Material bracket of die bonder
By designing an adjustable crystal-solid machine material bracket and air blower cleaning mechanism, the problem of low adaptability of crystal-solid machine material bracket is solved, and the effect of adapting to pallets of different sizes and preventing material pollution is achieved, and the applicability of the device is improved. and wafer quality.
Patent Information
- Application Number
- CN202323654276.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2023-12-31
- Publication Date
- 2024-12-31
- Estimated Expiration
- 2033-12-31
AI Technical Summary
The existing solid crystal machine material bracket has low adaptability and cannot adapt to the size of different solid crystal machine material trays, resulting in frequent replacement of material brackets when replacing solid crystal machine or using new process technology, resulting in losses and pollution.
A crystal-fixing machine material bracket including adjustable brackets and discs is designed, using electric push rods and clips to fix the material plates, and an air blower cleaning mechanism is equipped to ensure that the brackets are adapted to different sizes and prevent material contamination.
It improves the applicability and practicality of the bracket, reduces the frequency of replacing the bracket, prevents material contamination, and ensures chip quality.
Smart Images

Figure CN222281932U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the field of a material bracket for a crystal bonding machine, in particular to a material bracket for a crystal bonding machine. Background Art
[0002] With the continuous advancement of semiconductor technology, the integration of semiconductor devices continues to increase, and the diameter of wafers gradually increases. This requires higher performance and stability for the material bracket of the die bonder to adapt to larger diameter wafers and more complex process requirements. The size of the existing die bonder material bracket is usually fixed and designed for a specific die bonder. When replacing the die bonder or adopting a new process technology, the material bracket may need to be redesigned or replaced.
[0003] In view of the above shortcomings, a material bracket for a die bonder is designed which can adapt to different sizes of die bonder material trays. Utility Model Content
[0004] In order to overcome the shortcoming of low adaptability of the existing material bracket of the crystal bonder, the technical problem to be solved is: to provide a material bracket of the crystal bonder that can adapt to different sizes of the material trays of the crystal bonder.
[0005] The technical scheme of the utility model is: a material bracket of a crystal bonding machine, comprising a base; supporting feet, the upper part of the base is connected with two front and rear supporting feet; a connecting block, the upper part of the supporting feet is connected with a connecting block; a disc, the right side of the connecting block is connected with a disc; an electric push rod No. 1, the upper part of the disc is connected with four electric push rods No. 1; a clamp, the outer side of the electric push rod No. 1 is connected with a clamp, and the clamps are all slidably connected to the disc; a clamping block, a plurality of clamping blocks are slidably connected to both sides of the electric push rod No. 1 on the upper part of the disc; a spring, a spring is connected between the clamping block and the disc; a material discharge mechanism, the left part of the upper side of the connecting block is provided with a material discharge mechanism; a cleaning mechanism, the right part of the upper side of the connecting block is provided with a cleaning mechanism.
[0006] In one embodiment, the discharge mechanism includes: an electric push rod No. 2, with four electric push rods No. 2 connected to the left upper part of the connecting block; and a bracket, with the upper part of each electric push rod No. 2 being connected to the bracket.
[0007] In one embodiment, the cleaning mechanism includes: a supporting rack, which is connected to the right part of the upper side of the connecting block; and an air blowing gun, which is clamped on the upper part of the supporting rack.
[0008] In one embodiment, the clip is made of rubber.
[0009] In one embodiment, the electric push rods are perpendicular to each other.
[0010] In one embodiment, the disk is made of a high temperature alloy.
[0011] The beneficial effects are: 1. The bracket and the disc of the utility model are designed with adjustable sizes, which can adapt to the sizes of different material trays of the crystal bonding machine, avoid frequent replacement of material brackets when replacing the crystal bonding machine or adopting new process technology, causing a lot of losses, and improve the applicability and practicality of the device.
[0012] 2. The utility model is convenient for centralized placement of material trays and also convenient for staff to remove and replace the material trays, thereby ensuring that the material trays are not contaminated by materials required for wafer preparation due to random placement.
[0013] 3. The utility model air blowing gun can blow away the flying dust on the upper part of the material tray to prevent impurities from falling into the material during the feeding process to cause pollution, resulting in unqualified quality of the produced wafers. BRIEF DESCRIPTION OF THE DRAWINGS
[0014] Figure 1 It is a three-dimensional structural schematic diagram of the utility model.
[0015] Figure 2 It is a structural schematic diagram of the utility model.
[0016] Figure 3 It is a partial three-dimensional structural schematic diagram of the utility model.
[0017] Figure 4 It is a three-dimensional structural schematic diagram of the cleaning mechanism and the material discharging mechanism of the utility model.
[0018] Markings in the figure are: 1-base, 2-support foot, 3-connecting block, 4-disc, 5-clip, 6-electric push rod No. 1, 7-block, 70-spring, 8-discharging mechanism, 81-electric push rod No. 2, 82-bracket, 9-cleaning mechanism, 91-support rack, 92-air blowing gun. DETAILED DESCRIPTION
[0019] The utility model is further described below in conjunction with the embodiments shown in the accompanying drawings.
[0020] A material bracket for a die bonding machine, such as Figure 1-4As shown, it includes a base 1; a supporting foot 2, wherein the upper part of the base 1 is connected to two front and rear supporting feet 2; a connecting block 3, wherein the upper part of the supporting foot 2 is connected to the connecting block 3; a disc 4, wherein the right side of the connecting block 3 is connected to the disc 4, and the disc 4 is made of a high-temperature alloy; an electric push rod No. 6, wherein four electric push rods No. 6 are connected to the upper part of the disc 4, and the electric push rods No. 6 are perpendicular to each other; a clip 5, wherein the outer side of the electric push rod No. 6 is connected to the clip 5, and the clip 5 is slidably connected to the disc 4, and the clip 5 is made of rubber; a clamping block 7, wherein a plurality of clamping blocks 7 are slidably connected to both sides of the electric push rod No. 6 on the upper part of the disc 4; a spring 70, wherein a spring 70 is connected between the clamping block 7 and the disc 4; a discharging mechanism 8, wherein the left part of the upper side of the connecting block 3 is provided with a discharging mechanism 8; a cleaning mechanism 9, wherein the right part of the upper side of the connecting block 3 is provided with a cleaning mechanism 9.
[0021] like Figure 1 , Figure 2 and Figure 4 As shown, the discharge mechanism 8 includes: a second electric push rod 81, four second electric push rods 81 are connected to the left upper part of the connecting block 3; and a bracket 82, the upper part of each of the second electric push rods 81 is connected to the bracket 82.
[0022] When using the device, the staff will place the material tray to be used on the disc 4, control the telescopic end of the electric push rod No. 1 6 to move and drive the clamp 5 to move to a position where the material tray can be fixed, which is convenient for the staff to add the materials required for preparing the wafer into the material tray. The clamp 5 is made of rubber and has an anti-slip effect. Since the bracket 82 and the disc 4 are both designed with adjustable sizes, they can adapt to the sizes of material trays of different crystal bonders, preventing frequent replacement of material brackets when replacing crystal bonders or adopting new process technologies, causing a large amount of losses, thereby improving the applicability and practicality of the device. Subsequently, the material tray is placed on the upper part of the bracket 82, and the telescopic end of the electric push rod No. 2 81 is controlled to move to an appropriate length to fix the material tray, which is convenient for the centralized placement of the material trays and also convenient for the staff to remove the material trays and replace them, thereby ensuring that the material trays are not contaminated by the materials required for preparing the wafers due to random placement.
[0023] like Figure 1 , Figure 2 and Figure 4 As shown, the cleaning mechanism 9 includes: a supporting rack 91 , to which the right portion of the upper side of the connecting block 3 is connected; and an air blowing gun 92 , to which the upper portion of the supporting rack 91 is clamped.
[0024] When adding materials to the material tray, opening the air blowing gun 92 can blow away the flying dust on the upper part of the material tray to prevent impurities from falling into the materials during the adding process to cause pollution and result in substandard quality of the produced wafers.
[0025] The above description is only an example of the implementation of the present invention and is not intended to limit the present invention. Any equivalent replacement made within the principle of the present invention shall be included in the protection scope of the present invention. The contents not elaborated in the present invention belong to the existing technology known to the technicians in this professional field.
Claims
1. A material bracket for a crystal bonding machine, characterized in that: The utility model comprises a base (1); a supporting foot (2), wherein the upper part of the base (1) is connected to two supporting feet (2) at the front and rear ends; a connecting block (3), wherein the upper part of the supporting foot (2) is connected to the connecting block (3); a disc (4), wherein the right side of the connecting block (3) is connected to the disc (4); an electric push rod No. 1 (6), wherein the upper part of the disc (4) is connected to four electric push rods No. 1 (6); and a clamp (5), wherein the outer side of the electric push rod No. 1 (6) is connected to the clamp (5). The blocks (5) are all connected to the disc (4) in a sliding manner; a clamping block (7), a plurality of clamping blocks (7) are provided on the upper part of the disc (4) and are connected to both sides of the electric push rod No. 1 (6) in a sliding manner; a spring (70), a spring (70) is connected between the clamping block (7) and the disc (4); a material discharge mechanism (8), a material discharge mechanism (8) is provided on the left part of the upper side of the connecting block (3); and a cleaning mechanism (9), a cleaning mechanism (9) is provided on the right part of the upper side of the connecting block (3).
2. A material bracket for a crystal bonding machine as claimed in claim 1, characterized in that: The material discharge mechanism (8) comprises: a second electric push rod (81), four second electric push rods (81) are connected to the left upper part of the connection block (3); and a bracket (82), the upper part of each of the second electric push rods (81) is connected to the bracket (82).
3. A material bracket for a die bonder according to claim 2, characterized in that: The cleaning mechanism (9) comprises: a supporting rack (91) connected to the right portion of the upper side of the connecting block (3); and an air blowing gun (92) clamped on the upper portion of the supporting rack (91).
4. A material bracket for a die bonder according to claim 3, characterized in that: The clip (5) is made of rubber.
5. A material bracket for a die bonder according to claim 4, characterized in that: The electric push rods No. 1 (6) are perpendicular to each other.
6. A material bracket for a crystal bonding machine as claimed in claim 5, characterized in that: The disc (4) is made of high temperature alloy.
