Temperature adjusting device

Abstract

The utility model provides a temperature adjusting device which is used for adjusting the temperature of a component, the temperature adjusting device comprises a liquid storage tank, a water pump and a plurality of temperature control assemblies, a liquid heat-conducting medium is packaged in the liquid storage tank, the liquid storage tank is used for generating heat conduction with the component, and each temperature control assembly comprises a heat transfer part, a semiconductor refrigerator and a radiator. The liquid storage tank, the water pump and the plurality of heat transfer pieces are communicated through a flow guide pipe to form a circulating pipeline, the semiconductor refrigerator is provided with a refrigerating surface and a heating surface, and in one part of the temperature control assemblies, the heat transfer pieces are connected to the refrigerating surface of the semiconductor refrigerator; in the other part of the temperature control assemblies, the heat transfer piece is connected to the heating surface of the semiconductor cooler, and the radiator is connected to the cooling surface of the semiconductor cooler. And through mutual cooperation of the liquid storage tank, the water pump and the multiple temperature control assemblies, the whole temperature adjusting device is small in occupied space and good in universality.

Description

Technical Field

[0001] The present application belongs to the technical field of temperature control equipment, and more specifically, to a temperature regulating device. Background Art

[0002] The projector is used to project images onto a screen and can provide a brightness ranging from tens of lumens to tens of thousands of lumens. It is widely used in business, education, home, outdoor, and entertainment fields. The projector is equipped with a light source assembly and a water-cooled radiator. The water-cooled radiator is used to dissipate heat for the light source assembly, thereby reducing the impact of temperature changes on the brightness of the light source assembly.

[0003] The existing water-cooled radiator includes a heat sink and a water tank. The heat sink is connected to the light source assembly to generate heat conduction. The water tank stores water. Multiple water pipes are connected between the heat sink and the water tank to form a circulation pipeline. Since a compressor is installed in the water tank to cool the water source, the volume of the water tank is large, and the compressor cannot heat the water source. It is difficult to apply to the scene where the light source assembly needs to be heated. Therefore, there is a problem that the whole machine occupies a large space and has poor versatility. Utility Model Content

[0004] One of the purposes of the embodiments of the present application is to provide a temperature regulating device to solve the technical problem that in the prior art, a compressor is installed in the water tank of a water-cooled radiator to cool the water source, resulting in a large volume of the water tank and the compressor cannot heat the water source, making it difficult to apply to scenarios where light source components need to be heated, resulting in the water-cooled radiator occupying a large space and having poor versatility.

[0005] To solve the above technical problems, in the first aspect, an embodiment of the present application provides a temperature regulating device for regulating the temperature of components, the temperature regulating device comprising a liquid storage tank, a water pump and a plurality of temperature control components, the liquid storage tank being encapsulated with a liquid heat-conducting medium, the liquid storage tank being used to generate heat conduction with the components; the temperature control component comprising a heat transfer element, a semiconductor refrigerator and a radiator, the heat transfer element having a flow channel for the liquid heat-conducting medium to flow through, the liquid storage tank, the water pump and a plurality of the heat transfer elements being connected by a flow guide pipe to form a circulation pipeline; the semiconductor refrigerator having a cooling surface and a heating surface; in a part of the temperature control components, the heat transfer element is connected to the cooling surface of the semiconductor refrigerator, and the radiator is connected to the heating surface of the semiconductor refrigerator; in another part of the temperature control components, the heat transfer element is connected to the heating surface of the semiconductor refrigerator, and the radiator is connected to the cooling surface of the semiconductor refrigerator.

[0006] The beneficial effects of the temperature regulating device provided by the present application are as follows: a liquid storage tank, a water pump and a plurality of temperature control components are arranged to cooperate with each other, and a circulation pipeline is formed by connecting the flow guide pipe. A liquid heat-conducting medium is encapsulated in the liquid storage tank. Under the action of the water pump, the liquid heat-conducting medium can flow in the circulation pipeline. The liquid storage tank is connected to components, so that the liquid heat-conducting medium in the liquid storage tank and the components can generate heat conduction. Compared with the water-cooled radiator in the prior art, the semiconductor refrigerator of the present application can regulate the temperature of the liquid heat-conducting medium flowing through the flow channel of the heat transfer element, thereby changing the temperature of the liquid heat-conducting medium in the liquid storage tank. The semiconductor refrigerator is small in size, which can save the space occupied by the whole machine of the temperature regulating device to facilitate the assembly of other components; the number of semiconductor refrigerators is multiple, a part of the semiconductor refrigerators is used to cool the liquid heat-conducting medium, and another part of the semiconductor refrigerators is used to heat the liquid heat-conducting medium, so that it can be applicable to a variety of use environment temperature scenarios and has stronger versatility; the radiator is used to enhance the heat exchange efficiency between the semiconductor refrigerator and the surrounding air to ensure the normal use of the semiconductor refrigerator.

[0007] In an achievable technical solution, the liquid storage tank includes a box body and a cover plate, a receiving groove is formed inside the box body, the receiving groove is used to place the liquid heat-conducting medium, the cover plate is installed at the notch of the receiving groove, and the side of the cover plate facing away from the receiving groove is provided for connection of the components.

[0008] In a feasible technical solution, the box body includes a bottom wall and side walls surrounding the bottom wall, and the side walls are provided with a pipe opening for the connection of the flow guide pipe.

[0009] In a feasible technical solution, the bottom wall is connected to a plurality of guide blocks arranged at intervals, one end of the guide block is connected to the side wall, and a guide gap is left between the other end and the side wall for the liquid heat transfer medium to flow.

[0010] In a feasible technical solution, the semiconductor refrigerator is in a block-shaped structure, and two opposite side surfaces of the semiconductor refrigerator respectively form the cooling surface and the heating surface.

[0011] In an achievable technical solution, the heat transfer element includes a first heat conducting plate, the heat sink includes a second heat conducting plate, an installation gap is formed between the first heat conducting plate and the second heat conducting plate for placing the semiconductor refrigerator, and the first heat conducting plate and the second heat conducting plate are bolted together.

[0012] In an achievable technical solution, the heat transfer element further includes a joint, which is disposed on the side of the first heat conducting plate away from the semiconductor refrigerator, and has a hollow structure to form the flow channel, and openings of the flow channel are respectively provided on opposite sides of the joint.

[0013] In a feasible technical solution, the joint is provided with a plurality of heat-conducting strips on the inner peripheral wall of the flow passage, and the plurality of heat-conducting strips are arranged at intervals along the circumference of the joint.

[0014] In a feasible technical solution, the joint is provided with a collar at the opening of the flow passage, and the collar is used for connecting the flow guide pipe.

[0015] In an achievable technical solution, the radiator further includes a fin group, which is disposed on the side of the second heat conduction plate away from the semiconductor refrigerator. The temperature control component further includes a fan, which is installed on the periphery of the guide tube, and the air outlet of the fan faces the fin group. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.

[0017] Figure 1 An assembly diagram of a temperature regulating device and components provided in an embodiment of the present application;

[0018] Figure 2 In the embodiment of this application Figure 1 A top view of the temperature regulating device and components;

[0019] Figure 3 In the embodiment of this application Figure 1 A disassembled diagram of one of the temperature control components;

[0020] Figure 4 In the embodiment of this application Figure 1 Another disassembled diagram of the temperature control component;

[0021] Figure 5 In the embodiment of this application Figure 1 A disassembled diagram of the fluid tank;

[0022] Figure 6 In the embodiment of this application Figure 5 Front view of the box.

[0023] Among them, the reference numerals in the figure are:

[0024] 10. liquid storage tank; 11. box body; 111. bottom wall; 112. side wall; 113. guide block; 12. cover plate; 101. pipe opening; 102. guide gap;

[0025] 20. Water pump;

[0026] 30. Temperature control assembly; 31. Heat transfer element; 311. First heat conduction plate; 312. Joint; 313. Heat conduction strip; 314. Ring; 32. Semiconductor refrigerator; 321. Cooling surface; 322. Heating surface; 33. Heat sink; 331. Second heat conduction plate; 332. Fin group; 34. Fan; 301. Flow passage;

[0027] 40. Flow guide pipe;

[0028] 50. Components. DETAILED DESCRIPTION

[0029] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present application more clearly understood, the present application is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and are not used to limit the present application.

[0030] It should be noted that when an element is referred to as being "fixed to" or "disposed on" another element, it can be directly on the other element or indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or indirectly connected to the other element.

[0031] It should be understood that the terms "length", "width", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0032] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of this application, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0033] The following is a detailed description with reference to the accompanying drawings and embodiments:

[0034] Please also read Figures 1 to 4The embodiment of the present application provides a temperature regulating device for regulating the temperature of a component 50. The temperature regulating device includes a liquid storage tank 10, a water pump 20, and a plurality of temperature control components 30. The liquid storage tank 10 contains a liquid heat-conducting medium. The liquid storage tank 10 is used to generate heat conduction with the component 50. The temperature control component 30 includes a heat transfer element 31, a semiconductor refrigerator 32, and a radiator 33. The heat transfer element 31 has a flow channel 301 for the liquid heat-conducting medium to flow through. The liquid storage tank 10, the water pump 20, and the plurality of heat transfer elements 30 are The components 31 are connected through the guide tube 40 to form a circulation pipeline. The semiconductor refrigerator 32 has a cooling surface 321 and a heating surface 322. In one part of the temperature control component 30, the heat transfer component 31 is connected to the cooling surface 321 of the semiconductor refrigerator 32, and the radiator 33 is connected to the heating surface 322 of the semiconductor refrigerator 32. In another part of the temperature control component 30, the heat transfer component 31 is connected to the heating surface 322 of the semiconductor refrigerator 32, and the radiator 33 is connected to the cooling surface 321 of the semiconductor refrigerator 32.

[0035] In application, a liquid storage tank 10, a water pump 20 and a plurality of temperature control components 30 are arranged to cooperate with each other, and a circulation pipeline is formed by connecting the flow guide pipe 40. Liquid heat-conducting medium is encapsulated in the liquid storage tank 10. Under the action of the water pump 20, the liquid heat-conducting medium can flow in the circulation pipeline. The liquid storage tank 10 is connected to components, so that the liquid heat-conducting medium in the liquid storage tank 10 can generate heat exchange with the components 50.

[0036] Specifically, the semiconductor refrigerator 32 can adjust the temperature of the liquid heat-conducting medium flowing through the flow channel 301 of the heat transfer element 31, thereby changing the temperature of the liquid heat-conducting medium in the liquid storage tank 10. The semiconductor refrigerator 32 is relatively small in size, which can save the space occupied by the entire temperature adjustment device to facilitate the assembly of other components.

[0037] Specifically, there are multiple semiconductor refrigerators 32, some of which are used to cool the liquid heat-conducting medium, and other semiconductor refrigerators 32 are used to heat the liquid heat-conducting medium, so that it can be applied to a variety of ambient temperature scenarios and has greater versatility.

[0038] Specifically, the radiator 33 is used to enhance the heat exchange efficiency between the semiconductor refrigerator 32 and the surrounding air to ensure the normal use of the semiconductor refrigerator 32 .

[0039] In application, the component 50 can be a heat dissipation substrate of the light source assembly, the liquid heat conducting medium can be pure water or antifreeze, the flow guide tube 40 is made of plastic, the semiconductor refrigerator 32 is made of ceramic, and the liquid storage tank 10 is made of alloy.

[0040] Specifically, the guide pipe 40 includes a first pipe section, a second pipe section, a third pipe section and a fourth pipe section. The first pipe section and the fourth pipe section are connected to opposite sides of the liquid storage tank 10, and the second pipe section and the third pipe section are connected to opposite sides of the water pump 20.

[0041] Please also read Figure 1 to Figure 2 In one embodiment of the present application, there are two temperature control components 30, and the opposite sides of one heat transfer component 31 in the two temperature control components 30 are respectively connected to the first pipe segment and the second pipe segment, and the opposite sides of the other heat transfer component 31 in the two temperature control components 30 are respectively connected to the third pipe segment and the fourth pipe segment, thereby forming a circulation pipeline.

[0042] It is understandable that in other embodiments of the present application, the number of temperature control components 30 is greater than two, the flow guide pipe 40 further includes a fifth pipe segment, and some adjacent heat transfer elements 31 are connected via the fifth pipe segment.

[0043] In one embodiment, please refer to Figure 1 , Figure 5 and Figure 6 The liquid storage box 10 includes a box body 11 and a cover plate 12. A receiving groove is formed inside the box body 11, and the receiving groove is used to place the liquid heat-conducting medium. The cover plate 12 is installed at the notch of the receiving groove. The side of the cover plate 12 away from the receiving groove is for connecting the components 50.

[0044] In application, the cover plate 12 is snap-fitted and installed at the notch of the receiving groove of the box body 11 to facilitate the replacement of the liquid heat-conducting medium in the receiving groove. The connection between the cover plate 12 and the box body 11 is provided with a sealing ring or coated with glue to improve the sealing of the liquid storage tank 10.

[0045] In one embodiment, please refer to Figure 1 , Figure 5 and Figure 6 The box body 11 includes a bottom wall 111 and side walls 112 surrounding the bottom wall 111 . The side wall 112 is provided with a pipe opening 101 for connecting the flow guide pipe 40 .

[0046] In application, there are two pipe openings 101 , which are arranged opposite to each other, and nuts are installed at the pipe openings 101 of the side wall 112 for connecting the flow guide pipe 40 .

[0047] In one embodiment, please refer to Figure 1 , Figure 5 and Figure 6 The bottom wall 111 is connected to a plurality of guide blocks 113 arranged at intervals. One end of the guide block 113 is connected to the side wall 112, and a guide gap 102 is left between the other end and the side wall 112 for the liquid heat transfer medium to flow.

[0048] In application, the height of the guide block 113 is the same as the height of the side wall 112, and the two guide gaps 102 of adjacent guide blocks 113 are respectively located on opposite sides of the guide blocks 113. Multiple guide blocks 113 can cooperate to divide the receiving groove and extend the flow path of the liquid heat-conducting medium in the receiving groove, so that the temperature difference of each part in the receiving groove is smaller and the heat conduction between each part of the component 50 and the liquid storage tank 10 is more uniform.

[0049] In one embodiment, please refer to Figures 1 to 4 The semiconductor refrigerator 32 has a block structure, and two opposite sides of the semiconductor refrigerator 32 form a cooling surface 321 and a heating surface 322 respectively.

[0050] In application, the semiconductor cooler 32 can be electrically connected to the integrated circuit board, and the start or shut down of the semiconductor cooler 32 can be controlled by a software program.

[0051] In one embodiment, please refer to Figures 1 to 4 The heat transfer element 31 includes a first heat conducting plate 311, and the heat sink 33 includes a second heat conducting plate 331. An installation gap is formed between the first heat conducting plate 311 and the second heat conducting plate 331 for placing the semiconductor refrigerator 32. The first heat conducting plate 311 and the second heat conducting plate 331 are bolted together.

[0052] In application, the cooling surface 321 and the heating surface 322 of the semiconductor refrigerator 32 are coated with thermal grease, which can ensure that the semiconductor refrigerator 32 is firmly installed in the installation gap and improve the heat conduction efficiency between the opposite sides of the semiconductor refrigerator 32 and the first heat conducting plate 311 and the second heat conducting plate 331 respectively.

[0053] In one embodiment, please refer to Figures 1 to 4 The heat transfer element 31 also includes a joint 312, which is arranged on the side of the first heat conducting plate 311 away from the semiconductor refrigerator 32. The joint 312 is a hollow structure to form a flow channel 301, and openings of the flow channel 301 are respectively provided on opposite sides of the joint 312.

[0054] In application, the semiconductor cooler 32 can generate heat conduction with the joint 312 through the first heat conduction plate 311, thereby absorbing or releasing heat from the liquid heat conduction medium flowing through the flow channel 301 of the joint 312. As the liquid heat conduction medium continues to flow in the circulation pipeline, the temperature of the liquid heat conduction medium in the liquid storage tank 10 changes, thereby adjusting the temperature of the components 50 connected to the liquid storage tank 10.

[0055] In one embodiment, please refer to Figures 1 to 4 The joint 312 is provided with a plurality of heat-conducting strips 313 on the inner peripheral wall of the flow passage 301 , and the plurality of heat-conducting strips 313 are arranged at intervals along the circumference of the joint 312 .

[0056] In applications, the plurality of heat-conducting strips 313 can increase the contact area between the liquid flow-conducting medium and the joint 312 to improve the heat conduction efficiency.

[0057] In one embodiment, please refer to Figures 1 to 4 The joint 312 is provided with a collar 314 at the opening of the flow passage 301 , and the collar 314 is connected to the flow guide pipe 40 .

[0058] In application, the collar 314 can facilitate the connection between the flow guide tube 40 and the joint 312, and the connection is more stable and has better sealing performance.

[0059] In one embodiment, please refer to Figures 1 to 4 The heat sink 33 also includes a fin group 332, which is arranged on the side of the second heat conducting plate 331 away from the semiconductor refrigerator 32. The temperature control component 30 also includes a fan 34, which is installed on the outer periphery of the guide tube 40, and the air outlet of the fan 34 faces the fin group 332.

[0060] In application, the semiconductor refrigerator 32 can generate heat conduction with the fin group 332 through the second heat conduction plate 331. The fin group 332 can increase the contact area between the semiconductor refrigerator 32 and the surrounding air on the side away from the heat transfer element 31. The fan 34 can enhance the flow rate of the air around the semiconductor refrigerator 32 to improve the heat exchange efficiency between the semiconductor refrigerator 32 and the surrounding air, ensure the normal use of the semiconductor refrigerator 32, and improve the operating stability of the temperature control device.

[0061] The above are only preferred embodiments of the present application and are not intended to limit the present application. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present application should be included in the protection scope of the present application.

Claims

1. A temperature regulating device for regulating the temperature of a component (50), characterized in that: The temperature regulating device comprises a liquid storage tank (10), a water pump (20) and a plurality of temperature control components (30); a liquid heat-conducting medium is encapsulated in the liquid storage tank (10); and the liquid storage tank (10) is used to generate heat conduction with the component (50); The temperature control component (30) comprises a heat transfer element (31), a semiconductor refrigerator (32) and a radiator (33); the heat transfer element (31) has a flow passage (301) for the liquid heat-conducting medium to flow through; the liquid storage tank (10), the water pump (20) and a plurality of the heat transfer elements (31) are connected via a flow guide pipe (40) to form a circulation pipeline; The semiconductor refrigerator (32) has a cooling surface (321) and a heating surface (322); In a portion of the temperature control assembly (30), the heat transfer element (31) is connected to the cooling surface (321) of the semiconductor refrigerator (32), and the heat sink (33) is connected to the heating surface (322) of the semiconductor refrigerator (32); In another part of the temperature control component (30), the heat transfer element (31) is connected to the heating surface (322) of the semiconductor refrigerator (32), and the heat sink (33) is connected to the cooling surface (321) of the semiconductor refrigerator (32).

2. The temperature control device according to claim 1, characterized in that: The liquid storage box (10) comprises a box body (11) and a cover plate (12); a receiving groove is formed inside the box body (11); the receiving groove is used to place the liquid heat-conducting medium; the cover plate (12) is installed at the notch of the receiving groove; and the side of the cover plate (12) facing away from the receiving groove is used for connection with the component (50).

3. The temperature regulating device according to claim 2, characterized in that: The box body (11) comprises a bottom wall (111) and side walls (112) arranged around the bottom wall (111), and the side walls (112) are provided with a pipe opening (101) for the flow guide pipe (40) to be connected.

4. The temperature regulating device according to claim 3, characterized in that: The bottom wall (111) is connected to a plurality of guide blocks (113) arranged at intervals, one end of the guide block (113) is connected to the side wall (112), and a guide gap (102) for the liquid heat-conducting medium to flow is left between the other end and the side wall (112).

5. The temperature regulating device according to claim 1, characterized in that: The semiconductor refrigerator (32) has a block-shaped structure, and two opposite surfaces of the semiconductor refrigerator (32) respectively form the cooling surface (321) and the heating surface (322).

6. The temperature regulating device according to claim 1, characterized in that: The heat transfer element (31) comprises a first heat conducting plate (311), and the heat sink (33) comprises a second heat conducting plate (331). An installation gap is formed between the first heat conducting plate (311) and the second heat conducting plate (331) for placing the semiconductor refrigerator (32). The first heat conducting plate (311) and the second heat conducting plate (331) are connected by bolts.

7. The temperature regulating device according to claim 6, characterized in that: The heat transfer element (31) further comprises a joint (312), wherein the joint (312) is arranged on a side of the first heat conducting plate (311) facing away from the semiconductor refrigerator (32), and the joint (312) is a hollow structure to form the flow passage (301), and openings of the flow passage (301) are respectively provided on opposite sides of the joint (312).

8. The temperature regulating device according to claim 7, characterized in that: The joint (312) is provided with a plurality of heat-conducting strips (313) on the inner peripheral wall of the flow passage (301), and the plurality of heat-conducting strips (313) are arranged at intervals along the circumference of the joint (312).

9. The temperature regulating device according to claim 7, characterized in that: The joint (312) is provided with a collar (314) at the opening of the flow passage (301), and the collar (314) is connected to the flow guide pipe (40).

10. The temperature adjustment device according to claim 6, characterized in that: The heat sink (33) further comprises a fin group (332), wherein the fin group (332) is arranged on a side of the second heat conducting plate (331) facing away from the semiconductor refrigerator (32), and the temperature control component (30) further comprises a fan (34), wherein the fan (34) is installed on the outer periphery of the flow guide tube (40), and an air outlet of the fan (34) faces the fin group (332).

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