Thermal management system and energy storage device
By setting up a refrigerant cooling device in the thermal management system of the energy storage equipment, ensuring that the refrigerant temperature is within the range of 50℃~60℃, the problems of low cooling efficiency and condensation are solved, and efficient and stable system temperature and safety are achieved in a high-temperature environment run.
Patent Information
- Application Number
- CN202420701487.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-04-08
- Publication Date
- 2025-01-07
- Estimated Expiration
- 2034-04-08
AI Technical Summary
The cooling efficiency of the thermal management system of existing energy storage equipment is low, which leads to the need to limit the operating power of the compressor in high temperature environments. The low coolant temperature may lead to condensation problems and affect product safety.
A thermal management system is designed, including an air conditioning system and multiple cooling devices. The refrigerant is cooled downstream of the condenser by the first cooling device to ensure that the refrigerant temperature is within the range of 50°C to 60°C, avoid condensation, and pass through the first The second cooling device cools down the heating element to ensure the stable operation of the system.
It realizes efficient and stable system temperature in high-temperature environments, avoids damage to electronic components and condensation problems, enables the compressor to work at higher power, and improves product safety and cooling efficiency.
Smart Images

Figure CN222317326U_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the technical field of energy storage devices, and more specifically, to a thermal management system and an energy storage device. Background Art
[0002] Components such as the inverter and power conversion device in the thermal management system of the energy storage device will generate heat when working. In order to ensure that these components can work normally, a corresponding cooling system needs to be set up to cool them down. The cooling efficiency of the existing cooling system is low, and the operating power of the compressor of the thermal management system needs to be limited when the temperature is high. In addition, the coolant temperature of some cooling systems is low, which may cause condensation in the working parts, and there is a possibility of short circuit problems, which affects the safety of the product. Utility Model Content
[0003] In view of this, the present application provides a thermal management system and energy storage device that can efficiently stabilize the system temperature, enable the compressor of the thermal management system to operate at a higher power, and will not cause condensation problems, and the product has a higher safety.
[0004] In the first aspect, the present application provides a thermal management system, which includes: an air-conditioning system, including a compressor, a condenser, a frequency converter and an evaporator, the compressor being connected to the condenser, the compressor being used to compress a low-temperature and low-pressure refrigerant into a high-temperature and high-pressure refrigerant and then transport it to the condenser for condensation, the frequency converter being connected to the compressor and being used to adjust the speed of the compressor, the evaporator being used to cool working parts; a first cooling device being arranged at the frequency converter and being connected in series in the air-conditioning system downstream of the condenser, the refrigerant flowing in the first cooling device being used to cool the frequency converter.
[0005] Preferably, the first cooling device comprises: a liquid inlet and a liquid outlet; and a plurality of flow channels arranged at intervals, wherein one end of the plurality of flow channels is connected to the liquid inlet, and the other end of the plurality of flow channels is connected to the liquid outlet.
[0006] Preferably, the liquid inlet and the liquid outlet are arranged on one side of the first cooling device, and the multiple flow channels are bent to form a U-shaped structure; and / or, the first cooling device includes a first plate body and a second plate body, and at least one of the first plate body and the second plate body is provided with the multiple flow channels, the liquid inlet and the liquid outlet, the outer peripheral edges of the first plate body and the second plate body are sealed connected, and the parts between adjacent flow channels are sealed connected to the correspondingly arranged first plate body or second plate body.
[0007] Preferably, the thermal management system further includes a liquid inlet pipe and a liquid outlet pipe, one end of the liquid inlet pipe is connected to the liquid inlet, and one end of the liquid outlet pipe is connected to the liquid outlet; the thermal management system further includes a first connecting pipe and a second connecting pipe, wherein: the other end of the liquid inlet pipe is welded to the first connecting pipe, and the other end of the liquid outlet pipe is welded to the second connecting pipe; and / or, the thermal management system further includes a first fastener and a second fastener, the other end of the liquid inlet pipe is provided with a first flange, the end of the first connecting pipe connected to the liquid inlet pipe is provided with a second flange, the first flange and the second flange are compressed and connected by the first fastener, the other end of the liquid outlet pipe is provided with a third flange, the end of the second connecting pipe connected to the liquid outlet pipe is provided with a fourth flange, and the third flange and the fourth flange are compressed and connected by the second fastener.
[0008] Preferably, the inverter fits tightly with the first cooling device, wherein: the inverter is welded to the first cooling device; and / or the thermal management system includes a third fastener, and the inverter and the first cooling device are pressed and connected by the third fastener.
[0009] Preferably, when the frequency converter and the first cooling device are press-connected by the third fastener, a heat-conducting medium is provided between the frequency converter and the first cooling device, and one side of the heat-conducting medium contacts the frequency converter and the other side contacts the first cooling device.
[0010] Preferably, the thermal management system further includes: a heating element; a second cooling device, which is arranged at the heating element and is connected in series in the air-conditioning system downstream of the condenser, and the refrigerant flowing in the second cooling device is used to cool the heating element.
[0011] Preferably, the heating element comprises a power conversion device, and the power conversion device is used to convert input electrical energy into required electrical energy.
[0012] Preferably, the structure of the second cooling device is the same as or different from that of the first cooling device; the connection method of the second cooling device and the heating element is the same as or different from the connection method of the first cooling device and the inverter.
[0013] In a second aspect, the present application provides an energy storage device, comprising: a battery as a working component and a third cooling device arranged at the battery; the thermal management system described in the first aspect above, wherein the evaporator of the thermal management system is arranged at the third cooling device so as to perform heat exchange with the third cooling device to achieve temperature management of the battery.
[0014] Compared with the solution of reducing the heat generated by the inverter by limiting the operating power of the compressor when the ambient temperature is high (for example, greater than or equal to 45°C), the solution of the present application adopts refrigerant to cool the inverter, and since the first cooling device is downstream of the condenser, the temperature of the refrigerant in the first cooling device can be within a fixed temperature range, for example, 50°C to 60°C. In this way, even when the ambient temperature is high (for example, greater than or equal to 45°C), the inverter can still be cooled well, thereby efficiently stabilizing the temperature of the system, avoiding damage to electronic components in the system due to excessive temperature, enabling the compressor to operate at a higher power, and avoiding the problem of condensed water generated due to low cooling temperature.
[0015] Other features and advantages of the present application will be described in detail in the subsequent detailed description. BRIEF DESCRIPTION OF THE DRAWINGS
[0016] The accompanying drawings constituting a part of the present application are used to provide a further understanding of the present application, and the schematic embodiments of the present application and their descriptions are used to explain the present application. In the accompanying drawings:
[0017] Figure 1 A schematic diagram of the structure of a thermal management system provided in an embodiment of the present application;
[0018] Figure 2 for Figure 1 An exemplary partial structural schematic diagram of a first cooling device of the thermal management system shown;
[0019] Figure 3 A schematic diagram of a partial structure of another thermal management system provided in an embodiment of the present application;
[0020] Figure 4 A schematic diagram of a partial structure of another thermal management system provided in an embodiment of the present application;
[0021] Figure 5 A schematic diagram of the partial structural decomposition of another thermal management system provided in an embodiment of the present application. DETAILED DESCRIPTION
[0022] The technical solution of the present application will be described in detail below with reference to the accompanying drawings and in combination with specific embodiments.
[0023] The thermal management unit of the energy storage battery generates air or water flow at a certain temperature through the internal air conditioning system, which acts on the battery module through the air duct or cooling water flow channel to control its temperature. Since the system is not a single working mode, it is necessary to continuously adjust the output of the power source, for example, the compressor, water pump, etc. constantly change the speed. Among them, the speed adjustment of the compressor is achieved through the inverter. The inverter generates heat when working. If the heat cannot be dissipated in time, the temperature will continue to rise, reducing the service life of the components.
[0024] In addition, because the system involves many electrical components, the required voltage is not uniform. It generally includes AC power of different voltages, such as high voltage (400V~800V) DC power and low voltage (12V~36V) DC power. The external power supply of the system is another voltage. Therefore, the power supply needs to be processed. Generally, AC / DC and DC / DC power conversion modules are used. These two power conversion modules will also generate heat and also need to be temperature controlled.
[0025] At present, there are mainly three cooling methods in related technologies: the first is to connect the heat source with the heat sink, transfer the heat from the heat source to the heat sink, and dissipate the heat into the environment by increasing the heat dissipation area through the heat sink; the second is to add a cooling fan on the basis of the first method, and generate a certain wind speed on the heat sink through the rotation of the fan to accelerate the dissipation of heat; the third is to contact the heat source with a metal container with a flow channel inside, pass coolant into the container, and take away the heat through the flow of the coolant.
[0026] The first two cooling methods both dissipate heat into the surrounding environment and exchange heat with the air. The heat exchange efficiency is low and is limited by the ambient temperature. When the ambient temperature is high, it is necessary to reduce the heat generation by limiting the system operating power. The third cooling method is limited by the type of thermal management system. If it is not a water cooling system, there is no coolant to take away the heat from the heat source. In addition, the temperature of the coolant in the water cooling system is generally lower than the ambient temperature, which will cause condensation on the heat source, causing short circuits and even safety problems.
[0027] In view of this, the present application provides a thermal management system and an energy storage device. The thermal management system can efficiently stabilize the system temperature, so that the compressor of the thermal management system can operate at a higher power, and condensation problems will not occur, and the product safety is relatively high. Among them, the energy storage device includes a battery as a working component and a third cooling device arranged at the battery, and the thermal management system of the first aspect above. The evaporator of the thermal management system is arranged at the third cooling device so as to perform heat exchange with the third cooling device to achieve management of the battery temperature.
[0028] Figure 1 This is a schematic diagram of the structure of a thermal management system provided in an embodiment of the present application. Figure 1 As shown, the thermal management system includes an air conditioning system 1 and a first cooling device 2. The air conditioning system 1 includes a compressor (not shown in the figure), a condenser 11, a frequency converter 12 and an evaporator (not shown in the figure). The compressor is connected to the condenser 11. The compressor is used to compress the low-temperature and low-pressure refrigerant into a high-temperature and high-pressure refrigerant and then transport it to the condenser 11 for condensation. The frequency converter 12 is connected to the compressor and is used to adjust the speed of the compressor. The evaporator is used to cool working parts such as batteries. The first cooling device 2 is arranged at the frequency converter 12 and is connected in series in the air conditioning system 1 downstream of the condenser 11. The refrigerant circulating in the first cooling device 2 is used to cool the frequency converter 12.
[0029] Compared with the solution of reducing the heat generated by the inverter by limiting the operating power of the compressor when the ambient temperature is high (for example, greater than or equal to 45°C), the solution of the present application adopts refrigerant to cool the inverter, and since the first cooling device is downstream of the condenser, the temperature of the refrigerant in the first cooling device can be within a fixed temperature range, for example, 50°C to 60°C. In this way, even when the ambient temperature is high, the inverter can still be cooled well, thereby efficiently stabilizing the temperature of the system, avoiding damage to electronic components in the system due to excessive temperature, enabling the system to operate at a higher power, and at the same time avoiding the problem of condensed water generated due to low cooling temperature.
[0030] Continue to refer Figure 1 In some embodiments, the thermal management system further includes a heating element 3 and a second cooling device 4. The second cooling device 4 is disposed at the heating element 3 and is connected in series in the air conditioning system 1 downstream of the condenser 11. The refrigerant flowing in the second cooling device 4 is used to cool the heating element 3.
[0031] Exemplarily, the heating element 3 includes a power conversion device, which is used to convert the input electric energy into the required electric energy. In some embodiments, the power conversion device includes a first power conversion device, and the first power conversion device (i.e., AC / DC power conversion module) is used to convert alternating current into direct current. In other embodiments, the power conversion device includes a second power conversion device (i.e., DC / DC power conversion module), and the second power conversion device is used to convert high-voltage direct current into low-voltage direct current.
[0032] Figure 2 for Figure 1 An exemplary partial structural diagram of the first cooling device of the thermal management system shown in FIG. Figure 2As shown, the first cooling device 2 includes a liquid inlet J, a liquid outlet C, and a plurality of flow channels D arranged at intervals. One end of the plurality of flow channels D is connected to the liquid inlet J, and the other end of the plurality of flow channels D is connected to the liquid outlet C. Among them, the plurality of flow channels D can be arranged in parallel, which can reduce the flow resistance of the refrigerant and enable the refrigerant to fully absorb the heat transferred from the electronic control system.
[0033] In some embodiments, the liquid inlet J and the liquid outlet C are arranged on one side of the first cooling device 2, and the plurality of flow channels D are bent to form a U-shaped structure. In other embodiments, the first cooling device 2 includes a first plate body and a second plate body, and one of the first plate body and the second plate body is provided with a plurality of flow channels D, a liquid inlet J and a liquid outlet C, the outer peripheral edges of the first plate body and the second plate body are sealed and connected, and the portion between adjacent flow channels D is sealed and connected with the correspondingly arranged first plate body or second plate body. In other embodiments, a plurality of flow channels may be respectively arranged on the first plate body and the second plate body, and the liquid inlet and the liquid outlet may be arranged on at least one of the first plate body and the second plate body.
[0034] In addition, the structure of the second cooling device 4 may be the same as or different from that of the first cooling device 2. Further, the thermal management system further includes a liquid inlet pipe P1 and a liquid outlet pipe P2, one end of the liquid inlet pipe P1 is connected to the liquid inlet J, and one end of the liquid outlet pipe P2 is connected to the liquid outlet C.
[0035] Figure 3 This is a partial structural diagram of another thermal management system provided in an embodiment of the present application. Figure 3 As shown, the thermal management system further includes a first connecting pipe L1 and a second connecting pipe L2. The thermal management system further includes a first fastener (not shown in the figure) and a second fastener G2, the other end of the liquid inlet pipe P1 is provided with a first flange T1, the end of the first connecting pipe L1 connected to the liquid inlet pipe P1 is provided with a second flange T2, the first flange T1 and the second flange T2 are tightly connected by the first fastener, the other end of the liquid outlet pipe P2 is provided with a third flange T3, the end of the second connecting pipe L2 connected to the liquid outlet pipe P2 is provided with a fourth flange T4, the third flange T3 and the fourth flange T4 are tightly connected by the second fastener G2.
[0036] Exemplarily, the first fastener and the second fastener may be of the same type. Taking the first fastener as an example, the first fastener may be arranged through the first flange T1 and the second flange T2, and the first fastener may be a bolt. In other embodiments, the first fastener may not pass through the first flange T1 and the second flange T2, but may be able to clamp the first flange T1 and the second flange T2. In addition, the thermal management system further includes a first O-ring (not shown in the figure) and a second O-ring M2. The first O-ring is arranged between the first flange T1 and the second flange T2, and the second O-ring M2 is arranged between the third flange T3 and the fourth flange T4.
[0037] In other embodiments, the liquid inlet pipe P and the first connecting pipe L1, and the liquid outlet pipe P2 and the second connecting pipe L2 may also be connected in other ways. Figure 4 A partial structural diagram of another thermal management system provided in an embodiment of the present application. Figure 4 As shown, the other end of the liquid inlet pipe P1 is connected to the first connecting pipe L1 by welding, and the other end of the liquid outlet pipe P2 is connected to the second connecting pipe L2 by welding. For example, flame welding can be used.
[0038] Figure 5 The following is a schematic diagram of the partial structure decomposition of another thermal management system provided in the embodiment of the present application. Figure 5 As shown, the thermal management system includes a third fastener G3, and the inverter 12 and the first cooling device 2 are pressed and connected via the third fastener G3.
[0039] For example, the inverter 12 is provided with a plurality of first through holes, and the first cooling device 2 is provided with a plurality of second through holes corresponding to the plurality of first through holes, and each third fastener G3 is provided through the corresponding first through hole and second through hole. The third fastener G3 may be a bolt. Alternatively, the third fastener G3 does not pass through the inverter 12 and the first cooling device 2, but clamps the inverter 12 and the first cooling device 2.
[0040] Furthermore, in order to better conduct the heat generated by the inverter 12 to the first cooling device 2, a heat conducting medium Z is provided between the inverter 12 and the first cooling device 2, one side of the heat conducting medium Z is in contact with the inverter 12, and the other side is in contact with the first cooling device 2.
[0041] In other embodiments, the third fastener may not be provided, and the frequency converter 12 and the first cooling device 2 are tightly fitted, and the frequency converter 12 and the first cooling device 2 are welded and connected.
[0042] In addition, the connection mode of the second cooling device 4 and the heating element 3 may be the same as or different from the connection mode of the first cooling device 2 and the inverter 12 .
[0043] In summary, the method of using fins for heat dissipation is limited by the ambient temperature. Generally, when the ambient temperature exceeds 45°C, the thermal management system will have to limit the power because the working parts such as the battery heat up too quickly. The compressor of the air-conditioning system will also reduce the power output because the temperature reaches the temperature threshold (generally 85°C) that triggers limited power operation.
[0044] The thermal management system of the embodiment of the present application installs a cooling device such as a cold plate at working parts that can generate heat, such as a compressor inverter, AC / DC and DC / DC modules (i.e., a power conversion device), and connects it in series in the air-conditioning system loop. Since a refrigerant is used to cool the working parts and the cold plate is downstream of the condenser, the temperature of the refrigerant in the cold plate can be stabilized in the range of 50°C to 60°C. Even when the ambient temperature is ≥45°C, the temperature of the working parts can still be well stabilized and no condensed water will be generated, thereby solving the problem of difficult system temperature control and providing a cooling solution that can stabilize the system temperature and will not bring negative effects.
[0045] The cold plate can be closely fitted with the working parts such as the compressor inverter, AC / DC and DC / DC modules, so that the heat of the working parts can be better transferred to the refrigerant in the cold plate. In addition, the close fit can be achieved by bolting or welding. In addition, in order to prevent the presence of air in the contact gap from affecting the heat transfer, a thermal conductive glue (i.e., a thermal conductive medium) can be applied between the cold plate and the working parts.
[0046] For example, the cold plate can be formed by stamping and brazing, and can include a flow channel (i.e., a first plate body), a refrigerant inlet (i.e., a liquid inlet), a refrigerant outlet (i.e., a liquid outlet), and a cover plate (i.e., a second plate body). The stamped flow channels can be multiple in parallel to reduce the refrigerant resistance. When the air conditioning system is working, the refrigerant continuously flows through the cold plate, and the refrigerant fully absorbs the heat transferred from the working parts through the special flow channel design inside the cold plate. At the same time, the flat part between the flow channels, such as a plane, can increase the brazing welding area to ensure the pressure resistance of the cold plate and meet the pressure requirements of the refrigerant medium when working.
[0047] Furthermore, multiple cold plates can be arranged in series, and the multiple cold plates can be respectively contacted with working parts that need heat dissipation, such as compressor inverter, AC / DC and DC / DC, etc. The connection method of the liquid inlet pipe and the liquid outlet pipe of the cold plate and the corresponding pipeline in the air-conditioning system can be a pressure plate connection (that is, compressed by flanges and fasteners) and sealed by O-rings, or it can be connected by flame welding.
[0048] The preferred embodiments of the present application are described in detail above; however, the present application is not limited to the specific details in the above embodiments. Within the technical concept of the present application, a variety of simple modifications can be made to the technical solution of the present application, and these simple modifications all fall within the protection scope of the present application.
[0049] It should also be noted that the various specific technical features described in the above specific embodiments can be combined in any suitable manner without contradiction. In order to avoid unnecessary repetition, the present application will not further describe various possible combinations. In addition, the various different embodiments of the present application can also be combined arbitrarily, as long as they do not violate the idea of the present application, they should also be regarded as the contents disclosed in the present application.
Claims
1. A thermal management system, characterized in that: include: An air conditioning system (1) comprises a compressor, a condenser (11), a frequency converter (12) and an evaporator, wherein the compressor is connected to the condenser (11), the compressor is used to compress a low-temperature and low-pressure refrigerant into a high-temperature and high-pressure refrigerant and then deliver the refrigerant to the condenser (11) for condensation, the frequency converter (12) is connected to the compressor and is used to adjust the speed of the compressor, and the evaporator is used to cool the working parts; A first cooling device (2) is arranged at the inverter (12) and is connected in series in the air conditioning system (1) downstream of the condenser (11); the refrigerant flowing in the first cooling device (2) is used to cool the inverter (12).
2. The thermal management system according to claim 1, characterized in that: The first cooling device (2) comprises: Liquid inlet (J) and liquid outlet (C); A plurality of flow channels (D) are arranged at intervals, one end of the plurality of flow channels (D) is connected to the liquid inlet (J), and the other end of the plurality of flow channels (D) is connected to the liquid outlet (C).
3. The thermal management system according to claim 2, characterized in that: The liquid inlet (J) and the liquid outlet (C) are arranged on one side of the first cooling device (2), and the plurality of flow channels (D) are bent to form a U-shaped structure; and / or, The first cooling device (2) comprises a first plate body and a second plate body, and at least one of the first plate body and the second plate body is provided with the plurality of flow channels (D), the liquid inlet (J) and the liquid outlet (C), the outer peripheral edges of the first plate body and the second plate body are sealed and connected, and the portion between adjacent flow channels (D) is sealed and connected to the correspondingly arranged first plate body or second plate body.
4. The thermal management system according to claim 2, characterized in that: The thermal management system further comprises a liquid inlet pipe (P1) and a liquid outlet pipe (P2), one end of the liquid inlet pipe (P1) is connected to the liquid inlet port (J), and one end of the liquid outlet pipe (P2) is connected to the liquid outlet port (C); the thermal management system further comprises a first connecting pipe (L1) and a second connecting pipe (L2), wherein: The other end of the liquid inlet pipe (P1) is connected to the first connecting pipe (L1) by welding, and the other end of the liquid outlet pipe (P2) is connected to the second connecting pipe (L2) by welding; and / or, The thermal management system further comprises a first fastener and a second fastener (G2); the other end of the liquid inlet pipe (P1) is provided with a first flange (T1); the end of the first connecting pipe (L1) connected to the liquid inlet pipe (P1) is provided with a second flange (T2); the first flange (T1) and the second flange (T2) are compressed and connected via the first fastener; the other end of the liquid outlet pipe (P2) is provided with a third flange (T3); the end of the second connecting pipe (L2) connected to the liquid outlet pipe (P2) is provided with a fourth flange (T4); the third flange (T3) and the fourth flange (T4) are compressed and connected via the second fastener (G2).
5. The thermal management system according to claim 1, characterized in that: The frequency converter (12) is closely fitted to the first cooling device (2), wherein: The frequency converter (12) is connected to the first cooling device (2) by welding; and / or, The thermal management system comprises a third fastener (G3), and the frequency converter (12) and the first cooling device (2) are pressed and connected via the third fastener (G3).
6. The thermal management system according to claim 5, characterized in that: When the frequency converter (12) and the first cooling device (2) are pressed and connected by the third fastener (G3), a heat-conducting medium (Z) is arranged between the frequency converter (12) and the first cooling device (2), and one side of the heat-conducting medium (Z) is in contact with the frequency converter (12) and the other side is in contact with the first cooling device (2).
7. The thermal management system according to any one of claims 1 to 6, characterized in that: Also includes: Heating element (3); The second cooling device (4) is arranged at the heating element (3) and is connected in series in the air conditioning system (1) downstream of the condenser (11); the refrigerant flowing in the second cooling device (4) is used to cool the heating element (3).
8. The thermal management system according to claim 7, characterized in that: The heating element (3) comprises a power conversion device, and the power conversion device is used to convert input electric energy into required electric energy.
9. The thermal management system according to claim 7, characterized in that: The structure of the second cooling device (4) is the same as or different from the structure of the first cooling device (2); The connection method of the second cooling device (4) and the heating element (3) is the same as or different from the connection method of the first cooling device (2) and the frequency converter (12).
10. An energy storage device, characterized in that: include: A battery as a working component and a third cooling device arranged at the battery; According to the thermal management system according to any one of claims 1 to 9, the evaporator of the thermal management system is arranged at the third cooling device so as to perform heat exchange with the third cooling device to achieve temperature management of the battery.