Wide-angle planar infrared receiving module

Abstract

The utility model relates to the technical field of infrared communication, in particular to a wide-angle planar infrared receiving module. Comprising a combined PCB, a die bonding module for receiving signals and decoding the signals is integrated on the combined PCB, and a filter layer is glued and fixed on the die bonding module; the solid crystal module comprises a PD light receiving wafer and an IC decoding wafer, the PD light receiving wafer is used for receiving light signals and converting the light signals into electric signals, and the IC decoding wafer is used for decoding the electric signals converted by the PD light receiving wafer. According to the utility model, the plane type infrared receiving head is not required to be accurately aligned with an emission source, and the plane type infrared receiving head generally adopts a wide-spectrum receiving mode and can receive infrared light with various wavelengths, so that the plane type infrared receiving head can better identify and filter effective infrared signals in the case of interference of a complex ambient light source, and the anti-interference capability of the system is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of infrared communication, in particular to a wide-angle planar infrared receiving module. Background Art

[0002] At present, most infrared receiving heads use infrared receiving heads with lenses, which are devices used to receive infrared light signals and convert them into electrical signals. They are usually used in remote control, wireless data transmission, infrared communication and other fields. However, existing circular lens infrared receiving heads usually have a certain directionality, that is, they can only receive infrared light signals in a specific direction. If the angle deviation between the transmitter and the receiver is too large, it may cause signal reception failure or instability. The receiving angle is usually small, which limits its use in application scenarios that require wide-range reception. Utility Model Content

[0003] In view of the shortcomings of the prior art, the utility model provides a wide-angle planar infrared receiving module, which solves the problem that the existing circular lens can only receive infrared light signals in a specific direction, too large angle deviation may lead to signal reception failure or instability, and the receiving angle is usually small. It has the advantages of receiving infrared signals within a wider angle range, being more convenient and flexible to use, and having strong anti-interference ability.

[0004] In order to achieve the above purpose, the utility model provides the following technical solutions:

[0005] A wide-angle planar infrared receiving module includes a combined PCB board, on which is integrated a die-bonding module for receiving and decoding signals, and on which is glued an inherent filter layer; the die-bonding module includes a PD light-receiving chip for receiving optical signals and converting them into electrical signals, and an IC decoding chip for decoding the electrical signals converted by the PD light-receiving chip.

[0006] Furthermore, the PD light receiving chip and the IC decoding chip are both provided with an IN pin, an OUT pin, a GND pin and a VCC pin.

[0007] Furthermore, the IN pin, OUT pin, GND pin and VCC pin on the PD light receiving chip are connected and conducted with the IN pin, OUT pin, GND pin and VCC pin on the IC decoding chip respectively.

[0008] Furthermore, the combined PCB board includes a bottom plate, side plates are fixedly connected to both sides of the bottom plate, the bottom plate is fixedly connected to the PD light receiving chip and the IC decoding chip, the side plates are fixedly connected to the filter layer, and a grounding pin is provided at the bottom of the bottom plate.

[0009] Furthermore, the height of the bottom plate is 0.2 mm, and the height of the side plate is 0.8 mm.

[0010] Furthermore, the filter layer is made of black glue.

[0011] Compared with the prior art, the utility model provides a wide-angle planar infrared receiving module, which has the following beneficial effects:

[0012] 1. The surface of the black glue used in the filter layer of the utility model is smooth and has no protrusions. The lens-free flat infrared receiving head does not need a lens to focus the infrared light, so it can receive infrared signals within a wider angle range without the need to accurately align the transmitting source, which makes it more convenient and flexible to use. The flat infrared receiving head usually adopts a wide-band receiving method and can receive infrared light of multiple wavelengths. When facing complex environmental light source interference, it can better identify and filter out effective infrared signals, thereby improving the system's anti-interference ability. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] The drawings described herein are used to provide a further understanding of the present application and constitute a part of the present application. The illustrative embodiments of the present application and their descriptions are used to explain the present application and do not constitute an improper limitation on the present application. In the drawings:

[0014] Figure 1 This is a side view of the die bonding wire of the wide-angle planar infrared receiving module of the utility model;

[0015] Figure 2 This is a side view of the wide-angle planar infrared receiving module of the utility model;

[0016] Figure 3 It is a top view of the die bonding wires of the wide-angle planar infrared receiving module of the utility model.

[0017] In the figure:

[0018] 1. Assembled PCB board; 11. Bottom plate; 12. Side plate;

[0019] 2. Die bonding module; 21. PD light receiving chip; 22. IC decoding chip;

[0020] 3. Filter layer. DETAILED DESCRIPTION

[0021] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0022] At present, most infrared receiving heads use infrared receiving heads with lenses, which are devices used to receive infrared light signals and convert them into electrical signals. They are usually used in remote control, wireless data transmission, infrared communication and other fields. However, existing circular lens infrared receiving heads usually have a certain directionality, that is, they can only receive infrared light signals in a specific direction. If the angle deviation between the transmitter and the receiver is too large, it may cause signal reception failure or instability. The receiving angle is usually small, which limits its use in application scenarios that require wide-range reception.

[0023] Please refer to Figure 1-Figure 3 In order to solve the problem that the existing circular lens can only receive infrared light signals in a specific direction, too large an angle deviation may lead to signal reception failure or instability, and the receiving angle is usually small, this embodiment provides a wide-angle planar infrared receiving module. By using a planar infrared receiving head to receive infrared light, no lens is needed to focus the infrared light, and the received infrared light is decoded, infrared signals can be received within a wider angle range without the need to accurately align the transmitting source, making it more convenient and flexible to use. A die-bonding module 2 for receiving and decoding signals is integrated on the combined PCB board 1. The die-bonding module 2 is glued with an inherent filter layer 3, and the filter layer 3 is made of black glue. The combined PCB board 1 adopts a combined board with a low middle and high sides; the die-bonding module 2 includes a module for receiving optical signals and converting The PD light receiving chip 21 for electric signals and the IC decoding chip 22 for decoding the electric signals converted by the PD light receiving chip 21, the PD light receiving chip 21 adopts the chip model S-60AF4PDN, receives the optical signal emitted by IR (infrared) and converts it into electric signals, the IC decoding chip 22 adopts the chip model ND6200, decodes the received signal, the black plastic surface adopted by the filter layer 3 is smooth and has no protrusions, and the lens-free flat infrared receiving head does not need a lens to focus the infrared light, so it can receive infrared signals in a wider angle range without the need to accurately align the emission source, which makes it more convenient and flexible in use, and the flat infrared receiving head usually adopts a wide-band receiving method, which can receive infrared light of multiple wavelengths. When facing the interference of complex environmental light sources, it can better identify and filter out effective infrared signals, and improve the anti-interference ability of the system.

[0024] As a preferred technical solution of this embodiment, the PD light receiving chip 21 and the IC decoding chip 22 are both provided with IN pin, OUT pin, GND pin and VCC pin. The IN pin, OUT pin, GND pin and VCC pin on the PD light receiving chip 21 are respectively connected to the IN pin, OUT pin, GND pin and VCC pin on the IC decoding chip 22. The PD light receiving chip 21 and the IC decoding chip 22 are connected and conducted through gold wires, so that the signals can be received normally and decoded.

[0025] As a preferred technical solution of this embodiment, the combined PCB board 1 includes a bottom plate 11, and side plates 12 are fixedly connected on both sides of the bottom plate 11. The bottom plate 11 is fixedly connected to a PD light receiving chip 21 and an IC decoding chip 22. The PD light receiving chip 21 and the IC decoding chip 22 are fixed at the center of the bottom plate 11. The side plate 12 is fixedly connected to the filter layer 3. A grounding pin is provided at the bottom of the bottom plate 11. The height of the bottom plate 11 is 0.2 mm, and the height of the side plate 12 is 0.8 mm. The middle solid crystal module 2 and the welding wire area of ​​the combined PCB board 1 are filled with black glue through molding, so that the surface of the glue is smooth and has no protrusions. The glue is solidified after high-temperature baking. The IR (infrared) light source emits infrared light. The infrared receiving head first filters out light below the 850nm band through the outer layer of black glue, and then receives infrared light above the 850nm band through the PD light receiving chip 21, converts the optical signal into an electrical signal, and the IC decoding chip 22 performs signal decoding processing.

[0026] It should be noted that, in this article, the terms "comprises", "includes" or any other variations thereof are intended to cover non-exclusive inclusion, so that a process, method, article or apparatus that includes a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or apparatus.

[0027] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A wide-angle planar infrared receiving module, characterized in that: The invention comprises a combined PCB board (1), on which a die-bonding module (2) for receiving signals and performing signal decoding is integrated, and an inherent optical filter layer (3) is glued on the die-bonding module (2); the die-bonding module (2) comprises a PD light receiving chip (21) for receiving optical signals and converting them into electrical signals, and an IC decoding chip (22) for decoding the electrical signals converted by the PD light receiving chip (21).

2. A wide-angle planar infrared receiving module according to claim 1, characterized in that: The PD light receiving chip (21) and the IC decoding chip (22) are both provided with an IN pin, an OUT pin, a GND pin and a VCC pin.

3. A wide-angle planar infrared receiving module according to claim 2, characterized in that: The IN pin, OUT pin, GND pin and VCC pin on the PD light receiving chip (21) are respectively connected to the IN pin, OUT pin, GND pin and VCC pin on the IC decoding chip (22).

4. The wide-angle planar infrared receiving module according to claim 3, characterized in that: The combined PCB board (1) comprises a bottom plate (11), side plates (12) are fixedly connected to both sides of the bottom plate (11), the bottom plate (11) is fixedly connected to the PD light receiving chip (21) and the IC decoding chip (22), the side plates (12) are fixedly connected to the filter layer (3), and a grounding pin is provided at the bottom of the bottom plate (11).

5. The wide-angle planar infrared receiving module according to claim 4, characterized in that: The height of the bottom plate (11) is 0.2 mm, and the height of the side plate (12) is 0.8 mm.

6. The wide-angle planar infrared receiving module according to claim 1, characterized in that: The filter layer (3) is made of black glue.

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