Display module and display device

Abstract

The utility model discloses a display module and a display device, and belongs to the technical field of display. The display module comprises a display panel, a plurality of driving chips and a plurality of first buffer parts. The driving chip and the first buffer part are both connected with the side, away from the first panel part, of the second panel part, and the thickness of the first buffer part is larger than that of the driving chip in the direction perpendicular to the display surface. Therefore, when the display device provided with the display module is extruded, the first buffer part can bear the extrusion force. The first buffer part has a good buffer effect, and after the first buffer part is extruded, the extrusion force can be eliminated by the first buffer part through the buffer effect of the first buffer part on the extrusion force, so that the probability that the driving chip is extruded is low, and the probability that the driving chip is damaged due to extrusion can be further avoided. In this way, the first buffer part can protect the driving chip, and the reliability of the display device provided with the display module is improved.

Description

Technical Field

[0001] The present application relates to the field of display technology, and in particular to a display module and a display device. Background Art

[0002] With the development of display technology, the demand and application scope of display devices are constantly expanding. Commonly used display devices include televisions, tablet computers, laptops, and monitors.

[0003] The display device may generally include: a display module and a housing. The display module may include: a display panel and a driving chip bound and connected to the display panel.

[0004] However, when the display device is squeezed, the housing in the display device will also squeeze the driver chip in the display module, causing the driver chip to be easily damaged, thereby resulting in low reliability of the display device. Summary of the invention

[0005] The embodiment of the present application provides a display module, which can solve the problem that the driver chip in the prior art is easily damaged by being squeezed. The technical solution is as follows:

[0006] In one aspect, a display module is provided, comprising:

[0007] A display panel, the display panel comprising: a first panel portion and a second panel portion arranged opposite to each other, and a panel bending portion for connecting the first panel portion and the second panel portion, wherein the first panel portion has a display surface;

[0008] a plurality of driving chips fixedly connected to a side of the second panel portion facing away from the first panel portion;

[0009] and a first buffer portion located between two adjacent driving chips, the first buffer portion being connected to a side of the second panel portion facing away from the first panel portion;

[0010] Wherein, in a direction perpendicular to the display surface, the thickness of the first buffer portion is greater than the thickness of the driving chip.

[0011] Optionally, in the length extension direction of the second panel portion, a first gap is provided between the first buffer portion and the adjacent driving chip.

[0012] Optionally, there is at least one first buffer portion between two adjacent driving chips, the first buffer portion is strip-shaped, and a length extension direction of the first buffer portion is parallel to a length extension direction of the second panel portion.

[0013] Optionally, when there are a plurality of first buffer portions between two adjacent driving chips, a distance between two adjacent first buffer portions is greater than or equal to an extension length of the first buffer portion.

[0014] Optionally, the second panel portion has a plurality of connection areas corresponding to the plurality of driving chips one by one, and the driving chips are closer to the panel bending portion than the corresponding connection areas;

[0015] The display module further includes: a plurality of flexible circuit boards connected to the plurality of connection areas in a one-to-one correspondence, and a second buffer portion located between two adjacent flexible circuit boards, the second buffer portion being connected to the back surface of the first panel portion;

[0016] Wherein, in a direction perpendicular to the display surface, a thickness of the second buffer portion is greater than a distance between a surface of the flexible circuit board facing away from the first panel portion and a back surface of the first panel portion.

[0017] Optionally, in the length extension direction of the second panel portion, a second gap is provided between the second buffer portion and the adjacent flexible circuit board;

[0018] In a direction perpendicular to the length extension of the second panel portion, a third gap is defined between the first buffer portion and the connection area.

[0019] Optionally, the first buffer portion and the second buffer portion both include: a colloid layer, a support layer and an elastic buffer layer that are stacked, and the colloid layer is closer to the display panel than the elastic buffer layer.

[0020] Optionally, the first buffer portion and the second buffer portion are arranged separately.

[0021] Optionally, in a direction perpendicular to the length extension direction of the second panel portion, a distance between the second buffer portion and the second panel portion is greater than or equal to a width of the second buffer portion.

[0022] Optionally, the support layer in the first buffer portion and the support layer in the second buffer portion are an integral structure, and the elastic buffer layer in the first buffer portion and the elastic buffer layer in the second buffer portion are an integral structure.

[0023] Optionally, the thickness of the colloid layer in the first buffer portion is smaller than the thickness of the colloid layer in the second buffer portion.

[0024] Optionally, a side of the colloid layer in the first buffer portion facing away from the second panel portion is flush with a side of the colloid layer in the second buffer portion facing away from the first panel portion.

[0025] Optionally, both the first buffer portion and the second buffer portion are in a strip shape, and an extension direction of the first buffer portion intersects with an extension direction of the second buffer portion.

[0026] Optionally, when the number of the first buffer portion between two adjacent driving chips is one, and the number of the second buffer portion between two adjacent flexible circuit boards is one, an end portion of the second buffer portion is connected to a central portion of the first buffer portion;

[0027] Alternatively, when the number of the first buffer parts between two adjacent driving chips is two and the number of the second buffer parts between two adjacent flexible circuit boards is two, an end of the second buffer part is connected to an end of the first buffer part.

[0028] On the other hand, a display device is provided, including: a housing, and a display module connected to the housing, wherein the display module is any one of the display modules described above.

[0029] The beneficial effects brought by the technical solution provided by the embodiment of the present application include at least:

[0030] A display module includes: a display panel, a plurality of driver chips and a plurality of first buffer parts. Since the driver chip and the first buffer part in the display module are both connected to the side of the second panel part away from the first panel part, and in the direction perpendicular to the display surface, the thickness of the first buffer part is greater than the thickness of the driver chip. Therefore, when the display device equipped with the display module is squeezed, the first buffer part can withstand the squeezing force. And the first buffer part has a good buffering effect. After the first buffer part is squeezed, the squeezing force can be dissipated by the first buffer part through the buffering effect of the first buffer part on the squeezing force, so that the probability of the driver chip being squeezed is low, and the probability of the driver chip being damaged due to squeezing can be avoided. In this way, the first buffer part can protect the driver chip and improve the reliability of the display device equipped with the display module. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0032] Figure 1 is a top view of a display module provided in an embodiment of the present application;

[0033] Figure 2 yes Figure 1A cross-sectional view of the display module at AA' is shown;

[0034] Figure 3 is a partial enlarged view of a display module provided in an embodiment of the present application;

[0035] Figure 4 is a top view of another display module provided in an embodiment of the present application;

[0036] Figure 5 yes Figure 4 A partial enlarged view of the display module shown;

[0037] Figure 6 is a cross-sectional view of a display module provided in an embodiment of the present application;

[0038] Figure 7 yes Figure 4 A partial enlarged view of another display module is shown;

[0039] Figure 8 is a structural schematic diagram of a display module provided in an embodiment of the present application;

[0040] Fig. 9 is a schematic diagram of the structure of another display module provided in an embodiment of the present application;

[0041] Fig.10 is a top view of another display module provided in an embodiment of the present application;

[0042] Fig.11 is a structural schematic diagram of another display module provided in an embodiment of the present application;

[0043] Fig.12 yes Fig.10 A partial enlarged view of the display module shown;

[0044] Fig.13 is a top view of a display module provided by another embodiment of the present application;

[0045] Fig.14 is a schematic structural diagram of a display device provided in an embodiment of the present application;

[0046] Fig.15 It is a schematic diagram of the structure of another display device provided in an embodiment of the present application. DETAILED DESCRIPTION

[0047] In order to make the objectives, technical solutions and advantages of the present application clearer, the implementation methods of the present application will be further described in detail below with reference to the accompanying drawings.

[0048] The present application embodiment provides a display module, please refer to Figure 1 and Figure 2 , Figure 1 is a top view of a display module provided in an embodiment of the present application, Figure 2 yes Figure 1 The display module 000 is a cross-sectional view taken along line AA′. The display module 000 may include: a display panel 100 , a plurality of driving chips 200 , and a plurality of first buffers 300 .

[0049] The display panel 100 may include: a first panel portion 101 and a second panel portion 102 arranged opposite to each other, and a panel bending portion 103 for connecting the first panel portion 101 and the second panel portion 102. Here, the panel bending portion 103 may be located between the first panel portion 101 and the second panel portion 102, and one side of the panel bending portion 103 may be connected to the first panel portion 101, and the other end of the panel bending portion 103 may be connected to the second panel portion 102. And the first panel portion 101 in the display panel 100 may have a display surface.

[0050] The driver chip 200 in the display module 000 can be fixedly connected to the side of the second panel portion 102 away from the first panel portion 101. It should be noted that the first panel portion 101, the second panel portion 102 and the panel bending portion 103 in the display panel 100 are all integrated with signal wiring, and the signal wiring in the panel bending portion 103 can connect the signal wiring in the first panel portion 101 and the signal wiring in the second panel portion 102, and the signal wiring in the first panel portion 101 can be electrically connected to the sub-pixel in the first panel portion 101. After the driver chip 200 is bound to the second panel portion 102 in the display panel 100, the driver chip 200 can be electrically connected to the signal wiring in the second panel portion 102. In this way, the driver chip 200 can send a driving signal to the sub-pixel in the first panel portion 101 through these signal wirings, so that the sub-pixel in the first panel portion 101 can emit light outward, and then the display surface of the first panel portion 101 can display the corresponding picture.

[0051] In the embodiment of the present application, the first buffer portion 300 in the display module 000 may be located between two adjacent driver chips 200, and the first buffer portion 300 may be connected to a side of the second panel portion 102 that is away from the first panel portion 101. In the direction perpendicular to the display surface P of the first panel portion 101, the thickness of the first buffer portion 300 may be greater than the thickness of the driver chip 200.

[0052] In this way, since the driver chip 200 and the first buffer part 300 in the display module 000 are both connected to the side of the second panel part 102 away from the first panel part 101, and in the direction perpendicular to the display surface P, the thickness of the first buffer part 300 is greater than the thickness of the driver chip 200. Therefore, when the display device with the display module 000 installed is squeezed, the first buffer part 300 can withstand the squeezing force. And the first buffer part 300 has a good buffering effect. After the first buffer part 300 is squeezed, the squeezing force can be dissipated by the first buffer part 300 through the buffering effect of the first buffer part 300 on the squeezing force, so that the probability of the driver chip 200 being squeezed is low, and the probability of the driver chip 200 being damaged due to squeezing can be reduced. In this way, the first buffer part 300 can protect the driver chip 200, and improve the reliability of the display device with the display module 000 installed.

[0053] In summary, the embodiment of the present application provides a display module, including: a display panel, a plurality of driver chips and a plurality of first buffer parts. Since the driver chip and the first buffer part in the display module are both connected to the side of the second panel part away from the first panel part, and in the direction perpendicular to the display surface, the thickness of the first buffer part is greater than the thickness of the driver chip. Therefore, when the display device equipped with the display module is squeezed, the first buffer part can withstand the squeezing force. And the first buffer part has a good buffering effect. After the first buffer part is squeezed, the squeezing force can be dissipated by the first buffer part through the buffering effect of the first buffer part on the squeezing force, so that the probability of the driver chip being squeezed is low, and the probability of the driver chip being damaged due to squeezing can be avoided. In this way, the first buffer part can protect the driver chip and improve the reliability of the display device equipped with the display module.

[0054] In this application, please refer to Figure 3 , Figure 3 It is a partial enlarged view of a display module provided by an embodiment of the present application. In the length extension direction of the second panel portion 102 in the display panel 100 , there may be a first gap D1 between the first buffer portion 300 and the driving chip 200 in the display module 000 .

[0055] It should be noted that after the first buffer portion 300 is squeezed, the first buffer portion 300 can be deformed so that the first buffer portion 300 can have a buffering effect, thereby eliminating the squeezing force on the first buffer portion 300. To this end, when there is a first gap D1 between the first buffer portion 300 and the driver chip 200, it can be ensured that when the first buffer portion 300 is deformed, the first buffer portion 300 will not contact the driver chip 200, thereby avoiding the deformed first buffer portion 300 from squeezing the driver chip 200, and further protecting the driver chip 200.

[0056] It should also be noted that, in the length extension direction of the second panel portion 102 in the display panel 100, the first gap D1 between the first buffer portion 300 and the driver chip 200 may be: the sum of the peripheral tolerance of the first buffer portion 300, the fitting tolerance of the first buffer portion 300, and the material tolerance of the driver chip 200. The length of the first gap D1 between the first buffer portion 300 and the driver chip 200 may be in the range of 0.1 mm to 1 mm. For example, the length of the first gap D1 between the first buffer portion 300 and the driver chip 200 may be 1.5 mm.

[0057] In the present application, a fourth gap B1 may also be provided between the first buffer portion 300 and the outer edge of the panel bending portion 103 in a direction perpendicular to the length extension of the second panel portion 102. Similarly, after the first buffer portion 300 is deformed by the extrusion force, when the fourth gap B1 is provided between the first buffer portion 300 and the outer edge of the panel bending portion 103, it can be ensured that when the first buffer portion 300 is deformed, the first buffer portion 300 will not contact the panel bending portion 103, thereby avoiding the deformed first buffer portion 300 from extruding the panel bending portion 103, and protecting the panel bending portion 103.

[0058] It should be noted that, in the length extension direction perpendicular to the second panel portion 102, the length of the fourth gap B1 between the outer edge of the first buffer portion 300 and the panel bending portion 103 can be in the range of 1 mm to 3 mm. For example, the length of the fourth gap B1 between the outer edge of the first buffer portion 300 and the panel bending portion 103 can be 1.5 mm.

[0059] In the present application, in the direction perpendicular to the length extension of the second panel portion 102, the first buffer portion 300 can be closer to the outer edge of the panel bending portion 103 relative to the driver chip 200. In this way, compared with the case where the driver chip 200 is closer to the outer edge of the panel bending portion 103 relative to the first buffer portion 300, when the first buffer portion 300 is closer to the outer edge of the panel bending portion 103 relative to the driver chip 200, the width B4 of the first buffer portion 300 in the direction perpendicular to the length extension of the second panel portion 102 can be large enough, so that the first buffer portion 300 can have a better buffering effect, and thus can better protect the driver chip 200.

[0060] Optional, please refer to Figure 4 , Figure 4000. The number of the first buffer portion 300 between two adjacent driver chips 200 in the display module 000 may be at least one. The first buffer portion 300 in the display module 000 may be strip-shaped, and the length extension direction of the first buffer portion 300 may be parallel to the length extension direction of the second panel portion 102.

[0061] It should be noted that if Figure 3 As shown, when the number of the first buffer portion 300 between two adjacent driver chips 200 in the display module 000 is one, in the length extension direction of the second panel portion 102, the distance B2 between the two adjacent driver chips 200 in the display module 000 is approximately in the range of 33 mm to 42 mm. Since the length D1 of the first buffer portion 300 between the two adjacent driver chips 200 and the first gap between the driver chips 200 can be in the range of 0.1 mm to 1 mm. For this reason, in the length extension direction of the second panel portion 102, the extension length B3 of the first buffer portion 300 can be in the range of 35 mm to 40 mm. For example, in the length extension direction of the second panel portion 102, the extension length B3 of the first buffer portion 300 can be 38.25 mm.

[0062] In this application, please refer to Figure 5 , Figure 5 yes Figure 4 A partial enlarged view of the display module is shown. When there are multiple first buffers 300 between two adjacent driver chips 200 in the display module 000, the distance B5 between two adjacent first buffers 300 can be greater than or equal to the extension length B3 of the first buffer 300. In this way, compared with the case where there is only one first buffer 300 between two adjacent driver chips 200 in the display module 000, when there are multiple first buffers 300 between two adjacent driver chips 200 in the display module 000, it is ensured that the first buffer 300 can protect the driver chip 200, while reducing the material used for the first buffer 300, thereby reducing the manufacturing cost of the display device equipped with the display module 000.

[0063] It should be noted that when there are multiple first buffers 300 between two adjacent driver chips 200 in the display module 000, a first gap D1 is provided between the driver chip 200 and the adjacent first buffer 300 in the length extension direction of the second panel portion 102. A fourth gap B1 is also provided between each first buffer 300 and the outer edge of the panel bending portion 103 in the length extension direction perpendicular to the second panel portion 102.

[0064] In this application, please refer to Figure 4 and Figure 6 , Figure 6 The second panel portion 102 in the display panel 100 may have a plurality of connection areas 400 corresponding to a plurality of driver chips 300. The connection area 400 in the second panel portion 102 may be closer to the panel bending portion 103 than the driver chip 200.

[0065] The display module 000 may further include: a plurality of flexible circuit boards 500 connected one-to-one with the plurality of connection areas of the second panel portion 102, and a second buffer portion 600 located between two adjacent flexible circuit boards 500. Here, the driving chip 200 can be electrically connected to the corresponding flexible circuit board 500 through the corresponding connection area 400. The second buffer portion 600 in the display module 000 may be connected to the back side of the first panel portion 101.

[0066] In the direction perpendicular to the display surface P, the thickness of the second buffer portion 600 in the display module 000 may be greater than the distance between a surface of the flexible circuit board 500 facing away from the first panel portion 101 and the back surface of the first panel portion 101 .

[0067] It should be noted that if Figure 6 As shown, there is a height difference between the back side of the first panel portion 101 and the side of the second panel portion 102 facing away from the first panel portion 101 in the display panel 100. In this way, the flexible circuit board 500 extends from the side of the second panel portion 102 facing away from the first panel portion 101 to the back side of the first panel portion 101. Here, in the direction perpendicular to the display surface, the thickness of the second buffer portion 600 can be greater than the distance between the side of the part of the flexible circuit board 500 located on the side of the second panel portion 102 facing away from the first panel portion 101, facing away from the first panel portion 101 and the back side of the first panel portion 101. In this way, the thickness of the second buffer portion 600 can be greater than the distance between the side of the entire flexible circuit board 500 facing away from the first panel portion 101 and the back side of the first panel portion 101.

[0068] Therefore, when the display device with the display module 000 installed is squeezed, it is the second buffer 600 that bears the squeezing force. The second buffer 600 has a good buffering effect. After the second buffer 600 is squeezed, the squeezing force can be dissipated by the second buffer 600 through the buffering effect of the second buffer 600 on the squeezing force, so that the probability of the flexible circuit board 500 being squeezed is low, and the probability of the flexible circuit board 600 being damaged due to squeezing can be avoided. In this way, the second buffer 600 can protect the flexible circuit board 500, thereby improving the reliability of the display device with the display module 000 installed.

[0069] In this application, please refer to Figure 7 , Figure 7 yes Figure 4 A partial enlarged view of another display module is shown. In the length extension direction of the second panel portion 102, a second gap D2 may be provided between the second buffer portion 600 and the adjacent flexible circuit board 500. In this way, when the second buffer portion 600 is squeezed and deformed, when there is a second gap D2 between the second buffer portion 600 and the adjacent flexible circuit board 500, it can be ensured that when the second buffer portion 600 is deformed, the second buffer portion 600 will not contact the flexible circuit board 500, thereby avoiding the deformed second buffer portion 600 from squeezing the flexible circuit board 500, and further protecting the flexible circuit board 500.

[0070] For example, in the length extension direction of the second panel portion 102, the second gap D2 between the second buffer portion 600 and the adjacent flexible circuit board 500 may be: the sum of the peripheral tolerance of the second buffer portion 600, the fitting tolerance of the second buffer portion 600, and the material tolerance of the flexible circuit board 500. In the length extension direction of the second panel portion 102, the length of the second gap D2 between the second buffer portion 600 and the adjacent flexible circuit board 500 may be in the range of 0.1 mm to 1 mm. For example, in the length extension direction of the second panel portion 102, the length of the second gap D2 between the second buffer portion 600 and the adjacent flexible circuit board 500 may be 0.5 mm.

[0071] In this application, if Figure 7 As shown, in the direction perpendicular to the length extension of the second panel portion 102, there is a third gap D3 between the first buffer portion 300 and the connection area 400. In this way, when the first buffer portion 300 is squeezed and deformed, the third gap between the first buffer portion 300 and the connection area 400 can prevent the first buffer portion 300 from contacting the connection area 400, thereby avoiding the deformed first buffer portion 300 from squeezing the connection area 400, and ensuring the reliability of the connection between the driver chip 200 and the flexible circuit board 500.

[0072] For example, in the direction perpendicular to the length extension of the second panel portion 102, the third gap D3 between the first buffer portion 300 and the connection area 400 may be: the sum of the peripheral tolerance of the first buffer portion 300, the fitting tolerance of the first buffer portion 300, and the material tolerance of the driver chip 200. In the direction perpendicular to the length extension of the second panel portion 102, the length of the third gap D3 between the first buffer portion 300 and the connection area 400 may be in the range of 0.1 mm to 1 mm. For example, in the direction perpendicular to the length extension of the second panel portion 102, the length of the third gap D3 between the first buffer portion 300 and the connection area 400 may be 0.5 mm.

[0073] It should be noted that, in the direction of the length extension of the second panel portion 102, at the end of the flexible circuit board 500 away from the corresponding connection area 400, the distance between two adjacent flexible circuit boards 500 in the display module 000 can be in the range of 4 mm to 8 mm. Since the second gap D2 between the second buffer portion 600 and the adjacent flexible circuit board 500 is in the range of 0.1 mm to 1 mm, the width of the second buffer portion 600 can be in the range of 5 mm to 7 mm in the direction of the length extension of the second panel portion 102. In the exemplary direction of the length extension of the second panel portion 102, the width of the second buffer portion 600 can be millimeters.

[0074] Optional, please refer to Figure 8 , Figure 8 It is a structural schematic diagram of a display module provided in an embodiment of the present application. The first buffer part 300 and the second buffer part 600 in the display module 000 may include: a stacked colloid layer K1, a support layer K2 and an elastic buffer layer K3, and the colloid layer K1 may be closer to the display panel 100 relative to the elastic buffer layer K2. Among them, the colloid layer K1 can play a fixing role to fix the first buffer part 300 and the second buffer part 600 on the display panel 100. The elastic buffer layer K3 can play a buffering role. When the first buffer part 300 and the second buffer part 600 are squeezed, the elastic buffer layer K3 can be deformed to eliminate the squeezing force. The support layer K2 can play a supporting role to support the elastic buffer layer. Here, the elastic buffer part K3 can be a foam with good cushioning properties.

[0075] In this application, if Figure 7 As shown, the first buffer part 300 and the second buffer part 600 in the display module 000 may be separately arranged. Here, the colloid layer K1 in the first buffer part 300 and the colloid layer K1 in the second buffer part 600 are separately arranged, the support layer K2 in the first buffer part 300 and the support layer K2 in the second buffer part 600 are separately arranged, and the elastic buffer layer K3 in the first buffer part 300 and the elastic buffer part K3 in the second buffer part 600 are separately arranged.

[0076] like Figure 8 As shown, the colloid layer K1 in the first buffer part 300 can fix the first buffer part 300 on the side of the second panel part 102 away from the first panel part 101. In the direction perpendicular to the display surface P of the first panel part 101, the thickness H1 of the driver chip 200 can be less than the thickness H2 of the first buffer part 300. In this way, when the first buffer part 300 is squeezed, the elastic buffer layer K3 in the first buffer part 300 can be squeezed and deformed to eliminate the squeezing force, thereby reducing the probability of the driver chip 200 being squeezed.

[0077] like Fig. 9 As shown, Fig. 9 is a schematic diagram of the structure of another display module provided in an embodiment of the present application. The colloid layer K1 in the second buffer portion 600 can fix the second buffer portion 600 on the back side of the first panel portion 101. In the direction perpendicular to the display surface P of the first panel portion 101, the thickness H3 of the second buffer portion 600 can be greater than the distance H4 between the side of the entire flexible circuit board 500 that is away from the first panel portion 101 and the back side of the first panel portion 101. In this way. When the second buffer portion 600 is squeezed, the elastic buffer layer K3 in the second buffer portion 600 can be squeezed and deformed to eliminate the squeezing force, thereby reducing the probability of the flexible circuit board 500 being squeezed.

[0078] In this application, please refer to Fig.10 , Fig.10 000 is a top view of another display module provided by an embodiment of the present application. The first buffer portion 300 and the second buffer portion 600 in the display module 000 may be an integral structure. Since the first buffer portion 300 is connected to the side of the second panel portion 102 facing away from the first panel portion 101, and the second buffer portion 300 is connected to the back of the first panel portion 101, and there is a height difference between the back of the first panel portion 101 and the side of the second panel portion 102 facing away from the first panel portion 101, in this case, please refer to Fig.11 , Fig.11 The supporting layer K2 in the first buffer part 300 can be an integral structure with the supporting layer K2 in the second buffer part 600, and the elastic buffer layer K3 in the first buffer part 300 can be an integral structure with the elastic buffer layer K3 in the second buffer part 600.

[0079] In this application, if Fig.11 As shown, the height difference between the back side of the first panel portion 101 and the side of the second panel portion 102 facing away from the first panel portion 101 makes the thickness H5 of the colloid layer K1 in the first buffer portion 300 smaller than the thickness H6 of the colloid layer K1 in the second buffer portion 600. The difference between the thickness of the colloid layer K1 in the first buffer portion 300 and the thickness of the colloid layer K1 in the second buffer portion 600 is the height difference.

[0080] Optional, such as Fig.11As shown, the side of the colloid layer K3 in the first buffer part 300 facing away from the second panel part 102 is flush with the side of the colloid layer K3 in the second buffer part 600 facing away from the first panel part 101. In addition, the thickness of the support layer K2 provided on the side of the colloid layer K3 in the first buffer part 300 facing away from the second panel part 102 is the same as the thickness of the support layer K2 provided on the side of the colloid layer K3 in the second buffer part 600 facing away from the first panel part 101. For this reason, the support layer K2 in the first buffer part 300 can be an integral structure with the support layer K2 in the second buffer part 600. Similarly, the thickness of the elastic buffer layer K3 provided on the side of the support layer K2 in the first buffer part 300 facing away from the second panel part 102 is the same as the thickness of the elastic buffer layer K3 provided on the side of the colloid layer K3 in the second buffer part 600 facing away from the first panel part 101. For this reason, the elastic buffer layer K3 in the first buffer part 300 can be an integral structure with the elastic buffer layer K3 in the second buffer part 600.

[0081] In this way, when the first buffer portion 300 and the second buffer portion 600 are squeezed, the first buffer portion 300 and the second buffer portion 600 can withstand the squeeze at the same time, and the elastic buffer layer K3 of the first buffer portion 300 and the second buffer portion 600 as an integrated structure can be deformed to eliminate the squeezing force, thereby reducing the probability of the driving chip 200 and the flexible circuit board 500 being squeezed.

[0082] In this application, please refer to Fig.12 , Fig.12 yes Fig.10 A partial enlarged view of the display module shown. The first buffer portion 300 and the second buffer portion 600 in the display module may both be strip-shaped, and the extension direction of the first buffer portion 300 may intersect with the extension direction of the second buffer portion 600. Here, the extension direction of the first buffer portion 300 may be the length extension direction of the second panel portion 102, and the extension direction of the second buffer portion 600 may be perpendicular to the length extension direction of the second panel portion 102. That is, the first buffer portion 300 may intersect with the second buffer portion 600 perpendicularly.

[0083] For example, the length of the first buffer portion 300 in the length extension direction of the second panel portion 102 may be in the range of 35 mm to 40 mm, and the width of the first buffer portion 300 in the length extension direction perpendicular to the second panel portion 102 may be in the range of 2.5 mm to 4 mm. The width of the second buffer portion 600 in the length extension direction of the second panel portion 102 may be in the range of 5 mm to 7 mm. In the length extension direction perpendicular to the second panel portion 102, one end of the second buffer portion 600 may intersect with the first buffer portion 300, and the other end may be flush with the end of the flexible circuit board 500 away from the driver chip 200.

[0084] Optional, such as Fig.12 As shown, when there is one first buffer portion 300 between two adjacent driving chips 200 in the display module 000 and one between two adjacent flexible circuit boards 500 , the end of the second buffer portion 600 can be connected to the central portion of the first buffer portion 300 .

[0085] Optional, please refer to Fig.13 , Fig.13 : is a top view of a display module provided by another embodiment of the present application. In the case where the number of first buffer parts 300 between two adjacent driver chips 200 in the display module 000 is two, and the number of second buffer parts 600 between two adjacent flexible circuit boards 500 is two, the end of the second buffer part 600 can be connected to the end of the first buffer part 300. In this way, compared with the case where the number of first buffer parts 300 between two adjacent driver chips 200 in the display module 000 is one, and the number of second buffer parts 600 between two adjacent flexible circuit boards 500 is one, in the case where the number of first buffer parts 300 between two adjacent driver chips 200 in the display module 000 is two, and the number of second buffer parts 600 between two adjacent flexible circuit boards 500 is two, the overall material consumption of the first buffer part 300 and the second buffer part 600 is less, saving costs.

[0086] It should be noted that if Fig.10 and Fig.13 As shown, when the first buffer portion 300 and the second buffer portion 600 in the display module 000 are connected together, while the first buffer portion 300 protects the driver chip 200 and the second buffer portion 600 protects the flexible circuit board 500, the connection area 400 between the driver chip 200 and the flexible circuit board 500 can also be protected, so that the probability of the connection area 400 being squeezed is low, the reliability of the connection between the driver chip 200 and the flexible circuit board 500 is improved, and the reliability of the display device installed with the display module 000 is further improved.

[0087] In summary, the embodiment of the present application provides a display module, including: a display panel, a plurality of driver chips and a plurality of first buffer parts. Since the driver chip and the first buffer part in the display module are both connected to the side of the second panel part away from the first panel part, and in the direction perpendicular to the display surface, the thickness of the first buffer part is greater than the thickness of the driver chip. Therefore, when the display device equipped with the display module is squeezed, the first buffer part can withstand the squeezing force. And the first buffer part has a good buffering effect. After the first buffer part is squeezed, the squeezing force can be dissipated by the first buffer part through the buffering effect of the first buffer part on the squeezing force, so that the probability of the driver chip being squeezed is low, and the probability of the driver chip being damaged due to squeezing can be avoided. In this way, the first buffer part can protect the driver chip and improve the reliability of the display device equipped with the display module.

[0088] The present application also provides a display device, which can be a television, a tablet computer, a notebook computer, etc. Fig.14 , Fig.14 001 may include: a housing 011 , and a display module 000 connected to the housing. The display module 000 may be any of the above-mentioned display modules 000 .

[0089] In this application, please refer to Fig.14 and Fig.15 , Fig.15 0111 and 0112. The frame 0112 in the housing 011 can be fixedly connected to the four sides of the display module 000 so that the display module 000 can be fixed in the housing 011. The cover plate 0111 in the housing 011 can be fixedly connected to the side of the frame 0112 away from the display surface. When the display device 001 is squeezed, the part of the cover plate 0111 that is not fixedly connected to the frame 0112 may move toward the display panel 100 in the display module 000. In this way, the first buffer portion 300 will bear the squeeze of the cover plate 0111. After the first buffer portion 300 is squeezed, the first buffer portion 300 can be deformed to dissipate the squeezing force, thereby reducing the probability of damage to the driver chip 200 due to squeezing. In this way, the reliability of the display device 001 is improved.

[0090] It should be noted that in the accompanying drawings, the sizes of layers and regions may be exaggerated for clarity of illustration. It is also understood that when an element or layer is referred to as being "on" another element or layer, it may be directly on the other element, or there may be an intermediate layer. In addition, it is understood that when an element or layer is referred to as being "under" another element or layer, it may be directly under the other element, or there may be more than one intermediate layer or element. In addition, it is also understood that when a layer or element is referred to as being "between" two layers or two elements, it may be the only layer between the two layers or two elements, or there may also be more than one intermediate layer or element. Similar reference numerals throughout the text indicate similar elements.

[0091] In the present application, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance. The term "plurality" refers to two or more than two, unless otherwise clearly defined.

[0092] The above description is only an optional embodiment of the present application and is not intended to limit the present application. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present application shall be included in the protection scope of the present application.

Claims

1. A display module, characterized in that: include: A display panel, the display panel comprising: a first panel portion and a second panel portion arranged opposite to each other, and a panel bending portion for connecting the first panel portion and the second panel portion, wherein the first panel portion has a display surface; a plurality of driving chips fixedly connected to a side of the second panel portion facing away from the first panel portion; and a first buffer portion located between two adjacent driving chips, the first buffer portion being connected to a side of the second panel portion facing away from the first panel portion; Wherein, in a direction perpendicular to the display surface, the thickness of the first buffer portion is greater than the thickness of the driving chip.

2. The display module according to claim 1, characterized in that: In the lengthwise extension direction of the second panel portion, a first gap is provided between the first buffer portion and the adjacent driving chip.

3. The display module according to claim 1, characterized in that: There is at least one first buffer portion between two adjacent driving chips. The first buffer portion is in a strip shape, and a length extension direction of the first buffer portion is parallel to a length extension direction of the second panel portion.

4. The display module according to claim 3, characterized in that: When there are a plurality of first buffer portions between two adjacent driving chips, a distance between two adjacent first buffer portions is greater than or equal to an extension length of the first buffer portion.

5. The display module according to any one of claims 1 to 4, characterized in that: The second panel portion has a plurality of connection areas corresponding to the plurality of driving chips one by one, and the driving chips are closer to the panel bending portion than the corresponding connection areas; The display module further includes: a plurality of flexible circuit boards connected to the plurality of connection areas in a one-to-one correspondence, and a second buffer portion located between two adjacent flexible circuit boards, the second buffer portion being connected to the back surface of the first panel portion; Wherein, in a direction perpendicular to the display surface, a thickness of the second buffer portion is greater than a distance between a surface of the flexible circuit board facing away from the first panel portion and a back surface of the first panel portion.

6. The display module according to claim 5, characterized in that: In the length extension direction of the second panel portion, a second gap is provided between the second buffer portion and the adjacent flexible circuit board; In a direction perpendicular to the length extension of the second panel portion, a third gap is defined between the first buffer portion and the connection area.

7. The display module according to claim 5, characterized in that: The first buffer portion and the second buffer portion both include: a colloid layer, a support layer, and an elastic buffer layer which are stacked, and the colloid layer is closer to the display panel than the elastic buffer layer.

8. The display module according to claim 7, characterized in that: The first buffer portion and the second buffer portion are separately arranged.

9. The display module according to claim 8, characterized in that: In a direction perpendicular to the length extension of the second panel portion, a distance between the second buffer portion and the second panel portion is greater than or equal to a width of the second buffer portion.

10. The display module according to claim 7, characterized in that: The support layer in the first buffer part and the support layer in the second buffer part are an integral structure, and the elastic buffer layer in the first buffer part and the elastic buffer layer in the second buffer part are an integral structure.

11. The display module according to claim 10, characterized in that: The thickness of the colloid layer in the first buffer portion is smaller than the thickness of the colloid layer in the second buffer portion.

12. The display module according to claim 11, characterized in that: A side of the colloid layer in the first buffer portion facing away from the second panel portion is flush with a side of the colloid layer in the second buffer portion facing away from the first panel portion.

13. The display module according to any one of claims 10 to 12, characterized in that: The first buffer portion and the second buffer portion are both in a strip shape, and an extension direction of the first buffer portion intersects with an extension direction of the second buffer portion.

14. The display module according to claim 13, characterized in that: When the number of the first buffer portion between two adjacent driving chips is one, and the number of the second buffer portion between two adjacent flexible circuit boards is one, an end portion of the second buffer portion is connected to a central portion of the first buffer portion; Alternatively, when the number of the first buffer parts between two adjacent driving chips is two and the number of the second buffer parts between two adjacent flexible circuit boards is two, an end of the second buffer part is connected to an end of the first buffer part.

15. A display device, characterized in that: It comprises: a shell, and a display module connected to the shell, wherein the display module is the display module according to any one of claims 1 to 14.

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