Chip bearing disc

Abstract

The utility model relates to the technical field of semiconductor chip bearing, in particular to a chip bearing disc. According to the chip bearing disc, through the design of the bearing inclined planes and the supporting convex points, the contact mode of the chip and the bearing disc is innovated, the friction force is remarkably reduced, and many problems of small-size chips in the bearing, overturning, transporting and storing processes are solved. When the bearing unit of one bearing disc and the cover body unit of the other bearing disc cover the bearing chip, the bearing inclined surface of the bearing unit obliquely extends from the base body to form line / surface line contact, so that the contact area is greatly reduced, the pressure intensity distribution is homogenized, and the solder balls are prevented from being abraded due to high stress. And the inclined form also reserves a space for the solder ball on the bottom surface to prevent direct extrusion. And the supporting salient points on the end surface of the second frame body of the cover body unit are in point / local surface contact with the chip when the two covered bearing discs are overturned, so that the adsorption effect is effectively inhibited, and the taking-out difficulty is reduced.

Description

Technical Field

[0001] The present application relates to the field of semiconductor chip carrying technology, and in particular to a chip carrying tray. Background Art

[0002] The chip carrier structure is a plastic product that is mainly used in the chip loading, transportation and packaging test process. Its main purpose is to prevent the chip from being physically damaged during these steps, while improving the convenience of automated testing and installation.

[0003] For example, publication number CN213042892U discloses a chip tray structure, comprising a base, a plurality of fixed protrusions extending upward from one side of the base, and a plurality of surrounding walls extending downward from the other side of the base, wherein the fixed protrusions have a lower contact surface contacting a chip, and the surrounding walls surround at least a portion of the contour of the chip, wherein the fixed protrusions of one wafer tray structure are engaged with the surrounding walls of another wafer tray structure, and the other side of the base has a plurality of inclined upper contact surfaces adjacent to the surrounding walls. The contact position between the chip and the tray can be lowered, and the generation of static electricity when the tray is transported can be reduced.

[0004] Although the above chip carrier structure has many practical functions, with the integration and miniaturization of chips, the development of chip carriers suitable for miniaturized chips is the research and development focus of the industry. When the upper and lower covers of the above multiple carriers are used to carry small-sized chips, the size of the through hole in the center will be correspondingly reduced. When the covered carrier is turned over for chip testing, sometimes the chip is adsorbed on the top of the carrier and cannot be removed, affecting the use of small-sized chips. In addition, some chips have solder balls and other parts that are prone to collision and wear in the center of the bottom surface. When designing the chip carrier, the problem of wear also needs to be considered. Utility Model Content

[0005] In order to solve the above technical problems, the present application proposes a chip carrier, which is specifically implemented through the following technical solutions:

[0006] A chip carrier, characterized in that it comprises: a base, a carrier unit for carrying a chip is arranged on one side of the base, and a cover unit corresponding to the carrier unit is arranged on the other side of the base; the carrier unit comprises a first frame extending upward from one side of the base, and a first limiting retaining wall arranged at the outer edge of the first frame; the inner side of the first frame is provided with a supporting inclined surface extending upward and outward from one side of the base and used for supporting the chip; the first limiting retaining wall is provided with an inner side surface for connecting with the side surface of the chip; the cover unit comprises a second frame extending downward from the other side of the base, and a second limiting retaining wall arranged at the outer edge of the second frame; the end face of the second frame is provided with a supporting bump.

[0007] Preferably, the second limiting retaining wall is L-shaped and is arranged at the four corners of the second frame.

[0008] Preferably, adjacent second limiting retaining walls form engaging grooves for cooperating with the first limiting retaining walls of another carrying plate.

[0009] Preferably, the supporting protrusions are arranged at the four corners of the end surface of the second frame.

[0010] Preferably, the chip carrier plate further comprises a through hole penetrating the carrier unit and the cover unit.

[0011] Preferably, the inner side surface is inclined, and the first limiting retaining wall further comprises an avoidance surface which is connected with the inner side surface and has an outward expansion angle greater than the outward expansion angle of the inner side surface.

[0012] Preferably, the second limiting retaining wall includes a first inclined surface extending outward from the end surface of the second frame body, and a second inclined surface connected to the first inclined surface and having an outward expansion angle greater than the outward expansion angle of the first inclined surface.

[0013] Preferably, the outer side surface of the first frame body is a slope extending upward from one side of the base body and is converged; the outer side surface of the second frame body is a slope extending downward from one side of the base body and is converged.

[0014] Preferably, a first outer inclined surface is provided on a side of the first limiting retaining wall away from the first frame body and extending upward in a convergent manner from one side of the base body.

[0015] Preferably, the second limiting retaining wall is provided with a second outer inclined surface on a side away from the second frame body and extending downward from one side of the base body.

[0016] Compared with the prior art, this application has the following beneficial effects:

[0017] The present application relates to the field of semiconductor chip carrying technology, and specifically to a chip carrier. The chip carrier of the present application innovates the contact mode between the chip and the carrier through the design of supporting inclined surfaces and supporting convex points, significantly reduces friction, and solves many problems of small-sized chips in the process of carrying, flipping, transportation, and storage. When the carrying unit of one carrier plate and the cover unit of another carrier plate cover the chip, the supporting inclined surface of the carrying unit extends obliquely from the base to form a line / surface line contact, which greatly reduces the contact area, evens out the pressure distribution, and avoids the wear of the solder balls due to high stress. Its inclined shape also leaves space for the solder balls on the bottom surface to prevent direct extrusion. The supporting convex points on the end face of the second frame of the cover unit form point / partial surface contact with the chip when the two covered carrier plates are flipped, effectively suppressing the adsorption effect and reducing the difficulty of removal. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to clearly illustrate the embodiments, the following is a brief introduction to the accompanying drawings:

[0019] Figure 1 A top view of a chip carrier according to an embodiment of the present application;

[0020] Figure 2 A bottom view of the chip carrier of the embodiment of the present application;

[0021] Figure 3 , 4 It is a schematic diagram of the structure of the chip carrier at different angles;

[0022] Figure 5 It is an assembly cross-sectional view of the laminated chip carrier of the embodiment of the present application;

[0023] Figure numerals: 100, base, 210, first frame, 211, supporting inclined surface, 220, first limiting retaining wall, 221, inner side surface, 222, avoidance surface, 223, first outer inclined surface, 310, second frame, 311, supporting protrusion, 320, second limiting retaining wall, 321, first inclined surface, 322, second inclined surface, 323, second outer inclined surface, 400, through hole. DETAILED DESCRIPTION

[0024] The utility model is further described below in conjunction with the drawings and specific embodiments of the specification. A person of ordinary skill in the art will be able to implement the utility model based on these descriptions. In addition, the embodiments of the utility model involved in the following description are usually only embodiments of a part of the utility model, rather than all of the embodiments. Therefore, based on the embodiments in the utility model, all other embodiments obtained by a person of ordinary skill in the art without making creative work should fall within the scope of protection of the utility model. Example

[0025] See also Figure 1 to Figure 5 , a chip carrier disclosed in this embodiment includes:

[0026] A base 100, a carrier unit for carrying a chip is disposed on one side of the base 100, and a cover unit corresponding to the carrier unit is disposed on the other side of the base 100; the carrier unit includes a first frame 210 extending upward from one side of the base 100, and a first limiting retaining wall 220 disposed on the outer edge of the first frame 210; a supporting inclined surface 211 extending upward and outward from one side of the base 100 and used to support the bottom of the chip is disposed on the inner side of the first frame 210; the first limiting retaining wall 220 is provided with an inner side surface 221 for connecting with the side surface of the chip. In this embodiment, by providing the supporting inclined surface 211, when the chip is placed on the carrier unit, compared with the surface connection, the supporting inclined surface 211 and the four sides of the chip will form a line connection, which utilizes the light weight of the small chip, can ensure the quality of the chip, and avoid the friction and electrostatic adsorption problems caused by the excessive connection surface. Furthermore, the inclined design of the supporting inclined surface 221 reserves sufficient space for the chip with the solder ball arranged at the center of the bottom surface, avoiding direct contact between the solder ball and the carrier plate, and further protecting it from extrusion damage. In addition, the inner side surface 221, as a precisely integrated part of the first limiting retaining wall 220, precisely fits with the side surface of the chip, which not only ensures the accurate placement of the chip on the carrier plate, but also gives the system the necessary buffering capacity.

[0027] The cover unit includes a second frame 310 extending downward from the other side of the base 100, and a second limiting retaining wall 320 arranged at the outer edge of the second frame 310. Furthermore, the second limiting retaining wall 320 is L-shaped and is arranged at the four corners of the second frame 310; an engagement groove for matching with the first limiting retaining wall 220 of another carrier plate is formed between adjacent second limiting retaining walls 320. The second limiting retaining wall 320 in the cover unit adopts an L-shaped design, and an engagement groove for matching with the first limiting retaining wall 220 of another carrier plate is formed between adjacent retaining walls, which not only significantly enhances the fixing stability, precise positioning capability and packaging sealing of the chip in the carrier plate, but also simplifies the assembly and disassembly process, improves the structural strength and durability, and provides a safer, more reliable and efficient carrying environment for the chip.

[0028] When the carrier unit of one carrier plate covers the chip with the cover unit of another carrier plate, considering that the upper surface of the chip will establish a connection with the lower surface of the second frame 310 of the other carrier plate during the flipping test, in order to reduce the adsorption force, in this embodiment, the lower surface of the second frame 310 is evenly distributed with support bumps 311 for supporting the upper surface of the chip. The support bumps 311 are arranged at the four corners of the end face of the second frame 310. In order to assist the support bump 311 structure of the cover unit and jointly prevent vacuum adsorption when the carrier plates are overlapped, the chip carrier plate also includes a through hole 400 that penetrates the carrier unit and the cover unit.

[0029] To facilitate the access of the chip, in this embodiment, the inner side surface 221 is tilted, and the first limiting retaining wall 220 also includes a avoidance surface 222 that is connected to the inner side surface 221 and has an outward expansion angle greater than the outward expansion angle of the inner side surface 221. The second limiting retaining wall 320 includes a first inclined surface 321 extending outward from the end surface of the second frame 310, and a second inclined surface 322 that is connected to the first inclined surface 321 and has an outward expansion angle greater than the outward expansion angle of the first inclined surface 321. The continuous inclined surface design of the second limiting retaining wall 320 provides a preset motion trajectory for the chip, guiding it to slide along the inclined surface to a predetermined position. This guiding effect helps the chip maintain a stable motion direction during the flipping process, avoiding inaccurate positioning or impact damage caused by accidental offset.

[0030] In addition, to facilitate the demoulding process in the carrier plate manufacturing process, the outer side surface of the first frame body 210 is a slope extending upward from one side of the base body and is gathered; the outer side surface of the second frame body 310 is a slope extending downward from one side of the base body and is gathered. The first limiting retaining wall 220 is provided with a first outer slope 223 extending upward from one side of the base body 100 and is gathered on the side away from the first frame body 210. The second limiting retaining wall 320 is provided with a second outer slope 323 extending downward from one side of the base body 100 and is gathered on the side away from the second frame body 310.

Claims

1. A chip carrier, characterized in that: include: A base body (100), wherein a carrying unit for carrying a chip is arranged on one side of the base body (100), and a cover unit corresponding to the carrying unit is arranged on the other side of the base body (100); The bearing unit comprises a first frame (210) extending upward from one side of the base (100), and a first limiting retaining wall (220) arranged at the outer edge of the first frame (210); the first frame (210) is provided with a supporting inclined surface (211) extending upward and outward from one side of the base (100) and used to support the chip on the inner side; the first limiting retaining wall (220) is provided with an inner side surface (221) used to connect with the side surface of the chip; The cover unit comprises a second frame (310) extending downward from the other side of the base (100), and a second limiting retaining wall (320) arranged at the outer edge of the second frame (310); a supporting protrusion (311) is arranged on the end surface of the second frame (310).

2. A chip carrier according to claim 1, characterized in that: The second limiting retaining wall (320) is L-shaped and is arranged at the four corners of the second frame (310).

3. A chip carrier according to claim 2, characterized in that: An engagement groove for matching with the first position limiting retaining wall (220) of another supporting plate is formed between adjacent second position limiting retaining walls (320).

4. A chip carrier according to claim 2 or 3, characterized in that: The supporting protrusions (311) are arranged at the four corners of the end surface of the second frame body (310).

5. The chip carrier according to claim 1, characterized in that: The chip carrier plate further comprises a through hole (400) penetrating the carrier unit and the cover unit.

6. The chip carrier according to claim 1, characterized in that: The inner side surface (221) is arranged tilted, and the first position-limiting retaining wall (220) further comprises a relief surface (222) connected to the inner side surface (221) and having an outward expansion angle greater than the outward expansion angle of the inner side surface (221).

7. The chip carrier according to claim 1, characterized in that: The second position-limiting retaining wall (320) comprises a first inclined surface (321) extending outwardly from the end surface of the second frame body (310), and a second inclined surface (322) connected to the first inclined surface (321) and having an outward expansion angle greater than that of the first inclined surface (321).

8. The chip carrier according to claim 1, characterized in that: The outer side surface of the first frame body (210) is a sloped surface extending upward from one side of the base body and forming a convergence; the outer side surface of the second frame body (310) is a sloped surface extending downward from one side of the base body and forming a convergence.

9. The chip carrier according to claim 1, characterized in that: A first outer inclined surface (223) extending upwards from one side of the base body (100) is provided on the side of the first limiting retaining wall (220) away from the first frame body (210).

10. The chip carrier according to claim 1, characterized in that: The second position-limiting retaining wall (320) is provided with a second outer inclined surface (323) on the side away from the second frame body (310) and extending downward from one side of the base body (100).

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