Bonding wire annealing device capable of rapidly cooling

Abstract

The utility model relates to the technical field of bonding wire annealing devices, in particular to a bonding wire annealing device capable of rapidly cooling, which comprises a device shell, a discharge port is arranged on one side of the device shell, a feed port is arranged on the other side of the device shell, and the discharge port is communicated with the feed port. A placing plate is fixedly connected to the lower ends of the discharging port and the feeding port, a placing groove is formed in the placing plate, rotating motors are symmetrically and fixedly connected to the two sides of the front end of the device shell, the output ends of the rotating motors penetrate into the device shell to be fixedly connected with rotating rolling shafts, and fixed rolling shafts are rotationally connected to the inner wall of the device shell at the lower ends of the rotating rolling shafts; the inner walls of the front end and the rear end of one side of the interior of the device shell are rotationally connected with a plurality of sets of placement rolling shafts, one side of the upper end face of the device shell is fixedly connected with a fan, and the bonding wire annealing device capable of rapidly cooling has the advantages that the bonding wires can be placed in parallel to facilitate cooling, and cooling of the bonding wires can be accelerated through the fan.

Description

Technical Field

[0001] The utility model relates to the technical field of bonding wire annealing devices, in particular to a bonding wire annealing device capable of rapidly cooling down. Background Art

[0002] The bonding wire annealing device is an important equipment used in the production of semiconductor bonding wires. Its main function is to control the heating and cooling process so that the bonding wire material reaches a specific physical and chemical state, thereby improving its mechanical and electrical properties. Specifically, the bonding wire annealing device usually includes a heating furnace and a cooling system. During the heating stage, the bonding wire is placed in the heating furnace, and the temperature and time of the heating furnace are controlled to make the bonding wire reach the predetermined annealing temperature. During the annealing process, the crystal structure inside the bonding wire material will change, thereby eliminating or reducing internal stress and defects, and improving its strength and toughness. After the current annealing device anneals and heats the bonding wire, the bonding wire needs to be cooled before entering the next process. Due to the high temperature, the cooling time is slow and time-consuming.

[0003] Therefore, it is necessary to provide a new bonding wire annealing device that can quickly cool down to solve the above technical problems. Utility Model Content

[0004] In order to solve the above technical problems, the utility model provides a bonding wire annealing device capable of rapidly cooling down.

[0005] The bonding wire annealing device capable of rapidly cooling down provided by the utility model comprises:

[0006] The device shell has a discharge port on one side of the device shell and a feed port on the other side of the device shell. The lower ends of the discharge port and the feed port are fixedly connected with a placement plate, and the placement plate has a placement groove.

[0007] The rollers are placed, and the two sides of the front end of the device shell are symmetrically fixedly connected with rotating motors, the output end of the rotating motor penetrates into the device shell and is fixedly connected with rotating rollers, the lower end of the rotating roller is rotatably connected with the inner wall of the device shell, and multiple groups of placement rollers are rotatably connected to the inner walls of the front and rear ends of one side of the inner shell of the device, and a fan is fixedly connected to one side of the upper end surface of the device shell;

[0008] A heating unit is provided, wherein a heating chamber is fixedly connected to the inner center of the device shell, and a heating unit is fixedly connected to the upper and lower inner walls of the heating chamber.

[0009] Preferably, the lower end of the device housing is fixedly connected to a base, and the device can be fixed by the provided base.

[0010] Preferably, support feet are fixedly connected to the four directions of the lower end of the base, and the entire device can be supported by the provided support feet.

[0011] Preferably, the supporting legs are fixedly connected by a cross beam, and the support structure of the supporting legs can be strengthened by the provision of the cross beam.

[0012] Preferably, a filter is fixedly connected to the upper end of the fan, and the filter can prevent debris from entering the device.

[0013] Preferably, a controller is fixedly connected to one side of the front end surface of the device housing, and the device can be intuitively operated through the provided controller.

[0014] Preferably, the rotating motor, the fan and the heating unit are electrically connected to the controller via wires, and power and control signals can be transmitted to each electronic component via the provided wires.

[0015] Preferably, a power cord is fixedly connected to one side of the controller, and the device can be provided with power through the provided power cord.

[0016] Compared with the related art, the bonding wire annealing device capable of rapid cooling provided by the utility model has the following beneficial effects:

[0017] The utility model provides a bonding wire annealing device capable of rapidly cooling down;

[0018] 1. The utility model can fix the bonding wire by means of the placement roller, and can control the output end of the rotating motor 12 to rotate by means of the controller 9 to drive the rotating roller 15 to move the bonding wire to the heating chamber 17, and anneal the bonding wire by means of the heating unit 18. After heating, the bonding wire is again driven by the rotating roller 15 to move to the upper end of the placement roller 16, so as to facilitate cooling and heat dissipation of the bonding wire;

[0019] 2. The utility model can cool down the bonding wire by means of a fan. The controller 9 can control the fan 13 to draw air from the upper end into the device, and the motor 13 can cool down the bonding wire placed on the roller 16, thereby further accelerating the cooling of the bonding wire. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 This is a schematic diagram of the overall structure of the bonding wire annealing device capable of rapid temperature reduction provided by the utility model;

[0021] Figure 2 for Figure 1 A schematic top view of the cross-sectional structure of a bonding wire annealing device capable of rapid temperature reduction is shown;

[0022] Figure 3 for Figure 1 The front cross-sectional structural schematic diagram of a bonding wire annealing device capable of rapid cooling is shown.

[0023] Numbers in the figure: 1. Device housing; 2. Base; 3. Support legs; 4. Crossbeam; 5. Discharge port; 6. Feed port; 7. Placement plate; 8. Placement slot; 9. Controller; 10. Power cord; 11. Electric wire; 12. Rotating motor; 13. Fan; 14. Filter; 15. Rotating roller; 16. Placement roller; 17. Heating chamber; 18. Heating unit; 19. Fixed roller. DETAILED DESCRIPTION

[0024] In order to make the purpose, technical solution and advantages of the utility model more clear, the utility model is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the utility model and are not used to limit the utility model.

[0025] The specific implementation of the present utility model is described in detail below in conjunction with specific embodiments.

[0026] See also Figures 1 to 3 The embodiment of the utility model provides a bonding wire annealing device capable of rapid cooling, and the bonding wire annealing device capable of rapid cooling includes:

[0027] The device housing 1 has a discharge port 5 on one side of the device housing 1 and a feed port 6 on the other side of the device housing 1. The lower ends of the discharge port 5 and the feed port 6 are fixedly connected with a placement plate 7, and the placement plate 7 has a placement groove 8.

[0028] The rollers 16 are placed, and the rotating motors 12 are symmetrically fixedly connected to the two sides of the front end of the device housing 1. The output end of the rotating motor 12 penetrates into the device housing 1 and is fixedly connected to the rotating rollers 15. The lower end of the rotating rollers 15 is rotatably connected to the inner wall of the device housing 1. A plurality of groups of placing rollers 16 are rotatably connected to the inner walls of the front and rear ends of one side of the inner side of the device housing 1. A fan 13 is fixedly connected to one side of the upper end surface of the device housing 1.

[0029] A heating unit 18 is fixedly connected to a heating chamber 17 at the inner center of the device housing 1 , and a heating unit 18 is fixedly connected to the upper and lower inner walls of the heating chamber 17 .

[0030] It should be noted that: the controller 9 can be used to control the output end of the rotating motor 12 to rotate and drive the rotating roller 15 to move the bonding wire to the heating chamber 17, and the bonding wire is annealed by the heating unit 18. After heating, the bonding wire is driven by the rotating roller 15 to move to the upper end of the placement roller 16 again, so as to facilitate cooling and heat dissipation of the bonding wire. The controller 9 can control the fan 13 to suck air from the upper end into the device, and the bonding wire on the placement roller 16 is cooled by the motor 13, thereby achieving further accelerated cooling of the bonding wire.

[0031] In the embodiments of the present invention, please refer to Figure 1 and Figure 3 The lower end of the device housing 1 is fixedly connected with a base 2, and the device can be fixed by the provided base 2.

[0032] In the embodiments of the present invention, please refer to Figure 1 and Figure 3 The four directions of the lower end of the base 2 are fixedly connected with supporting feet 3, and the entire device can be supported by the provided supporting feet 3.

[0033] In the embodiments of the present invention, please refer to Figure 1 and Figure 3 The supporting legs 3 are fixedly connected by a cross beam 4, and the support structure of the supporting legs 3 can be strengthened by setting the cross beam 4.

[0034] In the embodiments of the present invention, please refer to Figure 1 and Figure 3 A filter screen 14 is fixedly connected to the upper end of the fan 13, and the filter screen 14 can prevent debris from entering the device.

[0035] In the embodiments of the present invention, please refer to Figure 1 and Figure 3 A controller 9 is fixedly connected to one side of the front end surface of the device housing 1, and the device can be operated intuitively through the provided controller 9.

[0036] In the embodiments of the present invention, please refer to Figure 1 and Figure 3 The rotating motor 12, the fan 13 and the heating unit 18 are electrically connected to the controller 9 through the wires 11, and the power and control signals can be transmitted to each electronic component through the set wires 11.

[0037] In the embodiments of the present invention, please refer to Figure 1 and Figure 3 A power cord 9 is fixedly connected to one side of the controller 9, and the power cord 9 can provide power to the device.

[0038] The working principle of the bonding wire annealing device capable of rapid temperature reduction provided by the utility model is as follows:

[0039] When in use, first manually connect the power cord 10 to electricity, then manually put the bonding wire into the device from the feed port 6, and then control the output end of the rotating motor 12 to rotate through the controller 9 to drive the rotating roller 15 to cooperate with the fixed roller 19 to move the bonding wire to the heating chamber 17, and anneal the bonding wire through the heating unit 18. After heating, the bonding wire is driven to move to the upper end of the placement roller 16 by the rotating roller 15 again, so as to facilitate cooling and heat dissipation of the bonding wire. The controller 9 can control the fan 13 to suck the air from the upper end into the device, and the motor 13 is used to cool the bonding wire on the placement roller 16, so as to further accelerate the cooling of the bonding wire, and the rotating roller 15 is used to cooperate with the fixed roller 19 to move the bonding wire out of the device from the discharge port 5.

[0040] The above description is only an embodiment of the present invention, and does not limit the patent scope of the present invention. Any equivalent structure or equivalent process transformation made by using the contents of the specification and drawings of the present invention, or directly or indirectly applied in other related technical fields, are also included in the patent protection scope of the present invention.

Claims

1. A bonding wire annealing device capable of rapid temperature reduction, characterized in that: include: A device housing (1), wherein a discharge port (5) is provided on one side of the device housing (1), and a feed port (6) is provided on the other side of the device housing (1); a placement plate (7) is fixedly connected to the lower ends of the discharge port (5) and the feed port (6), and a placement groove (8) is provided on the placement plate (7); The device housing (1) is provided with a placement roller (16), the front ends of the device housing (1) are symmetrically fixedly connected to the rotating motor (12), the output end of the rotating motor (12) penetrates into the device housing (1) and is fixedly connected to the rotating roller (15), the lower end of the rotating roller (15) is rotatably connected to the inner wall of the device housing (1), the inner wall of the front and rear ends of one side of the device housing (1) is rotatably connected to multiple groups of placement rollers (16), and the upper end surface of the device housing (1) is fixedly connected to a fan (13); A heating unit (18), wherein a heating chamber (17) is fixedly connected to the center of the interior of the device housing (1), and a heating unit (18) is fixedly connected to the upper and lower inner walls of the heating chamber (17).

2. The bonding wire annealing device capable of rapid temperature reduction according to claim 1, characterized in that: The lower end of the device housing (1) is fixedly connected to a base (2).

3. The bonding wire annealing device capable of rapid temperature reduction according to claim 2, characterized in that: Support feet (3) are fixedly connected to four directions of the lower end of the base (2).

4. The bonding wire annealing device capable of rapid temperature reduction according to claim 3, characterized in that: The supporting legs (3) are fixedly connected via a crossbeam (4).

5. The bonding wire annealing device capable of rapid temperature reduction according to claim 1, characterized in that: The upper end of the fan (13) is fixedly connected to a filter screen (14).

6. The bonding wire annealing device capable of rapid temperature reduction according to claim 1, characterized in that: A controller (9) is fixedly connected to one side of the front end surface of the device housing (1).

7. The bonding wire annealing device capable of rapid temperature reduction according to claim 6, characterized in that: The rotating motor (12), the fan (13) and the heating unit (18) are electrically connected to the controller (9) via electric wires (11).

8. The bonding wire annealing device capable of rapid temperature reduction according to claim 6, characterized in that: A power line (10) is fixedly connected to one side of the controller (9).

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