Piece sorting mechanism and piece reversing device
By using spaced-out aligning components and spacing shafts in the basket, combined with bevel gear rotation and movement, the aligning problem caused by small spacing between multiple rows of silicon wafers is solved, achieving efficient silicon wafer spacing and aligning, and improving the operational efficiency of slab silicon wafers.
Patent Information
- Application Number
- CN202323644277.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2023-12-29
- Publication Date
- 2025-01-07
- Estimated Expiration
- 2033-12-29
AI Technical Summary
In the automated production of solar cells, it is difficult to arrange multiple rows of silicon wafers in the basket, especially because the spacing between adjacent silicon wafers is small, making it difficult to effectively separate and arrange the wafers.
The first and second alignment components are spaced apart and combined with a spacing shaft that can be moved closer or further away. The spacing shaft is inserted into the gap between the silicon wafers and the silicon wafers are spaced and aligned by rotating and moving the bevel teeth. With the help of the drive component and the limiting tooth structure, the silicon wafers are arranged at a preset spacing.
It achieves efficient arrangement of multi-row silicon wafers, solving the problem of spacing and arrangement that cannot be achieved due to small spacing in existing technologies, and improving the convenience and efficiency of arrangement of slab silicon wafers.
Smart Images
Figure CN222320212U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of photovoltaic cell sheet preparation, in particular to a sheet sorting mechanism and a sheet reversing device. Background Art
[0002] In the field of automated production of solar cells, commonly used tools for storing silicon wafers or solar cells are called baskets, boats or carriers. Silicon wafers or solar cells are inserted into the limit slots in the basket. A common basket only stores one row of whole silicon wafers, and the silicon wafers can be organized by pushing them from both sides of the basket to the middle. However, when two or more rows of silicon wafers need to be stored in a basket, the spacing between adjacent silicon wafers is small, which makes it difficult to organize the silicon wafers. Utility Model Content
[0003] The embodiment of the utility model provides a slice arranging mechanism and a slice reversing device to solve the problem that it is inconvenient to arrange a plurality of sliced battery slices in the aforementioned flower basket.
[0004] In the first aspect, the utility model provides a slice tidying mechanism, which includes a first tidying component and a second tidying component arranged at intervals, and a spacing axis arranged between the first tidying component and the second tidying component and can be close to or away from the first tidying component and the second tidying component; the spacing axis includes a first spacing axis and a second spacing axis, and the first spacing axis and the second spacing axis are respectively provided with a first bevel tooth and a second bevel tooth, and the first bevel tooth and the second bevel tooth can respectively rotate around the axis of the first bevel tooth and the second bevel tooth.
[0005] Optionally, the first spacing axis and the second spacing axis further include a pad, which is configured to contact the side edge of the sliced silicon wafer.
[0006] Optionally, the first tidying component and the second tidying component have the same structure, and both include upper and lower limiting teeth and baffles, and the bottom surface of the tooth groove of the limiting tooth is coplanar with the first surface of the baffle in the vertical direction.
[0007] Optionally, it further includes a driving component, wherein a first driving component in the driving component simultaneously controls the first sorting component and the second sorting component, and a second driving component independently controls the rotation and translation of the spacing axis.
[0008] Optionally, the area where the pad is used to contact the sliced silicon wafer includes a transition surface and a first plane, and an extension surface of the first plane is higher than a tooth groove bottom surface of the first bevel tooth or the second bevel tooth.
[0009] Optionally, the diameter of the first spacing axis is smaller than the diameter of the second spacing axis.
[0010] In the second aspect, the utility model provides a wafer inversion device, comprising two wafer arranging mechanisms as described in any of the above, and also comprising a wafer flower basket arranged directly below the wafer arranging mechanism, a flower basket top tooth assembly that can be inserted into the wafer flower basket, and a flower basket positioning platform; the wafer flower basket is arranged on the flower basket positioning platform, and the flower basket top tooth assembly is used to push the silicon wafers in the wafer flower basket out or extend the wafer flower basket to receive the silicon wafers; the wafer arranging mechanism is arranged to arrange the wafer silicon wafers to be inserted into the wafer flower basket above the wafer flower basket, or to arrange the wafer silicon wafers taken out from the wafer flower basket.
[0011] Optionally, a mechanical gripper is further included, which is movably arranged above the slicing basket and is used to insert the slicing silicon wafers into the slicing basket or grab the slicing silicon wafers from the slicing basket.
[0012] Optionally, it also includes a boat turning mechanism, which includes a bottom plate, a side plate and a rotating shaft rotatably connected to the side plate, and the side plate is provided with a sheet body limiting groove, and the sheet body limiting groove is arranged in a one-to-one correspondence with the slot in the segmented flower basket.
[0013] The beneficial effects of the utility model are:
[0014] The sliced silicon wafer sorting mechanism provided by the present application includes a first sorting component and a second sorting component arranged at intervals, and a spacing axis arranged between the first sorting component and the second sorting component and can be close to or away from the first sorting component and the second sorting component. When the sorting mechanism is used to sort multiple sliced silicon wafers in a flower basket, the spacing axis can be inserted between two sliced silicon wafers. The first sorting component and the second sorting component are respectively on the sides of two columns of silicon wafers. The middle spacing axis can move toward the first sorting component and the second sorting component at the same time, so that the entire column of sliced silicon wafers between the first sorting component and the spacing axis and the entire column of sliced silicon wafers between the second sorting component and the spacing axis are sorted at the same time, and the two slices are separated according to a preset spacing, which solves the problem that the prior art cannot solve the problem of being unable to sort and sort due to the small spacing between the slices, and brings convenience to the sorting of the sliced silicon wafers.
[0015] In addition, the wafer flipping device provided by the utility model, on the basis of the aforementioned wafer arranging mechanism, is provided with a wafer basket for carrying the wafers, a wafer basket positioning platform for placing the wafer basket, and a wafer basket top tooth assembly that can be inserted into the wafer basket. The wafer basket top tooth assembly can be used to send the wafers in the wafer basket out of the wafer basket, and to guide the external wafers to be inserted into the wafer basket, thereby realizing the wafer flipping action of the wafers. The wafer flipping device of the utility model can take out all the wafers in the wafer basket at one time, or insert all the wafers into the wafer basket at one time, thereby improving the efficiency of inserting and taking out the wafers. BRIEF DESCRIPTION OF THE DRAWINGS
[0016] Figure 1 A schematic diagram showing the initial position of the slice arranging mechanism provided by the utility model;
[0017] Figure 2 A schematic diagram showing the action of the slice arranging mechanism provided by the utility model to arranging slices;
[0018] Figure 3 A front structural schematic diagram showing a first arranging component in the slice arranging mechanism provided by the utility model;
[0019] Figure 4 A schematic diagram showing the front structure of the separation axis in this embodiment;
[0020] Figure 5 A top view and a partial enlarged view of the slice arranging mechanism provided by the utility model when in use;
[0021] Figure 6 A schematic diagram showing the front structure of the film rewinding device provided by the utility model;
[0022] Figure 7 The utility model is a schematic diagram showing an axial side view of a boat turning mechanism in a film rewinding device.
[0023] Reference numerals:
[0024] 1: first sorting assembly; 2: second sorting assembly; 3: dividing axis; 31: first dividing axis; 32: second dividing axis; 4: pad; 5: limit tooth; 6: baffle; 7: slicing flower basket; 8: flower basket top tooth assembly; 9: boat turning mechanism; 10: first bevel tooth; 20: second bevel tooth; 100: slicing silicon wafer. DETAILED DESCRIPTION
[0025] The following will be combined with the drawings in the utility model embodiments to clearly and completely describe the technical solutions in the utility model embodiments. In addition, the "in one embodiment" or "in an embodiment" appearing in various places throughout the specification does not necessarily refer to the same embodiment. In addition, these specific features, structures or characteristics can be combined in one or more embodiments in any suitable manner.
[0026] It should also be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity from another entity, and do not necessarily require or imply any such actual relationship or order between these entities. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that an article or terminal device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such articles. In the absence of further restrictions, the elements defined by the sentence "including a ..." do not exclude the existence of other identical elements in the article including the elements.
[0027] refer to Figures 1 to 7 As shown, the utility model provides a slice arranging mechanism and a slice rewinding device.
[0028] In the first aspect, the utility model proposes a slice organizing mechanism, which includes a first organizing component 1 and a second organizing component 2 arranged at intervals, and a dividing axis 3 arranged between the first organizing component 1 and the second organizing component 2 and can be close to or away from the first organizing component 1 and the second organizing component 2; the dividing axis 3 includes a first dividing axis 31 and a second dividing axis 32, and the first dividing axis 31 and the second dividing axis 32 are respectively provided with a first bevel tooth 10 and a second bevel tooth 20, and the first bevel tooth 10 and the second bevel tooth 20 can rotate around the axis of the first bevel tooth 10 and the second bevel tooth 20 respectively.
[0029] The "flower basket" mentioned below refers to a slice flower basket 7 for carrying a plurality of slices.
[0030] As mentioned above, Figure 1 and Figure 5 As shown, the sliced silicon wafer sorting mechanism provided by the present application includes a first sorting component 1 and a second sorting component 2 which are arranged at intervals, and a spacing axis 3 which is arranged between the first sorting component 1 and the second sorting component 2 and can be close to or away from the first sorting component 1 and the second sorting component 2. When the sorting mechanism is used to sort multiple sliced silicon wafers 100 in the flower basket, the spacing axis 3 can be inserted between two sliced silicon wafers 100, and the first sorting component 1 and the second sorting component 2 are respectively on the sides of the two columns of silicon wafers, and the middle spacing axis 3 can be moved toward the first sorting component 1 and the second sorting component 2 at the same time, so that the entire column of sliced silicon wafers 100 between the first sorting component 1 and the spacing axis 3 and the entire column of sliced silicon wafers 100 between the second sorting component 2 and the spacing axis 3 are sorted at the same time, and the two slices are separated according to a preset spacing, which solves the problem that the prior art cannot solve the problem of being unable to sort and sort due to the small spacing between the slices, and brings convenience to the sorting of the sliced silicon wafers 100.
[0031] Specifically, the above-mentioned dividing shaft 3 includes a first dividing shaft 31 and a second dividing shaft 32, and the first bevel gear 10 and the second bevel gear 20 on the first dividing shaft 31 and the second dividing shaft 32 can rotate around their own axes; in addition, the first dividing shaft 31 and the second dividing shaft 32 also include a pad 4, which is configured to contact the side of the sliced silicon wafer 100. The first bevel gear 10 and the second bevel gear 20 are screwed to the first dividing shaft 31 and the second dividing shaft 32.
[0032] like Figure 1 and Figure 2 As shown, taking a flower basket containing two rows of sliced silicon wafers 100 as an example, when in use, the spacing axis 3 is slowly inserted into the gap between the two slices according to the positional relationship that the first spacing axis 31 is at the bottom and the second spacing axis 32 is at the top, and the first sorting component 1 and the second sorting component 2 are respectively lowered to the sides of the two rows of slices; then, the first spacing axis 31 and the second spacing axis 32 are controlled to rotate clockwise (or counterclockwise) so that the first bevel gear 10 and the second bevel gear 20 are respectively inserted into the gaps between the two adjacent rows of slices on both sides, and then the first spacing axis 31 is controlled to move in the direction indicated by the first bevel gear 10, and the second spacing axis 32 is controlled to move in the direction indicated by the second bevel gear 20, so that the first row of slices and the second row of slices in the flower basket are away from each other by a preset spacing, that is, the spacing effect is achieved.
[0033] Among them, when the aforementioned first dividing axis 31 and the second dividing axis 32 move toward the first column of slices and the second column of slices respectively, the first sorting component 1 on the other side of the first column of slices is controlled to move toward the first column of slices, and the second sorting component 2 is controlled to move toward the second column of slices, that is, the slices are pushed from both sides of the two columns of slices to finally achieve the purpose of sorting.
[0034] In addition, considering that the spacing between the two columns of slices in the flower basket is inconsistent, it is inconvenient to insert the slices into the gap between the two columns. In some embodiments, the diameter of the first spacing axis 31 is set to be smaller than the diameter of the second spacing axis. When the first spacing axis 31 enters the gap between the two columns of slices, the smaller diameter enters first, and after separating the two columns of slices by a certain distance, the second spacing axis 32 with a larger diameter continues to push the two columns of slices to both sides, thereby achieving the purpose of separation.
[0035] In some embodiments, the aforementioned first organizing component 1 and the second organizing component 2 have the same structure and can both include upper and lower limit teeth 5 and baffles 6, and the bottom surface of the tooth groove of the limit teeth 5 is coplanar with the first surface of the baffle 6 in the vertical direction.
[0036] like Figure 3As shown, the limiting teeth 5 and the baffle 6 of the first and second sorting components 1 and 2 are aligned in the vertical direction, and the limiting teeth 5 match the number of slices in the basket, so that there is a limiting tooth 5 between adjacent sliced silicon wafers 100. When it moves close to the side of the sliced silicon wafer 100, the limiting teeth 5 first separate all the sliced silicon wafers 100, and continue to move until the side of the slice contacts the baffle 6 at the bottom, and then cooperate with the separation axis 3 to move a preset distance to realize the sorting of all the slices. The function of the baffle 6 is to insulate and prevent the side of the slice from being worn during sorting. Therefore, the baffle 6 needs to be made of a soft material with insulating properties, such as PEEK.
[0037] Of course, the aforementioned first sorting component 1, second sorting component 2 and dividing shaft 3 all include component devices that drive their movement, wherein a first driving component is provided to simultaneously control the first sorting component 1 and the second sorting component 2 to increase the uniformity of the sorting actions of the first sorting component 1 and the second sorting component 2; the second driving component independently controls the rotation and translation of the dividing shaft 3, and may utilize a motor and a high-precision cylinder, and this embodiment does not make any specific limitation on this.
[0038] In some embodiments, Figure 4 As shown, the area where the pad 4 is used to contact the slicing silicon wafer 100 includes a transition surface and a first plane, and the extension surface of the first plane is higher than the bottom surface of the tooth groove of the first bevel tooth 10 or the second bevel tooth 20. The transition surface can be an arc, or a straight slope formed by chamfering. During the rotation of the separation shaft 3, the transition surface can reduce the friction or impact on the side of the slicing silicon wafer 100. In addition, the first plane is parallel to the groove surface of the limit tooth 5, and the height of the surface in the vertical direction can be set slightly higher than the height of the plane where the tooth groove of the first bevel tooth 10 or the second bevel tooth 20 is located, so that the pad 4 contacts the edge of the slicing before the tooth groove of the first bevel tooth 10 or the second bevel tooth 20, protecting the slicing silicon wafer 100 from wear.
[0039] In the second aspect, the utility model provides a wafer inversion device, comprising two wafer arranging mechanisms as any of the aforementioned ones, and also comprising a wafer basket 7 arranged directly below the wafer arranging mechanism, a basket top tooth assembly 8 that can be inserted into the wafer basket 7, and a basket positioning platform; the wafer basket 7 is arranged on the basket positioning platform, and the basket top tooth assembly 8 is used to push out the silicon wafers in the wafer basket 7 or extend the wafer basket 7 to receive the silicon wafers; the wafer arranging mechanism is configured to arrange the wafers 100 to be inserted into the wafer basket 7 above the wafer basket 7, or to arrange the wafers 100 taken out of the wafer basket 7.
[0040] The wafer flipping device provided by the utility model is provided with a wafer basket 7 for carrying the wafer slices 100, a wafer basket positioning platform for placing the wafer basket 7, and a wafer basket top tooth assembly 8 which can be inserted into the wafer basket 7 on the basis of the aforementioned wafer arranging mechanism. The wafer flipping device provided by the utility model can, by using the wafer basket top tooth assembly 8, deliver the wafer slices 100 in the wafer basket 7 out of the wafer basket 7, and guide the external wafer slices 100 to be inserted into the wafer basket 7, so as to realize the wafer flipping action. The wafer flipping device of the utility model can take out all the wafer slices 100 in the wafer basket 7 at one time, or insert all the wafer slices 100 into the wafer basket 7 at one time, thereby improving the efficiency of inserting and taking out the wafer slices 100.
[0041] In some embodiments, the film rewinding device may further include a boat turning mechanism 9, such as Figure 6 and Figure 7 As shown, the boat turning mechanism 9 is arranged on the left side of the wafer basket 7. A wafer boat (a device for carrying silicon wafers) is fixed in the mechanism. The structure of the wafer boat is similar to that of the wafer basket 7. Because of the way of inserting silicon wafers in the wafer boat, the wafer boat needs to be turned from the wafer boat to the wafer boat when inserting the silicon wafers in the wafer boat. Figure 6 The position shown is rotated 90° clockwise so that the front of the wafer boat faces upward, so as to facilitate the insertion and removal of silicon wafers from the front of the wafer boat. When placing silicon wafers into the slice basket 7, it is necessary to align each slice directly above the basket; during aligning, the first aligning component 1 and the second aligning component 2 cooperate with the spacing axis 3 to complete the aligning of all sliced silicon wafers 100. The top tooth component 8 of the basket includes top teeth and a drive to control the top teeth to move up and down, and a sliding component to control the top teeth to move left and right, so as to be compatible with slice baskets 7 at different positions.
[0042] In some embodiments, the aforementioned wafer flipping device further includes a mechanical gripper, which is movably disposed above the slicing basket 7 and is used to insert the slicing silicon wafer 100 into the slicing basket 7 or grab the slicing silicon wafer 100 from the slicing basket 7. The mechanical gripper is used to adsorb and fix each slicing silicon wafer 100, and complete the import and export of the slicing silicon wafer 100 in the basket, or to realize the import and export of the silicon wafer between the basket and the wafer boat. The design of the suction cup for adsorbing the silicon wafer on the mechanical hand is related to the number and parameters of the slicing silicon wafer 100, and this embodiment does not impose specific restrictions on this.
[0043] Specifically, Figure 7 As shown, the boat turning mechanism 9 in the aforementioned embodiment may include a bottom plate, a side plate and a rotating shaft rotatably connected to the side plate, and the side plate is provided with a sheet limiting groove, and the sheet limiting groove is arranged one-to-one correspondingly with the card slot in the sheet flower basket 7. Figure 7 The arrow in the figure indicates the steering angle of the connecting shaft.
[0044] Finally, the utility model provides a slice tidying mechanism and a film reversing device, the slice tidying mechanism includes a first tidying component 1 and a second tidying component 2 arranged at intervals, and a spacing axis 3 arranged between the first tidying component 1 and the second tidying component 2 and can be close to or away from the first tidying component 1 and the second tidying component 2; the spacing axis 3 includes a first spacing axis 31 and a second spacing axis 32, and the first bevel teeth 10 and the second bevel teeth 20 on the first spacing axis 31 and the second spacing axis 32 can rotate around their axis. The slice tidying mechanism provided by the utility model solves the problem that the prior art cannot solve the problem of being unable to separate and tidy up due to the small spacing between the slices, which brings convenience to the tidying up of the sliced silicon wafers 100. In addition, the film reversing device provided can export or insert all the sliced silicon wafers 100 at one time, which improves the efficiency of inserting and taking out the sliced silicon wafers 100.
[0045] It should also be noted that the various embodiments in this specification are described in a progressive manner, and each embodiment focuses on the differences from other embodiments. The same or similar parts between the various embodiments can be referenced to each other.
Claims
1. A fragmentation reorganization mechanism, characterized in that: The slice arranging mechanism comprises a first arranging component (1) and a second arranging component (2) which are arranged at intervals, and a spacing axis (3) which is arranged between the first arranging component (1) and the second arranging component (2) and can be moved closer to or farther away from the first arranging component (1) and the second arranging component (2); the spacing axis (3) comprises a first spacing axis (31) and a second spacing axis (32); the first spacing axis (31) and the second spacing axis (32) are respectively provided with a first bevel tooth (10) and a second bevel tooth (20); the first bevel tooth (10) and the second bevel tooth (20) can respectively rotate around the axis of the first bevel tooth (10) and the second bevel tooth (20).
2. The fragment reorganization mechanism according to claim 1, characterized in that: The first spacing axis (31) and the second spacing axis (32) further include a pad (4), and the pad (4) is arranged to contact the side edge of the sliced silicon wafer (100).
3. The fragment reorganization mechanism according to claim 2, characterized in that: The first arranging component (1) and the second arranging component (2) have the same structure, and both comprise upper and lower position-limiting teeth (5) and baffles (6), wherein the tooth groove bottom surface of the position-limiting teeth (5) is coplanar with the first surface of the baffle (6) in the vertical direction.
4. The fragment reorganization mechanism according to claim 3, characterized in that: It also comprises a driving assembly, wherein a first driving assembly in the driving assembly simultaneously controls the first sorting assembly (1) and the second sorting assembly (2), and a second driving assembly independently controls the rotation and translation of the spacing axis (3).
5. The fragment reorganization mechanism according to claim 2, characterized in that: The area of the pad (4) used for contacting the sliced silicon wafer (100) includes a transition surface and a first plane, and the extension surface of the first plane is higher than the tooth groove bottom surface of the first bevel tooth (10) or the second bevel tooth (20).
6. The fragment reorganization mechanism according to claim 1, characterized in that: The shaft diameter of the first spacing shaft (31) is smaller than the shaft diameter of the second spacing shaft (32).
7. A film rewinding device, characterized in that: The invention comprises two slice arranging mechanisms as claimed in any one of claims 1 to 6, and further comprises a slice flower basket (7) arranged directly below the slice arranging mechanism, a flower basket top tooth assembly (8) which can be inserted into the slice flower basket (7), and a flower basket positioning platform; the slice flower basket (7) is arranged on the flower basket positioning platform, and the flower basket top tooth assembly (8) is used to push the silicon wafers in the slice flower basket (7) out or extend the slice flower basket and receive the silicon wafers; the slice arranging mechanism is arranged to arrange the slice silicon wafers (100) to be inserted into the slice flower basket (7) above the slice flower basket (7), or arrange the slice silicon wafers (100) taken out of the slice flower basket (7).
8. The film rewinding device according to claim 7, characterized in that: It also comprises a mechanical gripper, which is movably arranged above the slicing basket (7) and is used to insert the slicing silicon wafer (100) into the slicing basket (7) or to grab the slicing silicon wafer (100) from the slicing basket (7).
9. The film rewinding device according to claim 7, characterized in that: It also includes a boat turning mechanism (9), which includes a bottom plate, a side plate and a rotating shaft rotatably connected to the side plate, and the side plate is provided with a sheet body limiting groove, and the sheet body limiting groove is arranged in a one-to-one correspondence with the slot in the sheet flower basket (7).