Sintering device for wafer production

Abstract

The utility model provides a sintering device for wafer production, which comprises a vacuum sintering furnace body and further comprises an air exhaust system arranged at the top of the vacuum sintering furnace body, heating devices are arranged on two sides of an inner cavity of the vacuum sintering furnace body, and the heating devices are connected with the vacuum sintering furnace body. The left side of the front side of the vacuum sintering furnace body is fixedly connected with a door body through a shaft pin; the supporting plates are arranged on the two sides of the rear side of an inner cavity of the vacuum sintering furnace body, ventilation grooves are formed in the two sides of each supporting plate, forming containers are arranged at the tops and the bottoms of inner cavities of the two supporting plates, and inner cavities of the forming containers are movably connected with partition plates; the auxiliary assembly is arranged at the bottom of an inner cavity of the forming container, connecting plates are fixedly connected to the two sides of the front side of the forming container, and first clamping plates are fixedly connected to the rear sides of the connecting plates. The sintering device for wafer production provided by the utility model solves the problem that the existing sintering device is inconvenient to demould the wafer after sintering molding.

Description

Technical Field

[0001] The utility model relates to the technical field of wafers, in particular to a sintering device for wafer production. Background Art

[0002] Sintering in wafer production refers to the high-temperature treatment of semiconductor materials (such as silicon, gallium nitride, etc.) to form a crystal structure with specific electrical and structural properties. Sintering is a key step in the semiconductor process, which is used to improve the purity, crystallinity and electrical properties of the crystal to meet the requirements of semiconductor devices. The wafer sintering device is a device used to sinter mixed materials, usually operating in a vacuum or inert atmosphere. The wafer sintering device usually places the mixed material in a container and performs the sintering process in a vacuum or inert atmosphere. Under high temperature conditions, the particles of the mixed material will combine due to the action of thermal energy to form a block with a good shape and uniform density.

[0003] However, after the wafer is formed, it usually faces the challenge of removal, because the sintered block may adhere to the inner wall of the container. Appropriate methods need to be taken out to make the wafer easy to remove. The current common method is to coat a layer of non-adhesive material on the inner wall of the container to reduce the adhesion of the wafer to the inner wall of the container. However, the staff still needs to turn the container over to remove it, which affects the production demolding efficiency.

[0004] Therefore, it is necessary to provide a new sintering device for wafer production to solve the above technical problems. Utility Model Content

[0005] In order to solve the above technical problems, the utility model provides a sintering device for wafer production with convenient demoulding.

[0006] The sintering device for wafer production provided by the utility model comprises: a vacuum sintering furnace body, and also comprises: an exhaust system arranged on the top of the vacuum sintering furnace body, heating devices are arranged on both sides of the inner cavity of the vacuum sintering furnace body, and the left side of the front side of the vacuum sintering furnace body is fixedly connected with a door body through an axle pin; support plates are arranged on both sides of the rear side of the inner cavity of the vacuum sintering furnace body, air permeable grooves are opened on both sides of the support plates, and molding containers are arranged on the top and bottom of the inner cavities of the two support plates, and the inner cavity of the molding container is movably connected with a partition; an auxiliary component is arranged at the bottom of the inner cavity of the molding container, connecting plates are fixedly connected on both sides of the front side of the molding container, the rear side of the connecting plate is fixedly connected with a first clamping plate, and the front side of the door body is fixedly connected with a controller body.

[0007] As a sintering device for wafer production provided by the utility model, preferably, a reinforcement plate is fixedly connected to one side of the support plate, and the rear side of the reinforcement plate is fixedly connected to the vacuum sintering furnace body.

[0008] As a sintering device for wafer production provided by the utility model, preferably, the support plate is fixedly connected to a connecting shell on the side away from the molding container, the inner cavity of the connecting shell is provided with springs, the opposite sides of the two springs are fixedly connected to the inner wall of the connecting shell, and the opposite sides of the two springs are fixedly connected to a second clamping plate.

[0009] As a sintering device for wafer production provided by the utility model, preferably, the front side of the second clamping plate is fixedly connected to a push plate, the front side of the push plate penetrates to the outside of the connecting plate, and the front side of the connecting plate is provided with an opening for cooperating with the push plate.

[0010] As a sintering device for wafer production provided by the utility model, preferably, opposite sides of the two second clamping plates are fixedly connected with sliding sleeves, the inner cavity of the sliding sleeve is provided with a limiting rod, and the two ends of the limiting rod are respectively fixedly connected to the connecting shell and the support plate.

[0011] As a sintering device for wafer production provided by the utility model, preferably, the auxiliary component includes a threaded sleeve, the rear side of the threaded sleeve is fixedly connected to the molding container, the inner cavity of the threaded sleeve is provided with a bidirectional screw, the front and rear sides of the surface of the bidirectional screw are provided with threaded rings, both sides of the threaded ring are fixedly connected with guide plates, the side of the guide plate away from the threaded ring is fixedly connected with a sliding block, the inner cavity of the sliding block is provided with a sliding rod, both sides of the sliding rod are fixedly connected to the inner wall of the molding container, the top of the sliding block is fixedly connected with a push rod through a hinge seat, the side of the push rod away from the sliding block is fixedly connected to the partition through a hinge seat, and the front side of the bidirectional screw is fixedly connected with a torsion block.

[0012] As a sintering device for wafer production provided by the utility model, preferably, a bearing seat is sleeved on the surface of the bidirectional screw, and the bottom of the bearing seat is fixedly connected to the molding container.

[0013] Compared with the prior art, the beneficial effects of the utility model are:

[0014] The sintering device for wafer production of the utility model, when the user needs to take out the formed wafer, firstly drives the bidirectional screw to rotate by twisting the twist block, when the bidirectional screw rotates, the two threaded rings will move relative to each other, when the threaded ring moves, the guide plate and the sliding block will be driven to move on the surface of the sliding rod, at this time the sliding block drives the push rod to lift the partition through the hinge seat, so that the formed wafer is demolded, which solves the problem of the existing sintering device that it is inconvenient to demold the wafer after sintering. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 A schematic structural diagram of a preferred embodiment of a sintering device for wafer production provided by the utility model;

[0016] Figure 2 It is a schematic diagram of the structure of the unfolded door body;

[0017] Figure 3 It is a schematic diagram of the structure of the molded container;

[0018] Figure 4 is a schematic diagram of the structure of the auxiliary components shown;

[0019] Figure 5 Schematic diagram of the structure inside the connecting shell shown.

[0020] Numbers in the figure: 1. Vacuum sintering furnace body; 2. Exhaust system; 3. Heating device; 4. Door body; 5. Support plate; 6. Breathing groove; 7. Molding container; 8. Partition; 9. Auxiliary components; 901. Threaded sleeve; 902. Bidirectional screw; 903. Threaded ring; 904. Guide plate; 905. Sliding block; 906. Sliding rod; 907. Push rod; 908. Twist block; 909. Bearing seat; 10. Connecting plate; 11. First clamping plate; 12. Controller body; 13. Reinforcement plate; 14. Connecting shell; 15. Spring; 16. Second clamping plate; 17. Push plate; 18. Sliding sleeve; 19. Limit rod. DETAILED DESCRIPTION

[0021] The utility model is further described below in conjunction with the accompanying drawings and implementation modes.

[0022] Please refer to Figure 1 , Figure 2 , Figure 3 , Figure 4 and Figure 5 ,in Figure 1 A schematic structural diagram of a preferred embodiment of a sintering device for wafer production provided by the utility model; Figure 2 for Figure 1 The schematic diagram of the structure of the door body being unfolded is shown; Figure 3 for Figure 1 A schematic diagram of the structure of the molded container being unfolded; Figure 4 for Figure 1 A schematic diagram of the structure of the auxiliary components shown; Figure 5 for Figure 1A schematic diagram of the structure inside the connection shell is shown. A sintering device for wafer production includes: a vacuum sintering furnace body 1, and also includes: an exhaust system 2 arranged on the top of the vacuum sintering furnace body 1, heating devices 3 are arranged on both sides of the inner cavity of the vacuum sintering furnace body 1, and the left side of the front side of the vacuum sintering furnace body 1 is fixedly connected to a door body 4 through an axle pin; support plates 5 are arranged on both sides of the rear side of the inner cavity of the vacuum sintering furnace body 1, and air permeable grooves 6 are opened on both sides of the support plates 5, and molding containers 7 are arranged on the top and bottom of the inner cavity of the two support plates 5, and the inner cavity of the molding container 7 is movably connected to a partition plate 8; an auxiliary component 9 is arranged at the bottom of the inner cavity of the molding container 7, and the two sides of the front side of the molding container 7 are fixedly connected to the connection plate 10, and the rear side of the connection plate 10 is fixedly connected to the first clamping plate 11, and the front side of the door body 4 is fixedly connected to the controller body 12.

[0023] refer to Figure 3 and Figure 5 As shown, a reinforcing plate 13 is fixedly connected to one side of the support plate 5, and the rear side of the reinforcing plate 13 is fixedly connected to the vacuum sintering furnace body 1, and a connecting shell 14 is fixedly connected to the side of the support plate 5 away from the molding container 7, and a spring 15 is provided in the inner cavity of the connecting shell 14, and the opposite sides of the two springs 15 are fixedly connected to the inner wall of the connecting shell 14, and the opposite sides of the two springs 15 are fixedly connected to a second clamping plate 16, and the front side of the second clamping plate 16 is fixedly connected to a push plate 17, and the front side of the push plate 17 passes through the outer side of the connecting plate 10, and the front side of the connecting plate 10 is provided with an opening for cooperating with the push plate 17, and the opposite sides of the two second clamping plates 16 are fixedly connected to a sliding sleeve 18, and the inner cavity of the sliding sleeve 18 is provided with a limiting rod 19, and the two ends of the limiting rod 19 are respectively fixedly connected to the connecting shell 14 and the support plate 5.

[0024] It should be noted that the fixed connection between the reinforcement plate 13 and the vacuum sintering furnace body 1 plays a role in reinforcing the support plate 5. When the user needs to take out the molding container 7, the push plate 17 can be pushed to drive the second clamping plate 16 to squeeze the spring 15. At this time, the spring 15 retracts under the force, and the second clamping plate 16 is separated from the surface of the first clamping plate 11. Then the molding container 7 can be taken out, and it is convenient to demold it. The sliding sleeve 18 is fixedly connected to the second clamping plate 16. When the second clamping plate 16 moves, it will drive the sliding sleeve 18 to move on the surface of the limit rod 19, thereby assisting in limiting the second clamping plate 16.

[0025] refer to Figure 2 and Figure 4As shown, the auxiliary component 9 includes a threaded sleeve 901, the rear side of the threaded sleeve 901 is fixedly connected to the molding container 7, the inner cavity of the threaded sleeve 901 is provided with a bidirectional screw 902, the front and rear sides of the surface of the bidirectional screw 902 are provided with threaded rings 903, both sides of the threaded ring 903 are fixedly connected with guide plates 904, the side of the guide plate 904 away from the threaded ring 903 is fixedly connected with a sliding block 905, the inner cavity of the sliding block 905 is provided with a sliding rod 906, both sides of the sliding rod 906 are fixedly connected to the inner wall of the molding container 7, the top of the sliding block 905 is fixedly connected with a push rod 907 through a hinge seat, the side of the push rod 907 away from the sliding block 905 is fixedly connected to the partition 8 through a hinge seat, the front side of the bidirectional screw 902 is fixedly connected with a torsion block 908, the surface of the bidirectional screw 902 is sleeved with a bearing seat 909, and the bottom of the bearing seat 909 is fixedly connected to the molding container 7.

[0026] It should be noted that: when the user needs to take out the molded wafer, the user first twists the twist block 908 to drive the bidirectional screw 902 to rotate on the surface of the bearing seat 909. When the bidirectional screw 902 rotates, the two threaded rings 903 will move relative to each other. When the threaded ring 903 moves, it will drive the guide plate 904 to move and the sliding block 905 to move on the surface of the sliding rod 906. At this time, the sliding block 905 drives the push rod 907 to drive the partition 8 to rise through the hinge seat, thereby removing the molded wafer from the mold.

[0027] The working principle of a sintering device for wafer production provided by the utility model is as follows:

[0028] First, pour the wafer material into the inner cavity of the molding container 7, and then insert it between the two support plates 5. At this time, the connecting plate 10 drives the first clamping plate 11 to be inserted into the inner cavity of the connecting shell 14, and the second clamping plate 16 is forced to squeeze the spring 15 until the first clamping plate 11 is completely inserted into the inner cavity of the connecting shell 14. The second clamping plate 16 is reset by the spring 15 to install the first clamping plate 11, and then the door body 4 is closed, and the air is extracted through the exhaust system 2, and then heated by the resistor in the heating device 3. The heat rate of the molding container 7 can be increased through the air permeable groove 6. After sintering is completed, the door body 4 is opened, and then the push plate 17 is pushed to drive the second clamping plate 16 to squeeze the spring 15. When the second clamping plate 16 moves, it will drive the sliding sleeve 18 to move on the surface of the limit rod 19. At this time, the spring 15 is forced to retract, and the second clamping plate 16 is separated from the surface of the first clamping plate 11. Then the molding container 7 can be taken out. Later, when the user needs to take out the molded wafer, first, the torsion block 908 is twisted to drive the bidirectional screw rod 902 to rotate on the surface of the bearing seat 909. When the bidirectional screw rod 902 rotates, the two threaded rings 903 will move relative to each other. When the threaded ring 903 moves, it will drive the guide plate 904 to move and the sliding block 905 to move on the surface of the sliding rod 906. At this time, the sliding block 905 drives the push rod 907 to drive the partition 8 to rise through the hinge seat, thereby demolding the molded wafer.

[0029] The above description is only an embodiment of the present invention, and does not limit the patent scope of the present invention. Any equivalent structure or equivalent process transformation made by using the contents of the specification and drawings of the present invention, or directly or indirectly applied in other related technical fields, are also included in the patent protection scope of the present invention.

Claims

1. A sintering device for wafer production, characterized in that: The invention comprises a vacuum sintering furnace body (1), and further comprises: An exhaust system (2) is arranged on the top of the vacuum sintering furnace body (1), heating devices (3) are arranged on both sides of the inner cavity of the vacuum sintering furnace body (1), and a door body (4) is fixedly connected to the left side of the front side of the vacuum sintering furnace body (1) via an axle pin; Support plates (5) are arranged on both sides of the rear side of the inner cavity of the vacuum sintering furnace body (1), and air permeable grooves (6) are provided on both sides of the support plates (5). The top and bottom of the inner cavities of the two support plates (5) are provided with molding containers (7), and the inner cavity of the molding container (7) is movably connected with a partition plate (8); An auxiliary component (9) is arranged at the bottom of the inner cavity of the molding container (7), and connecting plates (10) are fixedly connected to both sides of the front side of the molding container (7), and the rear side of the connecting plate (10) is fixedly connected to a first clamping plate (11), and the front side of the door body (4) is fixedly connected to a controller body (12).

2. A sintering device for wafer production according to claim 1, characterized in that: A reinforcing plate (13) is fixedly connected to one side of the support plate (5), and a rear side of the reinforcing plate (13) is fixedly connected to the vacuum sintering furnace body (1).

3. A sintering device for wafer production according to claim 1, characterized in that: A connecting shell (14) is fixedly connected to the side of the support plate (5) away from the molding container (7); a spring (15) is arranged in the inner cavity of the connecting shell (14); opposite sides of the two springs (15) are fixedly connected to the inner wall of the connecting shell (14); and opposite sides of the two springs (15) are fixedly connected to a second clamping plate (16).

4. A sintering device for wafer production according to claim 3, characterized in that: The front side of the second clamping plate (16) is fixedly connected to a push plate (17), the front side of the push plate (17) penetrates to the outside of the connecting plate (10), and the front side of the connecting plate (10) is provided with an opening for use with the push plate (17).

5. The sintering device for wafer production according to claim 4, characterized in that: The two second clamping plates (16) are fixedly connected to a sliding sleeve (18) on opposite sides thereof, and a limiting rod (19) is provided in the inner cavity of the sliding sleeve (18), and the two ends of the limiting rod (19) are respectively fixedly connected to the connecting shell (14) and the supporting plate (5).

6. The sintering device for wafer production according to claim 1, characterized in that: The auxiliary component (9) comprises a threaded sleeve (901), the rear side of the threaded sleeve (901) is fixedly connected to the molding container (7), the inner cavity of the threaded sleeve (901) is provided with a bidirectional screw rod (902), the front side and the rear side of the surface of the bidirectional screw rod (902) are both provided with a threaded ring (903), both sides of the threaded ring (903) are fixedly connected to a guide plate (904), and the side of the guide plate (904) away from the threaded ring (903) is fixedly connected to the guide plate (904). A sliding block (905) is connected, and the inner cavity of the sliding block (905) is provided with a sliding rod (906), both sides of the sliding rod (906) are fixedly connected to the inner wall of the molding container (7), the top of the sliding block (905) is fixedly connected to a push rod (907) through a hinge seat, and the side of the push rod (907) away from the sliding block (905) is fixedly connected to the partition (8) through a hinge seat, and the front side of the bidirectional screw rod (902) is fixedly connected to a torsion block (908).

7. The sintering device for wafer production according to claim 6, characterized in that: A bearing seat (909) is sleeved on the surface of the bidirectional screw rod (902), and the bottom of the bearing seat (909) is fixedly connected to the molding container (7).

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