Universal device for realizing Rogers flexible substrate conductive adhesive bonding

Abstract

The utility model discloses a universal device for realizing Rogers soft substrate conductive adhesive bonding. The universal device comprises an upper gland, a lower gland, a magnet, epoxy adhesive, an adhesive tape, a tube shell, a pressing block, a Rogers soft substrate and conductive adhesive. The upper gland and the lower gland of the universal device are connected with the magnet through epoxy glue, and the universal device applies pressure to the Rogers soft substrate through the pressing block. The tube shell is used as a carrier for assembling the Rogers soft substrate, the conductive adhesive is used for interconnection between the tube shell and the Rogers soft substrate, and the pressing block is used for positioning during bonding and curing of the Rogers soft substrate through the conductive adhesive. The scheme is simple and effective, and the problems that when the Rogers soft substrate and the tube shell are connected through the conductive adhesive, fixation through the cover plate, the screw and the pressing block is tedious and time-consuming, and the cover plate is damaged are solved.

Description

Technical Field

[0001] The utility model relates to a tube shell packaging structure, in particular to a universal device for realizing conductive adhesive bonding of Rogers soft substrates, and belongs to the technical field of mechanical structural components. Background Art

[0002] In microwave hybrid integrated circuits, the substrate material is generally RT / duroid 5880 and 5870 type plates. This type of substrate is filled with polytetrafluoroethylene glass fiber, which is thin and soft, has good temperature stability, and does not produce large burrs during substrate processing, so it is widely used. However, due to the high operating frequency of the components / modules, the grounding requirements are particularly high. When the frequency of the product is above the L band, it is necessary to obtain "large-area grounding" between the microwave substrate and the shell by bonding or soldering. Compared with the equipment requirements of soldering, there are disadvantages such as flux residue after welding. Conductive adhesive bonding has the advantages of easy operation and process-friendly.

[0003] Conventional substrate bonding uses a cover plate + screw + pressure block method, which has the following disadvantages: 1. Low work efficiency, the screws need to be removed before and after the substrate is bonded; 2. The component / module structure has requirements, and space for the screw hole design needs to be reserved; 3. The cover plate needs to be customized to prevent deformation during fixing. Therefore, it is necessary to propose a new device to solve the problem of fixing Rogers soft substrate conductive adhesive bonding too heavy. Summary of the invention

[0004] In order to solve the above problems, the utility model discloses a universal device for realizing conductive adhesive bonding of Rogers soft substrate. The universal device of the technical solution has a simple structure and is easy to implement, which solves the problem of cumbersome, time-consuming and cover plate loss of fixing the Rogers soft substrate and the tube shell conductive adhesive by using a cover plate + screws + pressure block when interconnecting.

[0005] In order to achieve the above-mentioned purpose, the technical scheme of the utility model is as follows: including upper and lower pressure covers, magnets, epoxy glue, tape, tube shell, pressing block, Rogers soft substrate, and conductive glue. The upper and lower pressure covers of the universal device are interconnected with the magnets by epoxy glue, and the universal device applies pressure to the Rogers soft substrate through the pressing block. The tube shell is used as a carrier of the Rogers soft substrate, the conductive glue is used for the interconnection between the tube shell and the Rogers soft substrate, and the pressing block is used for positioning during bonding and curing of the conductive glue of the Rogers soft substrate. This scheme is simple and effective, and it solves the problem of cumbersome, time-consuming and cover plate loss when the Rogers soft substrate is interconnected with the tube shell conductive glue using cover plate + screws + pressing block.

[0006] As an improvement of the utility model, the upper and lower pressure covers (1) of the universal device (11) are made of 5A05 aluminum alloy, and the edge thickness of the upper and lower pressure covers (1) is not less than 5mm±0.5mm, which is convenient to process and not easy to deform, thereby preventing uneven force during the bonding process of the conductive adhesive (7).

[0007] As an improvement of the utility model, the upper and lower glands (1) are both designed with a rectangular groove (9), the length and width of the groove (9) are 15 cm×15 cm, and the height of the groove (9) is 5 mm±0.5 mm. This model specification can meet the bonding requirements of the Rogers soft substrate (6) in most tube shells (4);

[0008] As an improvement of the utility model, the upper and lower glands are both designed with corresponding mounting holes (8), the diameter of the mounting holes is 13 mm ± 0.5 mm, and the depth of the mounting holes is 6 mm ± 0.5 mm, which can effectively ensure the installation of the magnet (2);

[0009] As an improvement of the utility model, the center distance of the mounting holes (8) of the upper and lower pressure covers (1) is 25 mm to 35 mm, ensuring that after the magnets (2) are installed, there is sufficient magnetic force between the upper and lower covers (1) of the universal device (1).

[0010] As an improvement of the utility model, the adhesive tape is a high-temperature adhesive tape, which is used for a long time at a high temperature of 150° C. and is attached to the bottom of the rectangular groove (9) of the upper and lower glands (1), so as to prevent the surface of the tube shell (4) from being scratched during the fixing process;

[0011] As an improvement of the utility model, the material of the magnet (2) is samarium cobalt high-temperature super-strong magnet, which can realize the magnetism of the component during the high-temperature curing process of the conductive glue (7).

[0012] As an improvement of the utility model, the epoxy glue (3) is an insulating glue with a glass transition temperature of ≥150°C, which can prevent the magnet (2) and the upper and lower pressure covers (1) from being delaminated during the curing of the conductive glue;

[0013] As an improvement of the present invention, the width of the pressing block (5) is 0.1 mm to 0.2 mm narrower than the installation groove of the Rogers soft substrate (6) of the tube shell (4), so as to avoid the pressing block being unable to press the substrate (6) during the installation and curing process of the conductive glue (7), resulting in uneven force on the substrate (6) and poor substrate bonding.

[0014] As an improvement of the utility model, the thickness of the pressing block (5) and the Rogers soft substrate (6) after being installed in the tube shell (4) is 0.5 mm to 1.0 mm thicker than the rectangular groove (9) of the upper and lower pressing covers (1) of the general device, which can well ensure the suction force of the upper and lower pressing covers (1) when the tube shell (4) after the pressing block (5) and the Rogers soft substrate (6) are installed adopts the general device.

[0015] Compared with the prior art, the utility model has the following advantages: 1) This solution is simple to process and easy to implement. The universal device solves the problem of cumbersome, time-consuming, and cover plate loss of the cover plate + screw + pressure block of the traditional Rogers soft substrate conductive adhesive bonding; 2) The Rogers soft substrate conductive adhesive bonding achieved by this solution avoids the process of screwing before the Rogers soft substrate bonding and removing the screws after bonding, which can greatly improve work efficiency; 3) This technical solution can realize the curing of Rogers soft substrate conductive adhesive bonding when the component cannot be designed with screw holes; 4) This technical solution can avoid the customization of the inner cover during Rogers soft substrate conductive adhesive bonding, avoiding cost waste; 5) The processing cost of this solution is low, which is conducive to further promotion. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a universal device for achieving conductive adhesive bonding of Rogers soft substrates.

[0017] Figure 2 The invention relates to an upper and lower pressure cover of a universal device for realizing the conductive adhesive bonding of Rogers soft substrate.

[0018] Figure 3 It is a magnet that is a universal device for bonding Rogers soft substrates with conductive adhesive.

[0019] In the figure: 1. upper and lower pressure covers; 2. magnets; 3. epoxy glue; 4. tube shell; 5. pressure block; 6. Rogers soft substrate; 7. conductive glue; 8. mounting hole; 9. rectangular groove; 10. tape; 11. general device. DETAILED DESCRIPTION

[0020] The present invention will be further described below in conjunction with the accompanying drawings and specific implementations. It should be understood that the following specific implementations are only used to illustrate the present invention and are not used to limit the scope of the present invention.

[0021] Example 1: See Figure 1A general device for achieving conductive adhesive bonding of a Rogers soft substrate comprises upper and lower pressure covers (1), a magnet (2), epoxy adhesive (3), adhesive tape (10), a tube shell (4), a pressure block (5), a Rogers soft substrate (6), and a conductive adhesive (7). The upper and lower pressure covers (1) and the magnet (2) of the general device (11) are interconnected by epoxy adhesive (3), and the general device (11) applies pressure to the Rogers soft substrate (6) through the pressure block (5). The tube shell (4) is used as a carrier for assembling the Rogers soft substrate (6), the conductive adhesive (7) is used for interconnecting the tube shell (4) and the Rogers soft substrate (6), and the pressure block (5) is used for positioning the Rogers soft substrate (6) during bonding and curing of the conductive adhesive (7). The width of the pressing block (5) is 0.1 mm to 0.2 mm narrower than the installation groove of the Rogers soft substrate (6) of the tube shell (4), so as to avoid the pressing block failing to press the substrate (6) during the installation and curing process of the conductive adhesive (7), resulting in uneven force on the substrate (6) and poor adhesion of the substrate. The thickness of the pressing block (5) and the Rogers soft substrate (6) after being installed on the tube shell (4) is 0.5 mm to 1.0 mm thicker than the rectangular groove (9) of the upper and lower pressure covers (1) of the general device, which can well ensure the suction force of the upper and lower pressure covers (1) when the tube shell (4) after the pressing block (5) and the Rogers soft substrate (6) are installed adopts the general device.

[0022] Example 2: See Figure 2A general device for achieving conductive adhesive bonding of Rogers soft substrates, the general device (11) comprising upper and lower pressure covers (1), magnets (2), epoxy adhesive (3), and adhesive tape (10). The upper and lower pressure covers (1) of the general device (11) are made of 5A05 aluminum alloy, and the edge thickness of the upper and lower pressure covers (1) is not less than 5mm±0.5mm. The processing is convenient and not easy to deform, which prevents uneven force during the bonding process of the conductive adhesive (7). The upper and lower pressure covers (1) are both designed with rectangular grooves (9), the length and width of the grooves (9) are 15cm×15cm, and the height of the grooves (9) is 5mm±0.5mm. This model specification can meet the bonding of Rogers soft substrates (6) in most tube shells (4). The upper and lower pressure covers are both designed with corresponding mounting holes (8), the diameter of the mounting holes is 13mm±0.5mm, and the depth of the mounting holes is 6mm±0.5mm, which can effectively ensure the installation of the magnets (2). The center distance of the mounting holes (8) of the upper and lower pressure covers (1) is 25 mm to 35 mm, ensuring that after the magnet (2) is installed, there is sufficient magnetic force between the upper and lower covers (1) of the universal device (1). The upper and lower pressure covers (1) of the universal device and the magnet (2) are interconnected by epoxy glue (3), and the epoxy glue (3) is an insulating glue with a glass transition temperature ≥ 150°C, which can prevent the magnet (2) and the upper and lower pressure covers (1) from being delaminated during the curing of the conductive glue. The adhesive tape (10) is attached to the bottom of the rectangular groove (9) in the upper and lower pressure covers (1). The adhesive tape is a high-temperature adhesive tape, which is used for a long time at a high temperature of 150°C. It is attached to the bottom of the rectangular groove (9) of the upper and lower pressure covers (1) to prevent the surface of the tube shell (4) from being scratched during the fixing process.

[0023] Example 3: See Figure 3 , a universal device for realizing conductive adhesive bonding of Rogers soft substrate, wherein the material of the magnet (2) is samarium cobalt high-temperature super-strong magnet, which can realize the magnetism of the component during the high-temperature curing process of the conductive adhesive (7).

[0024] The utility model can also combine at least one of the technical features described in Examples 2 and 3 with Example 1 to form a new implementation method.

[0025] The process of implementing substrate bonding using a universal device for bonding Rogers soft substrates with conductive adhesive is as follows: 1. Use a dispensing device to apply an appropriate amount of conductive adhesive to the bonding area of ​​the Rogers soft substrate and its carrier; 2. Use tweezers to pick up the Rogers soft substrate and place it in the carrier bonding area, and press it gently; 3. Place the pressing block on the upper layer of the Rogers soft substrate; 4. Place the rectangular groove of the lower layer of the universal device for placing the carrier completed in step 3; 5. Align the upper layer pressing cover of the universal device with the rectangular groove of the lower layer pressing cover, close them with magnets, and observe whether there is a certain gap of 0.5mm to 1.0mm between the upper and lower pressing covers to ensure that the magnet applies a certain pressure to the pressing block; 6. Place the device completed in step 5 in a blast drying oven to cure the conductive adhesive; 7. After curing, remove the universal device and check the bonding effect.

[0026] The technical means disclosed in the solution of the utility model are not limited to the technical means disclosed in the above-mentioned implementation mode, but also include technical solutions composed of any combination of the above technical features. It should be pointed out that for ordinary technicians in this technical field, several improvements and modifications can be made without departing from the principle of the utility model, and these improvements and modifications are also regarded as the protection scope of the utility model.

Claims

1. A general device for achieving conductive adhesive bonding of Rogers soft substrates, characterized in that: The universal device (11) comprises a tube shell (4), a pressing block (5), a Rogers soft substrate (6), and a conductive adhesive (7). The universal device (11) comprises an upper and lower pressing cover (1), a magnet (2), an epoxy adhesive (3), and an adhesive tape (10). The upper and lower pressing covers (1) and the magnet (2) of the universal device are interconnected by using the epoxy adhesive (3). The adhesive tape (10) is attached to the bottom of the rectangular groove (9) in the upper and lower pressing covers (1). The universal device (11) applies pressure to the Rogers soft substrate (6) through the pressing block (5). The tube shell (4) is used as a carrier of the Rogers soft substrate (6). The conductive adhesive (7) is used to interconnect the tube shell (4) and the Rogers soft substrate (6). The pressing block (5) is used to position the Rogers soft substrate (6) and the conductive adhesive (7) during bonding and curing.

2. A universal device for achieving conductive adhesive bonding of Rogers soft substrates according to claim 1, characterized in that: The upper and lower pressure covers (1) of the universal device (11) are made of 5A05 aluminum alloy, and the edge thickness of the upper and lower pressure covers (1) is not less than 5 mm ± 0.5 mm.

3. A universal device for achieving conductive adhesive bonding of Rogers soft substrates according to claim 1, characterized in that: The upper and lower glands (1) are both designed with a rectangular groove (9), the length and width of the groove (9) are (15 cm ± 0.5 mm) × (15 cm ± 0.5 mm), and the height of the groove (9) is 5 mm ± 0.5 mm.

4. A universal device for achieving conductive adhesive bonding of Rogers soft substrates according to claim 2, characterized in that: The upper and lower glands (1) are both designed with corresponding mounting holes (8), the diameter of the mounting holes is 13 mm ± 0.5 mm, and the depth of the mounting holes is 6 mm ± 0.5 mm.

5. A universal device for achieving conductive adhesive bonding of Rogers soft substrates according to claim 4, characterized in that: The center distance between the mounting holes (8) of the upper and lower glands (1) is 25 mm to 35 mm.

6. A universal device for achieving conductive adhesive bonding of Rogers soft substrates according to claim 1, characterized in that: The adhesive tape (10) is a high-temperature adhesive tape and can be used for a long time at a high temperature of 150°C.

7. A universal device for achieving conductive adhesive bonding of Rogers soft substrates according to claim 1, characterized in that: The material of the magnet (2) is a samarium cobalt high temperature resistant super strong magnet.

8. A universal device for achieving conductive adhesive bonding of Rogers soft substrates according to claim 1, characterized in that: The epoxy adhesive (3) is an insulating adhesive with a glass transition temperature of ≥150°C.

9. A universal device for achieving conductive adhesive bonding of Rogers soft substrates according to claim 1, characterized in that: The width of the pressing block (5) is 0.1 mm to 0.2 mm narrower than that of the Rogers soft substrate (6).

10. A universal device for achieving conductive adhesive bonding of Rogers soft substrates according to claim 1, characterized in that: The thickness of the pressing block (5) and the Rogers soft substrate (6) after being installed in the tube shell (4) is 0.5 mm to 1.0 mm thicker than the rectangular grooves (9) of the upper and lower pressing covers (1) of a common device.

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