Automatic cutting and feeding device for semiconductor electronic component pins

Abstract

The utility model discloses an automatic cutting and feeding device for semiconductor electronic component pins. The automatic cutting and feeding device comprises a workbench, a feeding mechanism, a control box, a material placing mechanism, a plurality of cutting mechanisms and a recycling box, each cutting mechanism comprises a cutting assembly and a limiting assembly; each cutting assembly is provided with an adjusting structure. The material placing mechanism comprises a material frame and one or more positioning assemblies, and the positioning assemblies are arranged on the cutting assemblies respectively. Linkage synchronous adjustment of the cutting assemblies is achieved by arranging the adjusting structure, it is guaranteed that the distance between the two cutting assemblies is adjusted at equal intervals, the adjusting efficiency is improved, and the subsequent production efficiency and machining quality are guaranteed; the feeding assembly is arranged below the cutting assembly, the cut semiconductor electronic elements automatically fall onto the material frame to be placed, then automatic feeding is achieved, the feeding assembly is simple in structure, automatic falling is achieved, time is saved, the feeding action is coherent, and the feeding efficiency is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor electronic component pin cutting equipment, in particular to an automatic cutting and feeding device for semiconductor electronic component pins. Background Art

[0002] Resistors usually have longer pins on both sides when they leave the factory. When you buy a resistor for use, you usually need to cut the pins to the required length.

[0003] Currently, the cutting process of some resistor pins relies on manual labor. In order to improve efficiency, there are devices that can automatically cut resistor pins. Such devices are usually equipped with a cutter that can provide shear force to cut the pins. However, in the process of automatically cutting the pins with the cutter, the cutter often gets caught on the pins, causing the resistor to move out of the predetermined position and unable to be transmitted along the predetermined route and posture. It is very easy for the resistor to get stuck in the device, resulting in frequent shutdowns for maintenance during operation. In response to the above problems, people invented patent number: CN202321886362.6, which discloses an automatic cutting mechanism for resistor pins, in which the resistor on the resistor transmission assembly is located between the two inner gear plates, and the pins on both sides of the resistor are hooked by the clamping teeth on the two gear plates on the corresponding sides at the same time, so as to drive the resistor to rotate and transmit with the gear plates around the rotating shaft; the two corresponding outer gear plates are respectively provided with a cutter, which does not rotate with the gear plates, and has a cutting blade abutting against the side of the gear plate. During the rotation transmission of the resistor, the pin will move to the cutting blade, and a shear force acting on the pin is formed between the cutting blade and the gear plate to cut off the pin, thereby realizing automatic cutting of the pins on both sides of the resistor. However, the cutting mechanism still has the following problems: 1. The four gear plates, two cutters and the clamping part of the cutting mechanism can slide along the axial direction of the rotating shaft respectively, so as to adjust the cutting length of the pin to meet the requirements of different pin lengths. However, the adjustment method is a single sliding adjustment, and the synchronous spacing adjustment between the two cutters cannot be achieved. The cutting distances on both sides may be different during adjustment, and the adjustment efficiency is slow, which affects the production efficiency. 2. The feeding mechanism of the existing cutting mechanism is complicated, the action steps are cumbersome, and the time is long, which affects the efficiency of feeding or feeding. Utility Model Content

[0004] The utility model aims to solve the technical problems in the prior art such as slow adjustment efficiency of the cutting mechanism, complicated feeding steps and influence on the subsequent processing efficiency by providing an automatic cutting and feeding device for semiconductor electronic component pins in view of the current technical deficiencies.

[0005] The technical solution adopted by the utility model to achieve the above-mentioned purpose is:

[0006] An automatic cutting and feeding device for semiconductor electronic component pins comprises a workbench, a feeding mechanism, a control box, a material placement mechanism and a plurality of cutting mechanisms; the workbench is provided with a platform, a plurality of cutting mechanisms are arranged on the platform in an array, the material placement mechanism is arranged above the cutting mechanism; the feeding mechanism is arranged below the cutting mechanism; a recovery box is arranged below the feeding mechanism;

[0007] The cutting mechanisms all include a cutting component and a limiting component; the cutting components are all provided with an adjustment structure; the material placement mechanism includes a material rack and one or more positioning components, and the positioning components are respectively arranged on the cutting components.

[0008] As a further improvement, the platform is provided with a mounting plate, and the mounting plate is provided with a plurality of through holes arranged in an array; the cutting components include a mounting block, a servo motor, a linkage rod, two block blocks and two cutting blocks, and the mounting block is provided with a fixed block, and the mounting block is fixed to the mounting plate through the fixed block; the block is provided with two straight slot holes, and the straight slot holes are provided with mounting seats, and the mounting seats are provided with screws and bearings; the driving end of the servo motor is connected to the linkage rod, and the linkage rod is respectively inserted into the bearings; the two cutting blocks are arranged on the mounting seat in a mirror-image manner, and the cutting blocks are provided with notches; the notches are provided with tools.

[0009] As a further improvement, a pin key positioning structure is provided between the bearing and the linkage rod; the bearings are provided with gears, the gears are respectively arranged in the notches, the gears are provided with teeth, and slots are provided between the teeth. The slots between the two gears constitute positioning slots, and the positioning slots are used for the placement and positioning of semiconductor electronic components.

[0010] As a further improvement, the adjustment structure includes two groups of straight slot hole groups and two guide blocks, the two groups of straight slot hole groups are arranged on the mounting block in a mirror-image manner, the two guide blocks are respectively arranged on the straight slot hole groups, the straight slot hole groups each include two straight slot holes 1, the mounting block is also provided with a plurality of support buckle blocks, a positioning ring block and a linkage gear; the two guide blocks are each provided with a connecting block, one of the connecting blocks is provided with a rack 1, and the other connecting block is provided with a rack 2, and the rack 1 and the rack 2 both form a tooth linkage structure with the linkage gear.

[0011] As a further improvement, the guide blocks are each provided with two screws, and the guide blocks are connected to the connecting blocks via screws respectively; the screws are each provided with a spring, and the spring is arranged between the nut of the screw and the guide block; a spacing is provided between the guide block and the mounting block; the top of the guide block and the top of the mounting block are both provided with arc surfaces; the top of the guide block is each provided with a guide part, and the guide part is close to the gear.

[0012] As a further improvement, the limit assembly includes a servo motor 1, a first gear and a first clamping block, the driving end of the servo motor 1 is provided with a connecting rod, and the connecting rod penetrates into the end surface of the mounting plate, and the end of the connecting rod is provided with a cam; the first gear is fixed on the linkage rod; the first clamping block is provided with a rotating shaft, and the rotating shaft is fixedly connected to the mounting plate; the first clamping block is provided with a stop rod and a limit buckle, the limit buckle is arranged on the outer side of the first gear, and the stop rod is arranged on the inner side surface of the limit buckle; the mounting plate and the limit buckle are also provided with a connecting rod, and a tension spring is provided between the two connecting rods.

[0013] As a further improvement, the feeding mechanism includes a feeding assembly and an outer cover, the feeding assembly includes two guide rails, a chain and a first servo motor, the two guide rails are arranged below the cutting assembly in an upper and lower mirror-image manner, the first servo motor is arranged at one end of the guide rail, and the first servo motor is provided with a second gear; the chain is sleeved outside the two guide rails and the second gear; the chain is composed of a plurality of chain links, the chain links are each provided with a material rack, the material rack is each composed of two placement blocks, and the placement blocks are each provided with a plurality of placement slots.

[0014] As a further improvement, the outer cover is arranged at one end of the guide rail; the outer cover is provided with a funnel and two correction components arranged in mirror image; the two correction components each include a first mounting block, a first connecting block and a circular baffle, the first mounting block is arranged on the outer cover, the first connecting block is arranged on the first mounting block, and the circular baffle is arranged on the first connecting block; the first mounting block is provided with two first screws, the first connecting block is provided with two first straight slot holes, and the first connecting block is fixed to the first mounting block through the first straight slot holes.

[0015] As a further improvement, the platform is provided with a first bracket, and the material rack is arranged on the first bracket; the material rack is provided with multiple material placement bins and guide plates, and the guide plates are provided with guide rod brackets; the first bracket is provided with a first mounting plate, and the first mounting plate is provided with a second guide rod bracket, and multiple positioning components are arranged in an array at the bottom of the first mounting plate; multiple positioning components include positioning blocks, and the positioning blocks are provided with guide grooves, and the tops of the guide grooves are provided with arc surfaces.

[0016] As a further improvement, the first bracket is also provided with an operation control screen, the workbench is provided with a controller component and a plurality of adjustable supporting feet; the recycling box and the workbench are detachably connected.

[0017] Compared with the prior art, the above one or more technical solutions in the automatic cutting and feeding device for semiconductor electronic component pins provided by the embodiment of the utility model have at least one of the following technical effects:

[0018] 1. The utility model realizes the automatic action of feeding, loading, cutting and conveying the pins of semiconductor electronic components by setting a feeding mechanism, a material placement mechanism and a plurality of cutting mechanisms, thereby improving the automation efficiency; the adjustment of the cutting assembly is realized by setting an adjustment structure, and the tooth linkage structure is formed by using a rack 1, a rack 2 and a linkage gear, so that the linkage and synchronous adjustment can be achieved, thereby ensuring the equidistant adjustment of the distance between the two cutting assemblies, improving the adjustment efficiency, preventing the occurrence of different cutting distances on both sides during adjustment, and ensuring the subsequent production efficiency and processing quality;

[0019] 2. The feeding assembly is arranged below the cutting assembly, and the feeding assembly includes two guide rails, a chain and a first servo motor. A plurality of material racks are arranged on the chain, so that the cut semiconductor electronic components are automatically placed on the material racks, and then automatic feeding is realized. The feeding assembly has a simple structure, realizes automatic dropping, saves time, and has a continuous feeding action, thereby improving feeding efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.

[0021] Figure 1 This is a schematic diagram of the overall structure of the automatic cutting and feeding device for semiconductor electronic component pins of this embodiment;

[0022] Figure 2 is a schematic structural diagram of a cutting assembly of this embodiment;

[0023] Figure 3 This is a schematic structural diagram of the cutting assembly of this embodiment from another angle;

[0024] Figure 4 for Figure 1 An enlarged schematic diagram of A in FIG.

[0025] Figure 5Schematic diagram of the structure of the material rack of this embodiment;

[0026] Figure 6 Schematic diagram of the structure of the limit assembly of this embodiment. DETAILED DESCRIPTION

[0027] The following description is only a preferred embodiment of the present invention and does not limit the protection scope of the present invention.

[0028] For example, see the attached Figure 1 to Figure 6 A semiconductor electronic component pin automatic cutting and feeding device 1 comprises a workbench 2, a feeding mechanism 3, a control box 4, a material placement mechanism 5 and a plurality of cutting mechanisms 6; the workbench 2 is provided with a platform 7, a plurality of the cutting mechanisms 6 are arranged on the platform 7 in an array, the material placement mechanism 5 is arranged above the cutting mechanism 6; the feeding mechanism 3 is arranged below the cutting mechanism 6; a recovery box 8 is provided below the feeding mechanism 3;

[0029] The cutting mechanism 6 includes a cutting component 60 and a limiting component 61; the cutting component 60 is provided with an adjustment structure 62; the material placement mechanism 5 includes a material rack 50 and one or more positioning components 51, and the positioning components 51 are respectively arranged on the cutting component 60. The cutting mechanism 6 is used to cut the pins of multiple semiconductor electronic components to improve the efficiency of batch processing, and when one of them fails, there is no need to stop the machine and the processing can continue, thereby ensuring the stability of material feeding and the subsequent processing efficiency.

[0030] The platform 7 is provided with a mounting plate 70, and the mounting plate 70 is provided with a plurality of through holes arranged in an array; the cutting components 60 each include a mounting block 600, a servo motor 601, a linkage rod 602, two stoppers 603 and two cutting blocks 604, the mounting block 600 is provided with a fixing block 605, and the mounting block 600 is fixed to the mounting plate 70 by the fixing block 605; the stopper 603 is provided with two straight slot holes 606, and the straight slot holes 606 are each provided with a mounting seat 607, The mounting seats 607 are provided with screws and bearings; the driving end of the servo motor 601 is connected to the linkage rod 602, and the linkage rod 602 is respectively inserted into the bearings; the two cutting blocks 604 are arranged on the mounting seat 607 in a mirror-image manner, and the cutting blocks 604 are provided with notches 608; the notches 608 are provided with tools 609, and the cutting assembly 60 is used to synchronously cut off the pins of semiconductor electronic components to improve the cutting efficiency.

[0031] A pin key positioning structure is provided between the bearing and the linkage rod 602, and the pin key positioning structure includes a pin key and a keyway; the bearings are provided with gears 610, and the gears 610 are respectively arranged in the slots 608, and the gears 610 are provided with teeth, and a slot 610a is provided between the teeth, and the slot 610a between the two gears 610 constitutes a positioning slot, which is used for placing and positioning semiconductor electronic components, and the slot 610a between the gears 610 and the gears 610 constitutes a positioning slot 610a for arranging and conveying materials, thereby ensuring neat arrangement and improving subsequent cutting efficiency.

[0032] The adjustment structure 62 includes two groups of straight slot hole groups 620 and two guide blocks 621. The two groups of straight slot hole groups 620 are arranged on the mounting block 600 in a mirror-image manner. The two guide blocks 621 are respectively arranged on the straight slot hole groups 620. The straight slot hole groups 620 each include two straight slot holes. The mounting block 600 is also provided with a plurality of support buckle blocks, a positioning ring block and a linkage gear. The two guide blocks 621 are both provided with a connecting block, one of which is provided with a rack 621a, and the other is provided with a toothed rack 621a. The connecting block is provided with a rack 2 621b, and the rack 1 621a and the rack 2 621b both form a tooth linkage structure with the linkage gear, so that they can be linked and adjusted synchronously to improve the adjustment efficiency; the rack 1 621a and the rack 2 621b are both provided with an operating part; the adjustment structure 62 can form different spacings according to the pin cutting requirements, so that the cutting component 60 can be cut into semiconductor electronic components of different specifications and sizes, thereby improving applicability, and the adjustment is simple, improving the adjustment efficiency, thereby ensuring processing efficiency.

[0033] The guide block 621 is provided with two screws 1, and the guide block 621 is connected to the connecting block through the screws 1 respectively; the screw 1 is provided with a spring 621c, and the spring 621c is arranged between the nut 1 of the screw 1 and the guide block 621, and the spring 621c is used to make the guide block 621 and the mounting block 600 elastically connected, so that it can be used for the passage of electronic materials of different thicknesses, improve the applicability, and ensure the straightness of the semiconductor electronic component materials during transportation, and ensure the subsequent processing efficiency and stability; a spacing is provided between the guide block 621 and the mounting block 600, and the spacing is used for the correction of the material to ensure the transportation stability of the material; the top of the guide block 621 and the top of the mounting block 600 are both provided with arc surfaces; the top of the guide block 621 is provided with a guiding part, and the guiding part is close to the gear 610. The guide block 621 is used for the arrangement, guidance and arrangement of the semiconductor electronic component materials to ensure that they fall into the position of the gear 610, thereby ensuring the subsequent cutting efficiency and quality.

[0034] The limiting assembly 61 includes a servo motor 610, a first gear 611 and a first clamping block 612. A connecting rod is provided at the driving end of the servo motor 610, and the connecting rod penetrates the end surface of the mounting plate 70. A cam 613 is provided at the end of the connecting rod. The first gear 611 is fixed on the linkage rod 602. The first clamping block 612 is provided with a rotating shaft, and the rotating shaft is fixedly connected to the mounting plate 70. The first clamping block 612 is provided with a blocking rod 614 and a limiting buckle 615. The limiting buckle 615 is arranged on the outer side of the first gear 611, and the blocking rod 614 is arranged on the inner side surface of the limiting buckle 615. The mounting plate 70 and the limiting buckle 615 are also provided with a connecting rod, and a tension spring 616 is provided between the two connecting rods. The limiting assembly 61 is used to ensure the unidirectionality of the conveying of semiconductor electronic component materials, prevent the linkage rod 602 from flipping, and ensure the efficiency and stability of the cutting and processing of semiconductor electronic component materials.

[0035] The feeding mechanism 3 includes a feeding assembly 30 and an outer cover 31, the feeding assembly 30 includes two guide rails 300, a chain 301 and a first servo motor 302, the two guide rails 300 are arranged below the cutting assembly 60 in an upper and lower mirror-image manner, the first servo motor 302 is arranged at one end of the guide rail 300, and the first servo motor 302 is provided with a second gear 303; the chain 301 is sleeved outside the two guide rails 300 and the second gear 303; the chain 301 is composed of a plurality of chain links, each of which is provided with a material rack 301a, each of which is composed of two placement blocks, each of which is provided with a plurality of placement slots 301b, the material rack 301a is used for the falling and placement of cut semiconductor electronic component materials, and the feeding assembly 30 is used for conveying and feeding the cut semiconductor electronic component materials.

[0036] The outer cover 31 is arranged at one end of the guide rail 300; the outer cover 31 is provided with a funnel 310 and two correction components 311 arranged in mirror image; the two correction components 311 each include a first mounting block 311a, a first connecting block 311b and a circular baffle 311c, the first mounting block 311a is arranged on the outer cover 31, the first connecting block 311b is arranged on the first mounting block 311b, and the circular baffle 311c is arranged on the first connecting block 311b; the first mounting block 311a is provided with two first screws, the first connecting block 311b is provided with two first straight slot holes, the first connecting block 311b is fixed to the first mounting block 311a through the first straight slot holes, and the correction component 311 is used to correct the cut semiconductor electronic components during transportation to ensure the subsequent linkage feeding action.

[0037] The platform 7 is provided with a first bracket, and the material rack 50 is arranged on the first bracket; the material rack 50 is provided with multiple material placement bins 500 and a guide plate 501, and the guide plate 501 is provided with a guide rod bracket 502; the first bracket is provided with a first mounting plate, and the first mounting plate is provided with a second guide rod bracket, and multiple positioning components 51 are arranged in an array at the bottom of the first mounting plate 70; multiple positioning components 51 include a positioning block, and the positioning block is provided with a guide groove, and the top of the guide groove is provided with an arc surface, the material rack 50 is used to place materials of semiconductor electronic components with pins, the first guide rod bracket and the second guide rod bracket are used for guiding electronic coil materials, and the positioning component 51 is used for adjusting and positioning the position of semiconductor electronic component coil materials.

[0038] The first bracket is also provided with an operation control screen 11, and the workbench 2 is provided with a controller assembly and a plurality of adjustable support legs 12; the recycling box 8 is detachably connected to the workbench 2; the recycling box 8 is used for recycling the cut pin waste.

[0039] The utility model realizes the automatic actions of feeding, loading, pin cutting and conveying the pins of semiconductor electronic components by arranging a feeding mechanism, a material placement mechanism and a plurality of cutting mechanisms, thereby improving the automation efficiency; the adjustment of the cutting component is realized by arranging an adjustment structure, and a tooth linkage structure is formed by using a rack one, a rack two and a linkage gear, so that linkage and synchronous adjustment can be achieved, thereby ensuring the equidistant adjustment of the spacing between the two cutting components, improving the adjustment efficiency, preventing the occurrence of different cutting distances on both sides during adjustment, and ensuring the subsequent production efficiency and processing quality; the feeding component is arranged below the cutting component, and the feeding component includes two guide rails, a chain and a first servo motor, and a plurality of material racks are arranged on the chain, so that the semiconductor electronic components that have been cut are automatically dropped onto the material racks for placement, and then automatic feeding is realized, and the feeding component has a simple structure, realizes automatic material dropping, saves time, and has a continuous feeding action, thereby improving the feeding efficiency.

[0040] The present invention is not limited to the above-mentioned embodiments. Other automatic cutting and feeding devices for semiconductor electronic component pins obtained by adopting the same or similar structures or devices as the above-mentioned embodiments of the present invention are all within the protection scope of the present invention.

Claims

1. A semiconductor electronic component pin automatic cutting and feeding device, characterized in that: The automatic cutting and feeding device for semiconductor electronic component pins comprises a workbench, a feeding mechanism, a control box, a material placement mechanism and a plurality of cutting mechanisms; the workbench is provided with a platform, a plurality of cutting mechanisms are arranged on the platform in an array, the material placement mechanism is arranged above the cutting mechanism; the feeding mechanism is arranged below the cutting mechanism; a recovery box is arranged below the feeding mechanism; The cutting mechanisms all include a cutting component and a limiting component; the cutting components are all provided with an adjustment structure; the material placement mechanism includes a material rack and one or more positioning components, and the positioning components are respectively arranged on the cutting components.

2. The automatic cutting and feeding device for semiconductor electronic component pins according to claim 1, characterized in that: The platform is provided with a mounting plate, and the mounting plate is provided with a plurality of through holes arranged in an array; the cutting components each include a mounting block, a servo motor, a linkage rod, two stoppers and two cutting blocks, and the mounting block is provided with a fixing block, and the mounting block is fixed to the mounting plate through the fixing block; the stopper is provided with two straight slot holes, and the straight slot holes are provided with mounting seats, and the mounting seats are provided with screws and bearings; the driving end of the servo motor is connected to the linkage rod, and the linkage rod is respectively inserted into the bearings; the two cutting blocks are arranged on the mounting seat in a mirror-image manner, and the cutting blocks are provided with notches; the notches are provided with tools.

3. The automatic cutting and feeding device for semiconductor electronic component pins according to claim 2, characterized in that: A pin key positioning structure is provided between the bearing and the linkage rod; the bearings are provided with gears, the gears are respectively arranged in the notches, the gears are provided with teeth, and slots are provided between the teeth. The slots between the two gears constitute positioning slots, and the positioning slots are used for placing and positioning semiconductor electronic components.

4. The automatic cutting and feeding device for semiconductor electronic component pins according to claim 3, characterized in that: The adjustment structure includes two groups of straight slot hole groups and two guide blocks. The two groups of straight slot hole groups are arranged on the mounting block in a mirror-image manner. The two guide blocks are respectively arranged on the straight slot hole groups. The straight slot hole groups each include two straight slot holes 1. The mounting plate is also provided with a plurality of supporting buckle blocks, a positioning ring block and a linkage gear. The two guide blocks are each provided with a connecting block, one of the connecting blocks is provided with a rack 1, and the other connecting block is provided with a rack 2. The rack 1 and the rack 2 both form a tooth linkage structure with the linkage gear.

5. The automatic cutting and feeding device for semiconductor electronic component pins according to claim 4, characterized in that: The guide blocks are each provided with two screws 1, and the guide blocks are connected to the connecting blocks via screws 1 respectively; the screws 1 are provided with a spring, and the spring is arranged between the nut 1 of the screw 1 and the guide block; a spacing is provided between the guide block and the mounting block; the top of the guide block and the top of the mounting block are both provided with arc surfaces; the top of the guide block is each provided with a guide part, and the guide part is close to the gear.

6. The automatic cutting and feeding device for semiconductor electronic component pins according to claim 5, characterized in that: The limit assembly includes a servo motor 1, a first gear and a first clamping block, a driving end of the servo motor 1 is provided with a connecting rod, and the connecting rod penetrates the end surface of the mounting plate, and a cam is provided at the end of the connecting rod; the first gear is fixed on the linkage rod; the first clamping block is provided with a rotating shaft, and the rotating shaft is fixedly connected to the mounting plate; the first clamping block is provided with a stop rod and a limit buckle, the limit buckle is arranged on the outer side of the first gear, and the stop rod is arranged on the inner side surface of the limit buckle; the mounting plate and the limit buckle are also provided with a connecting rod, and a tension spring is provided between the two connecting rods.

7. The automatic cutting and feeding device for semiconductor electronic component pins according to claim 6, characterized in that: The feeding mechanism includes a feeding assembly and an outer cover, the feeding assembly includes two guide rails, a chain and a first servo motor, the two guide rails are arranged below the cutting assembly in an up and down mirror-image manner, the first servo motor is arranged at one end of the guide rail, and the first servo motor is provided with a second gear; the chain is sleeved outside the two guide rails and the second gear; the chain is composed of a plurality of chain links, the chain links are each provided with a material rack, the material rack is each composed of two placement blocks, and the placement blocks are each provided with a plurality of placement slots.

8. The automatic cutting and feeding device for semiconductor electronic component pins according to claim 7, characterized in that: The outer cover is arranged at one end of the guide rail; the outer cover is provided with a funnel and two correction components arranged in mirror image; the two correction components each include a first mounting block, a first connecting block and a circular baffle, the first mounting block is arranged on the outer cover, the first connecting block is arranged on the first mounting block, and the circular baffle is arranged on the first connecting block; the first mounting block is provided with two first screws, the first connecting block is provided with two first straight slot holes, and the first connecting block is fixed to the first mounting block through the first straight slot holes.

9. The automatic cutting and feeding device for semiconductor electronic component pins according to claim 8, characterized in that: The platform is provided with a first bracket, and the material rack is arranged on the first bracket; the material rack is provided with multiple material placement bins and guide plates, and the guide plates are provided with guide rod brackets; the first bracket is provided with a first mounting plate, and the first mounting plate is provided with a second guide rod bracket, and multiple positioning components are arranged in an array at the bottom of the first mounting plate; multiple positioning components include positioning blocks, and the positioning blocks are provided with guide grooves, and the tops of the guide grooves are provided with arc surfaces.

10. The automatic cutting and feeding device for semiconductor electronic component pins according to claim 9, characterized in that: The first bracket is also provided with an operation control screen, and the workbench is provided with a controller component and a plurality of adjustable supporting feet; the recycling box and the workbench are detachably connected.

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