Image acquisition device

Abstract

The utility model provides image acquisition equipment, and relates to the technical field of image acquisition. The image acquisition equipment comprises a shell with a containing cavity and an image sensor assembly arranged in the containing cavity, the image sensor assembly comprises an image sensor, a sensor circuit board and an adjusting pad, the image sensor is connected with the sensor circuit board, and the sensor circuit board is connected to the shell; the adjusting pad is located between the sensor circuit board and the shell to adjust the collimation degree of the image sensor relative to the shell, so that other transition structure components such as a front end plate do not need to be arranged, the assembly error accumulation is small when the image sensor is leveled, the assembly structure of the image acquisition equipment is simplified, and the height of the whole machine is reduced; meanwhile, the production and assembly efficiency is improved, and the production cost is reduced.

Description

Technical Field

[0001] The present application relates to the field of image acquisition technology, and in particular to an image acquisition device. Background Art

[0002] With the development of science and technology, image data has become important data information, and image acquisition equipment used to collect image data has also been widely used in different fields such as industrial logistics, autonomous driving, and intelligent robots.

[0003] In the related art, the functions of image acquisition devices are increasing, and the number of electronic control boards installed inside the image acquisition devices is also increasing. The image acquisition devices usually include a shell and an image sensor circuit board arranged in the shell, on which an image sensor is arranged, and a reinforcement plate and an end plate are required to be arranged between the image sensor circuit board and the shell. During assembly, the flatness of the image sensor needs to be adjusted by three-point spring leveling.

[0004] However, the structure of current image acquisition equipment results in an excessively high height of the entire device, complex assembly procedures, and high production costs. Utility Model Content

[0005] The present application provides an image acquisition device to solve at least one technical problem that the structure of the current image acquisition device causes the height of the whole device to be too high, the assembly process to be complicated, and the production cost to be high.

[0006] In order to achieve the above-mentioned purpose, the present application provides an image acquisition device, which includes a shell having a receiving cavity, and an image sensor assembly arranged in the receiving cavity, wherein the image sensor assembly includes an image sensor, a sensor circuit board and an adjustment pad.

[0007] The image sensor is connected to a sensor circuit board, and the sensor circuit board is connected to a housing; an adjustment pad is located between the sensor circuit board and the housing to adjust the alignment of the image sensor relative to the housing.

[0008] In some embodiments, the image sensor assembly further includes a reinforcing plate, the reinforcing plate abutting against a side of the sensor circuit board facing away from the image sensor.

[0009] The image acquisition device provided by the present application has the following beneficial effects: by arranging the reinforcement plate on the side of the sensor circuit board away from the image sensor, the sensor circuit board can directly abut against the inner wall of the shell, so that the cumulative assembly error is small when leveling the image sensor, and it is only necessary to directly measure the flatness of the image sensor through instruments such as a collimator, and to ensure the flatness of the image sensor through an adjustment pad, and there is no need to set other transition structural components such as a front end plate, thereby simplifying the assembly structure of the image acquisition device, reducing the height of the entire machine, and at the same time improving the production and assembly efficiency and reducing the production cost.

[0010] In some embodiments, the image acquisition device provided by the present application may also include a plurality of first connecting members, which are arranged at intervals on the circumferential edge of the sensor circuit board, and the first connecting members are constructed to connect the sensor circuit board and the shell; and adjustment pads are arranged at the positions where at least some of the first connecting members are located.

[0011] Such an arrangement can ensure that the image sensor has good flatness after adjustment.

[0012] In some embodiments, the image acquisition device provided in the present application may further include a second connecting member, the sensor circuit board is provided with an avoidance gap, the second connecting member is arranged in the avoidance gap, and the second connecting member is constructed to connect the reinforcement plate and the shell.

[0013] This arrangement allows the reinforcing plate to be directly connected to the housing, and the reinforcing plate presses the sensor circuit board tightly, thereby improving the structural strength of the sensor circuit board.

[0014] In some embodiments, the image acquisition device provided by the present application also includes a main control board, which is arranged in the accommodating cavity, and the main control board is located on the side of the reinforcement plate away from the sensor circuit board; a first connector is provided on the sensor circuit board, and a second connector is provided on the main control board, and the first connector is snap-connected with the second connector.

[0015] With this arrangement, the main control board and the sensor circuit board are directly connected, reducing the distance between the two, thereby reducing the height of the entire device.

[0016] In some embodiments, the main control board has an elastic portion, and the second connector is connected to the elastic portion.

[0017] With such an arrangement, the elastic part can absorb the error when the main control board and the sensor circuit board are directly fastened together, thereby improving the reliability of the connection between the two.

[0018] In some embodiments, the main control board is provided with an opening, the opening is opposite to the first connector, and the elastic portion is a cantilever structure arranged in the opening.

[0019] Such an arrangement reduces the space occupied by the main control board and can improve the compactness of the structure of the main control board in the accommodating cavity.

[0020] In some embodiments, there are multiple elastic parts, first connectors, and second connectors, the first connectors and the second connectors correspond one to one, and each elastic part is connected to at least one second connector.

[0021] Such an arrangement improves the reliability of the buckling connection between the first connector and the second connector at each position.

[0022] In some embodiments, the image acquisition device provided by the present application may also include a buffer and an interface board. The interface board is arranged on the side of the main control board away from the sensor circuit board, and the interface board is connected to the shell; the first side of the buffer is connected to the elastic part, and the second side of the buffer is abutted against the interface board.

[0023] Such an arrangement enables the buffer member to compress the elastic portion, thereby compressing the second connector, thereby improving the reliability of the connection between the first connector and the second connector.

[0024] In some embodiments, the image acquisition device provided in the present application may further include a first fixing member and a second fixing member, wherein the first fixing member is configured to connect the main control board and the shell, and the second fixing member is configured to connect the interface board and the first fixing member.

[0025] Such an arrangement can improve the installation reliability of the main control board and the interface board.

[0026] In some embodiments, the housing may include a front cover, a back cover, and a middle frame, wherein the front cover is connected to the back cover and surrounds a receiving cavity; the middle frame is located between the front cover and the back cover, and the edges of the opposite side surfaces of the middle frame are respectively in contact with the front cover and the back cover. The image sensor, the sensor circuit board, and the reinforcement board are located on the side of the middle frame facing the front cover; and the main control board is located on the side of the middle frame facing the back cover.

[0027] With such arrangement, the installation reliability of each circuit board in the accommodating cavity is improved through the support of the middle frame.

[0028] In some embodiments, the image acquisition device provided in the present application may further include a temperature sensor, which is connected to the side of the main control board facing the middle frame; the middle frame has an avoidance opening, and the temperature sensor passes through the avoidance opening and abuts against either the reinforcement plate or the sensor circuit board.

[0029] With such an arrangement, the operating temperature of the sensor circuit board can be accurately detected, so that the operating temperature of the sensor circuit board is maintained within a safe range.

[0030] In some embodiments, the image acquisition device provided in the present application may further include a first heat conductor and a second heat conductor, wherein the first heat conductor is disposed between the sensor circuit board and the middle frame; and the second heat conductor is disposed between the main control board and the middle frame.

[0031] With this arrangement, the heat on the sensor circuit board and the main control board can be transferred to the casing through the middle frame, thereby improving the heat dissipation efficiency.

[0032] The present application provides an image acquisition device, comprising a shell with a accommodating cavity, and an image sensor, a sensor circuit board, an adjustment pad and a reinforcement plate arranged in the accommodating cavity, the image sensor is connected to the sensor circuit board, the sensor circuit board is connected to the shell, and the reinforcement plate abuts against a side of the sensor circuit board away from the image sensor; the adjustment pad is located between the sensor circuit board and the shell to adjust the flatness of the image sensor, so that the cumulative assembly error is small when leveling the image sensor, and it is only necessary to directly measure the flatness of the image sensor through instruments such as a collimator, and there is no need to set other transition structural components such as a front end plate, thereby simplifying the assembly structure of the image acquisition device, reducing the height of the entire machine, and at the same time improving the production and assembly efficiency and reducing the production cost.

[0033] In addition to the technical problems solved by the embodiments of the present application described above, the technical features that constitute the technical solutions, and the beneficial effects brought about by the technical features of these technical solutions, other technical problems that can be solved by the image acquisition device provided by the present application, other technical features included in the technical solutions, and the beneficial effects brought about by these technical features will be further described in detail in the specific implementation methods. BRIEF DESCRIPTION OF THE DRAWINGS

[0034] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, a brief introduction will be given below to the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0035] Figure 1 A schematic diagram of the structure of an image acquisition device provided in an embodiment of the present application;

[0036] Figure 2 A cross-sectional view of an image acquisition device provided in an embodiment of the present application;

[0037] Figure 3 A schematic diagram of the position of an adjustment pad in an image acquisition device provided in an embodiment of the present application;

[0038] Figure 4 A schematic diagram of the assembly of a reinforcement plate in an image acquisition device provided in an embodiment of the present application;

[0039] Figure 5 Schematic diagram of the assembly of the main control board in the image acquisition device provided in the embodiment of the present application Figure 1 ;

[0040] Figure 6 Schematic diagram of the assembly of the main control board in the image acquisition device provided in the embodiment of the present application Figure 2 ;

[0041] Figure 7 Schematic diagram of the structure of the main control board in the image acquisition device provided in the embodiment of the present application Figure 1 ;

[0042] Figure 8 Schematic diagram of the structure of the main control board in the image acquisition device provided in the embodiment of the present application Figure 2 ;

[0043] Fig. 9 A schematic diagram of the structure of a middle frame in an image acquisition device provided in an embodiment of the present application.

[0044] Description of reference numerals:

[0045] 100-housing; 101-accommodating chamber; 110-front cover; 120-middle frame; 121-first avoidance hole; 122-second avoidance hole; 123-avoidance opening; 130-rear cover;

[0046] 200-image sensor; 210-filter; 220-sealing gasket;

[0047] 300 - sensor circuit board; 301 - first connecting member; 302 - avoidance gap; 310 - first connector;

[0048] 400-Adjustment pad;

[0049] 500-reinforcement plate; 501-second connecting piece;

[0050] 600-main control board; 601-opening; 610-second connector; 620-elastic part; 630-buffer; 640-first fixing part; 650-temperature sensor;

[0051] 700-interface board; 710-second fixing member;

[0052] 800 - Radiator. DETAILED DESCRIPTION

[0053] In order to make the purpose, technical solution and advantages of the embodiments of the present application clearer, the technical solution in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0054] First, those skilled in the art should understand that these implementations are only used to explain the technical principles of the present application and are not intended to limit the scope of protection of the present application. Those skilled in the art can make adjustments to them as needed to adapt to specific application scenarios.

[0055] Secondly, it should be noted that in the description of the present application, terms such as "up", "down", "left", "right", "front", "back", "inside" and "outside" indicating directions or positional relationships are based on the directions or positional relationships shown in the drawings. This is merely for the convenience of description and does not indicate or imply that the device or component must have a specific orientation, be constructed and operated in a specific orientation. Therefore, it should not be understood as a limitation on the present application.

[0056] In addition, it should be noted that in the description of this application, unless otherwise clearly specified and limited, the terms "connected" and "connection" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be the internal communication of two components. For those skilled in the art, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0057] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "illustrative embodiments", "examples", "specific examples", or "some examples" means that the specific features, structures, materials, or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present disclosure. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described may be combined in any one or more embodiments or examples in a suitable manner.

[0058] Image acquisition devices have more and more functions, and more and more electric control boards are installed inside them. The image acquisition devices usually include a housing and an image sensor circuit board arranged in the housing. The image sensor is arranged on the image sensor circuit board. A reinforcement plate and an end plate are also required between the image sensor circuit board and the housing. During assembly, the flatness of the image sensor needs to be adjusted by three-point spring leveling. However, the structure of the current image acquisition device will result in the height of the whole machine being too high, the assembly process being complicated, and the production cost being high.

[0059] In view of the above problems, an embodiment of the present application provides an image acquisition device. By setting a reinforcement plate on the side of the sensor circuit board away from the image sensor, the sensor circuit board can directly abut against the inner wall of the shell of the image acquisition device, so that the cumulative assembly error is small when leveling the image sensor. It is only necessary to directly measure the flatness of the image sensor through instruments such as a collimator, and to ensure the flatness of the image sensor through an adjustment pad, so that the image sensor remains parallel to the front side end face of the shell. There is no need to set other transition structural components such as a front end plate, thereby simplifying the assembly structure of the image acquisition device, reducing the height of the whole machine, and at the same time improving the production and assembly efficiency and reducing the production cost.

[0060] To facilitate understanding, the following first describes the applicable application scenarios of the image acquisition device provided in the embodiments of the present application.

[0061] The image acquisition device provided in the embodiment of the present application can be used in the automation equipment of a manufacturing factory, or in the handling robots or automated sorting equipment of a logistics warehouse, to identify the surrounding environment or objects. By way of example, the image acquisition device can be an industrial camera, a barcode reader, etc., and the embodiment of the present application does not specifically limit this.

[0062] Figure 1 A schematic diagram of the structure of an image acquisition device provided in an embodiment of the present application, Figure 2 A cross-sectional view of an image acquisition device provided in an embodiment of the present application, Figure 3 A schematic diagram of the position of the adjustment pad in the image acquisition device provided in an embodiment of the present application, Figure 4 A schematic diagram of the assembly of a reinforcement plate in an image acquisition device provided in an embodiment of the present application.

[0063] Please refer to Figures 1 to 4 The present application provides an image acquisition device, which includes a housing 100 having a receiving cavity 101. The image acquisition device includes an image sensor assembly disposed in the receiving cavity 101. The image sensor assembly includes an image sensor 200, a sensor circuit board 300, and an adjustment pad 400. The image sensor 200, the sensor circuit board 300, and the adjustment pad 400 are all disposed in the receiving cavity 101.

[0064] The image sensor 200 is connected to the sensor circuit board 300, and the sensor circuit board 300 is connected to the housing 100. The adjustment pad 400 is located between the sensor circuit board 300 and the housing 100 to adjust the alignment of the image sensor 200 relative to the housing 100.

[0065] It can be understood that in the embodiment of the present application, the flatness of the image sensor is ensured by providing an adjustment pad 400, and there is no need to provide other transition structural components such as a front end plate, thereby simplifying the assembly structure of the image acquisition device, reducing the height of the entire machine, and at the same time improving the production assembly efficiency and reducing the production cost.

[0066] In some embodiments, the image sensor assembly further includes a reinforcing plate 500 . The reinforcing plate 500 is disposed in the accommodating cavity 101 .

[0067] The image sensor 200 is used to realize the image acquisition function. The sensor circuit board 300 is used to drive and control the image sensor 200. The reinforcement plate 500 is used to enhance the structural strength of the sensor circuit board 300. The adjustment pad 400 is used to adjust the alignment of the image sensor 200 relative to the housing 100.

[0068] In some embodiments, the image sensor 200 is connected to the sensor circuit board 300, the sensor circuit board 300 is connected to the housing 100, and the reinforcing plate 500 abuts against a side of the sensor circuit board 300 away from the image sensor 200. The adjustment pad 400 is located between the sensor circuit board 300 and the housing 100.

[0069] It is understandable that the housing 100 is provided with an image acquisition port, and the image sensor 200 is opposite to the image acquisition port. Since the image sensor 200 is mounted on the sensor circuit board 300, the flatness of the image sensor 200 can be adjusted by adjusting the posture of the sensor circuit board 300 through the adjustment pad 400.

[0070] When assembling the sensor circuit board 300, the flatness of the image sensor 200 can be measured by a collimator, and an adjustment pad 400 can be added between the sensor circuit board 300 and the housing 100 according to the measurement result, so that the flatness of the image sensor 200 meets the standard requirements. For example, after adding the adjustment pad 400, the image sensor 200 is parallel to the surface of the housing 100 where the image acquisition port is set, or is close to parallel.

[0071] It should be noted that in the image acquisition device provided by some embodiments of the present application, by setting the reinforcement plate 500 on the side of the sensor circuit board 300 away from the image sensor 200, there is no need to set other transition structural components such as the front end plate, and there is no need to use a three-point spring leveling method to adjust the flatness, so that the sensor circuit board 300 can be directly abutted against the inner wall of the shell 100, so that the cumulative assembly error is small when leveling the image sensor 200, and different numbers of adjustment pads 400 can be added at different positions according to actual measurement results, thereby simplifying the assembly structure of the image acquisition device, reducing the height of the whole machine, and at the same time improving the production assembly efficiency and reducing the production cost.

[0072] First, the specific installation method of the sensor circuit board 300 and the setting position of the adjustment pad 400 are described in detail below.

[0073] Please continue to refer to Figures 1 to 4 In some embodiments, the image acquisition device provided by the present application may further include a plurality of first connectors 301, wherein the plurality of first connectors 301 are spaced apart at the circumferential edge of the sensor circuit board 300, and the first connectors 301 are configured to connect the sensor circuit board 300 and the housing 100.

[0074] The sensor circuit board 300 is provided with a mounting through hole, and the shell 100 is provided with a threaded hole. The first connecting member 301 can pass through the mounting through hole and be screwed to the threaded hole on the shell 100, so as to fix the sensor circuit board 300 on the inner wall of the shell 100.

[0075] Exemplarily, the first connecting member 301 may be a screw. The sensor circuit board 300 may be a square flat plate structure, and the sensor circuit board 300 is provided with electrical components such as a control unit, a resistor, a capacitor, an inductor, and a connector. The first connecting member 301 may be provided at each corner of the sensor circuit board 300 to improve the installation reliability of the sensor circuit board 300 on the housing 100.

[0076] It is understandable that the adjustment pad 400 is disposed at least partially where the first connecting member 301 is located, so as to ensure that the image sensor 200 has good flatness after adjustment. When the first connecting member 301 is locked, the sensor circuit board 300 can be pressed by the first connecting member 301, and the sensor circuit board 300 is pressed against the adjustment pad 400 at the same time.

[0077] Exemplarily, there may be four first connectors 301, and the four first connectors 301 are arranged at the four corners of the sensor circuit board 300. When adjusting the flatness of the image sensor 200, an adjustment pad 400 may be arranged at one or more positions of the four first connectors 301 according to actual conditions. The adjustment pad 400 may be a circular ring structure, and the adjustment pad 400 may be sleeved on the first connector 301.

[0078] It should be noted that the adjustment pad 400 can be an elastic gasket such as rubber or silicone, and the embodiment of the present application does not limit the specific material and thickness value of the adjustment pad 400.

[0079] In some embodiments, the image acquisition device provided in the present application may further include a second connecting member 501, the sensor circuit board 300 is provided with an avoidance gap 302, the second connecting member 501 is arranged in the avoidance gap 302, and the second connecting member 501 is constructed to connect the reinforcement plate 500 and the shell 100.

[0080] The reinforcing plate 500 may be provided with a mounting through hole, the housing 100 may be provided with a threaded hole, and the second connecting member 501 may pass through the mounting through hole and be screwed to the threaded hole on the housing 100, thereby fixing the reinforcing plate 500 to the inner wall of the housing 100. Since the reinforcing plate 500 is arranged on the side of the sensor circuit board 300 away from the mounting surface on the housing 100, when the second connecting member 501 locks the reinforcing plate 500, the reinforcing plate 500 may be close to the sensor circuit board 300, so that the reinforcing plate 500 presses the sensor circuit board 300, thereby improving the structural strength of the sensor circuit board 300.

[0081] Exemplarily, the second connector 501 may be a threaded connector such as a screw or a bolt. The reinforcing plate 500 may be a square flat plate structure, and the area of ​​the reinforcing plate 500 may be smaller than the area of ​​the sensor circuit board 300, so that there may be an empty area on the side of the sensor circuit board 300 facing the reinforcing plate 500 for installing electrical components.

[0082] Exemplarily, the second connector 501 may be disposed at each corner of the reinforcing plate 500 to improve the reliability of the installation of the reinforcing plate 500 on the housing 100. There may be four second connectors 501, and the four second connectors 501 are disposed at the four corners of the reinforcing plate 500. The area of ​​the avoidance notch 302 on the sensor circuit board 300 corresponding to the installation position of the second connector 501 is larger than the cross-sectional area of ​​the second connector 501 to avoid interference between the second connector 501 and the sensor circuit board 300 during installation.

[0083] It should be noted that the shape of the avoidance gap 302 can be a gap on the edge of the sensor circuit board 300, and the shape of the avoidance gap 302 can be semicircular, square, triangular, trapezoidal, semi-elliptical, etc., and the embodiment of the present application does not make specific limitations on this.

[0084] Figure 5 Schematic diagram of the assembly of the main control board in the image acquisition device provided in the embodiment of the present application Figure 1 , Figure 6 Schematic diagram of the assembly of the main control board in the image acquisition device provided in the embodiment of the present application Figure 2 , Figure 7 Schematic diagram of the structure of the main control board in the image acquisition device provided in the embodiment of the present application Figure 1 , Figure 8 Schematic diagram of the structure of the main control board in the image acquisition device provided in the embodiment of the present application Figure 2 .

[0085] Please refer to Figures 5 to 8 , and combined with Figures 1 to 4The image acquisition device provided in some embodiments of the present application further includes a main control board 600. The following describes in detail the location of the main control board 600 and the specific connection method between the main control board 600 and the sensor circuit board 300.

[0086] In some embodiments, the main control board 600 can be disposed in the accommodating cavity 101, and the main control board 600 is located on the side of the reinforcing plate 500 away from the sensor circuit board 300. The sensor circuit board 300 is provided with a first connector 310, and the main control board 600 is provided with a second connector 610, and the first connector 310 and the second connector 610 are buckled.

[0087] It can be understood that the main control board 600 serves as the main control board of the image acquisition device, and the main control board 600 is electrically connected to the sensor circuit board 300 by interlocking the first connector 310 and the second connector 610 .

[0088] In the current related technologies, the main control board 600 and the sensor circuit board 300 are usually connected through a flexible circuit board, and the provision of a flexible circuit board requires a large space to be reserved between the main control board 600 and the sensor circuit board 300, and a separate flexible circuit board assembly step is required. In the embodiment of the present application, the main control board 600 and the sensor circuit board 300 are directly buckled through the first connector 310 and the second round connector. The first connector 310 is directly installed on the sensor circuit board 300 as an electronic component during production, and the second connector 610 is directly installed on the main control board 600 as an electronic component during production. Thus, while reducing the distance between the main control board 600 and the sensor circuit board 300 to reduce the height of the entire machine, the assembly steps of the main control board 600 of the image acquisition device can be simplified, the assembly efficiency can be improved, and there is no need to provide a flexible circuit board, thereby reducing production costs.

[0089] In some embodiments, the main control board 600 has an elastic portion 620, and the second connector 610 is connected to the elastic portion 620, so that the elastic portion 620 can absorb the error when the main control board 600 and the sensor circuit board 300 are directly fastened, thereby improving the reliability of the connection between the two.

[0090] It is understandable that, since the image sensor 200 is mounted on the sensor circuit board 300, after ensuring the flatness of the image sensor 200, the body of the sensor circuit board 300 may be tilted at a small angle relative to the surface of the image sensor 200. Thus, after the main control board 600 is installed and connected to the housing 100, the body of the main control board 600 and the body of the sensor circuit board 300 may be tilted at a small angle. In the embodiment of the present application, by providing an elastic portion 620 on the main control board 600, when the second connector 610 is plugged into the first connector 310, the second connector 610 can generate a small movement through the elastic deformation of the elastic portion 620, thereby ensuring that the first connector 310 can be tightly buckled with the second connector 610.

[0091] It should be noted that the reinforcing plate 500 is arranged on the side of the sensor circuit board 300 facing the main control board 600, and the sensor circuit board 300 can be a hard board, so there is no need to set a semi-steel plate structure on the sensor circuit board 300, that is, there is no need to reserve space for the deformation of the sensor circuit board 300, so the height of the whole device can be reduced. The error of the main control board 600 and the sensor circuit board 300 not being parallel during assembly can be absorbed by the elastic part 620 on the main control board 600, and the elastic deformation of the elastic part 620 can utilize the gap on both sides of the main control board 600.

[0092] In addition, since the image acquisition device provided in the embodiment of the present application will more often redesign or change the layout and structure of the sensor circuit board 300 when designing different models, compared with a circuit board with a semi-steel plate, the sensor circuit board 300 in the embodiment of the present application can be a hard board, and the design and change cost of the sensor circuit board 300 is lower, thereby reducing the production cost of the entire machine.

[0093] In some embodiments, the main control board 600 is provided with an opening 601, the opening 601 is opposite to the first connector 310, and the elastic portion 620 is a cantilever structure disposed in the opening 601. In this way, the space occupied by the main control board 600 can be reduced, and the compactness of the structure of the main control board 600 in the accommodating cavity 101 can be improved.

[0094] For example, the elastic part 620 may be an integrally formed structure with the main control board 600 . The second connector 610 is mounted on a side of the elastic part 620 facing the sensor circuit board 300 .

[0095] In some embodiments, there are multiple elastic parts 620, first connectors 310, and second connectors 610, and the first connectors 310 and the second connectors 610 correspond one to one. At least one second connector 610 is connected to each elastic part 620, thereby improving the reliability of the snap-on connection between the first connector 310 and the second connector 610 at each position.

[0096] Exemplarily, the main control board 600 may be provided with two openings 601, each opening 601 is provided with an elastic portion 620, each elastic portion 620 is provided with a second connector 610, and the sensor circuit board 300 is provided with first connectors 310 at positions opposite to the two elastic portions 620. When the main control board 600 is installed in the accommodating cavity 101 and fixed on the housing 100, the two second connectors 610 are plugged with the two first connectors 310 respectively.

[0097] In some embodiments, the image acquisition device provided by the present application may further include a buffer 630 and an interface board 700, wherein the interface board 700 is disposed on a side of the main control board 600 away from the sensor circuit board 300, and the interface board 700 is connected to the housing 100. A first side of the buffer 630 is connected to the elastic portion 620, and a second side of the buffer 630 is in contact with the interface board 700.

[0098] It is understandable that the interface board 700 may be provided with a connector for plugging in cables and an interface for electrically connecting to an external device. The buffer 630 is sandwiched between the interface board 700 and the main control board 600, so that the buffer 630 can compress the elastic part 620, and then compress the second connector 610, thereby improving the reliability of the connection between the first connector 310 and the second connector 610.

[0099] Exemplarily, the buffer 630 may be foam and has elasticity. When the interface plate 700 is installed in the accommodating cavity 101 and the interface plate 700 is connected to the shell 100 , the interface plate 700 may compress the buffer 630 so that the buffer 630 generates pressure on the elastic part 620 .

[0100] In some embodiments, the image acquisition device provided by the present application may also include a first fixing member 640 and a second fixing member 710, wherein the first fixing member 640 is configured to connect the main control board 600 and the shell 100, and the second fixing member 710 is configured to connect the interface board 700 and the first fixing member 640, thereby improving the installation reliability of the main control board 600 and the interface board 700.

[0101] Among them, the first fixing member 640 and the second fixing member 710 can both be bolts, the shell 100 can be provided with a threaded hole, the main control board 600 can be provided with an installation through hole, and the first fixing member 640 can pass through the installation through hole on the main control board 600 and be screwed to the threaded hole on the shell 100.

[0102] A threaded hole may be provided at one end of the first fixing member 640 facing the interface board 700, and a mounting through hole may be provided on the interface board 700. The second fixing member 710 may pass through the mounting through hole on the interface board 700 and be screwed to the threaded hole on the first fixing member 640, thereby indirectly fixing the interface board 700 to the housing 100, thereby ensuring the reliability and stability of the installation structure of the interface board 700 and the main control board 600.

[0103] For example, the first fixing member 640 and the second fixing member 710 may be arranged in a one-to-one correspondence. There may be four first fixing members 640 , the main control board 600 may be a square structure, and the four first fixing members 640 may be installed at the four corners of the main control board 600 .

[0104] Fig. 9 A schematic diagram of the structure of a middle frame in an image acquisition device provided in an embodiment of the present application.

[0105] The specific structure of the housing 100 is described in detail below.

[0106] Please refer to Fig. 9 , combined with Figures 1 to 8 In some embodiments, the housing 100 may include a front cover 110, a rear cover 130 and a middle frame 120, wherein the front cover 110 and the rear cover 130 are connected and surround the accommodating cavity 101. The middle frame 120 is located between the front cover 110 and the rear cover 130, and the edges of the opposite side surfaces of the middle frame 120 abut against the front cover 110 and the rear cover 130 respectively.

[0107] The image sensor 200, the sensor circuit board 300 and the reinforcing plate 500 are located on the side of the middle frame 120 facing the front cover 110. The main control board 600 is located on the side of the middle frame 120 facing the rear cover 130. The support of the middle frame 120 can improve the installation reliability of each circuit board in the accommodating cavity 101.

[0108] It is understandable that both the sensor circuit board 300 and the reinforcement plate 500 can be connected to the front cover 110. The main control board 600 can be connected to the front cover 110 through the middle frame 120 via the first fixing member 640. The front cover 110 can be provided with a first avoidance hole 121 for the first fixing member 640 to pass through, and the aperture of the first avoidance hole 121 is larger than the outer diameter of the first fixing member 640. The first avoidance hole 121 is arranged in a one-to-one correspondence with the first fixing member 640.

[0109] In addition, since the second connector 610 on the main control board 600 needs to be snapped into the first connector 310 on the sensor circuit board 300, a second avoidance hole 122 may also be provided at a position on the middle frame 120 opposite to the first connector 310 and the second connector 610, and the first connector 310 and the second connector 610 may pass through the second avoidance hole 122 and be plugged into each other.

[0110] In some embodiments, the image acquisition device provided by the present application may further include a temperature sensor 650, which is connected to the side of the main control board 600 facing the middle frame 120. The middle frame 120 has an escape opening 123, and the temperature sensor 650 passes through the escape opening 123 and abuts against any one of the reinforcement plate 500 and the sensor circuit board 300.

[0111] It is understandable that the temperature sensor 650 can accurately detect the operating temperature of the sensor circuit board 300 so as to maintain the operating temperature of the sensor circuit board 300 within a safe range.

[0112] In some embodiments, the image acquisition device provided by the present application may further include a first heat conducting member and a second heat conducting member, wherein the first heat conducting member is disposed between the sensor circuit board 300 and the middle frame 120 , and the second heat conducting member is disposed between the main control board 600 and the middle frame 120 .

[0113] The first heat conducting member and the second heat conducting member may be heat conducting foam. The first heat conducting member may be bonded to the electronic components with high heat generation on the sensor circuit board 300. The second heat conducting member may be bonded to the electronic components with high heat generation on the main control board 600. In this way, the heat on the sensor circuit board 300 and the main control board 600 may be transferred to the housing 100 through the middle frame 120, thereby improving the heat dissipation efficiency.

[0114] It should be noted that a radiator 800 may be provided outside the housing 100 and may be installed outside the rear cover 130. The radiator 800 may include a cooling fan and cooling fins, and the air inlet of the cooling fan is connected to the interior of the accommodating cavity 101.

[0115] In some embodiments, the image acquisition device further includes a filter 210 and a sealing gasket 220. The filter 210 is arranged opposite to the image sensor 200, the filter 210 is located between the image sensor 200 and the image acquisition port of the housing 100, and the sealing gasket 220 can be arranged between the image sensor 200 and the inner wall of the housing 100. The sealing gasket 220 can be arranged around the filter 210.

[0116] The present application provides an image acquisition device, which includes a shell with a accommodating cavity, and an image sensor assembly arranged in the accommodating cavity, the image sensor assembly includes an image sensor, a sensor circuit board and an adjustment pad, the image sensor is connected to the sensor circuit board, and the sensor circuit board is connected to the shell; the adjustment pad is located between the sensor circuit board and the shell to adjust the alignment of the image sensor relative to the shell, so that there is no need to set other transition structural components such as a front end plate, and the cumulative assembly error is small when leveling the image sensor, which simplifies the assembly structure of the image acquisition device, reduces the height of the whole machine, and at the same time improves the production assembly efficiency and reduces the production cost.

[0117] Finally, it should be noted that the above embodiments are only used to illustrate the technical solution of the present application, rather than to limit it. Although the present application has been described in detail with reference to the aforementioned embodiments, a person of ordinary skill in the art should understand that the technical solutions described in the aforementioned embodiments can still be modified, or some or all of the technical features therein can be replaced by equivalents. However, these modifications or replacements do not cause the essence of the corresponding technical solution to deviate from the scope of the technical solution of the embodiments of the present application.

Claims

1. An image acquisition device, characterized in that: It comprises a housing (100) having a housing cavity (101), and an image sensor assembly arranged in the housing cavity (101), wherein the image sensor assembly comprises an image sensor (200), a sensor circuit board (300) and an adjustment pad (400); The image sensor (200) is connected to the sensor circuit board (300), and the sensor circuit board (300) is connected to the housing (100); the adjustment pad (400) is located between the sensor circuit board (300) and the housing (100) to adjust the alignment of the image sensor (200) relative to the housing (100).

2. The image acquisition device according to claim 1, characterized in that: It also includes a plurality of first connecting members (301), wherein the plurality of first connecting members (301) are arranged at intervals on the circumferential edge of the sensor circuit board (300), and the first connecting members (301) are configured to connect the sensor circuit board (300) and the housing (100); and the adjustment pad (400) is arranged at the position where at least some of the first connecting members (301) are located.

3. The image acquisition device according to claim 1, characterized in that: The image sensor assembly further comprises a reinforcing plate (500), wherein the reinforcing plate (500) is in contact with a side of the sensor circuit board (300) facing away from the image sensor (200).

4. The image acquisition device according to claim 3, characterized in that: The sensor circuit board (300) further comprises a second connecting member (501), the sensor circuit board (300) is provided with an avoidance notch (302), the second connecting member (501) is arranged in the avoidance notch (302), and the second connecting member (501) is configured to connect the reinforcing plate (500) and the housing (100).

5. The image acquisition device according to claim 3 or 4, characterized in that: The sensor circuit board (300) is also provided with a main control board (600), wherein the main control board (600) is arranged in the accommodating cavity (101), and the main control board (600) is located on a side of the reinforcing plate (500) away from the sensor circuit board (300); a first connector (310) is provided on the sensor circuit board (300), and a second connector (610) is provided on the main control board (600), and the first connector (310) is buckled with the second connector (610).

6. The image acquisition device according to claim 5, characterized in that: The main control board (600) has an elastic portion (620), and the second connector (610) is connected to the elastic portion (620).

7. The image acquisition device according to claim 6, characterized in that: The main control board (600) is provided with an opening (601), the opening (601) is opposite to the first connector (310), and the elastic part (620) is a cantilever structure arranged in the opening (601).

8. The image acquisition device according to claim 6, characterized in that: The elastic part (620), the first connector (310), and the second connector (610) are all multiple, the first connector (310) and the second connector (610) correspond one to one, and each of the elastic parts (620) is connected to at least one of the second connectors (610).

9. The image acquisition device according to claim 6, characterized in that: It also includes a buffer component (630) and an interface board (700), wherein the interface board (700) is arranged on a side of the main control board (600) away from the sensor circuit board (300), and the interface board (700) is connected to the shell (100); the first side of the buffer component (630) is connected to the elastic part (620), and the second side of the buffer component (630) is in contact with the interface board (700).

10. The image acquisition device according to claim 9, characterized in that: It also includes a first fixing member (640) and a second fixing member (710), wherein the first fixing member (640) is configured to connect the main control board (600) and the housing (100), and the second fixing member (710) is configured to connect the interface board (700) and the first fixing member (640).

11. The image acquisition device according to claim 5, characterized in that: The housing (100) comprises a front cover (110), a rear cover (130) and a middle frame (120); the front cover (110) is connected to the rear cover (130) and surrounds the accommodating cavity (101); the middle frame (120) is located between the front cover (110) and the rear cover (130), and the edges of the opposite side surfaces of the middle frame (120) are respectively in contact with the front cover (110) and the rear cover (130); The image sensor (200), the sensor circuit board (300) and the reinforcing plate (500) are located on a side of the middle frame (120) facing the front cover (110); and the main control board (600) is located on a side of the middle frame (120) facing the rear cover (130).

12. The image acquisition device according to claim 11, characterized in that: It also includes a temperature sensor (650), which is connected to a side of the main control board (600) facing the middle frame (120); the middle frame (120) has an escape opening (123), and the temperature sensor (650) passes through the escape opening (123) to abut against any one of the reinforcement plate (500) and the sensor circuit board (300).

13. The image acquisition device according to claim 11, characterized in that: It also includes a first heat conducting member and a second heat conducting member, wherein the first heat conducting member is arranged between the sensor circuit board (300) and the middle frame (120); and the second heat conducting member is arranged between the main control board (600) and the middle frame (120).

Images