Electronic device

Abstract

The utility model provides electronic equipment. The electronic equipment comprises a refrigeration assembly, a heating element and a power supply, the refrigeration part is bent and defines a refrigeration area, and at least part of the projection of the heating part on the refrigeration part is located in the refrigeration area. The heat dissipation piece and the refrigeration piece are arranged at intervals; the P-type element and the N-type element are connected between the refrigeration piece and the heat dissipation piece, and the P-type element and the N-type element are electrically connected with the power supply, so that the structure of the refrigeration assembly in the electronic equipment is simplified, and the refrigeration efficiency of the refrigeration assembly on the heating piece is ensured.

Description

Technical Field

[0001] The utility model belongs to the technical field of refrigeration, and specifically relates to an electronic device. Background Art

[0002] Electronic devices generate a lot of heat during operation, causing the temperature of the electronic devices to be too high.

[0003] Currently, a heat dissipation back clip is configured to dissipate heat for electronic devices. However, the heat dissipation back clip not only increases the overall volume and weight of the electronic device, but also has low heat dissipation efficiency. Utility Model Content

[0004] One purpose of the utility model is to provide a new technical solution for electronic equipment.

[0005] The utility model provides an electronic device, comprising:

[0006] Refrigeration components, heating components and power supplies;

[0007] The refrigeration assembly includes a refrigeration element, a heat dissipation element, a P-type element and an N-type element, wherein the refrigeration element is bent and arranged to enclose a refrigeration area, and the projection of the heat dissipation element on the refrigeration element is at least partially located in the refrigeration area;

[0008] The heat dissipation element and the refrigeration element are arranged at intervals;

[0009] The P-type element and the N-type element are connected between the cooling element and the heat dissipation element, and the P-type element and the N-type element are electrically connected to the power supply.

[0010] Optionally, the cooling element is fixed to the inner surface of the housing of the electronic device.

[0011] Optionally, the cooling element is fixed to an outer surface of a housing of the electronic device.

[0012] Optionally, the cooling element is attached to the heating element.

[0013] Optionally, at least a partial structure of the heat sink is disposed adjacent to a middle frame of the electronic device.

[0014] Optionally, the refrigeration element and the heat dissipation element are both annular, the heat dissipation element is arranged on the outer circumference of the refrigeration element, and the refrigeration element encloses a closed refrigeration area.

[0015] Optionally, the refrigeration element has two refrigeration protrusions protruding toward the refrigeration area, and the heating device of the electronic device is located between the two refrigeration protrusions.

[0016] Optionally, the refrigeration element and the heat dissipation element are both C-shaped, the C-shaped refrigeration element surrounds the refrigeration area, and the heat dissipation element is arranged on a side of the refrigeration element away from the refrigeration area.

[0017] Optionally, the refrigeration element includes a first refrigeration element and a second refrigeration element, and the heat dissipation element includes a first heat dissipation element and a second heat dissipation element; the openings of the first refrigeration element and the second refrigeration element are opposite to each other and surround the refrigeration area, the first heat dissipation element is arranged on a side of the first refrigeration element away from the refrigeration area, and the second heat dissipation element is arranged on a side of the second refrigeration element away from the refrigeration area.

[0018] Optionally, the electronic device further comprises a control component and a temperature sensor;

[0019] The control component is electrically connected to the power supply and the temperature sensor respectively, and is used to adjust the output power of the power supply according to the measurement result of the temperature sensor.

[0020] Other features and advantages of the present invention will become apparent from the following detailed description of exemplary embodiments of the present invention with reference to the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] The accompanying drawings, which are incorporated in and constitute a part of the specification, illustrate embodiments of the present invention and, together with the description, serve to explain the principles of the present invention.

[0022] Figure 1 A top view of an electronic device provided by an embodiment of the utility model;

[0023] Figure 2 A side view of an electronic device provided by one embodiment of the utility model;

[0024] Figure 3 A schematic diagram of a refrigeration assembly of an electronic device provided by an embodiment of the utility model;

[0025] Figure 4 A top view of another electronic device provided by an embodiment of the utility model;

[0026] Figure 5 A side view of another electronic device provided by an embodiment of the utility model;

[0027] Figure 6 A top view of another electronic device provided by an embodiment of the utility model;

[0028] Figure 7 A schematic diagram of a first refrigeration assembly of another electronic device provided by an embodiment of the utility model;

[0029] Figure 8 A schematic diagram of a second refrigeration assembly of another electronic device provided by an embodiment of the utility model;

[0030] Fig. 9 A schematic diagram of a third cooling assembly of another electronic device provided by an embodiment of the utility model;

[0031] Fig.10 A schematic diagram of a fourth cooling assembly of another electronic device provided by an embodiment of the utility model;

[0032] Fig.11 A side view of another electronic device provided by an embodiment of the utility model;

[0033] Fig.12 A side view of another electronic device provided by an embodiment of the utility model.

[0034] Wherein: 100, refrigeration assembly; 1, refrigeration element; 11, refrigeration protrusion; 12, first refrigeration element; 13, second refrigeration element; 2, heat sink; 21, first heat sink; 22, second heat sink; 3, P-type element; 4, N-type element; 5, power supply; 6, flow guide; 61, first flow guide; 62, second flow guide; 63, third flow guide;

[0035] 200, heating element; 201, heating device; 300, housing; 400, middle frame; 500, battery. DETAILED DESCRIPTION

[0036] Various exemplary embodiments of the present invention will now be described in detail with reference to the accompanying drawings. It should be noted that unless otherwise specifically stated, the relative arrangements of components and steps, numerical expressions and numerical values ​​set forth in these embodiments do not limit the scope of the present invention.

[0037] The embodiments of the present application will be described in detail below, and examples of the embodiments are shown in the accompanying drawings. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present application, and should not be understood as limiting the present application. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in the field without making creative work are within the scope of protection of the present application.

[0038] The term "first" or "second" in the specification and claims of this application may include one or more of the features explicitly or implicitly. In the description of this application, unless otherwise specified, "plurality" means two or more. In addition, "and / or" in the specification and claims means at least one of the connected objects, and the character " / " generally means that the objects connected before and after are in an "or" relationship.

[0039] In the description of the present application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0040] In the description of this application, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0041] It should be noted that like reference numerals and letters refer to similar items in the following figures, and therefore, once an item is defined in one figure, it need not be further discussed in subsequent figures.

[0042] When an electronic device is running or charging, such as when the electronic device is in gaming mode, the heating element in the electronic device will generate a lot of heat, causing the temperature of the electronic device to be too high. The electronic device provided in the embodiment of the present application can cool the heating element of the electronic device through the refrigeration assembly 100, thereby preventing the temperature of the electronic device from being too high.

[0043] Reference Figure 3 and Figure 4 In some embodiments, the present application provides an electronic device, the electronic device comprising:

[0044] Refrigeration assembly 100, heating element 200 and power supply 5;

[0045] See also Figure 3 The refrigeration assembly 100 includes a refrigeration element 1, a heat sink 2, a P-type element 3 and an N-type element 4, wherein Figure 5 and Figure 6 The refrigeration element 1 is bent and encloses a refrigeration area, and the projection of the heating element 200 on the refrigeration element 1 is at least partially located in the refrigeration area;

[0046] The heat sink 2 and the refrigeration element are spaced apart, for example, a P-type element 3 and an N-type element 4 are spaced apart between the heat sink 2 and the refrigeration element;

[0047] The P-type element 3 and the N-type element 4 are connected between the cooling element 1 and the heat sink 2 , and the P-type element 3 and the N-type element 4 are electrically connected to the power supply 5 , so that the P-type element 3 , the N-type element 4 and the power supply 5 form a series loop.

[0048] In this embodiment, the heating element 200 can be a mainboard and a battery in an electronic device. Taking a mainboard as an example, the mainboard, as a main control device in an electronic device, can reduce the energy consumption of the electronic device while maintaining the high performance of the electronic device, thereby extending the service life of the electronic device. The mainboard can be a PCB board (printed circuit board), which specifically uses an insulating material as a substrate, and components such as resistors, capacitors, inductors, diodes, triodes and integrated circuits are arranged on the substrate. These components are interconnected through the lines on the PCB board to achieve electrical connection or electrical insulation to jointly support various functions of the electronic device. The mainboard will generate a certain amount of heat during operation, especially when processing high-load tasks.

[0049] The heat sink 2, as the hot end in the refrigeration assembly 100, and the cold end formed by the refrigeration element 1 in the refrigeration assembly 100, together form the main path for the current to pass. When an external voltage is applied to the refrigeration assembly 100, electrons are transferred between the P-type element 3 and the N-type element 4. In this process, a potential difference is formed between the hot end and the cold end, thereby driving the flow of electrons, so that the refrigeration assembly 100 can achieve a refrigeration effect under the action of the external voltage. The main function of the heat sink 2 is to release and absorb heat. During the refrigeration process, the heat sink 2 absorbs the heat transferred from the cold end and dissipates it into the environment, thereby maintaining the temperature difference effect of the refrigeration assembly 100.

[0050] In one embodiment, the heat sink 2 can be made of a metal material with high thermal conductivity, such as silver, copper, aluminum or other metal materials. These metal materials can effectively transfer heat from the inside of the refrigeration assembly 100 to the external environment, thereby improving the heat dissipation efficiency of the heat sink 2. At the same time, the metal material of the heat sink 2 also has good electrical conductivity to ensure that the current can pass smoothly.

[0051] In one embodiment, the electronic device further comprises a plurality of current guides 6, which are arranged between two of the three components, namely, the P-type component 3, the N-type component 4 and the power source 5, to ensure the stability of the current flow in the series circuit. Figure 3The guide member 6 includes a first guide member 61, a second guide member 62 and a third guide member 63. The first guide member 61 is connected between the positive terminal of the power supply 5 and the N-type element 4, the second guide member 62 is connected between the N-type element 4 and the P-type element 3, and the third guide member 63 is connected between the P-type element 3 and the negative terminal of the power supply 5, so that the P-type element 3, the N-type element 4 and the power supply 5 form a series circuit.

[0052] In this embodiment, the flow guide member enables current to flow effectively between the P-type element 3 and the N-type element 4, thereby generating a temperature difference between the cold end formed by the refrigeration element 1 and the hot end formed by the heat sink 2. The flow guide member 6 can be made of a material with high conductivity and low resistance, such as nickel, copper or aluminum. These metal materials not only have good conductivity, but also can quickly transfer heat.

[0053] In this embodiment, a P-type element 3 and an N-type element 4 are connected to form an electric couple. After direct current is passed into the above-mentioned series circuit through the power supply 5, energy transfer can be generated in the P-type element 3 and the N-type element 4. Specifically, the current flows from the N-type element 4 to the P-type element 3 and absorbs heat, so that the refrigeration element 1 located between the output end of the N-type element 4 and the input end of the P-type element 3 becomes the cold end; at the same time, the current flows from the P-type element 3 to the N-type element 4 and releases heat, so that the heat sink 2 located between the output end of the P-type element 3 and the input end of the N-type element 4 becomes the hot end.

[0054] The power source 5 may be a built-in battery provided inside the electronic device, or an external battery exposed on the electronic device. Meanwhile, a battery 500 for supplying power to electrical devices such as a mainboard and a screen is also provided inside the electronic device. On the one hand, the heat absorption efficiency of the N-type element 4 and the heat release efficiency of the P-type element 3 can be adjusted by the current output by the power source 5. For example, when the current output by the power source 5 increases, the heat absorption efficiency of the N-type element 4 and the heat release efficiency of the P-type element 3 can be increased. On the other hand, the heat absorption efficiency can be determined by the number of pairs of electric couples formed by the P-type element 3 and the N-type element 4. For example, when the number of pairs of electric couples formed by the P-type element 3 and the N-type element 4 increases, the heat absorption efficiency of the N-type element 4 and the heat release efficiency of the P-type element 3 also increase. See Fig.12 The side view of the electronic device in FIG. 1 shows that the heat dissipation element 2 is arranged on the side of the cooling element 1 away from the heating element 200, and the heat dissipation element 2 and the cooling element 1 are arranged on the side of the cooling element 1 away from the heating element 200. Fig.12 The heat sink 2 and the cooling element 1 are aligned in the thickness direction in the vertical direction, and two pairs of electric couples formed by P-type elements 3 and N-type elements 4 are connected between the heat sink 2 and the cooling element 1 to improve the heat absorption efficiency of the N-type element 4 and the heat release efficiency of the P-type element 3. Moreover, the cooling assembly 100 is integrated into the electronic device, which simplifies the structure of the cooling assembly 100 in the electronic device and reduces the overall volume and weight of the electronic device when dissipating heat.

[0055] The refrigeration component 1 is bent and encloses a refrigeration area so that heat can be absorbed through the refrigeration area; at least part of the projection of the heating component 200 on the refrigeration component 1 is located in the refrigeration area, that is, at least part of the heating component 200 is opposite to the refrigeration area, so that the heating component 200 is close to the refrigeration area, or the heating component 200 contacts the refrigeration area, so that the heating component 200 can be cooled through the refrigeration area surrounded by the refrigeration component 1, thereby ensuring the cooling efficiency of the refrigeration assembly 100 on the heating component 200 and avoiding excessive temperature of the heating component 200.

[0056] The heat sink 2 surrounds the outside of the cooling element 1 and is spaced apart from the cooling element 1 so that the heat absorbed by the cooling element 1 is transferred to the heat sink 2 and dissipated to the outside through the heat sink 2, thereby improving the efficiency of heat transfer to the outside in the electronic device.

[0057] In one embodiment, the heating element 200 is a mainboard in an electronic device, and the cooling area surrounded by the cooling element 1 can cool the mainboard. When the electronic device is running at high load and generates too much heat, the cooling component 100 is actively started to cool the mainboard, thereby reducing the mainboard temperature of the electronic device, ensuring that the chip on the mainboard operates within a safe operating range, and improving the user experience of using the electronic device.

[0058] In one embodiment, see Figure 6 The refrigeration element 1 and the heat sink 2 are arranged at equal intervals so that the heat absorbed by the refrigeration element 1 can be evenly transferred to the heat sink 2 and then output to the outside through the heat sink 2, thereby ensuring the cooling effect of the refrigeration element 1.

[0059] In one embodiment, see Figure 5 The cooling element 1 is fixed on the inner surface of the housing 300 of the electronic device.

[0060] In this embodiment, see Figure 5 The side view of the electronic device in FIG. 1 shows that the heat dissipation element 2 surrounds the outside of the cooling element 1, and the heat dissipation element 2 and the cooling element 1 are Figure 5 The housing 300 may be a protective structure of the electronic device to form a receiving cavity in the electronic device, so that the electronic device can place the heating element 200 and the battery 500 and other devices in the receiving cavity. For example, the housing 300 includes a back cover and a frame, and the frame is arranged at the edge of the back cover and forms a receiving cavity with the back cover; and the cooling element 1 is fixed to the inner surface of the housing 300 of the electronic device, and the housing 300 can be used to protect the cooling element 1; and the cooling element 1 is located inside the housing 300, so that the cooling element 1 can be more conveniently placed close to the heating element 200 or directly contact the heating element 200, thereby improving the cooling efficiency of the cooling element 1 on the heating element 200.

[0061] In one embodiment, the electronic device is a mobile phone, and the housing 300 includes a back cover of the mobile phone. The cooling element 1 and the heat sink 2 are both fixed to the inner surface of the back cover, so that while the cooling element 1 absorbs heat and transfers the heat to the heat sink 2, the heat of the heat sink 2 can be dissipated to the outside through the back cover.

[0062] In one embodiment, see Figure 1 and Figure 2 The cooling element 1 is fixed on the outer surface of the housing 300 of the electronic device.

[0063] In this embodiment, see Figure 2 The side view of the electronic device in FIG. 1 shows that the heat dissipation element 2 surrounds the outside of the cooling element 1, and the heat dissipation element 2 and the cooling element 1 are Figure 2 The cooling element 1 is fixed on the outer surface of the housing 300 of the electronic device, so that the cooling element 1 does not occupy the space of the internal accommodating cavity of the housing 300, and the utilization rate of the internal space of the electronic device is ensured; and the heat sink 2 can also be fixed on the outside of the housing 300, and the cooling assembly 100 is used as an external component for cooling, and the heat sink 2 can also be used to dissipate heat to the outside.

[0064] In one embodiment, see Figure 4 and Figure 5 The refrigeration component 1 is fitted with the heating component 200, which can facilitate the contact between the heating component 200 and the refrigeration component 1. The heat dissipated by the heating component 200 is directly transferred to the refrigeration component 1, so that the refrigeration component 1 directly cools the heating component 200, thereby improving the refrigeration efficiency of the refrigeration assembly 100.

[0065] In one embodiment, see Fig.11 The side view of the electronic device in FIG. 1 shows that the heat dissipation element 2 is arranged on the side of the cooling element 1 away from the heating element 200, and the heat dissipation element 2 and the cooling element 1 are arranged on the side of the cooling element 1 away from the heating element 200. Fig.11 The heat sink 2 is connected to the housing 300 of the electronic device, the cold end formed by the cooling element 1 is attached to the surface of the heating chip of the heating element 200 such as the motherboard, and the hot end formed by the heat sink 2 is in contact with the housing 300 such as the battery cover or the graphite sheet, so as to improve the heat dissipation efficiency of the heat sink 2, facilitate heat transfer between the cooling element 1 and the heat sink 2, and avoid the temperature of the heating chip being too high to affect the use.

[0066] In one embodiment, see Figure 6 , at least part of the structure of the heat sink 2 is disposed adjacent to the middle frame 400 of the electronic device. In this embodiment, the heat sink 2 can be close to the middle frame 400 or directly contact the middle frame 400, so that the heat sink 2 can transfer heat to the middle frame 400, and then dissipate heat to the outside through the middle frame 400.

[0067] In this embodiment, see Figure 6The hot end formed by the heat sink 2 is close to the middle frame 400 of the electronic device, and the heat sink 2 and the middle frame 400 are arranged at equal intervals to evenly discharge heat through the openings or gaps of the middle frame 400 to avoid heat accumulation inside the electronic device.

[0068] In one embodiment, see Figure 6 , the heating element 200 has a plurality of heating components 201;

[0069] The projection of the heating device 201 on the refrigeration element 1 is located in the refrigeration area.

[0070] In this embodiment, the heating device 201 can be a heating chip such as a processor chip, an image processor chip, and a communication chip on the heating element 200. The projection of the heating device 201 on the cooling element 1 is located in the cooling area, that is, the heating device 201 is opposite to the cooling area, so that the heating device 201 is close to the cooling area, or the heating device 201 contacts the cooling area, so that the heating device 201 can be cooled by the cooling area surrounded by the cooling element 1, thereby ensuring the cooling efficiency of the cooling component 100 on the heating device 201 and avoiding excessive temperature of the heating device 201 during operation.

[0071] It is worth noting that the refrigeration area enclosed by the refrigeration component 1 can be a closed area to form an annular refrigeration structure around the heating device 201; or the refrigeration area enclosed by the refrigeration component 1 can be an open area with at least one side open, and the opening is set to avoid interference of the refrigeration component 1 with the device located at the opening on the heating element 200.

[0072] In one embodiment, see Figure 6 and Figure 7 The refrigeration element 1 and the heat dissipation element 2 are both annular, and the heat dissipation element 2 is arranged on the outer peripheral side of the refrigeration element 1, and the refrigeration element 1 encloses a closed refrigeration area.

[0073] In this embodiment, the refrigeration component 100 serves as a structural component of the electronic device. The refrigeration component 100 is designed to have a refrigeration component 1 and a heat dissipation component 2 with an annular structure, which can facilitate the refrigeration component 1 to surround the heating component 200 or surround the heating device 201 on the heating component 200, thereby improving the cooling efficiency of the refrigeration component 100 on the heating component 200.

[0074] The heat sink 2 is disposed on the outer peripheral side of the refrigeration element 1 , and the heat absorbed by the refrigeration element 1 can be transferred to the heat sink 2 in a timely manner to ensure that the refrigeration element 1 is in a low temperature state.

[0075] In one embodiment, the heat dissipating element 2 and the refrigerating element 1 are arranged at equal intervals to facilitate balanced heat transfer from the refrigerating element 1 to the heat dissipating element 2 .

[0076] In one embodiment, see Figure 8The refrigeration element 1 has two refrigeration protrusions 11 protruding toward the refrigeration area, and the heating device 201 of the electronic device is located between the two refrigeration protrusions 11.

[0077] In this embodiment, the refrigeration protrusion 11 on the refrigeration component 1 can extend toward the heating device 201 so that the heating device 201 is close to the refrigeration component 1; and the heating device 201 of the electronic device is located between the two refrigeration protrusions 11, so that the heat dissipated by the heating device 201 can be transferred to the refrigeration component 1 in time through the two refrigeration protrusions 11, thereby improving the cooling efficiency of the refrigeration component 1 for the heating device 201.

[0078] In another embodiment, the number of refrigeration protrusions 11 on the refrigeration component 1 may be three, four, five or more, and the multiple refrigeration protrusions 11 may be distributed at equal intervals, and the heating device 201 of the electronic device is located between the multiple refrigeration protrusions 11 to form a heat dissipation path for the heating device 201 through the refrigeration protrusions 11, thereby improving the heat dissipation rate of the heating device 201.

[0079] In one embodiment, see Fig. 9 The refrigeration element 1 and the heat sink 2 are both C-shaped. The C-shaped refrigeration element 1 encloses a refrigeration area. The heat sink 2 is arranged on a side of the refrigeration element 1 away from the refrigeration area, and the end of the heat sink 2 and the end of the refrigeration element 1 can be connected through a P-type element 3 and an N-type element 4.

[0080] In this embodiment, the C-shaped refrigeration element 1 forms an open refrigeration area, and the projection of the heating element 200 on the refrigeration element 1 is at least partially located in the refrigeration area to facilitate the refrigeration of the heating element 200 by the refrigeration element 1; and the opening of the open refrigeration area can facilitate the arrangement of devices on the heating element 200, avoiding obstruction of the arrangement of devices on the heating element 200 by the refrigeration element 1.

[0081] In one embodiment, see Fig.10 The refrigeration element 1 includes a first refrigeration element 12 and a second refrigeration element 13, and the heat dissipation element 2 includes a first heat dissipation element 21 and a second heat dissipation element 22; the openings of the first refrigeration element 12 and the second refrigeration element 13 are opposite to each other and surround a refrigeration area, the first heat dissipation element 21 is arranged on a side of the first refrigeration element 12 away from the refrigeration area, and an end of the first heat dissipation element 21 and an end of the first refrigeration element 12 can be connected through a P-type element 3 and an N-type element 4; the second heat dissipation element 22 is arranged on a side of the second refrigeration element 13 away from the refrigeration area, and an end of the second heat dissipation element 22 and an end of the second refrigeration element 13 can be connected through a P-type element 3 and an N-type element 4.

[0082] In this embodiment, the first refrigeration component 12 and the second refrigeration component 13 are both C-shaped, and the openings of the first refrigeration component 12 and the second refrigeration component 13 are opposite to each other and surround a refrigeration area with openings on both sides, and the projection of the heating element 200 on the refrigeration component 1 is at least partially located in the refrigeration area to facilitate the refrigeration of the heating element 200 by the refrigeration component 1; and the openings on both sides of the refrigeration area can facilitate the lateral arrangement of the components on the heating element 200.

[0083] In one embodiment, the electronic device further comprises a control element and a temperature sensor;

[0084] The control component is electrically connected to the power supply 5 and the temperature sensor respectively, and is used to adjust the output power of the power supply according to the measurement result of the temperature sensor.

[0085] In this embodiment, the temperature sensor can be arranged on the heating element 200 to detect the real-time temperature of the heating element 200; the control element actively starts the cooling component 100 according to the measurement result of the temperature sensor, and adjusts the cooling efficiency of the cooling component 100 by continuously adjusting the output power of the power supply; the cooling element 1 is used to cool the heating element 200 so that the heat dissipation chip on the heating element 200 works within a suitable temperature range. Exemplarily, the control element can be a circuit board or a control chip in an electronic device.

[0086] It is understandable that the electronic device may specifically be a mobile phone, a tablet, a computer or other electronic device.

[0087] Although some specific embodiments of the present invention have been described in detail by way of examples, it should be understood by those skilled in the art that the above examples are for illustration only and are not intended to limit the scope of the present invention. It should be understood by those skilled in the art that the above embodiments may be modified without departing from the scope and spirit of the present invention. The scope of the present invention is defined by the appended claims.

Claims

1. An electronic device, comprising: Refrigeration components, heating components and power supplies; The refrigeration assembly includes a refrigeration element, a heat dissipation element, a P-type element and an N-type element, wherein the refrigeration element is bent and arranged to enclose a refrigeration area, and the projection of the heat dissipation element on the refrigeration element is at least partially located in the refrigeration area; The heat dissipation element and the refrigeration element are arranged at intervals; The P-type element and the N-type element are connected between the cooling element and the heat dissipation element, and the P-type element and the N-type element are electrically connected to the power supply.

2. The electronic device according to claim 1, wherein: The cooling element is fixed on the inner surface of the housing of the electronic equipment.

3. The electronic device according to claim 1, wherein: The cooling element is fixed on the outer surface of the housing of the electronic equipment.

4. The electronic device according to claim 1, wherein: The refrigeration component is attached to the heating component.

5. The electronic device according to claim 1, wherein: At least a part of the structure of the heat sink is arranged adjacent to the middle frame of the electronic device.

6. The electronic device according to claim 1, wherein: The refrigeration element and the heat dissipation element are both annular in shape, the heat dissipation element is arranged on the outer peripheral side of the refrigeration element, and the refrigeration element encloses a closed refrigeration area.

7. The electronic device according to claim 6, wherein: The refrigeration element has two refrigeration protrusions protruding toward the refrigeration area, and the heating device of the electronic equipment is located between the two refrigeration protrusions.

8. The electronic device according to claim 1, wherein: The refrigeration element and the heat dissipation element are both in a C-shape, the C-shaped refrigeration element surrounds the refrigeration area, and the heat dissipation element is arranged on a side of the refrigeration element away from the refrigeration area.

9. The electronic device according to claim 8, wherein: The refrigeration element includes a first refrigeration element and a second refrigeration element, and the heat dissipation element includes a first heat dissipation element and a second heat dissipation element; the openings of the first refrigeration element and the second refrigeration element are opposite to each other and surround the refrigeration area, the first heat dissipation element is arranged on a side of the first refrigeration element away from the refrigeration area, and the second heat dissipation element is arranged on a side of the second refrigeration element away from the refrigeration area.

10. The electronic device according to claim 1, wherein: The electronic device also includes a control unit and a temperature sensor; The control component is electrically connected to the power supply and the temperature sensor respectively, and is used to adjust the output power of the power supply according to the measurement result of the temperature sensor.

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