Cutting jig and cutting jig assembly

Abstract

The utility model discloses a cutting jig and a cutting jig assembly, and relates to the field of semiconductor production jigs, the cutting jig is provided with a bearing body, and the bearing body is of an annular table-shaped structure; a bearing boss is formed on the bearing body. The bearing body is used for being arranged on a cutting equipment workbench below a to-be-cut wafer to bear cut and fallen product small pieces. The cutting jig assembly comprises a cutting jig and a wafer support, and the wafer support is used for arranging a wafer to be cut; and the cutting jig is arranged in the sheet support. The cutting jig is arranged below the to-be-cut wafer, so that the falling distance of the small product pieces is reduced, the reaching speed of the small product pieces on the table top of the cutting equipment workbench is reduced, the impact force from the small product pieces to the table top of the cutting equipment workbench is relieved, the surface protection of the small product pieces is achieved, and the cutting efficiency is improved. By arranging the bearing body and the bearing boss which are of the annular-table-shaped structure, the contact area between the small product pieces and the bearing body is reduced, the risk of scratching is reduced, and therefore the yield of finished products is comprehensively improved, and invalid operation of the later manufacturing process is reduced.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor production jigs, in particular to a cutting jig and a cutting jig assembly. Background Art

[0002] As an important component of the second-generation low-light night vision device, the micro-nano grating cathode assembly is made of an anti-halo glass input window and a micro-nano grating substrate bonded together. During the production process of the micro-nano grating cathode assembly, there are effective areas and ineffective areas. If there are defects such as dirt and marks in the effective area, these areas also need to be avoided during the cutting process, so as to improve the yield of the finished product and reduce the ineffective operations in the post-process.

[0003] In the actual production process, laser cutting is usually used to cut the effective area of ​​the micro-nano grating cathode assembly from the wafer body with the invalid area. During cutting, the wafer body is set on the wafer support. After cutting, the micro-nano grating cathode assembly containing the effective area falls off the wafer support and falls onto the cutting equipment workbench. During this process, due to the long falling distance and the acceleration of gravity, the lower surface of the micro-nano grating cathode assembly that falls onto the cutting equipment workbench will inevitably be scratched, which reduces the product yield. Utility Model Content

[0004] In view of the above problems, the utility model provides a cutting jig and a cutting jig assembly.

[0005] The technical solution adopted by the utility model is as follows:

[0006] The present application provides a cutting jig, wherein the cutting jig is formed with a supporting body;

[0007] The supporting body is used to be arranged on a cutting equipment workbench below the wafer to be cut, and to receive small pieces of products that fall off after cutting.

[0008] In actual use, the wafer to be cut is placed on the wafer holder, which is placed on the workbench of the cutting equipment; the cutting jig is placed on the workbench of the cutting equipment and is located inside the wafer holder. Before cutting, select the cutting range first, adjust the position of the wafer holder or the cutting jig, so that the cut product pieces face the cutting jig below. When the cutting equipment cuts the wafer, the product pieces fall from the wafer holder to the cutting jig, rather than falling on the workbench of the cutting equipment.

[0009] That is, the present application sets a cutting jig under the wafer to be cut to reduce the distance that the product chips fall, thereby reducing the speed at which the product chips reach the workbench surface of the cutting equipment, alleviating the impact force of the product chips on the workbench surface of the cutting equipment, and achieving surface protection of the product chips, thereby improving the yield of finished products and reducing ineffective operations in the post-process.

[0010] Furthermore, the supporting body is in a ring-shaped structure.

[0011] The ring-shaped structure can reduce the contact area between the product chip and the supporting body, reduce the risk of scratches, and achieve surface protection of the product chip, thereby further improving the yield of the finished product and reducing ineffective operations in the post-process.

[0012] Furthermore, a supporting boss is formed on one end of the supporting body for receiving the small pieces of product that have been cut and dropped;

[0013] The supporting bosses include a plurality of bosses, which are arranged in a circular array, and the bosses are used to contact and receive the small pieces of products that have been cut and dropped;

[0014] The supporting body is in the shape of a circular ring platform;

[0015] The axes of the circles where the supporting bosses arranged in a circumferential array are located are collinear with the axis of the ring-shaped supporting body;

[0016] The upper surfaces of the plurality of supporting bosses for contacting with the product chips are located in the same horizontal plane.

[0017] The plurality of supporting bosses can further reduce the contact area between the product piece and the supporting body, reduce the risk of scratches, and achieve surface protection of the product piece.

[0018] Furthermore, a mounting portion is formed at the other end of the supporting body away from the supporting boss, and the mounting portion is used to fix the supporting body on a workbench of a cutting device.

[0019] The cutting jig can be detachably fixed on the working table of the cutting equipment through the mounting part, so that the small pieces of products dropped after cutting can be more stably received.

[0020] Furthermore, the supporting body is a barrel-shaped structure, and the bottom of the barrel-shaped supporting body is the mounting portion;

[0021] A mounting through hole is arranged at the bottom of the barrel-shaped structure, and the mounting through hole is used to cooperate with a fastener to fix the supporting body on the workbench of the cutting equipment.

[0022] Furthermore, the mounting portion is a mounting shaft, and the mounting shaft is used to cooperate with a through hole on a cutting equipment workbench to fix the supporting body on the cutting equipment workbench.

[0023] Furthermore, the diameter of the inscribed circle of the plurality of supporting bosses along the horizontal direction is 20 mm to 25 mm;

[0024] The diameter of the circumscribed circle of the plurality of supporting bosses along the horizontal direction is 21 mm to 30 mm.

[0025] Furthermore, the cutting jig is 8 mm to 12 mm high.

[0026] Furthermore, the supporting bosses include four, and the four supporting bosses are integrally formed with the supporting body;

[0027] The cutting jig is made of PEEK material.

[0028] PEEK material is used as the design material to ensure that the cutting tool will not be deformed by heat during the cutting process.

[0029] The present application also provides a cutting jig assembly, including a cutting jig and a sheet support;

[0030] One end of the wafer support is used to be placed on a cutting equipment workbench, and the other end of the wafer support is used to place a wafer to be cut;

[0031] The cutting jig is arranged inside the wafer support, and is used to receive small product pieces cut off from the wafer to be cut above the wafer support;

[0032] The cutting jig is the cutting jig mentioned above.

[0033] In actual use, the horizontal plane where the upper surface of the cutting jig is located does not exceed the horizontal plane where the upper surface of the sheet support is located.

[0034] The beneficial effects of the utility model are:

[0035] (1) By placing a cutting jig under the wafer to be cut, the distance that the product chips fall is reduced, thereby reducing the speed at which the product chips reach the worktable of the cutting equipment, alleviating the impact force of the product chips on the worktable of the cutting equipment, and achieving surface protection of the product chips, thereby improving the yield of finished products and reducing ineffective operations in the post-process.

[0036] (2) The structural design of the supporting body with a ring-shaped structure and multiple supporting bosses can reduce and further reduce the contact area between the product piece and the supporting body, reduce the risk of scratches, and achieve surface protection of the product piece. BRIEF DESCRIPTION OF THE DRAWINGS

[0037] Figure 1 This is a schematic diagram of the axial structure of the cutting jig of the embodiment of the utility model;

[0038] Figure 2 It is a schematic diagram of the top view of the cutting jig according to an embodiment of the utility model;

[0039] Figure 3 This is a schematic diagram of the use structure of the cutting jig of the embodiment of the utility model;

[0040] Figure 4It is a schematic diagram of the axial structure of a cutting jig according to another embodiment of the utility model.

[0041] The reference numerals in the figures are:

[0042] 1. Cutting jig; 10. Supporting body; 110. Mounting part; 111. Mounting through hole; 20. Supporting boss; 2. Wafer holder; 3. Wafer to be cut; 31. Product wafer; 4. Cutting equipment workbench. DETAILED DESCRIPTION

[0043] The utility model is described in detail below in conjunction with the accompanying drawings.

[0044] Example 1

[0045] like Figure 1 to Figure 3 As shown, the present application provides a cutting jig, which is formed with a supporting body 10;

[0046] The supporting body 10 is used to be arranged on the cutting equipment workbench 4 below the wafer 3 to be cut, and to receive the product chips 31 that fall off after cutting.

[0047] In actual use, the wafer 3 to be cut is set on the wafer holder 2, and the wafer holder 2 is set on the cutting equipment workbench 4; the cutting jig is set on the cutting equipment workbench 4 and is located inside the wafer holder 2. Before cutting, the cutting range is selected first, and the position of the wafer holder 2 or the cutting jig is adjusted so that the cut product small piece 31 faces the cutting jig below. When the cutting equipment cuts the wafer, the product small piece 31 falls from the wafer holder 2 to the cutting jig, instead of falling on the table 4 of the cutting equipment.

[0048] That is, the present application sets a cutting jig under the wafer 3 to be cut to reduce the distance that the product chip 31 falls, thereby reducing the speed at which the product chip 31 reaches the surface of the cutting equipment workbench 4, alleviating the impact force of the product chip 31 on the surface of the cutting equipment workbench 4, and achieving surface protection of the product chip 31, thereby improving the yield of the finished product and reducing ineffective operations in the post-process.

[0049] In this embodiment, the supporting body 10 is in a ring-shaped structure.

[0050] The ring-shaped structure can reduce the contact area between the product chip 31 and the supporting body 10, reduce the risk of scratches, and achieve surface protection of the product chip 31, thereby further improving the yield of the finished product and reducing ineffective operations in the post-process.

[0051] The supporting body 10 of the ring-shaped structure can reduce the weight of the cutting jig and facilitate the handling and installation operations.

[0052] In this embodiment, a supporting boss 20 is formed at one end of the supporting body 10 for receiving the cut product piece 31;

[0053] The supporting bosses 20 include a plurality of supporting bosses 20 arranged in a circular array, and the bosses are used to contact and receive the cut product pieces 31;

[0054] The supporting body 10 is in the shape of a circular ring platform;

[0055] The axes of the circles where the supporting bosses 20 are arranged in a circumferential array are collinear with the axis of the ring-shaped supporting body 10;

[0056] The upper surfaces of the plurality of supporting bosses 20 for contacting the product chips 31 are located in the same horizontal plane.

[0057] The plurality of supporting bosses 20 can further reduce the contact area between the product piece 31 and the supporting body 10 , thereby lowering the risk of scratches and achieving surface protection of the product piece 31 .

[0058] In this embodiment, a mounting portion 110 is formed at the other end of the supporting body 10 away from the supporting boss 20 , and the mounting portion 110 is used to fix the supporting body 10 on the cutting equipment workbench 4 .

[0059] The cutting jig can be detachably fixed on the cutting equipment workbench 4 through the mounting portion 110, so that the product pieces 31 dropped after cutting can be received more stably.

[0060] In this embodiment, the supporting body 10 is a barrel-shaped structure, and the bottom of the barrel-shaped supporting body 10 is the mounting portion 110;

[0061] A mounting through hole 111 is provided at the bottom of the barrel-shaped structure, and the mounting through hole 111 is used to cooperate with a fastener to fix the supporting body 10 on the cutting equipment workbench 4.

[0062] In this embodiment, the diameter of the inscribed circle of the plurality of supporting bosses 20 along the horizontal direction is 23 mm;

[0063] The diameter of the circumscribed circle of the plurality of supporting bosses 20 along the horizontal direction is 25 mm.

[0064] In this embodiment, the cutting jig is 10 mm high.

[0065] In this embodiment, the cross section of the supporting boss 20 is fan-shaped, and the thickness of the supporting boss 20 along the cross section is 2 mm.

[0066] In this embodiment, the supporting bosses 20 include four, and the four supporting bosses 20 are integrally formed with the supporting body 10, which is convenient for processing and production;

[0067] The cutting jig is made of PEEK.

[0068] PEEK material is used as the design material to ensure that the cutting tool will not be deformed by heat during the cutting process.

[0069] In actual use, the supporting bosses 20 include at least three to ensure that the cut product pieces 31 do not slip off easily.

[0070] like Figure 3 As shown, the present application also provides a cutting jig assembly, including a cutting jig 1 and a sheet holder 2;

[0071] One end of the wafer support 2 is used to be placed on a cutting equipment workbench 4, and the other end of the wafer support 2 is used to place a wafer 3 to be cut;

[0072] The cutting jig 1 is arranged inside the wafer support 2, and is used to receive the product chips 31 cut off from the wafer 3 to be cut above the wafer support 2;

[0073] The cutting jig 1 is the cutting jig mentioned above.

[0074] In actual use, the horizontal plane where the upper surface of the cutting jig 1 is located does not exceed the horizontal plane where the upper surface of the sheet holder 2 is located.

[0075] In this embodiment, the height of the cutting jig 1 is less than or equal to the height of the wafer holder 2 .

[0076] In this embodiment, the wafer 3 to be cut is a four-inch wafer with a diameter of 100 mm;

[0077] The product chip 31 is a micro-nano grating cathode component.

[0078] In this embodiment, the method of using the cutting jig assembly is as follows:

[0079] Before cutting, dot selection is performed on the wafer 3 to be cut, the invalid area is distinguished from the valid area and the cutting range is determined;

[0080] Place the wafer with the selected area on the wafer support 2, the outer diameter of the wafer support 2 is 100mm;

[0081] Fix the cutting jig on the cutting equipment workbench 4, place the wafer holder 2 and the wafer 3 to be cut on the cutting jig 1, adjust the positions of the wafer holder 2 and the wafer 3 to be cut, and make the cutting jig 1 be located directly below the product chip 31 containing the effective area, and then perform cutting;

[0082] After the cutting is completed, the product small piece 31 falls on the cutting jig 1, and the large wafer is still on the wafer holder 2. The wafer holder 2 and the wafer holder 2 are removed, and the outer diameter of the product small piece 31 is pinched manually or with a clamp to take out the product small piece 31.

[0083] Example 2

[0084] like Figure 4As shown, the difference between this embodiment and embodiment 1 is that, in this embodiment, the mounting portion 110 is a mounting shaft, and the mounting shaft is used to cooperate with the through hole on the cutting equipment workbench 4 to fix the supporting body 10 on the cutting equipment workbench 4.

[0085] The installation shaft is directly plugged into the cutting equipment workbench 4, which can reduce the time required for installation and removal of the cutting fixture 1, making it more convenient to use. In actual use, there can also be two installation shafts, and two installation shafts have a better fixing effect.

[0086] In this embodiment, the supporting body 10 is a columnar structure, and the supporting boss 20 receives the product pieces 31 that are cut and dropped.

[0087] Example 3

[0088] The difference between this embodiment and embodiment 1 is that, in this embodiment, the supporting body is a "cap"-shaped structure, the mounting portion is a convex edge arranged on the outer peripheral side of the supporting body, and a mounting through hole is arranged on the convex edge.

[0089] The above description is only a preferred embodiment of the utility model, and does not limit the patent protection scope of the utility model. Any equivalent structural transformation made using the contents of the utility model specification and drawings, directly or indirectly used in other related technical fields, is also included in the protection scope of the utility model.

Claims

1. A cutting jig, characterized in that: The cutting jig is formed with a supporting body; The supporting body is used to be arranged on a cutting equipment workbench below the wafer to be cut, and to receive the small pieces of products that fall off after cutting; The supporting body is used to receive the cut product piece at one end thereof, and a supporting boss is formed thereon. The supporting boss is used to contact and receive the cut product piece.

2. A cutting jig according to claim 1, characterized in that: The supporting body is in a ring-shaped structure.

3. A cutting jig according to claim 1, characterized in that: The supporting bosses include a plurality of supporting bosses, and the plurality of supporting bosses are arranged in a circular array; The supporting body is in the shape of a circular ring platform; The axes of the circles where the supporting bosses arranged in a circumferential array are located are collinear with the axis of the ring-shaped supporting body; The upper surfaces of the plurality of supporting bosses for contacting with the product chips are located in the same horizontal plane.

4. A cutting jig as claimed in claim 3, characterized in that: A mounting portion is formed at the other end of the supporting body away from the supporting boss, and the mounting portion is used to fix the supporting body on a workbench of a cutting device.

5. A cutting jig according to claim 4, characterized in that: The supporting body is a barrel-shaped structure, and the bottom of the barrel-shaped supporting body is the mounting portion; A mounting through hole is arranged at the bottom of the barrel-shaped structure, and the mounting through hole is used to cooperate with a fastener to fix the supporting body on the workbench of the cutting equipment.

6. A cutting jig according to claim 4, characterized in that: The mounting portion is a mounting shaft, and the mounting shaft is used to cooperate with a through hole on a cutting equipment workbench to fix the supporting body on the cutting equipment workbench.

7. A cutting jig as claimed in claim 3, characterized in that: The diameter of the inscribed circle of the plurality of supporting bosses along the horizontal direction is 20 mm to 25 mm; The diameter of the circumscribed circle of the plurality of supporting bosses along the horizontal direction is 21 mm to 30 mm.

8. A cutting jig according to claim 1, characterized in that: The cutting jig is 8 mm to 12 mm high.

9. A cutting jig according to claim 1, characterized in that: The supporting bosses include four, and the four supporting bosses are integrally formed with the supporting body; The cutting jig is made of PEEK material.

10. A cutting jig assembly, characterized in that: Including cutting jig and sheet holder; One end of the wafer support is used to be placed on a cutting equipment workbench, and the other end of the wafer support is used to place a wafer to be cut; The cutting jig is arranged inside the wafer support, and is used to receive small product pieces cut off from the wafer to be cut above the wafer support; The cutting jig is a cutting jig as described in any one of claims 1 to 9.

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