (16) detects the temperature of the contact surface between the heating platform (12) and the fixture disk (17).

6. The positioning and heating mechanism of the semiconductor automatic film tearing machine according to claim 5 is characterized in that: The size of the jig plate (17) matches the size of the strip placed on the jig plate (17).

7. The positioning and heating mechanism of the semiconductor automatic film tearing machine according to claim 1 is characterized in that: The contact positioning members of the first moving member (10) and the second moving member (19) that limit the strip are made of elastic material, and the first positioning member (13) and the second positioning member (14) are made of elastic material.

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