Wafer feeding and conveying system

Abstract

The utility model discloses a wafer feeding and conveying system, which relates to the technical field of normal-pressure chemical deposition and comprises an equipment body. A wafer carrying platform, a robot, a wafer cooling rotating platform, a wafer lifting system, a main supporting plate, a first linear guide rail, a first driving motor, a wafer heating assembly, a wafer heating assembly support and a vacuum generation system are arranged in the equipment body. According to the system provided by the utility model, the non-metal material layer made of high-purity quartz, Si or SiC is arranged, so that the wafer is prevented from being polluted; after the wafer is moved out through the wafer lifting system and the first linear guide rail, the wafer is independently deposited under the wafer heating assembly; and the deposition surface of each wafer completes film deposition at one time, so that the limitation of gas diffusion and transmission is eliminated, and the thickness and quality uniformity of the deposited film are better. High-purity quartz, a robot and other transportation measures are adopted in a closed system, pollution of personnel to wafers is isolated, and the wafer coating efficiency and the equipment integration degree are improved.

Description

Technical Field

[0001] The utility model relates to the technical field of atmospheric pressure chemical deposition, in particular to a wafer feeding material conveying system. Background Art

[0002] Atmospheric pressure chemical vapor deposition refers to the process of spraying a gaseous reaction source at a uniform speed onto the surface of a heated solid substrate under an environment with a pressure close to atmospheric pressure, causing the reaction source to undergo a chemical reaction on the substrate surface, and the reaction products to be deposited on the substrate surface to form a thin film.

[0003] like Figure 4 As shown, wafer transportation and deposition are usually achieved by placing the wafer substrate on a flexible conveyor belt 05 for continuous movement, and loading and unloading the wafer through rollers. The conveyor belt 05 is provided with a graphite substrate 06, and the process gas 01 is introduced from the top of the conveyor belt 05. The bottom of the conveyor belt 05 is provided with a belt cleaner 02 and an exhaust 03 to discharge the process gas 01; a heater 05 is provided under the conveyor belt 05. Due to the limitations of gas diffusion and transmission in conventional transportation methods, the thickness and quality of the deposited film are prone to certain non-uniformity on the substrate surface, resulting in variability and inconsistency in device performance. Summary of the invention

[0004] In order to solve the above technical problems, the utility model provides a wafer feeding material conveying system, which adopts high-purity quartz, robots and other transportation measures to isolate personnel from polluting wafers and improve wafer coating efficiency.

[0005] To achieve the above purpose, the utility model provides the following solutions:

[0006] The utility model provides a wafer feeding and conveying system, comprising an equipment body, wherein a wafer carrying platform, a robot, a wafer cooling and rotating platform, a wafer lifting system, a main support plate, a first linear guide rail, a first driving motor, a wafer heating component, a wafer heating component support and a vacuum generating system are arranged in the equipment body; the robot is arranged between the wafer carrying platform and the main support plate; the wafer carrying platform is used to carry a wafer box, and the wafer box is used to place wafers; a wafer cooling and rotating platform is arranged at one end of the main support plate close to the robot; a first linear guide rail is arranged on the main support plate, the wafer heating component support is slidably arranged on the first linear guide rail, and the wafer heating component is arranged on the wafer heating component support; the first driving motor is used to drive the wafer heating component support to slide on the first linear guide rail; the wafer heating component is connected to the vacuum generating system; the wafer lifting system is arranged on one side of the wafer cooling and rotating platform close to the wafer heating component support.

[0007] Optionally, the wafer cooling rotating platform includes a wafer holder, a wafer support, a rotating plate, an intermediate rotating shaft, a third driving motor and a holder support; the intermediate rotating shaft passes through the main support plate; the third driving motor is transmission-connected to the intermediate rotating shaft, and the third driving motor is used to drive the intermediate rotating shaft to rotate; the top of the intermediate rotating shaft is connected to the middle of the rotating plate; a wafer holder is respectively provided at both ends of the rotating plate, and a wafer support is provided on the wafer holder.

[0008] Optionally, the wafer support is made of high-purity non-metallic material.

[0009] Optionally, an optical fiber sensor is provided on the wafer support, and the optical fiber sensor is used to detect whether there is a wafer on the wafer support.

[0010] Optionally, the wafer lifting system includes a first wafer trolley, a second wafer trolley, a lifting cylinder, a second linear guide and a second drive motor; the first wafer trolley passes through the main support plate; the second wafer trolley is arranged on the first wafer trolley; the second drive motor is arranged at the bottom of the second linear guide, and the two linear guides are connected to the first wafer trolley; the lifting cylinder is arranged at the bottom of the second wafer trolley, and the lifting cylinder is used to drive the second wafer trolley; the second wafer trolley is located directly below the wafer support on the side of the wafer cooling rotating platform close to the wafer heating component support.

[0011] Optionally, both the first wafer trolley and the second wafer trolley are provided with wafer supports, and the wafer supports are used to support wafers.

[0012] Optionally, the wafer supports are all made of high-purity non-metallic materials.

[0013] Optionally, a drag chain is provided on the wafer heating assembly support, and the drag chain is used to place the wiring harness of the wafer heating assembly.

[0014] Optionally, a glass window is provided on a side of the equipment body close to the wafer mounting platform.

[0015] Optionally, the vacuum generating system includes a screw pump.

[0016] Compared with the prior art, the utility model has achieved the following technical effects:

[0017] The wafer feeding and conveying system in the utility model prevents the wafer from being contaminated by setting a non-metallic material layer of high-purity quartz, Si or SiC on the wafer support, rotating plate and vacuum adsorption port; after the wafer is moved out through the wafer lifting system and the first linear guide rail, it is deposited separately under the wafer heating component; the deposition surface of each wafer completes the film deposition at one time, getting rid of the limitations of gas diffusion and transmission, and the thickness and quality uniformity of the deposited film are better. High-purity quartz, robots and other transportation measures are adopted, and the system is in a closed system to isolate personnel from contaminating the wafer, thereby improving the wafer coating efficiency and equipment integration. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings required for use in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0019] Figure 1 It is a side view of the wafer conveying process of the embodiment of the utility model;

[0020] Figure 2 It is a top view of the wafer conveying process of the embodiment of the utility model;

[0021] Figure 3 It is a top view of a wafer cooling rotating platform in the form of a single wafer support platform according to an embodiment of the utility model;

[0022] Figure 4 This is a schematic diagram of the wafer transportation process for conventional atmospheric pressure chemical vapor deposition.

[0023] Description of reference numerals: 01, process gas; 02, belt cleaner; 03, exhaust; 04, heater; 05, conveyor belt; 06, graphite substrate;

[0024] 1. Equipment body; 2. Glass window; 3. Wafer loading platform; 4. Wafer box; 401. First wafer box; 402. Second wafer box; 403. Third wafer box; 5. Robot; 6. Wafer cooling rotating platform; 601. Wafer pallet; 602. Wafer support; 603. Rotating plate; 604. Intermediate rotating axis; 605. Third drive motor; 606. Pallet support; 7. Wafer lifting system; 701. First wafer trolley; 702. Second wafer trolley; 703. Lifting cylinder; 704. Second linear guide; 705. Second drive motor; 8. Main support plate; 9. First linear guide; 10. First drive motor; 11. Wafer heating assembly; 12. Wafer heating assembly support; 13. Vacuum generating system; 14. Wafer; 15. Drag chain. DETAILED DESCRIPTION

[0025] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0026] like Figures 1 to 3 As shown, this embodiment provides a wafer feeding and conveying system, including an equipment body 1, in which a wafer loading platform 3, a robot 5, a wafer cooling and rotating platform 6, a wafer lifting system 7, a main support plate 8, a first linear guide rail 9, a first drive motor 10, a wafer heating component 11, a wafer heating component support 12 and a vacuum generating system 13 are arranged; the robot 5 is arranged between the wafer loading platform 3 and the main support plate 8; the wafer loading platform 3 is used to carry a wafer box 4, and the wafer box 4 is used to place a wafer 14; the main support plate 8 A wafer cooling rotating platform 6 is arranged at one end close to the robot 5; a first linear guide rail 9 is arranged on the main support plate 8, a wafer heating component support 12 is slidably arranged on the first linear guide rail 9, and a wafer heating component 11 is arranged on the wafer heating component support 12; a first driving motor 10 is used to drive the wafer heating component support 12 to slide on the first linear guide rail 9; the wafer heating component 11 is connected to the vacuum generating system 13; a wafer lifting system 7 is arranged on one side of the wafer cooling rotating platform 6 close to the wafer heating component support 12.

[0027] In this specific embodiment, the wafer cooling rotating platform 6 includes a wafer holder 601, a wafer support 602, a rotating plate 603, an intermediate rotating shaft 604, a third driving motor 605 and a holder support 606; the intermediate rotating shaft 604 passes through the main support plate 8; the third driving motor 605 is transmission-connected to the intermediate rotating shaft 604, and the third driving motor 605 is used to drive the intermediate rotating shaft 604 to rotate; the top of the intermediate rotating shaft 604 is connected to the middle of the rotating plate 603; a wafer holder 601 is respectively arranged at both ends of the rotating plate 603, and a wafer support 602 is arranged on the wafer holder 601, and the wafer support 602 is made of high-purity non-metallic material.

[0028] The wafer lifting system 7 includes a first wafer trolley 701, a second wafer trolley 702, a lifting cylinder 703, a second linear guide rail 704 and a second drive motor 705; the first wafer trolley 701 passes through the main support plate 8; the second wafer trolley 702 is arranged on the first wafer trolley 701; the second drive motor 705 is arranged at the bottom of the second linear guide rail 704, and the two linear guides are connected to the first wafer trolley 701; the lifting cylinder 703 is arranged at the bottom of the second wafer trolley 702, and the lifting cylinder 703 is used to drive the second wafer trolley 702; the second wafer trolley 702 is located directly below the wafer support 601 on the side of the wafer cooling rotating platform 6 close to the wafer heating component support 12.

[0029] The wafer support 601, the first wafer trolley 701 and the second wafer trolley 702 are all made of high-purity non-metallic materials. The first wafer trolley 701 and the second wafer trolley 702 are both provided with wafer supports, which are used to support the wafer 14 and are all made of high-purity non-metallic materials.

[0030] A drag chain 15 is provided on the wafer heating assembly support 12 , and the drag chain 15 is used to place the wiring harness of the wafer heating assembly 11 , and to restrain and protect the wiring harness during movement.

[0031] A glass window 2 is provided on one side of the equipment body 1 close to the wafer mounting platform 3 .

[0032] The vacuum generating system 13 includes a screw pump, which generates a clean vacuum system to provide vacuum adsorption capability for the wafer heating assembly 11 and the robot 5 to avoid mechanical fixation damage or contamination of the wafer 14 .

[0033] The operation flow of the wafer feeding material conveying system for atmospheric pressure chemical vapor deposition in this embodiment is as follows:

[0034] a. The robot 5 absorbs a wafer 14 on which a thin film needs to be deposited from the wafer box 4 on the wafer loading platform 3;

[0035] b, the robot 5 places the wafer 14 to be coated on the wafer support 601 on the wafer cooling rotating platform 6 close to the side of the robot 5, and the wafer 14 is supported by the wafer support 602;

[0036] c. After the rotating plate 603 rotates 180° around the middle rotating axis 604, the wafers 14 to be coated are now on the side of the rotating plate 603 close to the wafer heating assembly 11, and the robot 5 absorbs the next batch of wafers 14 to be coated from the wafer box 4 on the wafer loading platform 3 and places them on the wafer support 601 on the rotating plate 603 close to the side of the robot 5;

[0037] d. The wafer heating assembly support 12 and the wafer heating assembly 11 thereon move along the first linear guide rail 9 to a position directly above the wafer support table 601 on the side of the wafer cooling rotating platform 6 close to the wafer heating assembly 11;

[0038] e. The wafer lifting system 7 lifts the first wafer trolley 701 vertically upward along the second linear guide rail 704, lifts the wafer support 601 on the rotating plate 603 close to the wafer heating component 11 together with the wafer 14 to be coated placed on the wafer support 601 and separates them from the rotating plate 603, lifts the wafer 14 to be coated close to the vacuum adsorption port below the wafer heating component 11, and the lifting cylinder 703 drives the second wafer trolley 702 to lift the wafer 14 to be coated upward and close to the vacuum adsorption port;

[0039] f. After the adsorption device under the wafer heating assembly 11 vacuum-adsorbs the wafer 14 to be coated, the second wafer trolley 702 is reset downward, the first wafer trolley 701 moves downward, and the wafer support 601 is lowered back onto the rotating flat plate 603. The first driving motor 10 drives the slider on the first linear guide rail 9 to move, driving the wafer heating assembly support 12 and the wafer heating assembly 11 thereon to return to the starting position to carry out the deposition process;

[0040] g. During the deposition process, the wafer heating assembly support 12 and the wafer heating assembly 11 thereon are driven by the slider on the first linear guide rail 9 to perform left-right reciprocating motion along the first linear guide rail 9;

[0041] h, after the deposition process is completed, the wafer heating assembly 11 and the coated wafer 14 are moved to the position directly above the wafer support 601 on the side of the wafer cooling rotating platform 6 close to the wafer heating assembly 11;

[0042] i. The first wafer trolley 701 is lifted vertically upward along the second linear guide rail 704 to lift the wafer support table 601 on the side of the wafer cooling rotating platform 6 close to the wafer heating component 11, and then the lifting cylinder 703 drives the second wafer trolley 702 to hold the coated wafer 14 upward alone, and the adsorption device under the wafer heating component 11 ends the vacuum adsorption, and the second wafer trolley 702 descends and resets, and the wafer 14 on which the thin film deposition has been completed is supported by the wafer support table 601 lifted by the upper end of the first wafer trolley 701;

[0043] j, the first wafer trolley 701 moves downward and returns to the initial position, and the wafer support 601 together with the wafer 14 on which the thin film deposition has been completed is transferred to the support plate support 606 on the side of the rotating plate 603 close to the wafer heating assembly 11;

[0044] k, after the rotating plate 603 rotates 180° around the middle rotating axis 604, the wafer 14 on which the thin film deposition has been completed and the wafer support 601 are transferred to the side of the wafer cooling rotating platform 6 close to the robot 5, while another batch of wafers 14 to be thin-filmed have been rotated to the side of the wafer cooling rotating platform 6 close to the wafer heating assembly 11;

[0045] l. After the wafers 14 that have completed thin film deposition are naturally cooled or forcedly cooled, the robot 5 transfers the wafers 14 that have completed thin film deposition to the wafer box 4 on the wafer loading platform 3. At this point, the thin film deposition of this batch of wafers 14 is completed, and the ck step is repeated.

[0046] It should be noted that, for those skilled in the art, it is obvious that the present invention is not limited to the details of the above exemplary embodiments, and the present invention can be implemented in other specific forms without departing from the spirit or basic features of the present invention. Therefore, no matter from which point of view, the embodiments should be regarded as exemplary and non-restrictive, and the scope of the present invention is defined by the appended claims rather than the above description, so it is intended to include all changes within the meaning and scope of the equivalent elements of the claims in the present invention, and any figure mark in the claims should not be regarded as limiting the claims involved.

[0047] This specification uses specific examples to illustrate the principles and implementation methods of the utility model. The above examples are only used to help understand the method and core idea of ​​the utility model. At the same time, for those skilled in the art, according to the idea of ​​the utility model, there will be changes in the specific implementation methods and application scope. In summary, the content of this specification should not be understood as limiting the utility model.

Claims

1. A wafer feeding material conveying system, characterized in that: The invention comprises an equipment body, wherein a wafer loading platform, a robot, a wafer cooling rotating platform, a wafer lifting system, a main support plate, a first linear guide rail, a first driving motor, a wafer heating component, a wafer heating component support and a vacuum generating system are arranged in the equipment body; the robot is arranged between the wafer loading platform and the main support plate; the wafer loading platform is used to carry a wafer box, and the wafer box is used to place wafers; a wafer cooling rotating platform is arranged at one end of the main support plate close to the robot; a first linear guide rail is arranged on the main support plate, the wafer heating component support is slidably arranged on the first linear guide rail, and the wafer heating component is arranged on the wafer heating component support; the first driving motor is used to drive the wafer heating component support to slide on the first linear guide rail; the wafer heating component is connected to the vacuum generating system; the wafer lifting system is arranged on one side of the wafer cooling rotating platform close to the wafer heating component support.

2. The wafer feeding material conveying system according to claim 1, characterized in that: The wafer cooling rotating platform includes a wafer holder, a wafer support, a rotating plate, an intermediate rotating shaft, a third driving motor and a holder support; the intermediate rotating shaft passes through the main support plate; the third driving motor is transmission-connected to the intermediate rotating shaft, and the third driving motor is used to drive the intermediate rotating shaft to rotate; the top of the intermediate rotating shaft is connected to the middle of the rotating plate; a wafer holder is respectively arranged at both ends of the rotating plate, and a wafer support is arranged on the wafer holder.

3. The wafer feeding material conveying system according to claim 2, characterized in that: The wafer support is made of high-purity non-metallic material.

4. The wafer feeding material conveying system according to claim 2, characterized in that: The wafer support platform is provided with an optical fiber sensor, and the optical fiber sensor is used to detect whether there is a wafer on the wafer support platform.

5. The wafer feeding material conveying system according to claim 1, characterized in that: The wafer lifting system includes a first wafer trolley, a second wafer trolley, a lifting cylinder, a second linear guide rail and a second driving motor; the first wafer trolley passes through the main support plate; the second wafer trolley is arranged on the first wafer trolley; the second driving motor is arranged at the bottom of the second linear guide rail, and the two linear guide rails are connected to the first wafer trolley; the lifting cylinder is arranged at the bottom of the second wafer trolley, and the lifting cylinder is used to drive the second wafer trolley; the second wafer trolley is located directly below the wafer support platform on the side of the wafer cooling rotating platform close to the wafer heating component support.

6. The wafer feeding material conveying system according to claim 5, characterized in that: The first wafer trolley and the second wafer trolley are both provided with wafer supports, and the wafer supports are used to support wafers.

7. The wafer feeding material conveying system according to claim 6, characterized in that: The wafer supports are all made of high-purity non-metallic materials.

8. The wafer feeding material conveying system according to claim 1, characterized in that: A drag chain is provided on the wafer heating component support, and the drag chain is used to place the wiring harness of the wafer heating component.

9. The wafer feeding material conveying system according to claim 1, characterized in that: A glass window is arranged on one side of the equipment body close to the wafer mounting platform.

10. The wafer feeding material conveying system according to claim 1, characterized in that: The vacuum generating system comprises a screw pump.

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