Surface-mounted diode image detection positioning structure

Abstract

The utility model belongs to the technical field of semiconductor inspection equipment, and particularly relates to a surface-mounted diode image detection positioning structure. The device comprises a positioning seat, the top surface of the positioning seat is provided with a first reference surface and a second reference surface, the first reference surface is higher than the second reference surface, and the distance between the first reference surface and the second reference surface is greater than the tolerance value of a surface-mounted diode base and a pin; a base of the surface-mounted diode is placed on the first reference surface, and a pin of the surface-mounted diode is suspended above the second reference surface; the optical detection equipment points to the positioning seat from the side surface; the vacuum suction nozzle is arranged above the positioning seat in a suspended mode, and the vacuum suction nozzle can rotate or move. The utility model is used for solving the technical problems in the prior art that optical detection equipment needs to position and calculate the surface-mounted diode twice, and the positioning error is large.

Description

Technical Field

[0001] The utility model belongs to the technical field of semiconductor inspection equipment, and in particular relates to a patch-type diode image detection positioning structure. Background Art

[0002] The surface-mount diode consists of a base and pins. Generally, the bottom surface of the base and the bottom surface of the pins should be in the same plane to facilitate welding. In the actual production process, the distance tolerance between the two is within ±0.05mm.

[0003] The existing detection method is to use a vacuum nozzle to absorb the SMD diode, and then send it to the optical detection equipment to measure the relative position of the base and the pin, and then obtain the specific value by subtracting the data of the two relative positions. In addition, the existing optical equipment performs line scanning, uses the center point of the line as the measurement reference, and performs calculations. The base and the pin are both stamped, and the tear band below the side of the pin and the base has color and shape differences with the smooth surface above the side. The position of the measurement line will be higher, at the junction of the tear band and the smooth surface, which will cause detection errors; and the measurement line is not horizontal, which will also cause measurement errors. Utility Model Content

[0004] The technical problem to be solved by the utility model is to overcome the deficiencies of the prior art and provide a chip diode image detection and positioning structure, which is used to solve the technical problems in the prior art that the optical detection equipment needs to position and measure the chip diode twice and the positioning error is large.

[0005] The utility model solves the above technical problems with the following technical solutions: a patch-type diode image detection and positioning structure, comprising:

[0006] A positioning seat, wherein a first reference plane and a second reference plane are provided on the top surface of the positioning seat, the first reference plane is higher than the second reference plane, and a distance between the first reference plane and the second reference plane is greater than a tolerance value of a SMD diode base and a pin;

[0007] The base of the SMD diode is placed on the first reference plane, and the pins of the SMD diode are suspended above the second reference plane;

[0008] An optical detection device, the optical detection device is directed toward the positioning seat from the side;

[0009] A vacuum suction nozzle is suspended above the positioning seat and can rotate or move.

[0010] The utility model places the base on the first reference plane, and only needs to measure the distance between the pin and the second reference plane to obtain the distance between the pin and the second reference plane. In fact, the distance between the first reference plane and the second reference plane is fixed and known, so the distance between the pin and the base is obtained to complete the detection.

[0011] Further: the width of the first reference surface is adapted to the width of the base;

[0012] The width of the second reference surface matches the width of the pin.

[0013] The beneficial effect of adopting this step is that the width of the second reference plane is adapted to the pin, which means that the distance from the side of the second reference plane and the side of the pin to the optical detection device is consistent, which makes it easy for the optical detection device to adjust the focal length and quickly obtain accurate test results.

[0014] Furthermore: an anodized layer is provided on the surface of the positioning seat.

[0015] The beneficial effects of adopting this step are as follows: the anodized layer has the effects of wear resistance and corrosion resistance, can protect the first reference surface and the second reference surface on the positioning seat from being easily worn, and improve the service life and accuracy of the positioning seat.

[0016] Furthermore, the positioning block is further provided with an adsorption through hole, one end of the adsorption through hole is located on the first reference plane, and the other end of the adsorption through hole is connected to a vacuum suction pipe.

[0017] The beneficial effect of adopting this step is that when the base is placed on the first reference plane, air is sucked out of the adsorption through hole by the vacuum suction tube, which can provide suction force to fix the base on the first reference plane, ensuring that the base will not move during the test.

[0018] Furthermore: the optical detection equipment is used for point measurement.

[0019] The beneficial effect of adopting this step is that the optical detection equipment capable of point measurement can find the lowest point of the pin and improve the detection accuracy.

[0020] The beneficial effects of the utility model are:

[0021] 1. Place the SMD diode on the positioning seat and measure the pins. Instead of using a vacuum nozzle to suck the SMD diode to measure the pins and base, it reduces the number of measurement points and the error caused by multiple measurements, and eliminates the measurement interference caused by unstable adsorption during vacuum nozzle adsorption.

[0022] 2. The original measurement method was line segment measurement, that is, the line segment output by the optical inspection equipment coincided with the lower edge line of the base and the pin, and then the height difference between the center points of the two line segments was calculated to obtain the inspection result. This method has a large error, and the current optical inspection equipment is to find the lowest point of the pin, which can reduce the distance error between the pin and the base, obtain more accurate inspection results, and improve product quality. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] In order to more clearly illustrate the specific implementation methods of the utility model or the technical solutions in the prior art, the drawings required for use in the specific implementation methods or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are some implementation methods of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0024] Figure 1 A schematic diagram of a patch-type diode image detection and positioning structure provided by the utility model;

[0025] Figure 2 A schematic diagram of the structure of a patch-type diode image detection positioning structure removal optical detection device provided by the utility model;

[0026] Figure 3 A schematic diagram of the structure of a positioning seat in a patch-type diode image detection positioning structure provided by the utility model;

[0027] Figure 4 The present invention is a schematic structural diagram of another embodiment of a positioning seat in a patch-type diode image detection positioning structure provided by the present invention.

[0028] Reference numerals:

[0029] 1-positioning seat; 2-vacuum nozzle; 3-optical detection equipment; 4-chip diode;

[0030] 11 - first reference plane; 12 - second reference plane; 13 - adsorption through hole; 41 - base; 42 - pin. DETAILED DESCRIPTION

[0031] The following embodiments of the technical solution of the utility model are described in detail in conjunction with the accompanying drawings. The following embodiments are only used to more clearly illustrate the technical solution of the utility model, and are therefore only used as examples, and cannot be used to limit the protection scope of the utility model.

[0032] It should be noted that, unless otherwise specified, the technical terms or scientific terms used in this application should have the common meanings understood by technicians in the field to which the utility model belongs.

[0033] In addition, the terms "first", "second", etc. are used for descriptive purposes only and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. In the description of the present utility model, the meaning of "plurality" is more than two, unless otherwise clearly and specifically limited.

[0034] Example

[0035] like Figure 1 , Figure 2 , Figure 3 and Figure 4 As shown, the utility model provides a patch type diode image detection positioning structure, comprising:

[0036] A positioning seat 1, wherein a first reference plane 11 and a second reference plane 12 are provided on the top surface of the positioning seat 1, wherein the first reference plane 11 is higher than the second reference plane 12, and a distance between the first reference plane 11 and the second reference plane 12 is greater than a tolerance value of a base 41 and a pin 42 of a SMD diode 4;

[0037] The base 41 of the SMD diode 4 is placed on the first reference plane 11, and the pin 42 of the SMD diode 4 is suspended above the second reference plane 12;

[0038] An optical detection device 3, the optical detection device 3 points to the positioning seat 1 from the side, and the optical detection device 3 can meet the existing 3D5S detection requirements;

[0039] The vacuum suction nozzle 2 is suspended above the positioning seat 1. The vacuum suction nozzle 2 can be rotated or moved to absorb and transfer the SMD diode 4 to the positioning seat 1. The vacuum suction nozzle 2 is no longer needed to keep sucking the SMD diode 4 for optical inspection.

[0040] The utility model places the base 41 on the first reference plane 11, and only needs to measure the distance between the pin 42 and the second reference plane 12 to obtain the distance between the pin 42 and the second reference plane 12. In fact, the distance between the first reference plane 11 and the second reference plane 12 is fixed and known, so the distance between the pin 42 and the base 41 is obtained, and the detection is completed; this measurement method improves the measurement efficiency and measurement accuracy.

[0041] On the basis of the above technical solution, the width of the first reference surface 11 is adapted to the width of the base 41;

[0042] The width of the second reference surface 12 matches the width of the pin 42 .

[0043] Among them, the width of the second reference surface 12 is adapted to the pin 42, which means that the distance from the side of the second reference surface 12 and the side of the pin 42 to the optical detection device 3 is consistent, which makes it easy for the optical detection device 3 to adjust the focal length and quickly obtain accurate test results.

[0044] On the basis of the above technical solution, the surface of the positioning seat 1 is provided with an anodized layer.

[0045] The anodized layer has the effects of wear resistance and corrosion resistance, and can protect the first reference surface 11 and the second reference surface 12 on the positioning seat 1 from being easily worn, thereby improving the service life and accuracy of the positioning seat 1.

[0046] On the basis of the above technical solution, the positioning block 1 is further provided with an adsorption through hole 13, one end of the adsorption through hole 13 is located on the first reference plane 11, and the other end of the adsorption through hole 13 is connected to a vacuum suction pipe, which is connected to a vacuum pump to generate negative pressure (less than standard atmospheric pressure).

[0047] When the base 41 is placed on the first reference plane 11 , air is sucked out of the adsorption through hole 13 by the vacuum suction tube, which can provide suction force to fix the base 41 on the first reference plane 11 , thereby ensuring that the base 41 does not move during the test.

[0048] On the basis of the above technical solution, the optical detection device 3 is used for point position measurement.

[0049] The traditional line-to-line measurement method takes an average value, so when white edges appear on the edges, it is easy to affect the edge grabbing judgment. Secondly, the actual use condition is that the distance from the lowest point of the pin 42 to the base 41 meets the requirements, which can ensure the welding effect. Line measurement grabs the center point of the line segment, so the detected value is not the actual required measurement value.

[0050] The optical detection device 3 capable of point measurement can find the lowest point of the pin 42, thereby improving the detection accuracy.

[0051] Finally, it should be noted that the above embodiments are only used to illustrate the technical solution of the utility model, rather than to limit it. Although the utility model has been described in detail with reference to the aforementioned embodiments, ordinary technicians in this field should understand that they can still modify the technical solutions recorded in the aforementioned embodiments, or replace some or all of the technical features therein with equivalents. However, these modifications or replacements do not make the essence of the corresponding technical solution deviate from the scope of the technical solution of the embodiments of the utility model.

Claims

1. A patch type diode image detection and positioning structure, characterized in that: include: A positioning seat, wherein a first reference plane and a second reference plane are provided on the top surface of the positioning seat, the first reference plane is higher than the second reference plane, and a distance between the first reference plane and the second reference plane is greater than a tolerance value of a SMD diode base and a pin; The base of the SMD diode is placed on the first reference plane, and the pins of the SMD diode are suspended above the second reference plane; An optical detection device, the optical detection device is directed toward the positioning seat from the side; A vacuum suction nozzle is suspended above the positioning seat and can rotate or move.

2. The SMD diode image detection and positioning structure according to claim 1, characterized in that: The width of the first reference surface is adapted to the width of the base; The width of the second reference surface matches the width of the pin.

3. The SMD diode image detection and positioning structure according to claim 1, characterized in that: The surface of the positioning seat is provided with an anodized layer.

4. The SMD diode image detection and positioning structure according to claim 1, characterized in that: The positioning seat is further provided with an adsorption through hole, one end of which is located on the first reference plane, and the other end of which is connected to a vacuum suction pipe.

5. The SMD diode image detection and positioning structure according to claim 1, characterized in that: The optical detection device is used for point position measurement.

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