Structure for FOF bonding to prevent LCD peeling
By setting a gold finger connection groove on the main FPC and forming an opening connected thereto, the bonding unevenness and gold finger peeling problems caused by the difference in the PI part thickness in the prior art are solved, and a more stable structural connection is achieved.
Patent Information
- Application Number
- CN202420651763.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-03-29
- Publication Date
- 2024-12-31
- Estimated Expiration
- 2034-03-29
AI Technical Summary
The FPC and gold finger components of the existing touch display screen are uneven due to the difference in thickness of the PI part, which is prone to poor functionality and gold finger peeling problems.
Set a gold finger connection groove on the main FPC, and an opening is formed on the outside of it to communicate with the gold finger connection groove. Cut off the reserved PI part to ensure that the opening and the bottom wall of the groove are on the same horizontal plane, and avoid the PI part from raising the gold finger. Enhance structural stability.
It effectively avoids the risks of poor functionality and gold finger peeling, and improves the reliability and stability of the structure.
Smart Images
Figure CN222283571U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of display screen assembly, in particular to a structure used for FOF bonding to prevent LCD from peeling off. Background Art
[0002] The existing touch screen usually uses the FPC of the touch screen to connect with the FPC of the display screen, and then connects with the terminal device through the FPC of the display screen. This method can save the cost of the terminal device and reduce the space of the terminal device. Figure 1 to Figure 2 As shown, in the display product, the FPC uses FOF to bind the gold finger to the edge of the PI part 5 with a thickness of 0.4 mm. Since the height of the PI part 5 is different, there will be a thickness difference between it and the gold finger component. During bonding, the gold finger component will be lifted up by the PI, resulting in uneven bonding and the risk of poor functionality. As a result, the gold finger component is prone to peeling off after the FPC is bent. Summary of the invention
[0003] In view of the problems of the prior art, the utility model provides a structure for FOF bonding to prevent LCD peeling. Compared with the traditional technology, the reserved PI part is cut off to form an opening, and the opening is connected to the gold finger connection groove, so as to avoid the problem of poor functionality caused by the reserved PI part lifting the gold finger component, and at the same time avoid the risk of easy peeling of the gold finger component after the FPC is bent, and the structure is reliable.
[0004] In order to solve the above technical problems, the utility model adopts the following technical solutions:
[0005] The utility model provides a structure for FOF bonding to prevent LCD peeling, which comprises a main FPC, wherein a gold finger connection groove is arranged on the main FPC, a gold finger component is attached in the gold finger connection groove, an opening is arranged on the outer side of the gold finger connection groove, the opening is communicated with the gold finger connection groove, and the bottom wall at the opening and the bottom wall of the gold finger connection groove are located on the same horizontal plane.
[0006] Preferably, a positioning MARK point is provided in the gold finger connection groove.
[0007] Beneficial effects of the utility model:
[0008] Compared with the traditional technology, the utility model cuts off the reserved PI part to form an opening, and the opening is connected to the gold finger connection groove, so as to avoid the problem of poor functionality caused by the reserved PI part lifting the gold finger component, and at the same time avoid the risk of the gold finger component being easily peeled off after the FPC is bent, and the structure is reliable. BRIEF DESCRIPTION OF THE DRAWINGS
[0009] Figure 1The present invention is a schematic diagram of the structure in which FPC in a display screen product of the prior art is bound to a gold finger through FOF.
[0010] Figure 2 This is a schematic structural diagram from another perspective of a display screen product in the prior art in which FPC is bound to a gold finger through FOF.
[0011] Figure 3 The utility model is a schematic diagram of a structure for FOF bonding to prevent LCD from peeling off.
[0012] Figure 4 This is a schematic structural diagram from another viewing angle of a structure for FOF bonding to prevent LCD peeling according to the utility model.
[0013] exist Figures 1 to 4 Reference numerals in the drawings include:
[0014] 1. Main FPC; 2. Gold finger connection slot; 3. Gold finger component; 4. Opening; 5. PI part. DETAILED DESCRIPTION
[0015] In order to facilitate the understanding of those skilled in the art, the present invention is further described below in conjunction with the embodiments and drawings, and the contents mentioned in the implementation modes are not intended to limit the present invention. The present invention is described in detail below in conjunction with the drawings.
[0016] A structure for FOF bonding to prevent LCD peeling, such as Figure 3 to Figure 4 As shown, it includes a main FPC 1, a gold finger connection slot 2 is provided on the main FPC 1, a gold finger component 3 is attached in the gold finger connection slot 2, an opening 4 is provided on the outside of the gold finger connection slot 2, the opening 4 is connected to the gold finger connection slot 2, and the bottom wall at the opening 4 is located on the same horizontal plane as the bottom wall of the gold finger connection slot 2. Specifically, compared with the traditional technology, the utility model cuts off the reserved PI part to form an opening 4, and the opening 4 is connected to the gold finger connection slot 2, so as to avoid the problem of poor functionality caused by the reserved PI part lifting the gold finger component 3, and at the same time avoid the risk of the gold finger component 3 being easily peeled off after the FPC is bent, and the structure is reliable.
[0017] In the embodiment of the present application, a positioning MARK point is arranged in the gold finger connection groove 2. Specifically, under the above arrangement, it is ensured that the gold finger component 3 is accurately bonded in the gold finger positioning groove.
[0018] The above is only a preferred embodiment of the utility model, and does not limit the utility model in any form. Although the utility model is disclosed as a preferred embodiment as above, it is not used to limit the utility model. Any technician familiar with this profession can make some changes or modifications to equivalent embodiments of equivalent changes by using the technical content disclosed above without departing from the scope of the technical solution of the utility model. However, any simple modification, equivalent change and modification made to the above embodiments according to the technology of the utility model, which does not depart from the content of the technical solution of the utility model, belongs to the scope of the technical solution of the utility model.
Claims
1. A structure for FOF bonding to prevent LCD peeling, characterized in that: It includes a main FPC, which is provided with a gold finger connection groove, in which a gold finger component is attached, an opening is provided on the outer side of the gold finger connection groove, the opening is connected with the gold finger connection groove, and the bottom wall at the opening is located on the same horizontal plane as the bottom wall of the gold finger connection groove.
2. The structure for FOF bonding to prevent LCD peeling according to claim 1, characterized in that: A positioning MARK point is arranged in the gold finger connection groove.