Integrated circuit packaging excessive glue removing equipment

Abstract

The utility model discloses an integrated circuit packaging excessive glue removing device, and relates to the technical field of integrated circuit processing. The integrated circuit comprises an integrated circuit body, a clamping assembly is arranged outside the integrated circuit body and comprises a mounting plate, a mounting block is fixed to the middle of the lower wall of the mounting plate, and a longitudinal screw and a transverse screw are correspondingly arranged on the upper side and the lower side of the mounting block respectively. The thread directions of the peripheral walls of the two sides of the longitudinal screw and the transverse screw are opposite, and the exteriors of the two sides of the longitudinal screw and the transverse screw are correspondingly in threaded connection with a longitudinal clamping plate and a transverse clamping plate respectively. The integrated circuit body is stably clamped and fixed through the transverse clamping plate which is in threaded connection with the transverse screw rod and the longitudinal clamping plate which is in threaded connection with the longitudinal screw rod, and the scraper can move on the front side, the rear side, the left side and the right side through the upper motor and the lower motor, so that the operation range of scraping excessive glue is enlarged.

Description

Technical Field

[0001] The utility model belongs to the technical field of integrated circuit processing, in particular to an integrated circuit packaging overflow glue removing device. Background Art

[0002] An integrated circuit is a circuit that integrates many electronic components (such as transistors, capacitors, resistors, etc.) on a semiconductor chip. It has greatly promoted the development of electronic technology, making electronic equipment smaller, lighter, faster and more reliable. When the integrated circuit is packaged, it is necessary to use a cleaning device to remove the residual glue on the integrated circuit to ensure the stability of the integrated circuit during use.

[0003] After searching, the authorization announcement number CN215198410U and the authorization announcement date 2021.12.17 disclose an integrated circuit packaging overflow glue removal device, which belongs to the technical field of overflow glue removal equipment, including a workbench, a support frame fixedly connected above the workbench, a servo motor installed on one side of the support frame, a screw installed on one side of the servo motor, the outer wall of the screw is threadedly connected to a threaded block, one side of the threaded block is fixedly connected to a vertical pole, one end of the vertical pole is fixedly connected to a sliding sleeve, the inner wall of the sliding sleeve is slidably connected to the sliding rod, an electric push rod is installed on one side of the threaded block, and a processing knife is installed on one end of the electric push rod. The utility model can adapt to the fixing of integrated circuit boards of different sizes through a compression spring, and the integrated circuit board can be easily fixed by setting a splint. The fixing effect of the splint can be improved by setting a support rod to avoid the integrated circuit board from being offset and causing damage, and the processing knife is driven by the servo motor and the electric push rod to scrape the overflowed glue of different thicknesses, and the scraping effect is good.

[0004] The prior art achieves the clamping and fixing of integrated circuits through the cooperation of suction cups and springs. However, the surfaces of some integrated circuits are uneven and cannot complete negative pressure adsorption. Although the spring can provide clamping force, it has poor stability when scraping off the overflow glue. In addition, under the action of the servo motor and the electric push rod, the scraper of the prior art can only move in the left and right directions and the up and down directions, resulting in a limited range of scraping off the overflow glue. For this reason, we provide an integrated circuit packaging overflow glue removal device to solve the above problems. Utility Model Content

[0005] The utility model aims to provide an integrated circuit packaging overflow glue removal device, which stably clamps and fixes the integrated circuit body through a transverse clamping plate threadedly connected to the transverse screw and a longitudinal clamping plate threadedly connected to the longitudinal screw, and the scraper can be moved to the front and rear sides and the left and right sides through the upper motor and the lower motor, thereby increasing the operating range of scraping off the overflow glue, solving the problem that the prior art has poor stability when scraping off the overflow glue through the cooperation of a suction cup and a spring, and the prior art scraper can only move in the left and right directions and the up and down directions, resulting in a limited range of scraping off the overflow glue.

[0006] In order to solve the above technical problems, the utility model is achieved through the following technical solutions:

[0007] The utility model is an integrated circuit packaging overflow glue removal device, comprising an integrated circuit body, a clamping assembly is arranged outside the integrated circuit body, the clamping assembly comprises a mounting plate, a mounting block is fixed at the middle position of the lower wall of the mounting plate, a longitudinal screw and a transverse screw are arranged on the upper and lower sides of the mounting block respectively, and the thread directions of the peripheral walls on both sides of the longitudinal screw and the transverse screw are opposite, and the longitudinal screw and the transverse screw are respectively threadedly connected with the longitudinal clamping plate and the transverse clamping plate on the outside of the two sides of the longitudinal screw and the transverse screw;

[0008] A cleaning assembly is arranged above the clamping assembly, and the cleaning assembly includes an electric push rod, a scraper is fixed to the lower end of the electric push rod, a lower moving block is fixed to the upper end of the electric push rod, the lower moving block is internally threadedly connected to a lower screw, a lower motor is fixed to the rear end of the lower screw, an upper moving block is arranged above the lower moving block, the upper moving block is internally threadedly connected to an upper screw, and an upper motor is arranged at the right end of the upper screw.

[0009] The utility model is further configured such that the transverse clamping plate and the longitudinal clamping plate are both convexly configured, and rectangular grooves are provided on the mounting plates corresponding to the positions of the transverse clamping plate and the longitudinal clamping plate.

[0010] The utility model is further configured such that the inner side walls of the two horizontal clamping plates and the inner side walls of the two vertical clamping plates are fixed with rubber sheets, a side wall of the rubber sheet away from the horizontal clamping plate or the vertical clamping plate is provided with an installation groove, and the four side walls of the integrated circuit body are all located in the corresponding installation grooves.

[0011] The utility model is further configured such that a screw block is fixed to the right end of the transverse screw and the front end of the longitudinal screw, the outer peripheral wall of the screw block is provided with anti-slip grooves, and the transverse screw and the longitudinal screw are rotatably connected to the mounting block through bearings.

[0012] The utility model is further configured that fixing rods are fixed at four corner positions of the lower wall of the mounting plate.

[0013] The utility model is further configured such that a lower guide plate is provided on the outside of the upper side of the lower moving block, and the lower guide plate is configured in a C shape, the lower screw is fixedly connected to the power output shaft of the lower motor, an end plate is fixed to the rear end of the lower guide plate, and the lower motor is fixedly connected to the end plate.

[0014] The utility model is further configured such that the upper moving block is fixedly connected to the lower guide plate, an upper guide plate is arranged on the outside of the upper side of the upper moving block, and the upper guide plate is arranged in a C shape, and the upper screw is fixedly connected to the power output shaft of the upper motor.

[0015] The utility model is further configured such that a left plate and a right plate are fixed to the left and right ends of the upper guide plate respectively, and the upper motor is fixedly connected to the right plate, and the lower ends of the left plate and the right plate are fixedly connected to the mounting plate.

[0016] The utility model has the following beneficial effects:

[0017] 1. The utility model provides a transverse screw, a longitudinal screw, a transverse clamping plate and a longitudinal clamping plate. Since the transverse screw is threadedly connected to the transverse clamping plate, the transverse screw drives the transverse clamping plate to move when the transverse screw rotates to achieve clamping and fixing of the integrated circuit body in the left and right directions. Since the longitudinal screw is threadedly connected to the longitudinal clamping plate, the longitudinal screw drives the longitudinal clamping plate to move when the longitudinal screw rotates to achieve clamping and fixing of the integrated circuit body in the front and back directions. Compared with the prior art, the transverse clamping plate and the longitudinal clamping plate are moved and clamped and fixed to the integrated circuit body by means of threaded connection, so that the clamping and fixing effect is better and the clamping and fixing stability is better, which solves the problem of poor stability when scraping off overflow glue by the cooperation of the suction cup and the spring in the prior art.

[0018] 2. The utility model sets a lower motor, a lower screw and a lower moving block. The lower motor causes the lower screw to rotate, driving the lower moving block to move forward and backward, driving the electric push rod and the scraper to move forward and backward accordingly. Compared with the prior art, it can move in the front and rear directions, left and right directions, and up and down directions, thereby achieving the effect of increasing the range of scraping off the overflowed glue, and solving the problem that the scraper in the prior art can only move in the left and right directions and up and down directions, resulting in a limited range of scraping off the overflowed glue.

[0019] Of course, any product implementing the present invention does not necessarily need to achieve all of the advantages described above at the same time. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] In order to more clearly illustrate the technical solutions of the embodiments of the utility model, the drawings required for describing the embodiments are briefly introduced below. Obviously, the drawings described below are only some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0021] Figure 1 The overall structure diagram of an integrated circuit packaging overflow glue removal device.

[0022] Figure 2 A structural diagram of the clamping assembly.

[0023] Figure 3 for Figure 2 Another structural diagram from another perspective.

[0024] Figure 4 A structural diagram of the clearing component.

[0025] In the accompanying drawings, the components represented by the reference numerals are listed as follows:

[0026] 1-integrated circuit body, 2-clamping assembly, 201-transverse clamping plate, 202-rubber sheet, 2021-mounting groove, 203-mounting plate, 2031-rectangular groove, 2032-fixing rod, 204-transverse screw, 205-longitudinal clamping plate, 206-longitudinal screw, 207-twist block, 208-mounting block, 3-clearing assembly, 301-upper guide plate, 3011-left plate, 3012-right plate, 302-upper motor, 3021-upper screw, 303-upper moving block, 304-lower guide plate, 3041-end plate, 305-lower motor, 3051-lower screw, 306-lower moving block, 307-electric push rod, 3071-scraper. DETAILED DESCRIPTION

[0027] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model. Specific embodiment 1

[0029] See also Figure 1-3The utility model is an integrated circuit packaging overflow glue removal device, comprising an integrated circuit body 1, a clamping assembly 2 is arranged outside the integrated circuit body 1, the clamping assembly 2 comprises a mounting plate 203, a mounting block 208 is fixed at the middle position of the lower wall of the mounting plate 203, and a longitudinal screw 206 and a transverse screw 204 are respectively arranged on the upper and lower sides of the mounting block 208, and the thread directions of the outer peripheral walls on both sides of the longitudinal screw 206 and the transverse screw 204 are opposite, so that the longitudinal screw 206 drives the two longitudinal clamping plates when rotating. 205 are brought closer to or farther away from each other, so that when the transverse screw 204 rotates, it drives the two transverse clamping plates 201 to move closer to or farther away from each other. The longitudinal screw 206 and the outer sides of the transverse screw 204 are respectively connected with the longitudinal clamping plate 205 and the transverse clamping plate 201 with corresponding threads. The longitudinal screw 206 and the transverse screw 204 respectively drive the longitudinal clamping plate 205 to move closer to each other and the transverse clamping plate 201 to move closer to each other and clamp them to achieve stable clamping and fixing of the integrated circuit body 1, so that the stability of the integrated circuit body 1 is better when scraping glue.

[0030] Specifically, the transverse clamping plate 201 and the longitudinal clamping plate 205 are both convexly arranged, and a rectangular groove 2031 is opened on the mounting plate 203 corresponding to the position of the transverse clamping plate 201 and the longitudinal clamping plate 205, and the transverse clamping plate 201 and the longitudinal clamping plate 205 are located in the corresponding rectangular groove 2031 for movement.

[0031] The inner side walls of the two horizontal clamps 201 and the inner side walls of the two longitudinal clamps 205 are fixed with rubber sheets 202. The side wall of the rubber sheet 202 away from the horizontal clamps 201 or the longitudinal clamps 205 is provided with a mounting groove 2021, and the four side walls of the integrated circuit body 1 are all located in the corresponding mounting grooves 2021. The two horizontal clamps 201 and the two longitudinal clamps 205 fix the integrated circuit body 1 in the horizontal direction, and the integrated circuit body 1 is fixed in the vertical direction by setting the integrated circuit body 1 in the mounting groove 2021.

[0032] A screw block 207 is fixed to the right end of the transverse screw rod 204 and the front end of the longitudinal screw rod 206. The corresponding transverse screw rod 204 and the longitudinal screw rod 206 can be rotated by operating the screw block 207. The outer peripheral wall of the screw block 207 is provided with anti-slip grooves to increase the friction between the hand and the screw block 207 when operating the screw block 207. The transverse screw rod 204 and the longitudinal screw rod 206 are rotatably connected to the mounting block 208 through bearings, so that the transverse screw rod 204 and the longitudinal screw rod 206 can rotate in place.

[0033] Fixing rods 2032 are fixed at the four corners of the lower wall of the mounting plate 203 , and the lower ends of the fixing rods 2032 are fixed to the mounting platform.

[0034] The operation process of this embodiment is: when in use, the integrated circuit body 1 is operated to make the integrated circuit body 1 and the installation groove 2021 be in the same horizontal plane, and the screw block 207 connected to the horizontal screw 204 is operated to rotate and drive the horizontal clamping plate 201 to approach each other until the left and right side walls of the integrated circuit body 1 are located in the corresponding installation grooves 2021 and a clamping state is generated, and then the screw block 207 connected to the longitudinal screw 206 is operated to rotate and drive the longitudinal clamping plate 205 to approach each other until the front and rear side walls of the integrated circuit body 1 are located in the corresponding installation grooves 2021 and a clamping state is generated, so that the integrated circuit body 1 can be firmly clamped and fixed. Specific embodiment 2

[0036] See also Figure 1 and 4 , which is the second embodiment of the utility model, and this embodiment is based on the previous embodiment, but is different from the first embodiment in that: a cleaning component 3 is arranged above the clamping component 2, and the cleaning component 3 includes an electric push rod 307, which is used to drive the scraper 3071 to move, and the scraper 3071 is fixed at the lower end of the electric push rod 307, which is used to scrape the overflow glue of the integrated circuit body 1, and the upper end of the electric push rod 307 is fixed with a lower moving block 306, and the internal thread of the lower moving block 306 is connected with a lower screw rod 3051, and the rear end of the lower screw 3051 is fixed with a lower motor 305, and the lower motor 305 drives the lower screw 3051 to rotate when working, and drives the lower moving block 306 to move, so that the electric push rod 307 and the scraper 3071 move forward and backward correspondingly. An upper moving block 303 is arranged above the lower moving block 306, and an upper screw rod 3021 is connected to the internal thread of the upper moving block 303. An upper motor 302 is arranged on the right end of the upper screw rod 3021. The upper motor 302 drives the upper screw rod 3021 to rotate, so that the upper moving block 303 moves, thereby driving the scraper 3071 to move left and right. The scraper 3071 is driven to move in the front and back directions by the lower motor 305, the lower screw rod 3051 and the lower moving block 306, and the scraper 3071 is driven to move in the left and right directions by the upper motor 302, the upper screw rod 3021 and the upper moving block 303. The electric push rod 307 is also used to move the scraper 3071 up and down, so as to achieve the purpose of increasing the range of scraping off the overflow glue.

[0037] Specifically, a lower guide plate 304 is provided on the outside of the upper side of the lower moving block 306, and the lower guide plate 304 is C-shaped. The lower moving block 306 and the lower guide plate 304 are clearance-matched. The lower screw rod 3051 is fixedly connected to the power output shaft of the lower motor 305, so that the lower motor 305 can drive the lower screw rod 3051 to rotate. An end plate 3041 is fixed to the rear end of the lower guide plate 304, and the lower motor 305 is fixedly connected to the end plate 3041.

[0038] The upper moving block 303 is fixedly connected to the lower guide plate 304, so that when the upper moving block 303 moves, the lower guide plate 304 is driven to move. An upper guide plate 301 is arranged on the outside of the upper side of the upper moving block 303, and the upper guide plate 301 is arranged in a C shape. The upper moving block 303 and the upper guide plate 301 are loosely matched, and the upper screw rod 3021 is fixedly connected to the power output shaft of the upper motor 302, so that the upper motor 302 can drive the upper screw rod 3021 to rotate.

[0039] The left and right ends of the upper guide plate 301 are respectively fixed with a left plate 3011 and a right plate 3012 , and the upper motor 302 is fixedly connected to the right plate 3012 . The lower ends of the left and right plates 3011 and 3012 are fixedly connected to the mounting plate 203 .

[0040] The rest of the structure is the same as that of the first embodiment.

[0041] The operation process of this embodiment is as follows: after the integrated circuit body 1 is clamped and fixed, the upper motor 302 is operated to drive the upper screw rod 3021 to rotate, and the upper moving block 303 is moved under the action of the upper guide plate 301, driving the scraper 3071 to move in the left and right directions. The lower motor 305 is operated to drive the lower screw rod 3051 to rotate, and the lower moving block 306 is moved under the action of the lower guide plate 304, driving the scraper 3071 to move in the front and back directions. The scraper 3071 is driven to move in the up and down directions by the electric push rod 307. Through the coordination of the scraper 3071 moving forward and backward, left and right, and up and down, the overflow glue is scraped off when the scraper 3071 moves.

[0042] In addition, the electrical appliances in the integrated circuit packaging overflow glue removal device are electrically connected to the external power supply through conductive wires. At the same time, the electrical appliances in the integrated circuit packaging overflow glue removal device are all existing technologies and their models are not limited here.

[0043] In the description of this specification, the description with reference to the terms "one embodiment", "example", "specific example", etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the utility model. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.

[0044] The preferred embodiments of the utility model disclosed above are only used to help explain the utility model. The preferred embodiments do not describe all the details in detail, nor do they limit the utility model to the specific implementation methods described. Obviously, many modifications and changes can be made according to the content of this specification. This specification selects and specifically describes these embodiments in order to better explain the principles and practical applications of the utility model, so that technicians in the relevant technical field can well understand and use the utility model. The utility model is limited only by the claims and their full scope and equivalents.

Claims

1. An integrated circuit packaging overflow glue removal device, comprising an integrated circuit body (1), characterized in that: A clamping assembly (2) is arranged outside the integrated circuit body (1), and the clamping assembly (2) comprises a mounting plate (203), a mounting block (208) is fixed at the middle position of the lower wall of the mounting plate (203), and a longitudinal screw rod (206) and a transverse screw rod (204) are arranged on the upper and lower sides of the mounting block (208) respectively, and the thread directions of the peripheral walls on both sides of the longitudinal screw rod (206) and the transverse screw rod (204) are opposite, and the longitudinal clamping plate (205) and the transverse clamping plate (201) are respectively threadedly connected on the outside of both sides of the longitudinal screw rod (206) and the transverse screw rod (204); A cleaning component (3) is arranged above the clamping component (2), and the cleaning component (3) comprises an electric push rod (307), a scraper (3071) is fixed to the lower end of the electric push rod (307), a lower moving block (306) is fixed to the upper end of the electric push rod (307), the lower moving block (306) is internally threadedly connected to a lower screw rod (3051), a lower motor (305) is fixed to the rear end of the lower screw rod (3051), an upper moving block (303) is arranged above the lower moving block (306), the upper moving block (303) is internally threadedly connected to an upper screw rod (3021), and an upper motor (302) is arranged at the right end of the upper screw rod (3021).

2. The integrated circuit packaging overflow glue removal device according to claim 1, characterized in that: The transverse clamping plate (201) and the longitudinal clamping plate (205) are both convexly arranged, and a rectangular groove (2031) is provided on the mounting plate (203) corresponding to the positions of the transverse clamping plate (201) and the longitudinal clamping plate (205).

3. The integrated circuit packaging overflow glue removal device according to claim 2, characterized in that: The inner side walls of the two transverse clamping plates (201) and the inner side walls of the two longitudinal clamping plates (205) are both fixed with rubber sheets (202), a side wall of the rubber sheet (202) away from the transverse clamping plate (201) or the longitudinal clamping plate (205) is provided with a mounting groove (2021), and the four side walls of the integrated circuit body (1) are all located in the corresponding mounting grooves (2021).

4. The integrated circuit packaging overflow glue removal device according to claim 1, characterized in that: A screw block (207) is fixed to the right end of the transverse screw rod (204) and the front end of the longitudinal screw rod (206). The outer peripheral wall of the screw block (207) is provided with anti-slip grooves. The transverse screw rod (204) and the longitudinal screw rod (206) are rotatably connected to the mounting block (208) via bearings.

5. The integrated circuit packaging overflow glue removal device according to claim 2, characterized in that: Fixing rods (2032) are fixed at the four corner positions of the lower wall of the mounting plate (203).

6. The integrated circuit packaging overflow glue removal device according to claim 1, characterized in that: A lower guide plate (304) is arranged on the outside of the upper side of the lower moving block (306), and the lower guide plate (304) is arranged in a C shape. The lower screw rod (3051) is fixedly connected to the power output shaft of the lower motor (305). An end plate (3041) is fixed to the rear end of the lower guide plate (304), and the lower motor (305) is fixedly connected to the end plate (3041).

7. The integrated circuit packaging overflow glue removal device according to claim 6, characterized in that: The upper moving block (303) is fixedly connected to the lower guide plate (304); an upper guide plate (301) is arranged outside the upper side of the upper moving block (303); and the upper guide plate (301) is arranged in a C shape; the upper screw rod (3021) is fixedly connected to the power output shaft of the upper motor (302).

8. The integrated circuit packaging overflow glue removal device according to claim 7, characterized in that: A left plate (3011) and a right plate (3012) are fixed to the left and right ends of the upper guide plate (301) respectively, and the upper motor (302) is fixedly connected to the right plate (3012), and the lower ends of the left plate (3011) and the right plate (3012) are fixedly connected to the mounting plate (203).

Images