Metal wire hot melt dipping device
Through the wire hot melt dip plating device, the problems of high energy consumption, unevenness and environmental pollution in the wire surface plating process in the prior art are solved, and the formation of continuous and uniform plating is achieved, which reduces production costs and improves the process environmental protection.
Patent Information
- Application Number
- CN202421131375.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-05-23
- Publication Date
- 2024-12-31
- Estimated Expiration
- 2034-05-23
AI Technical Summary
The existing wire surface plating process has problems such as high energy consumption, unevenness and environmental pollution in the electroplating process. The production cost of the electroplating process is high and unfriendly to the environment.
The metal wire hot melt dipping device is used to heat the metal through the melting module, cool the molding module to solidify the plating layer, and use a vacuum furnace and a pulling and wire collection module to achieve the formation of a continuous and uniform plating layer, reducing the use of chemical reagents and reducing production costs.
The continuous uniformity of the surface plating of metal wire is achieved, the process is simple, the environment is friendly, the production cost is low, and it has good economic and social benefits.
Smart Images
Figure CN222274651U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of metal wire surface coating equipment, in particular to a metal wire hot-melt dipping coating device. Background Art
[0002] Covering the surface of high-temperature refractory metals and alloy wires such as molybdenum, tungsten, tantalum and niobium with a metal coating (such as gold, silver, copper, etc.) can give the metal wires better conductivity, thermal stability and corrosion resistance. The coated metal wires can be used in many fields such as the electronics and medical industries. For example, gold-plated molybdenum wires are often used in high-reliability electrical components, where they can maintain high strength and conductivity.
[0003] In the prior art, methods for coating the surface of metal wires include vacuum evaporation, chemical plating, electroplating, etc. However, the electroplating process requires a continuous supply of electricity, which consumes a lot of energy. Factors such as the unevenness of the coating and the long preparation time also affect the energy efficiency of the process. The organic solvents and metal compounds in the electroplating solution will evaporate and leak, posing risks to the environment. Similarly, vacuum evaporation and chemical plating processes also require the use of a large amount of chemical reagents, which have high production costs, are not environmentally friendly, and have the problem of uneven coating. Utility Model Content
[0004] The utility model aims to provide a metal wire surface coating device, which can reduce the use of chemical reagents, lower production costs, and ensure continuous and uniform coating.
[0005] In order to achieve the above-mentioned object, the utility model provides a metal wire hot-melt dipping device, comprising:
[0006] A smelting module, used for heating and molten metal, wherein the smelting module comprises a smelting cavity;
[0007] A cooling and forming module, used to solidify the metal coating, the cooling and forming module comprising a discharge channel connected to the smelting cavity;
[0008] Drawing and winding wire module, used for drawing and winding metal wire;
[0009] A vacuum furnace, wherein the smelting module, the cooling and forming module and the drawing and wire-taking module are all arranged in the vacuum furnace, the vacuum furnace has a vacuum cavity, the smelting cavity is isolated from the vacuum cavity, and the discharge channel is connected to the vacuum cavity.
[0010] The metal wire hot melt dip plating device of the utility model can heat the metal to be plated to a molten state, utilize the interface reaction between the metal wire and the liquid metal in a high temperature state to form a thin metal interface diffusion layer, and after cooling, a continuous and uniform coating can be formed on the surface of the metal wire. The use of the device for metal wire surface plating has the advantages of simple process, environmental friendliness, and low production cost.
[0011] Furthermore, the smelting module includes a crucible and a heating coil, the crucible has the smelting cavity, the bottom of the crucible is provided with a bottom pouring hole, and the heating coil is wound outside the crucible. The crucible is used to smelt metal, and the bottom pouring hole is provided for the metal wire and liquid metal to pass through, and the size of the bottom pouring hole is determined by the wire diameter of the metal wire and the thickness of the coating.
[0012] Furthermore, the smelting module includes a pressure control device, which is used to introduce inert gas into the smelting cavity. The pressure control device can adjust the pressure difference between the smelting cavity and the vacuum cavity to increase the controllability of the coating.
[0013] Furthermore, the cooling molding module comprises a downflow guide tube, the downflow guide tube is integrally formed with the crucible, the discharge channel is formed in the downflow guide tube, and the discharge channel is connected to the bottom pouring hole. The cooling molding module has a simple structure, and the liquid metal is cooled and solidified in the process of passing through the discharge channel inside the downflow guide tube.
[0014] Furthermore, the cooling molding module comprises a cooling pipe, the cooling pipe is spiral, and the cooling pipe is sleeved on the downstream guide pipe. The cooling pipe is provided to improve the cooling and solidification efficiency of the coating.
[0015] Furthermore, the downstream guide pipe includes a connected extension section and a cooling section, and the cooling pipe is sleeved on the cooling section. The extension section is provided to play a transition role, so as to avoid solidification and blockage of the metal at the bottom pouring hole. The molten metal remains in liquid state in the extension section and solidifies into a solid state when flowing through the cooling section.
[0016] Furthermore, the gap between the cooling pipe and the downstream guide pipe is filled with a heat-conducting material, thereby achieving contact cooling and enhancing the condensation effect.
[0017] Furthermore, the drawing and taking-up module comprises a take-up shaft and a take-up motor, and the take-up motor is used to drive the take-up shaft to rotate. The drawing and taking-up module provides traction for the movement of the metal wire and arranges and winds the metal wire with the coating.
[0018] Furthermore, the cooling and forming module is arranged below the melting module, and the drawing and wire taking-up module is arranged below the cooling and forming module. This arrangement can utilize gravity to ensure that the metal wire and the metal melt move in a set direction to avoid misalignment.
[0019] Furthermore, the discharge channel is arranged vertically, thereby ensuring that the metal liquid is evenly distributed in the discharge channel and improving the uniformity of the coating. BRIEF DESCRIPTION OF THE DRAWINGS
[0020] Figure 1It is a schematic structural diagram of a metal wire hot-melt dipping device in an embodiment of the utility model.
[0021] Figure 2 It is a schematic diagram of the working state of the metal wire hot-melt dipping device in the embodiment of the utility model.
[0022] Description of reference numerals:
[0023] 11-crucible, 12-smelting cavity, 13-bottom injection hole, 14-heating coil, 15-pressure control device, 21-downstream guide pipe, 211-extension section, 212-cooling section, 22-discharging channel, 23-cooling pipe, 31-receiving shaft, 32-receiving motor, 4-vacuum furnace, 41-vacuum cavity, 5-metal wire, 6-metal melt. DETAILED DESCRIPTION
[0024] In order to make the purpose, technical scheme and advantages of the embodiments of the utility model clearer, the technical scheme in the embodiments of the utility model will be clearly and completely described below in conjunction with the drawings in the embodiments of the utility model. Obviously, the described embodiments are part of the embodiments of the utility model, not all of the embodiments. Generally, the components of the embodiments of the utility model described and shown in the drawings here can be arranged and designed in various different configurations.
[0025] Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the present invention to be protected, but merely represents selected embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.
[0026] It should be noted that similar symbols and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, it does not require further definition and explanation in the subsequent drawings.
[0027] In the description of the present utility model, it should be noted that the terms "upper", "lower", "left", "right", "inside", "outside", "front", "back", etc. indicate directions or positional relationships based on the directions or positional relationships shown in the accompanying drawings, or are the directions or positional relationships in which the utility model product is usually placed when in use. They are only for the convenience of describing the present utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific direction, be constructed and operated in a specific direction, and therefore cannot be understood as a limitation on the present utility model.
[0028] Combination Figure 1 and Figure 2As shown, this embodiment discloses a metal wire hot-melt dipping device, which is used for plating a metal layer on the surface of high-temperature refractory metals and alloy wires such as molybdenum, tungsten, tantalum and niobium. The device includes a smelting module, a cooling and forming module, a drawing and winding module and a vacuum furnace 4. The smelting module includes a smelting cavity 12, which is used to heat the molten metal. The cooling and forming module is used to solidify the metal coating, and includes a discharge channel 22, which is connected to the smelting cavity 12. The metal melt 6 will flow from the smelting cavity 12 into the discharge channel 22 and solidify in the discharge channel 22. The drawing and winding module is used to provide traction for the movement of the metal wire 5 and to wind up the metal wire 5. The vacuum furnace 4 is used to provide power for the flow of the molten metal 6. The above-mentioned smelting module, cooling and forming module and drawing and wire taking-up module are all arranged in the vacuum furnace 4. The vacuum furnace 4 has a vacuum cavity 41, and the smelting cavity 12 is isolated from the vacuum cavity 41. The discharge channel 22 is connected to the vacuum cavity 41, thereby forming a pressure difference between the smelting cavity 12 and the discharge channel 22, and the molten metal 6 will flow to the discharge channel 22.
[0029] Preferably, the smelting module includes a pressure control device 15, which is connected to the smelting cavity 12 through an air pipe, and can introduce inert gas into the smelting cavity 12, thereby adjusting the pressure difference between the smelting cavity 12 and the vacuum cavity 41, controlling the flow rate of the metal melt 6, and ensuring the uniformity of the coating.
[0030] The working principle of the above-mentioned device is as follows: the smelting module heats the metal to be plated to a molten state, the metal wire 5 passes through the smelting cavity 12 into the discharge channel 22, the solid metal wire 5 reacts with the liquid metal at an interface under high temperature to form a diffusion layer, and the metal melt 6 cools down and solidifies in the process of passing through the discharge channel 22, thereby forming a continuous and uniform coating on the surface of the metal wire 5, and the metal wire 5 that has completed the immersion coating is wound up by the drawing and winding module.
[0031] Combination Figure 1 As shown, in this embodiment, the smelting module includes a crucible 11 and a heating coil 14. The crucible 11 has a smelting cavity 12, and a bottom pouring hole 13 is provided at the bottom for the metal wire 5 and the liquid metal to pass through. The size of the bottom pouring hole 13 is determined by the wire diameter and the coating thickness of the metal wire 5. The heating coil 14 is wound around the outside of the crucible 11, and can heat the smelting cavity 12 evenly and efficiently.
[0032] The cooling molding module includes a downflow guide tube 21 and a cooling tube 23. A discharge channel 22 is formed in the downflow guide tube 21. The downflow guide tube 21 is integrally formed with the crucible 11. Furthermore, the downflow guide tube 21 is divided into two sections, namely an extension section 211 and a cooling section 212. The extension section 211 is located at the upper end of the downflow guide tube, and plays a transition role to prevent the metal from solidifying and clogging at the bottom injection hole 13. The cooling tube 23 is spiral, and cooling liquid can be passed into the interior. The cooling tube 23 is sleeved on the cooling section 212, so that the metal melt 6 in the discharge channel 22 is quickly cooled, and after flowing out of the discharge channel 22, it becomes a solidified metal coating.
[0033] In a preferred embodiment, the gap between the cooling tube 23 and the downstream guide tube 21 is filled with a heat-conducting material, such as brazing material, graphite powder, etc., thereby enhancing heat conduction, achieving full-contact cooling, and enhancing the condensation effect.
[0034] The wire drawing and taking-up module includes a wire taking-up shaft 31 and a wire taking-up motor 32, and the wire taking-up motor 32 is used to drive the wire taking-up shaft 31 to rotate. One end of the metal wire 5 can be connected to the wire taking-up shaft 31, or an independent traction wire can be set to fix the metal wire 5 to the traction wire. When the wire taking-up motor 32 works, the wire taking-up shaft 31 can be rotated, thereby providing traction for the movement of the metal wire 5, and arranging and winding the metal wire 5 that has been dip-plated.
[0035] Combination Figure 1 and Figure 2 As shown, in this embodiment, the crucible 11 is arranged at the top of the vacuum furnace 4, the downstream guide pipe 21 is arranged below the crucible 11, and the wire take-up shaft 31 is arranged below the downstream guide pipe 21, that is, the cooling and forming module is arranged below the smelting module, and the drawing and taking-up module is arranged below the cooling and forming module. This arrangement can utilize the effect of gravity to ensure that the metal wire 5 and the metal melt 6 move along the set direction to avoid misalignment.
[0036] Preferably, the discharge channel 22 is vertically arranged, one end of the metal wire 5 passes through the bottom pouring hole 13 of the crucible 11 vertically through the discharge channel 22, and is fixed on the wire reel 31, thereby ensuring that the metal liquid is evenly distributed in the discharge channel 22 and improving the uniformity of the coating.
[0037] The process of using the device provided in the above embodiment to perform surface coating on the metal wire 5 is as follows:
[0038] The metal material to be smelted (gold, silver, copper, etc.) is loaded into the crucible 11, and the vacuum furnace 4 is closed after the loading is completed. The traction wire is passed through the bottom injection hole 13 of the crucible 11 and the discharge channel of the downstream guide pipe 21, and fixed on the take-up shaft 31. The vacuum furnace 4 is evacuated, and after reaching the set vacuum degree, the metal material in the crucible 11 is heated and melted by the heating coil 14. Inert gas is filled into the smelting cavity 12 through the pressure control device 15, and the metal wire 5 passes through the metal melt 6 at a uniform speed from the top of the metal melt 6 along the force direction of the traction wire. The metal melt 6 on the surface of the metal wire 5 enters the discharge channel 22 from the bottom injection hole 13 along the metal wire 5, and solidifies to form a coating when passing through the cooling section 212. The metal wire 5 with a coating on the surface is evenly arranged on the take-up shaft 31 under the traction action of the take-up shaft 31.
[0039] The above process steps are simple, no chemical reagents are required, it is environmentally friendly, has low production costs, and has good economic and social benefits.
[0040] Finally, it should be noted that the above embodiments are only used to illustrate the technical solution of the utility model, rather than to limit it. Although the utility model has been described in detail with reference to the aforementioned embodiments, ordinary technicians in the field should understand that they can still modify the technical solutions recorded in the aforementioned embodiments, or replace some or all of the technical features therein with equivalents. However, these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the scope of the technical solutions of the embodiments of the utility model.
Claims
1. A metal wire hot-melt dipping device, characterized in that: include: A smelting module, used for heating and molten metal, the smelting module comprising a smelting chamber (12); A cooling and forming module, used for solidifying the metal coating, the cooling and forming module comprising a discharge channel (22) connected to the smelting cavity (12); A wire drawing and winding module, used for drawing and winding the metal wire (5); A vacuum furnace (4), wherein the smelting module, the cooling and forming module and the drawing and wire-taking module are all arranged in the vacuum furnace (4), the vacuum furnace (4) has a vacuum cavity (41), the smelting cavity (12) is isolated from the vacuum cavity (41), and the discharge channel (22) is connected to the vacuum cavity (41).
2. The metal wire hot-melt dipping device according to claim 1, characterized in that: The smelting module comprises a crucible (11) and a heating coil (14); the crucible (11) has the smelting cavity (12); a bottom pouring hole (13) is provided at the bottom of the crucible (11); and the heating coil (14) is wound around the outside of the crucible (11).
3. The metal wire hot-melt dipping device according to claim 1, characterized in that: The smelting module comprises a pressure control device (15), and the pressure control device (15) is used to introduce an inert gas into the smelting chamber (12).
4. The metal wire hot-melt dipping device according to claim 2, characterized in that: The cooling molding module comprises a downflow guide pipe (21), the downflow guide pipe (21) and the crucible (11) are integrally formed, the discharge channel (22) is formed in the downflow guide pipe (21), and the discharge channel (22) is connected to the bottom injection hole (13).
5. The metal wire hot-melt dipping device according to claim 4, characterized in that: The cooling molding module comprises a cooling pipe (23), the cooling pipe (23) is spiral-shaped, and the cooling pipe (23) is sleeved on the downstream guide pipe (21).
6. The metal wire hot-melt dipping device according to claim 5, characterized in that: The downstream guide pipe (21) comprises a connected extension section (211) and a cooling section (212); the extension section (211) is connected to the crucible (11); and the cooling pipe (23) is sleeved on the cooling section (212).
7. The metal wire hot-melt dipping device according to claim 5, characterized in that: The gap between the cooling pipe (23) and the downstream guide pipe (21) is filled with heat-conducting material.
8. The metal wire hot-melt dipping device according to claim 1, characterized in that: The wire drawing and taking-up module comprises a wire taking-up shaft (31) and a wire taking-up motor (32), and the wire taking-up motor (32) is used for driving the wire taking-up shaft (31) to rotate.
9. The metal wire hot-melt dipping device according to any one of claims 1 to 8, characterized in that: The cooling and forming module is arranged below the smelting module, and the drawing and wire-taking module is arranged below the cooling and forming module.
10. The metal wire hot-melt dipping device according to claim 9, characterized in that: The discharge channel (22) is arranged vertically.