Novel clamping device for wafer packaging

Abstract

The utility model relates to the technical field of wafer packaging processing, and particularly discloses a novel clamping device for wafer packaging, which comprises a suction cup mechanism, the suction cup mechanism comprises a first suction cup seat, a non-contact top disc is fixed above the first suction cup seat in a clamping manner, a cross-shaped mounting groove is arranged above the non-contact top disc, and a clamping groove is arranged above the cross-shaped mounting groove. An auxiliary mechanism is installed in the cross-shaped installation groove and comprises an installation block, an auxiliary assembly and driving blocks located on the two sides of the auxiliary assembly. The auxiliary assembly is used for assisting in supporting a wafer with warping degree above, and the driving block is used for driving a sliding block in the auxiliary assembly. According to the utility model, the vacuum can be increased to ensure the adsorption force, the vacuum stability of each area of the CHUCK can be ensured, the wafer with warping degree can be supported, and in addition, the auxiliary closing and clamping can be carried out when the wafer is small.

Description

Technical Field

[0001] The utility model belongs to the technical field of wafer packaging processing, and in particular relates to a novel clamping device for wafer packaging. Background Art

[0002] With the continuous evolution of semiconductor packaging technology, "Fan Out" wafer-level packaging (FOWLP) has become an important development direction in the industry. FOWLP technology allows more I / O (input / output) wiring to be placed outside the boundaries of the chip, effectively improving I / O density, reducing package size, and optimizing electrical performance. However, at the same time, the warpage of wafer products produced by FOWLP technology has increased significantly, which poses a challenge to wafer clamping during the packaging process.

[0003] Existing wafer packaging clamping devices, such as conventional CHUCK on AOI machines, usually rely on the principle of vacuum adsorption to fix the wafer. However, when facing highly warped wafers, conventional CHUCK often cannot provide sufficient adsorption force or uniformity, causing the wafer to move or fall off during processing, so CHUCK needs to be modified and upgraded. Utility Model Content

[0004] The utility model aims to provide a novel clamping device for wafer packaging, so as to solve the problems of movement and non-adherence to warped wafers existing in the prior art.

[0005] In order to achieve the above purpose, the utility model provides the following technical solutions:

[0006] A novel clamping device for wafer packaging includes a suction cup mechanism, the suction cup mechanism includes a suction cup seat, a non-contact top plate is fixed on the top of the suction cup seat by clamping, a cross mounting groove is provided on the top of the non-contact top plate, an auxiliary mechanism is installed inside the cross mounting groove, the auxiliary mechanism includes a mounting block and an auxiliary component, and includes driving blocks located on both sides of the auxiliary component; the auxiliary component is used to auxiliary support a wafer with warpage on the top, and the driving block is used to drive a sliding block inside the auxiliary component.

[0007] Preferably: the suction cup seat 1 is used to connect to an external vacuum device, and the suction cup seat 1 is used to generate negative pressure above the non-contact top plate to absorb the wafer.

[0008] Preferably: the auxiliary component surrounds the periphery of the mounting block, the auxiliary component includes an auxiliary support block, the driving block is fixedly connected to both sides of the auxiliary support block, one end of the auxiliary support block is fixedly connected to the mounting block, the end of the auxiliary support block away from the mounting block is fixedly connected with a connecting end, a slide groove is opened above the auxiliary support block, and the sliding block is slidably connected to the inside of the slide groove.

[0009] Preferably, the connecting end is connected to the bottom of the sliding block through a hose, a second suction cup seat is fixedly connected to the top of the sliding block, and an inclined top plate is fixed to the top of the second suction cup seat by means of a snap connection.

[0010] Preferably: the outside of the driving block is fixedly connected with a driving end head, and connecting tube 1 and connecting tube 2 are fixedly connected to both sides of the driving end head, and ends of connecting tube 1 and connecting tube 2 away from the driving end head both penetrate the driving block.

[0011] Preferably: telescopic airbag 1 and telescopic airbag 2 are provided inside the driving block, and telescopic airbag 1 and telescopic airbag 2 are respectively located on both sides of the sliding block, and telescopic airbag 1 and telescopic airbag 2 are both located inside the slide groove, and one end of telescopic airbag 1 away from the sliding block is fixedly connected to one end of connecting tube 2, and one end of telescopic airbag 2 away from the sliding block is fixedly connected to one end of connecting tube 1.

[0012] Preferably, the driving end is fixedly connected to an electronic valve at the intersection of the connecting pipe 1 and the connecting pipe 2.

[0013] Compared with the prior art, the beneficial effects of the utility model are:

[0014] 1. The utility model provides a suction cup seat 1. Due to the groove opened above the suction cup seat 1, compared with the conventional CHUCK, the groove and the hose are added, thereby increasing the adsorption area, making the vacuum distribution more uniform, and increasing the vacuum to ensure the adsorption force. At the same time, the stability of the vacuum in each area of ​​the CHUCK can be ensured.

[0015] 2. The utility model provides an auxiliary mechanism 2 and the objects included therein. When it is necessary to adsorb and clamp a wafer with a certain degree of warpage, the two electronic valves 29 around the mounting block 21 can be switched separately to make the sliding block 224 slide, thereby adapting to the bottom surface of the wafer with warpage, thereby preventing the wafer with warpage from being deformed due to hollow adsorption, and supporting the wafer with warpage. In addition, it can also assist in clamping the wafer when it is small. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1It is a three-dimensional diagram of the whole clamping device for wafer packaging of the utility model;

[0017] Figure 2 This is a schematic diagram of the structure of the suction cup mechanism of the utility model;

[0018] Figure 3 It is a structural schematic diagram of the existing CHUCK of the utility model;

[0019] Figure 4 For this utility model Figure 1 Schematic diagram of the structure of CHUCK;

[0020] Figure 5 It is a structural schematic diagram of the auxiliary mechanism of the utility model;

[0021] Figure 6 For this utility model Figure 5 Schematic diagram of the structure of the auxiliary components and the drive block;

[0022] Figure 7 For this utility model Figure 6 Schematic diagram of the structure of the sliding block part.

[0023] In the figure: 1. suction cup mechanism; 11. suction cup seat 1; 12. non-contact top plate; 13. cross mounting groove; 2. auxiliary mechanism; 21. mounting block; 22. auxiliary component; 221. auxiliary support block; 222. slide groove; 223. connecting end; 224. sliding block; 225. suction cup seat 2; 226. tilting top plate; 23. driving block; 24. driving end; 25. connecting tube 1; 26. connecting tube 2; 27. telescopic airbag 1; 28. telescopic airbag 2; 29. ​​electronic valve. DETAILED DESCRIPTION

[0024] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0025] Reference Figure 1-Figure 7As shown, the utility model provides a novel clamping device for wafer packaging, including a suction cup mechanism 1, the suction cup mechanism 1 includes a suction cup seat 11, a non-contact top plate 12 is fixed on the top of the suction cup seat 11 by a clamping method, a cross mounting groove 13 is opened on the top of the non-contact top plate 12, an auxiliary mechanism 2 is installed inside the cross mounting groove 13, the auxiliary mechanism 2 includes a mounting block 21 and an auxiliary component 22, and includes a driving block 23 located on both sides of the auxiliary component 22; the auxiliary component 22 is used to auxiliary support the wafer with warpage on the top, and the driving block 23 is used to drive the sliding block 224 inside the auxiliary component 22.

[0026] In a further embodiment, the suction cup seat 11 is used to connect to an external vacuum device, and the suction cup seat 11 is used to generate negative pressure above the non-contact top plate 12 to absorb the wafer.

[0027] In this embodiment, the non-contact top plate 12 is the top cover of the CHUCK suction cup in the prior art, which is provided with a large number of adsorption holes; the suction cup seat 11 is the CHUCK suction cup; the traditional CHUCK usually has only a flat adsorption surface, while the improved clamping device is designed with multiple grooves on the surface of the CHUCK. These grooves not only increase the adsorption area, thereby increasing the contact points between the wafer and the CHUCK, but also enable the wafer to fit more closely to the CHUCK surface when placed, reducing the possibility of air leakage; by connecting the groove and the vacuum pump through a hose, the improved suction cup clamping device can achieve a more uniform vacuum distribution. The design of the hose enables each groove to be independently vacuumed, avoiding wafer instability caused by insufficient or excessive vacuum in a certain area.

[0028] In a further embodiment, the auxiliary component 22 surrounds the periphery of the mounting block 21, and the auxiliary component 22 includes an auxiliary support block 221, and the driving block 23 is fixedly connected to both sides of the auxiliary support block 221, one end of the auxiliary support block 221 is fixedly connected to the mounting block 21, and the end of the auxiliary support block 221 away from the mounting block 21 is fixedly connected with a connecting end 223, and a slide groove 222 is opened above the auxiliary support block 221, and the sliding block 224 is slidably connected to the inside of the slide groove 222.

[0029] In this embodiment, the auxiliary components 22 are on the four sides of the mounting block 21, and the bottoms of the mounting block 21 and the auxiliary support block 221 are connected to the cross mounting groove 13 by snapping; the connecting end 223 is connected to the vacuum pump of the AOI machine like the suction cup seat 11, so that the top of the inclined top plate 226 generates negative pressure to adsorb the wafer like the top of the non-contact top plate 12.

[0030] In a further embodiment, the connecting end 223 is connected to the bottom of the sliding block 224 through a hose, a suction cup seat 225 is fixedly connected above the sliding block 224, and an inclined top plate 226 is fixed above the suction cup seat 225 by snap-fitting.

[0031] In this embodiment, the suction cup seat 225 and the inclined top plate 226 are small-sized CHUCK suction cups in the prior art, and the hose connecting the connecting end 223 to the bottom of the sliding block 224 is foldable so that the sliding block 224 can slide inside the sliding groove 222.

[0032] In a further embodiment, the outside of the driving block 23 is fixedly connected to a driving end 24, and connecting tube 1 25 and connecting tube 2 26 are fixedly connected to both sides of the driving end 24, and the ends of connecting tube 1 25 and connecting tube 2 26 away from the driving end 24 both penetrate the driving block 23.

[0033] In this embodiment, connecting tube 1 25 and connecting tube 2 26 are used to transport air to corresponding telescopic airbag 1 27 and telescopic airbag 2 28; the driving end 24 is connected to an external independent pump body through a hose, and the pump body is controlled by the computer terminal of the AOI machine.

[0034] In a further embodiment, a telescopic airbag 1 27 and a telescopic airbag 2 28 are provided inside the driving block 23. The telescopic airbag 1 27 and the telescopic airbag 2 28 are respectively located on both sides of the sliding block 224. The telescopic airbag 1 27 and the telescopic airbag 2 28 are both located inside the slide groove 222. One end of the telescopic airbag 1 27 away from the sliding block 224 is fixedly connected to one end of the connecting tube 2 26, and one end of the telescopic airbag 2 28 away from the sliding block 224 is fixedly connected to one end of the connecting tube 1 25.

[0035] In this embodiment, a groove is also provided on one side of the driving block 23 close to the auxiliary support block 221, and the groove is interconnected with the slide groove 222, so the telescopic airbag 1 27 and the telescopic airbag 2 28 are relatively inside the slide groove 222, thereby pushing the sliding block 224 to move.

[0036] In a further embodiment, the driving end 24 is fixedly connected to an electronic valve 29 at the intersection of the connecting pipe 1 25 and the connecting pipe 2 26 .

[0037] In this embodiment, the electronic valve 29 is an electrically controlled air valve in the prior art, which is used to connect to an external control device through electric wires to control the direction of the airflow, so that the valve plate inside the electronic valve 29 moves. When only the airflow is allowed to enter the interior of the connecting tube 1 25, the telescopic airbag 2 28 will expand and push the sliding block 224 to move. On the contrary, the airflow will enter the interior of the connecting tube 2 26 to expand the telescopic airbag 1 27 and push the sliding block 224. When the valve plate closes the driving end 24, the airflow inside the telescopic airbag 1 27 and the telescopic airbag 2 28 will remain unchanged, so that the sliding block 224 is fixed in one place.

[0038] The working principle of the utility model is as follows:

[0039] Adjust the adaptive clamping mechanism on the AOI machine according to the size and shape of the wafer. Then start the vacuum pump and adjust the appropriate vacuum degree through the vacuum adjustment system. Place the wafer on the auxiliary mechanism 2, and then drive the vacuum pump according to the situation to make the auxiliary mechanism 2 fit the bottom surface of the wafer. When the wafer warpage is not large, there is no need to drive the sliding block 224 to move. Then drive the vacuum pump to ensure that the wafer can form a negative pressure with the upper part of the inclined top plate 226 and the upper part of the non-contact top plate 12, so as to adsorb the wafer. Due to the more uniform grooves and hoses opened inside the suction cup seat 11, the adsorption area is increased, and the vacuum distribution is more uniform. The vacuum can be increased to ensure the adsorption force, and at the same time, the stability of the vacuum in each area of ​​the CHUCK composed of the suction cup seat 11 and the non-contact top plate 12 can be ensured.

[0040] When the wafer warpage is too large, the vacuum pump and computer terminal on the AOI machine can be used to generate negative pressure above the tilted top plate 226 and above the non-contact top plate 12 through the connection terminal 223. At this time, the computer terminal controls the opening and closing of the electronic valve 29, so that the air pump can inflate the driving terminal 24, and then through the connecting tube 1 25 and the connecting tube 2 26, the telescopic airbag 1 27 and the telescopic airbag 2 28 push the relative position of the sliding block 224, so that the four sliding blocks 224, with the upper suction cup seat 2 225 and the tilted top plate 226, can fit the bottom surface of the wafer with excessive warpage as much as possible, completing the auxiliary support;

[0041] When the wafer is small, air can be injected into the driving end 24 to make the four sliding blocks 224 approach the wafer for clamping;

[0042] The conventional CHUCK suction cup of the prior art AOI machine Automated Optical Inspection is a commonly used component in the semiconductor packaging and inspection process. Its working principle is mainly based on vacuum adsorption; vacuum generation: the CHUCK is usually equipped with a vacuum pump or connected to an external vacuum system. When the CHUCK is activated, the vacuum pump starts to work and generates a negative pressure vacuum state through the channel inside the suction cup; adsorption of wafers: the wafer is placed on the plane of the CHUCK. Due to the vacuum state formed inside the CHUCK, an adsorption force is generated between the wafer surface and the CHUCK. This adsorption force firmly fixes the wafer on the CHUCK to ensure that the wafer will not move or fall off during subsequent processing, inspection, etc.; stability maintenance: in order to ensure the stability of the wafer during processing, the CHUCK needs to maintain a certain vacuum degree. Usually, the vacuum degree of CHUCK can be monitored and adjusted through a control system to ensure that the adsorption force is moderate, neither too tight to damage the wafer nor too loose to cause the wafer to fall off; Wafer release: When the wafer is processed or inspected, the vacuum pump of CHUCK will stop working, the vacuum state inside the suction cup will be broken, the adsorption force between the wafer and CHUCK disappears, and the wafer can be easily removed from CHUCK.

[0043] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A novel wafer packaging clamping device, comprising a suction cup mechanism (1), characterized in that: The suction cup mechanism (1) comprises a suction cup seat (11), a non-contact top plate (12) is fixed on the top of the suction cup seat (11) by means of a snap connection, a cross mounting groove (13) is provided on the top of the non-contact top plate (12), an auxiliary mechanism (2) is installed inside the cross mounting groove (13), the auxiliary mechanism (2) comprises a mounting block (21) and an auxiliary component (22), and a driving block (23) located on both sides of the auxiliary component (22); the auxiliary component (22) is used to auxiliary support a wafer with a warpage on the top, and the driving block (23) is used to drive a sliding block (224) inside the auxiliary component (22).

2. A novel wafer packaging clamping device according to claim 1, characterized in that: The suction cup seat 1 (11) is used to connect to an external vacuum device, and the suction cup seat 1 (11) is used to generate negative pressure above the non-contact top plate (12) to absorb the wafer.

3. A novel wafer packaging clamping device according to claim 1, characterized in that: The auxiliary component (22) surrounds the periphery of the mounting block (21), and the auxiliary component (22) comprises an auxiliary support block (221). The driving block (23) is fixedly connected to both sides of the auxiliary support block (221). One end of the auxiliary support block (221) is fixedly connected to the mounting block (21). One end of the auxiliary support block (221) away from the mounting block (21) is fixedly connected to a connecting end (223). A sliding groove (222) is provided above the auxiliary support block (221), and the sliding block (224) is slidably connected to the inside of the sliding groove (222).

4. A novel wafer packaging clamping device according to claim 3, characterized in that: The connecting end (223) is connected to the bottom of the sliding block (224) through a hose, a second suction cup seat (225) is fixedly connected above the sliding block (224), and an inclined top plate (226) is fixed above the second suction cup seat (225) by means of a snap connection.

5. The novel wafer packaging clamping device according to claim 1 is characterized in that: The driving block (23) is fixedly connected to a driving end head (24) on the outside, and a connecting pipe 1 (25) and a connecting pipe 2 (26) are fixedly connected to two sides of the driving end head (24), and the ends of the connecting pipe 1 (25) and the connecting pipe 2 (26) away from the driving end head (24) both penetrate the driving block (23).

6. A novel wafer packaging clamping device according to claim 1, characterized in that: A telescopic airbag 1 (27) and a telescopic airbag 2 (28) are arranged inside the driving block (23). The telescopic airbag 1 (27) and the telescopic airbag 2 (28) are respectively located on both sides of the sliding block (224). The telescopic airbag 1 (27) and the telescopic airbag 2 (28) are both located inside the slide groove (222). One end of the telescopic airbag 1 (27) away from the sliding block (224) is fixedly connected to one end of the connecting tube 2 (26), and one end of the telescopic airbag 2 (28) away from the sliding block (224) is fixedly connected to one end of the connecting tube 1 (25).

7. The novel wafer packaging clamping device according to claim 5 is characterized in that: The driving end (24) is fixedly connected to an electronic valve (29) at the intersection of the connecting pipe 1 (25) and the connecting pipe 2 (26).

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