Laser etching jig

Abstract

The laser etching jig comprises a containing bottom plate, an upper baffle and two side baffles, the upper baffle and the two side baffles are arranged on the containing bottom plate, the two side baffles are arranged at the edges of the two sides of the upper end face of the containing bottom plate correspondingly, the upper baffle is arranged between the two side baffles, the upper baffle is perpendicular to the side baffles, and the side baffles are arranged on the side baffles. A positioning hole is formed in the placement bottom plate, and a positioning pin for positioning the circuit board is detachably connected in the positioning hole. The laser etching device has the effect of quickly positioning the circuit board to be subjected to laser etching.

Description

Technical Field

[0001] The present application relates to the technical field of circuit board processing, and in particular to a laser engraving jig. Background Art

[0002] PCB circuit board is one of the most important parts in electronic components, and the production requirements of PCB circuit board are also very strict, and no mistakes are allowed. Laser engraving machine has high precision and flexible operation, which can make up for some shortcomings of traditional processing. PCB laser engraving has become an indispensable part of the industrial production process, and its application field is also constantly breaking through itself and improving. It is the best process for laser engraving of circuit boards.

[0003] A Chinese patent with application number 202210354553.1 discloses a laser engraving device for PCB boards, including gears, rotating racks, and circuit board clamps. The clamps on the first circuit board clamp and the second circuit board clamp can clamp two circuit boards at the same time and perform laser engraving, thereby improving the efficiency of laser engraving. By setting a special-shaped first rack and a second rack, the first gear and the second gear meshing with the special-shaped rack can be driven to rotate, thereby driving the first circuit board clamp and the second circuit board clamp to rotate to the other side, thereby realizing laser engraving on the front and back sides of the two circuit boards. By making the special-shaped first rack and the second rack continue to move upward, the first gear and the second gear are driven to rotate simultaneously along the horizontal plane toward the direction of the flexible rod, thereby driving the first circuit board clamp and the second circuit board clamp to move to a state where the first circuit board clamp is at the bottom and the second circuit board clamp is at the top, thereby stacking the circuit boards, thereby improving the stacking efficiency.

[0004] However, during the laser engraving process of circuit boards, a clamp is required to clamp the circuit boards, and the replacement process of the circuit boards by operators is rather cumbersome, which is not suitable for mass laser engraving production of circuit boards.

[0005] Therefore, it is necessary to propose a new technical solution to solve the above problems. Utility Model Content

[0006] In order to improve the efficiency of the jig in the process of positioning the laser engraved circuit board, the present application provides a laser engraving jig.

[0007] The present application provides a laser engraving jig, which adopts the following technical solution:

[0008] A laser engraving jig comprises a placement base plate, an upper baffle plate arranged on the placement base plate and two side baffle plates, wherein the two side baffle plates are respectively arranged at the edge positions on both sides of the upper end surface of the placement base plate, the upper baffle plate is arranged between the two side baffle plates, and the upper baffle plate is arranged perpendicular to the side baffle plates. A positioning hole is arranged on the placement base plate, and a positioning pin for positioning a circuit board is detachably connected in the positioning hole.

[0009] By adopting the above technical solution, the circuit board is placed between the two side baffles and the upper baffle, and the conducting holes of the circuit board are plugged into the positioning pins to achieve a quick positioning effect on the circuit board.

[0010] Optionally: the two side baffles include a left baffle and a right baffle, the right baffle is fixedly connected to the placement base plate, one side of the upper baffle abuts against the right baffle, and the left baffle is slidably connected to the placement base plate along a direction perpendicular to the length of the upper baffle.

[0011] By adopting the above technical solution, the position of the right baffle is adjusted, which is conducive to adapting to the positioning processing of circuit boards of different widths.

[0012] Optional: A plurality of first bolts for limiting the left side baffle are arranged on the left side baffle, and the plurality of first bolts are arranged in an arrangement parallel to the length direction of the left side baffle, and a through hole for the first bolts to pass through is provided on the left side baffle, and one end of the first bolt passing through the through hole is threadedly connected to the placement base plate, and a plurality of groups of threaded holes for matching with the plurality of first bolts are provided on the placement base plate, and each group of threaded holes is evenly arranged in a direction parallel to the moving direction of the left side baffle.

[0013] By adopting the above technical solution, it is convenient to quickly adjust the position of the right baffle plate, and at the same time, the first bolt is connected to different threaded holes to ensure that the right baffle plate and the left baffle plate are always parallel.

[0014] Optionally: the through hole is a bar-shaped through hole, and the length direction of the through hole is set parallel to the moving direction of the left baffle.

[0015] By adopting the above technical solution, it is convenient to fine-tune the position of the left baffle and improve the positioning accuracy of the fixture.

[0016] Optionally: the upper end surface of the base plate is provided with a plurality of mounting grooves for mounting the upper baffle plate, the mounting grooves are evenly arranged along the length direction of the side baffle plate, and the upper baffle plate and the mounting grooves are detachably connected.

[0017] By adopting the above technical solution, during the positioning process of circuit boards with different laser engraving requirements, the upper baffle is installed in different installation slots, thereby improving the positioning effect of the fixture on different circuit boards.

[0018] Optionally: A plurality of positioning holes are provided on both sides of any of the upper baffles.

[0019] By adopting the above technical solution and providing a plurality of positioning holes, it is beneficial to effectively position different circuit boards.

[0020] Optionally: A foam layer is provided on one side of the upper baffle plate and the side baffle plate close to the circuit board to prevent the circuit board from being scratched.

[0021] By adopting the above technical solution, the circuit board is not damaged during the process of clamping the circuit board by placing the side baffle.

[0022] Optionally: the upper end surface of the base plate is provided with a strip groove, and the strip groove is arranged parallel to the length direction of the side baffle.

[0023] By adopting the above technical solution, it is convenient to take out the circuit board placed on the bottom plate.

[0024] In summary, the present application includes at least one of the following beneficial technical effects:

[0025] 1. The present application provides an upper baffle and two side baffles on the bottom plate to facilitate limiting the position of the circuit board, and simultaneously places positioning pins on the bottom plate to quickly position the circuit board.

[0026] 2. This application achieves effective clamping of circuit boards with different laser engraving requirements by adjusting the positions of the upper baffle and the right baffle. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] Figure 1 This is a schematic diagram of the structure of an embodiment of the present application;

[0028] Figure 2 for Figure 1 Schematic diagram of the structure of part A.

[0029] In the figure, 1. Place the base plate; 11. Strip groove; 12. Threaded hole; 13. Positioning hole; 14. Mounting groove; 2. Right baffle; 3. Left baffle; 31. First bolt; 32. Through hole; 4. Upper baffle; 5. Positioning pin; 51. Fixing pin; 6. Foam layer. DETAILED DESCRIPTION

[0030] The present application is further described in detail below in conjunction with the accompanying drawings.

[0031] The present application discloses a laser engraving jig, such as Figure 1 As shown, it includes a placement base plate 1 for placing circuit boards, an upper baffle plate 4 arranged on the placement base plate 1, and two side baffle plates. The upper end surface of the placement base plate 1 is rectangular. The placement base plate 1 is provided with a strip groove 11 for facilitating picking up the circuit board. The width of the strip groove 11 is between 1 cm and 3 cm. The strip groove 11 is arranged parallel to one side edge of the placement base plate 1, and the strip groove 11 passes through the center point of the upper end surface of the placement base plate 1. The two side baffle plates are respectively arranged on both sides of the strip groove 11, and the two side baffle plates and the strip groove 11 are parallel to each other.

[0032] like Figure 1 and Figure 2 As shown, the two side baffles include a left baffle 3 and a right baffle 2. The right baffle 2 is fixedly arranged at the edge of the bottom plate 1 to limit the right side of the circuit board. In order to achieve stable clamping of circuit boards of different widths, the right baffle 2 is slidably arranged on the upper end surface of the bottom plate 1. The right baffle 2 is provided with a plurality of first bolts 31 for limiting the position of the right baffle 2. The plurality of first bolts 31 are evenly arranged along the length direction of the left baffle 3. The right baffle 2 is provided with a plurality of through holes 32 for the first bolts 31 to pass through. In order to facilitate the adjustment of the position of the right baffle 2, the through hole 32 is a strip-shaped through hole 32. The width of the strip-shaped through hole 32 is greater than the screw diameter of the first bolt 31 and smaller than the nut diameter of the first bolt 31. The length direction of the through hole 32 is parallel to the moving direction of the left baffle 3, so that after the first bolt 31 is loosened, the right baffle 2 and the first bolt 31 slide, thereby adjusting the position of the right baffle 2. One end of the first bolt 31 passes through the through hole 32 and is threadedly connected to the placement base plate 1. In order to further accurately position the moving position of the right baffle 2, the upper end surface of the placement base plate 1 is provided with a plurality of groups of threaded holes 12 for the first bolt 31 to be threadedly connected. Each group of threaded holes 12 is evenly arranged along the moving direction of the left baffle 3. By threading the first bolt 31 into different threaded holes 12, the approximate position of the left baffle 3 can be quickly adjusted.

[0033] The upper baffle 4 is arranged between the two side baffles, and the upper baffle 4 is arranged perpendicular to the side baffles. The placement base plate 1 is provided with a mounting groove 14 for mounting the upper baffle 4, and the upper baffle 4 is detachably connected to the mounting groove 14 by two second bolts. In order to meet the processing requirements of circuit boards in different situations, the placement base plate 1 is provided with a plurality of mounting grooves 14, and the plurality of mounting grooves 14 are evenly arranged along the length direction of the side baffles. By installing the upper baffle 4 in different mounting grooves 14, it is helpful to meet the processing requirements of the circuit board. In order to prevent damage to the circuit board during the installation process, the upper baffle 4 and the two side baffles are provided with a foam layer 6 on the side close to the circuit board to prevent the circuit board from being scratched.

[0034] In order to further facilitate the positioning effect of the circuit board and ensure the stability of the circuit board during the laser engraving process, a positioning pin 5 for positioning the circuit board is provided on the placement base plate 1, and a positioning hole 13 for the positioning pin 5 to be inserted is provided on the upper end surface of the placement base plate 1. The positioning hole 13 and the positioning pin 5 are detachably connected, and a fixing pin 51 is provided on the upper end surface of the positioning pin 5. By inserting the through hole 32 of the circuit board into the fixing pin 51 of the positioning pin 5, the circuit board is limited. At the same time, in order to facilitate the laser engraving requirements of different circuit boards, multiple positioning holes 13 are provided on both sides of any upper baffle 4. By inserting the positioning pin 5 into different positioning holes 13, the limiting effect of different circuit boards is achieved.

[0035] The implementation principle of this embodiment is:

[0036] When the circuit board needs to be fixed, first install the upper baffle 4 into the corresponding installation groove 14 according to the laser engraving requirements of the circuit board, insert the positioning pin 5 into the positioning hole 13 accordingly, plug the conductive hole 32 of the circuit board and the fixing pin 51 on the positioning pin 5, and at the same time, the edge positions on both sides of the circuit board are respectively abutted against the upper baffle 4 and the right baffle 2, and then adjust the position of the left baffle 3 so that the left baffle 3 abuts against the circuit board, and then fix the left baffle 3 with the first bolt 31.

[0037] The embodiments of this specific implementation method are all preferred embodiments of the present application, and are not intended to limit the protection scope of the present application. Therefore, all equivalent changes made based on the structure, shape, and principle of the present application should be included in the protection scope of the present application.

Claims

1. A laser engraving jig, characterized by: The invention comprises a placement base plate (1), an upper baffle plate (4) arranged on the placement base plate (1), and two side baffle plates, wherein the two side baffle plates are respectively arranged at the edge positions on both sides of the upper end surface of the placement base plate (1), the upper baffle plate (4) is arranged between the two side baffle plates, and the upper baffle plate (4) is arranged perpendicular to the side baffle plates. A positioning hole (13) is arranged on the placement base plate (1), and a positioning pin (5) for positioning a circuit board is detachably connected in the positioning hole (13).

2. The laser engraving jig according to claim 1, characterized in that: The two side baffles include a left baffle (3) and a right baffle (2); the right baffle (2) is fixedly connected to the placement base plate (1); one side of the upper baffle (4) abuts against the right baffle (2); and the left baffle (3) is slidably connected to the placement base plate (1) along a direction perpendicular to the length of the upper baffle (4).

3. The laser engraving jig according to claim 2, characterized in that: The left baffle (3) is provided with a plurality of first bolts (31) for limiting the position of the left baffle (3), and the plurality of first bolts (31) are arranged in a row parallel to the length direction of the left baffle (3). The left baffle (3) is provided with a through hole (32) for the first bolt (31) to pass through, and one end of the first bolt (31) passing through the through hole (32) is threadedly connected to the placement base plate (1), and the placement base plate (1) is provided with a plurality of groups of threaded holes (12) for matching with the plurality of first bolts (31), and each group of the threaded holes (12) is evenly arranged in a row parallel to the moving direction of the left baffle (3).

4. The laser engraving jig according to claim 3, characterized in that: The through hole (32) is a strip-shaped through hole (32), and the length direction of the through hole (32) is arranged parallel to the moving direction of the left baffle (3).

5. The laser engraving jig according to claim 1, characterized in that: The upper end surface of the placement base plate (1) is provided with a plurality of mounting grooves (14) for mounting the upper baffle plate (4); the mounting grooves (14) are evenly arranged along the length direction of the side baffle plate; and the upper baffle plate (4) and the mounting grooves (14) are detachably connected.

6. The laser engraving jig according to claim 1, characterized in that: A plurality of positioning holes (13) are provided on both sides of any upper baffle plate (4).

7. The laser engraving jig according to claim 1, characterized in that: The upper baffle (4) and the side baffle close to the circuit board are both provided with a foam layer (6) for preventing the circuit board from being scratched.

8. The laser engraving jig according to claim 1, characterized in that: The upper end surface of the placement bottom plate (1) is provided with a strip-shaped groove (11), and the strip-shaped groove (11) is arranged parallel to the length direction of the side baffle.

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