Miniature industrial control host with automatically adjustable heat dissipation power
By designing an automatically adjusted heat dissipation mechanism in the micro industrial control host, and using temperature sensors and control circuits to adjust the fan speed, the problem of unsatisfactory heat dissipation effect is solved and the stability and life of the equipment are improved.
Patent Information
- Application Number
- CN202421027487.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-05-13
- Publication Date
- 2025-01-07
- Estimated Expiration
- 2034-05-13
AI Technical Summary
The existing micro-industrial control host has poor heat dissipation effect, resulting in excessive internal temperature of the host, affecting the performance of electronic components, equipment stability and life.
A heat dissipation mechanism including a motherboard, a temperature setting module, a heat sink, a temperature sensor, a heat conduction pipe and a fan is designed. The temperature in the chassis is detected through a temperature sensor, and the control circuit adjusts the fan speed according to the temperature signal to achieve automatic adjustment of the heat dissipation power.
It effectively improves the heat dissipation effect and ensures the stability and life of the industrial control host.
Smart Images

Figure CN222319400U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field related to industrial control equipment, in particular to a micro industrial control host with automatically adjustable heat dissipation power. Background Art
[0002] Industrial computer, or industrial control computer, is a general term for tools that use a bus structure to detect and control production processes, electromechanical equipment, and process equipment. The difference from ordinary computers is that the products and technologies of the industrial control industry are very special and are intermediate products. They provide reliable, embedded, and intelligent industrial computers for other industries. Generally speaking, industrial computers are computers designed specifically for industrial sites. Industrial control hosts need to have strong computing power, so they will generate a certain amount of heat. Therefore, there is a special need for a micro industrial control host with automatically adjustable heat dissipation power.
[0003] However, some existing micro industrial control hosts have poor heat dissipation effects, which can easily lead to excessive internal temperatures of the host. High temperature environments may cause performance degradation of electronic components and may also have adverse effects on the software and hardware inside the host, affecting the stability and life of the equipment. Utility Model Content
[0004] The purpose of the utility model is to provide a micro industrial control host with automatically adjustable heat dissipation power, so as to solve the problem that the existing micro industrial control host proposed in the above background technology has unsatisfactory heat dissipation effect, which easily leads to excessively high temperature inside the host. The high temperature environment may cause the performance of electronic components to decline, and may also have adverse effects on the software and hardware inside the host, affecting the stability and life of the equipment.
[0005] To achieve the above object, the utility model provides the following technical solution: a micro industrial control host with automatically adjustable heat dissipation power, comprising a chassis, a connecting piece is fixedly connected to one side surface of the chassis, a base is fixedly connected to the lower surface of the chassis, a gasket is fixedly connected to the lower surface of the base, a ventilation hole is opened on one side surface of the chassis, and a heat dissipation mechanism is arranged on the inner surface of the chassis;
[0006] The heat dissipation mechanism includes a mainboard, a temperature setting module, a heat sink, a temperature sensor, a heat pipe and a fan. The mainboard is fixedly connected to the inner surface of the chassis, the temperature setting module is installed on the upper surface of the mainboard, the heat sink is fixedly connected to the upper surface of the mainboard, the temperature sensor is fixedly connected to the upper surface of the heat sink, the heat pipe is fixedly connected to the inner surface of the heat sink, and the fan is fixedly connected to one side surface of the heat sink.
[0007] Preferably, the connection plates are provided in two groups symmetrically with respect to the central axis of the chassis, and the base is provided in multiple groups on the lower surface of the chassis.
[0008] Preferably, the gasket is made of rubber, and the lower surface of the base is provided with a gasket.
[0009] Preferably, the temperature sensors are arranged in multiple groups on the inner surface of the chassis, and the heat pipes are arranged in multiple groups on the surface of the heat sink.
[0010] Preferably, the fans are arranged in multiple groups on the inner surface of the chassis.
[0011] Compared with the prior art, the beneficial effects of the utility model are as follows: the micro industrial control host with automatically adjustable heat dissipation power, through the setting of the heat dissipation mechanism, when in use, the processor will generate a large amount of heat, one end of the heat pipe is in contact with the processor, and the other end is in contact with the heat sink, so that the heat generated by the processor is conducted to the heat sink, the fan is started, the air flow in the chassis is increased, the heat sink and the chassis are blown, and the heat is discharged from the chassis through the vents, the temperature sensor can detect the temperature in the chassis, and a control circuit is provided on the main board for obtaining the temperature signal detected by the temperature sensor and controlling the fan speed according to the temperature signal, thereby adjusting the heat dissipation power, the temperature setting module can set the target temperature value, and when the temperature value detected by the temperature sensor is higher than the target temperature value, the control circuit adjusts the fan speed according to the temperature difference, so as to realize the automatic adjustment of the heat dissipation power, effectively improve the heat dissipation effect, and ensure the stability and life of the industrial control host. BRIEF DESCRIPTION OF THE DRAWINGS
[0012] Figure 1 This is a schematic diagram of the side view of the appearance structure of the utility model;
[0013] Figure 2 This is a schematic diagram of the structure of the base and the gasket cooperating with each other in the utility model;
[0014] Figure 3 This is a schematic diagram of the structure of the heat sink and the fan cooperating with each other in the utility model;
[0015] Figure 4 This is a schematic diagram of the structure of the mainboard and the temperature sensor of the utility model cooperating with each other.
[0016] In the figure: 1. chassis; 2. connecting plate; 3. base; 4. gasket; 5. vent; 6. heat dissipation mechanism; 601. main board; 602. temperature setting module; 603. heat sink; 604. temperature sensor; 605. heat pipe; 606. fan. DETAILED DESCRIPTION
[0017] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.
[0018] See also Figure 1-4 The utility model provides a technical solution: a micro industrial control host with automatically adjustable heat dissipation power, comprising a chassis 1, a connecting piece 2 is fixedly connected to one side surface of the chassis 1, a base 3 is fixedly connected to the lower surface of the chassis 1, a gasket 4 is fixedly connected to the lower surface of the base 3, a vent 5 is opened on one side surface of the chassis 1, and a heat dissipation mechanism 6 is arranged on the inner surface of the chassis 1;
[0019] The heat dissipation mechanism 6 includes a mainboard 601, a temperature setting module 602, a heat sink 603, a temperature sensor 604, a heat pipe 605 and a fan 606. The mainboard 601 is fixedly connected to the inner surface of the chassis 1, the temperature setting module 602 is installed on the upper surface of the mainboard 601, the heat sink 603 is fixedly connected to the upper surface of the mainboard 601, the temperature sensor 604 is fixedly connected to the upper surface of the heat sink 603, the heat pipe 605 is fixedly connected to the inner surface of the heat sink 603, and the fan 606 is fixedly connected to one side surface of the heat sink 603. Through the arrangement of the mainboard 601, the temperature setting module 602, the heat sink 603, the temperature sensor 604, the heat pipe 605 and the fan 606, when in use, the processor will generate a lot of heat, and one end of the heat pipe 605 is in contact with the processor. , and the other end contacts the heat sink 603, transferring the heat generated by the processor to the heat sink 603, and the fan 606 is started to increase the air flow in the chassis 1, blowing air to the heat sink 603 and the chassis 1, and discharging the heat from the chassis 1 through the vent 5. The temperature sensor 604 can detect the temperature in the chassis 1. The mainboard 601 is provided with a control circuit for obtaining the temperature signal detected by the temperature sensor 604, and controlling the rotation speed of the fan 606 according to the temperature signal, thereby adjusting the heat dissipation power. The temperature setting module 602 can set a target temperature value. When the temperature value detected by the temperature sensor 604 is higher than the target temperature value, the control circuit adjusts the rotation speed of the fan 606 according to the temperature difference, thereby realizing the automatic adjustment of the heat dissipation power, effectively improving the heat dissipation effect, and ensuring the stability and life of the industrial control host.
[0020] Furthermore, two groups of connecting plates 2 are symmetrically arranged with respect to the central axis of the chassis 1, and multiple groups of bases 3 are arranged on the lower surface of the chassis 1. Through the arrangement of the connecting plates 2, when in use, the chassis 1 can be installed in a cabinet through the connecting plates 2, and multiple groups of main bodies can work simultaneously, thereby increasing work efficiency.
[0021] Furthermore, the material of the gasket 4 is rubber, and the lower surface of the base 3 is provided with a gasket 4. Through the setting of the gasket 4, when in use, the chassis 1 is placed on a plane, and the gasket 4 can provide a certain shock-absorbing effect. At the same time, the friction of rubber is relatively large, so that the chassis 1 can be placed more stably.
[0022] Furthermore, multiple groups of temperature sensors 604 are arranged on the inner surface of the chassis 1, and multiple groups of heat pipes 605 are arranged on the surface of the heat sink 603. Through the setting of the temperature sensors 604, when in use, multiple temperature sensors 604 are respectively arranged at different positions of the chassis 1 to achieve more accurate temperature detection.
[0023] Furthermore, multiple groups of fans 606 are arranged on the inner surface of the chassis 1. Through the arrangement of the fans 606, when in use, the fans 606 are started to increase the air flow in the chassis 1, blow air to the heat sink 603 and the chassis 1, and discharge the heat from the chassis 1 through the vents 5.
[0024] Working principle: The chassis 1 is installed in the cabinet through the connecting piece 2. Multiple groups of main bodies can work at the same time to increase work efficiency. The chassis 1 is placed on a flat surface. The gasket 4 can provide a certain shock absorption effect. At the same time, the friction of the rubber is large, which makes the chassis 1 more stable. When in use, the processor will generate a lot of heat. One end of the heat pipe 605 contacts the processor, and the other end contacts the heat sink 603. The heat generated by the processor is transferred to the heat sink 603. The fan 606 is started to increase the air flow in the chassis 1, and the heat sink 603 and the chassis 1 are blown to discharge the heat from the chassis 1 through the vent 5. The temperature sensor 604 can In order to detect the temperature inside the chassis 1, multiple temperature sensors 604 are respectively arranged at different positions of the chassis 1 to achieve more accurate temperature detection. A control circuit is arranged on the main board 601 for obtaining the temperature signal detected by the temperature sensor 604 and controlling the rotation speed of the fan 606 according to the temperature signal, thereby adjusting the heat dissipation power. The temperature setting module 602 can set a target temperature value. When the temperature value detected by the temperature sensor 604 is higher than the target temperature value, the control circuit adjusts the rotation speed of the fan 606 according to the temperature difference, thereby realizing automatic adjustment of the heat dissipation power, effectively improving the heat dissipation effect, and ensuring the stability and life of the industrial control host.
[0025] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.
Claims
1. A micro industrial control host with automatically adjustable heat dissipation power, comprising a chassis (1), characterized in that: A connecting piece (2) is fixedly connected to one side surface of the chassis (1), a base (3) is fixedly connected to the lower surface of the chassis (1), a gasket (4) is fixedly connected to the lower surface of the base (3), a vent (5) is provided on one side surface of the chassis (1), and a heat dissipation mechanism (6) is provided on the inner side surface of the chassis (1); The heat dissipation mechanism (6) comprises a mainboard (601), a temperature setting module (602), a heat sink (603), a temperature sensor (604), a heat pipe (605) and a fan (606); the mainboard (601) is fixedly connected to the inner surface of the chassis (1); the temperature setting module (602) is installed on the upper surface of the mainboard (601); the heat sink (603) is fixedly connected to the upper surface of the mainboard (601); the temperature sensor (604) is fixedly connected to the upper surface of the heat sink (603); the heat pipe (605) is fixedly connected to the inner surface of the heat sink (603); and the fan (606) is fixedly connected to one side surface of the heat sink (603).
2. The micro industrial control host with automatically adjustable heat dissipation power according to claim 1, characterized in that: The connecting pieces (2) are arranged in two groups symmetrically about the central axis of the chassis (1), and the base (3) is arranged in multiple groups on the lower surface of the chassis (1).
3. The micro industrial control host with automatically adjustable heat dissipation power according to claim 1 is characterized in that: The gasket (4) is made of rubber, and the lower surface of the base (3) is provided with a gasket (4).
4. The micro industrial control host with automatically adjustable heat dissipation power according to claim 1 is characterized in that: The temperature sensors (604) are arranged in multiple groups on the inner surface of the chassis (1), and the heat pipes (605) are arranged in multiple groups on the surface of the heat sink (603).
5. The micro industrial control host with automatically adjustable heat dissipation power according to claim 1, characterized in that: The fans (606) are arranged in multiple groups on the inner surface of the chassis (1).