Flip chip and lead bonding chip integrated windowing ball grid array packaging structure
Patent Information
- Application Number
- CN202420873700.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-04-25
- Publication Date
- 2025-01-07
- Estimated Expiration
- 2034-04-25
AI Technical Summary
传统的做法一般会将芯片堆叠粘贴在封装基板或封装引线框架之上，通过引线键合，注塑填合，植球，切割再分离单一化，而这种采取基板或者引线框架门槛低，竞争对手易于效仿复制电路设计，此方案不适宜于机密芯片封装方案
[0011] The utility model proposes a flip chip and wire bonding chip integrated windowed ball grid array packaging structure, which combines three chip packaging interconnection technologies: wire bonding technology, flip chip technology and windowed ball grid array. Encapsulation, while increasing the flash memory capacity, encapsulates the main control chip in a structure to reduce costs, avoid competitors from imitating, and meet confidential chip packaging requirements.
Smart Images
Figure CN222320267U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to a flip chip and a wire bonding chip integrated window ball grid array packaging structure, belonging to the technical field of semiconductor packaging. Background Art
[0002] Semiconductor packaging refers to the process of processing tested wafers into independent chips according to product models and functional requirements. The traditional method is to stack and paste the chips on the packaging substrate or packaging lead frame, and then separate them into single pieces through wire bonding, injection molding, ball planting, cutting, etc. However, this method of using substrates or lead frames has a low threshold, and competitors can easily imitate and copy circuit designs. This solution is not suitable for confidential chip packaging solutions. Utility Model Content
[0003] The utility model aims to overcome the deficiencies of the prior art and to provide a flip chip and wire bonding chip integrated window ball grid array packaging structure.
[0004] To achieve the above-mentioned purpose, the technical solution adopted by the utility model is: a flip chip and wire bonding chip integrated window ball grid array packaging structure, comprising a substrate, a flip chip body and a main control chip; a window through groove is opened in the middle of the substrate, and the window through groove separates the substrate; two flip chip bodies are provided, and the two flip chip bodies are respectively connected and fixed on the top surface of the substrate located on both sides of the window through groove; the main control chip is connected and fixed above the two flip chip bodies, and the main control chip and the substrates located on both sides of the window through groove are electrically connected through bonding wires; a heat sink is provided directly above the main control chip.
[0005] Preferably, the substrate, the flip chip body, the periphery of the main control chip and the window through groove are all injection-molded with epoxy resin, and the epoxy resin in the window through groove is a special-shaped structure.
[0006] Preferably, the flip chip body is fixed on the top surface of the substrate by high-temperature reflow soldering.
[0007] Preferably, the top surfaces of the two flip chip bodies are coated with thermosetting glue, and the main control chip is fixed on the two flip chip bodies by the thermosetting glue.
[0008] Preferably, heat dissipation silica gel is arranged between the main control chip and the heat dissipation plate.
[0009] Preferably, two sides of the main control chip, the heat sink and the two flip chips are flush, and the top surface of the heat sink is flush with the top surface of the epoxy resin located on both sides of the heat sink.
[0010] Due to the application of the above technical solution, the utility model has the following advantages compared with the prior art:
[0011] The utility model provides a flip chip and wire bonding chip integrated window ball grid array packaging structure, which combines three chip packaging interconnection technologies: wire bonding technology, flip chip technology and window ball grid array packaging, thereby increasing the flash memory capacity while packaging the main control chip in one structure, reducing costs, and preventing competitors from imitating, thereby meeting confidential chip packaging requirements. BRIEF DESCRIPTION OF THE DRAWINGS
[0012] The technical solution of the utility model is further described below in conjunction with the accompanying drawings:
[0013] Attached Figure 1 It is a structural schematic diagram of step one in the processing process of the utility model;
[0014] Attached Figure 2 It is a structural schematic diagram of step two and step three in the processing process of the utility model;
[0015] Attached Figure 3 It is a structural schematic diagram of step 4 in the processing process of the utility model;
[0016] Attached Figure 4 It is a structural schematic diagram of step five in the processing process of the utility model;
[0017] Attached Figure 5 It is a structural schematic diagram of step six in the processing process of the utility model;
[0018] Attached Figure 6 It is a structural schematic diagram of step seven in the processing process of the utility model;
[0019] Attached Figure 7 It is a structural schematic diagram of step eight in the processing process of the utility model;
[0020] Attached Figure 8 This is a structural diagram of step nine in the processing of the utility model
[0021] In the figure: 1. substrate; 2. flip chip body; 3. main control chip; 4. window groove; 5. bonding wire; 6. heat sink; 7. epoxy resin; 8. thermosetting glue; 9. heat dissipation silicone. DETAILED DESCRIPTION
[0022] The utility model is further described in detail below in conjunction with the accompanying drawings and specific embodiments.
[0023] As attached Figure 8 As shown, a flip chip and wire bonding chip integrated window ball grid array packaging structure described in the utility model includes a substrate 1, a flip chip body 2 and a main control chip 3.
[0024] A window groove 4 is provided in the middle of the substrate 1, and the window groove 4 separates the substrate 1; two flip chip bodies 2 are provided, and the two flip chip bodies 2 are respectively connected and fixed on the top surface of the substrate 1 located on both sides of the window groove 4; wherein the flip chip body 2 is fixed on the top surface of the substrate 1 by high-temperature reflow soldering.
[0025] The main control chip 3 is connected and fixed on the top of the two flip chip bodies 2, and the main control chip 3 is electrically connected to the substrate 1 located on both sides of the window groove 4 through bonding wires 5; wherein, thermosetting glue 8 is applied on the top surfaces of the two flip chip bodies 2, and the main control chip 3 is fixed on the two flip chip bodies 2 through the thermosetting glue 8.
[0026] A heat sink 6 is arranged directly above the main control chip 3. In this embodiment, the heat sink 6 is configured as a ceramic copper-clad heat sink. A heat dissipation silicone 9 is arranged between the main control chip 3 and the heat sink 6. The heat sink 6 is mounted above the main control chip 3 through the heat dissipation silicone 9.
[0027] The substrate 1 , the flip chip body 2 , the main control chip 3 and the window groove 4 are all injection-molded with epoxy resin 7 , and the epoxy resin 7 in the window groove 4 is a special-shaped structure.
[0028] The two sides of the main control chip 3, the heat sink 6 and the two flip chips are flush, and the top surface of the heat sink 6 is flush with the top surface of the epoxy resin 7 located on both sides of the heat sink 6 to facilitate injection molding.
[0029] As attached Figure 1-8 As shown, the processing process of the package structure of this scheme is as follows:
[0030] Step 1: Designing a window through groove 4 on the substrate 1;
[0031] During the manufacturing stage of the substrate 1 , the window opening through groove 4 and the position of the window opening through groove 4 are reserved.
[0032] Step 2: Flip chip body 2 mounting;
[0033] The flip chip body 2 and another flip chip body 2 are pasted onto the substrate 1 carrier.
[0034] Step 3: High temperature reflow soldering;
[0035] The flash memory flip chip body 2 and another flash memory flip chip body 2 are fixed on the substrate 1 carrier by high temperature reflow soldering, and the soldering flux is cleaned.
[0036] Step 4: Apply thermosetting glue 8;
[0037] Thermosetting glue 8 is applied on the surface of the flip chip body 2 , and thermosetting glue 8 is applied on the surface of another flip chip body 2 .
[0038] Step 5: Mount the main control chip 3;
[0039] The main control chip 3 is mounted on the thermosetting glue 8 .
[0040] Step 6: Bonding the main control chip 3;
[0041] The main control chip 3 is connected to the substrate 1 by conventional wire bonding.
[0042] Step 7: Mounting the ceramic copper-clad heat sink 6;
[0043] The surface of the main control chip 3 is coated with heat dissipation silica gel 9, and a ceramic copper-clad heat dissipation plate 6 is mounted.
[0044] Step 8: Epoxy resin 7 injection molding;
[0045] The epoxy resin 7 is injection molded, wherein the epoxy resin 7 in the window through groove 4 is of a special-shaped injection molding design.
[0046] Step 9: Sanding epoxy resin 7;
[0047] The epoxy resin 7 is polished so that the upper layer of the ceramic copper-clad heat sink 6 is flush with the epoxy resin 7 .
[0048] The current mainstream in the market is to package the main control chip 3 and the flash memory chip separately. Different from this, the difference of this solution is that the capacity of the flip chip is superimposed and packaged together with the main control chip 3.
[0049] The above are only specific application examples of the utility model and do not constitute any limitation to the protection scope of the utility model; any technical solutions formed by equivalent transformation or equivalent replacement shall fall within the protection scope of the utility model.
Claims
1. A flip chip and wire bond chip integrated window ball grid array packaging structure, characterized in that: The invention comprises a substrate (1), a flip chip body (2) and a main control chip (3); a window opening groove (4) is provided in the middle of the substrate (1), and the window opening groove (4) separates the substrate (1); two flip chip bodies (2) are provided, and the two flip chip bodies (2) are respectively connected and fixed on the top surface of the substrate (1) located on both sides of the window opening groove (4); the main control chip (3) is connected and fixed above the two flip chip bodies (2), and the main control chip (3) and the substrate (1) located on both sides of the window opening groove (4) are electrically connected through bonding wires (5); and a heat sink (6) is provided directly above the main control chip (3).
2. The flip chip and wire bond chip integrated window ball grid array packaging structure according to claim 1, characterized in that: The periphery of the substrate (1), the flip chip body (2), the main control chip (3), and the inside of the window opening groove (4) are all injection-molded with epoxy resin (7), and the epoxy resin (7) in the window opening groove (4) is a special-shaped structure.
3. The flip chip and wire bond chip integrated window ball grid array packaging structure according to claim 1, characterized in that: The flip chip body (2) is fixed on the top surface of the substrate (1) by high-temperature reflow soldering.
4. The flip chip and wire bond chip integrated window ball grid array packaging structure according to claim 1, characterized in that: The top surfaces of the two flip chip bodies (2) are coated with thermosetting glue (8), and the main control chip (3) is fixed on the two flip chip bodies (2) by means of the thermosetting glue (8).
5. The flip chip and wire bond chip integrated window ball grid array packaging structure according to claim 1, characterized in that: Heat dissipation silica gel (9) is arranged between the main control chip (3) and the heat dissipation plate (6).
6. The flip chip and wire bond chip integrated window ball grid array packaging structure according to claim 1, characterized in that: The two sides of the main control chip (3), the heat sink (6) and the two flip chips are flush, and the top surface of the heat sink (6) is flush with the top surface of the epoxy resin (7) located on both sides of the heat sink (6).