Gold immersion device for surface treatment and processing of PCB (Printed Circuit Board)
By introducing positioning, lifting, cleaning and drying components into the gold depositing device, the uneven problem caused by the residue of contaminants on the surface of the PCB board is solved, and appropriate treatment and drying of the gold depositing is achieved before the gold depositing is achieved, and the quality of the gold depositing is improved.
Patent Information
- Application Number
- CN202420704822.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-04-07
- Publication Date
- 2025-01-07
- Estimated Expiration
- 2034-04-07
AI Technical Summary
The existing gold sinking devices tend to retain pollutants and residues during the surface treatment of PCB boards, resulting in uneven surfaces after gold sinking and affecting product quality.
A gold sinking device including a treatment tank, support frame, positioning assembly, lifting assembly, cleaning assembly and drying assembly is designed. By positioning assembly, the horizontal position of the PCB board is changed, the height of the lifting assembly is adjusted, the cleaning assembly is removed from contaminants, and the drying assembly is dried. The dry components are dried to ensure proper treatment before depositing gold and ensure uniform deposition of the gold layer.
The device uses a cleaning system to process the PCB board before depositing gold, ensuring uniform deposition of the gold layer, improving processing quality, avoiding problems caused by moisture, and ensuring that the surface after depositing gold is dry and stain-free.
Smart Images
Figure CN222321857U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of PCB board surface treatment processing, in particular to a gold sinking device for PCB board surface treatment processing. Background Art
[0002] PCB boards are widely used in communication equipment. There is a very common process in the surface treatment of circuit boards, called immersion gold. The purpose of the immersion gold process is to deposit a nickel-gold coating with stable color, good brightness, smooth coating and excellent solderability on the surface of the printed circuit of the PCB board, and the immersion gold device is a key equipment in the surface treatment of PCB boards. However, in the actual use of the existing immersion gold device, since the PCB board is generally directly fixed and sunk in the device, and then the current is applied for electrodeposition to produce a layer of metal coating on the surface of the circuit board, and the surface of the PCB board will retain pollutants and residues during the previous processing, resulting in uneven surface of the PCB board after immersion gold, which seriously affects the quality of the PCB board. Utility Model Content
[0003] The utility model aims to provide a gold immersion device for surface treatment of PCB boards, so as to solve the problem that the existing gold immersion device mentioned in the background technology easily makes the surface of the PCB board uneven after gold immersion, thereby reducing the product quality.
[0004] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a gold sinking device for surface treatment of PCB boards, comprising a gold sinking device body, and also comprising a processing pool, a support frame, a positioning component, a lifting component, a cleaning component, a heating box, a drying component, and a gold sinking pool; a processing pool is arranged at the upper end of the gold sinking device body, a support frame is fixed to the upper end of the gold sinking device body, a positioning component is arranged on the outside of the support frame, a lifting component is arranged on the upper end of the positioning component, a cleaning component is arranged on the inner side of the processing pool, a heating box is connected to the front of the gold sinking device body, a drying component is arranged in front of the heating box, and a gold sinking pool is arranged at the upper end of the gold sinking device body.
[0005] Preferably, the horizontal position of the PCB board can be easily changed by setting the positioning component, so as to facilitate switching between the processing pool and the gold sinking pool. The height of the PCB board can be changed by setting the lifting component. The PCB board can also be cleaned by setting the cleaning component, and the PCB board can be dried by setting the drying component. Compared with the traditional gold sinking method, the device has a cleaning system.
[0006] Preferably, the positioning assembly includes a drive motor, a screw rod, and a sleeve. The drive motor is installed on the outside of the support frame, the right side of the drive motor is connected to the screw rod, and the right end of the screw rod is connected to the sleeve. The drive motor provides power to make the screw rod rotate in the sleeve to facilitate changing the horizontal position of the gold sinking basket.
[0007] Preferably, the positioning assembly also includes a first movable seat and a movable table. The surface of the screw rod is connected to the first movable seat, the first movable seat is threadedly connected to the screw rod, and the movable table is fixed to the upper end of the first movable seat. The movable table can be moved in a direction by rotating the screw rod so that the gold sinking basket can be switched between the treatment tank and the gold sinking tank.
[0008] Preferably, the positioning assembly also includes a second movable seat and a light rod. The second movable seat is fixed to the lower end of the movable table. The second movable seat is slidably connected to the light rod. The light rod is fixed to the inner side of the support frame. The second movable seat slides left and right on the light rod, so that the movable table can stably move laterally and play a guiding role.
[0009] Preferably, the lifting assembly includes a pneumatic cylinder, a piston rod, a gold sinking basket, and a PCB board slot. The pneumatic cylinder is installed on the upper end of the movable table, the lower end of the pneumatic cylinder is connected to the piston rod, the lower end of the piston rod is connected to the gold sinking basket, and a PCB board slot is provided on the inner side of the gold sinking basket. By starting the pneumatic cylinder, the gold sinking basket can be raised or lowered to facilitate gold sinking pre-treatment or gold sinking treatment.
[0010] Preferably, the cleaning component includes a water inlet pipe, a valve, a branch pipe, and a nozzle. A water inlet pipe is arranged at the bottom of the treatment pool, a valve is arranged on the left side of the water inlet pipe, the upper end of the water inlet pipe is connected to the branch pipe, and a nozzle is installed at the upper end of the branch pipe. The nozzles are distributed at equal intervals. By opening the valve, clean water can pass through the water inlet pipe and the branch pipe and finally be sprayed out from the nozzle to remove pollutants and residues on the surface of the PCB.
[0011] Preferably, the drying component includes a fan, a heating plate, and a ventilation net. The fan is installed in front of the heating box, the heating plate is installed inside the heating box, and the ventilation net is provided on the back of the heating box. The heating plate is used to heat and raise the temperature, and the wind force of the fan is used to drive the rapid flow of hot air, thereby ensuring that the surface of the PCB board is thoroughly dried.
[0012] Compared with the prior art, the beneficial effects of the utility model are:
[0013] 1. The immersion gold device for PCB surface treatment can change the horizontal position of the PCB through the positioning component to facilitate switching between the treatment pool and the immersion gold pool. The height of the PCB can be changed through the lifting component. The PCB can be cleaned through the cleaning component and dried through the drying component. Compared with the traditional immersion gold method, the device has a cleaning system and can be properly treated before immersion gold, thereby ensuring that the gold layer is evenly deposited on the PCB surface and improving the processing quality.
[0014] 2. The immersion gold device for the surface treatment of the PCB board has branch pipes that can be staggered with the PCB board slots in the treatment tank. Each area of the PCB board surface can be cleaned by using a plurality of nozzles, thereby ensuring that the PCB board surface is clean and free of stains before immersion gold. In addition, a fan and a heating plate are provided on the front side of the treatment tank to ensure that the PCB board surface can be thoroughly dried after cleaning to avoid problems caused by moisture. BRIEF DESCRIPTION OF THE DRAWINGS
[0015] Figure 1 It is a schematic diagram of the three-dimensional structure of the utility model;
[0016] Figure 2 This is a schematic diagram of the main structure of the gold sinking device of the utility model;
[0017] Figure 3 This is a schematic diagram of the structure of the lifting assembly of the utility model;
[0018] Figure 4 This is a schematic diagram of the structure of the cleaning component of the utility model.
[0019] In the figure: 1. gold sinking device body; 2. treatment tank; 3. support frame; 4. positioning assembly; 5. lifting assembly; 6. cleaning assembly; 7. heating box; 8. drying assembly; 9. gold sinking tank; 401. driving motor; 402. screw rod; 403. sleeve; 404. first movable seat; 405. movable table; 406. second movable seat; 407. light rod; 501. pneumatic cylinder; 502. piston rod; 503. gold sinking basket; 504. PCB board slot; 601. water inlet pipe; 602. valve; 603. branch pipe; 604. nozzle; 801. fan; 802. heating plate; 803. ventilation net. DETAILED DESCRIPTION
[0020] See also Figure 1-2The utility model provides a technical solution: a gold sinking device for surface treatment of PCB boards, comprising a gold sinking device body 1, a processing pool 2, a support frame 3, a positioning component 4, a lifting component 5, a cleaning component 6, a heating box 7, a drying component 8, and a gold sinking pool 9; the upper end of the gold sinking device body 1 is provided with the processing pool 2, the upper end of the gold sinking device body 1 is fixed with a support frame 3, the outer side of the support frame 3 is provided with a positioning component 4, the upper end of the positioning component 4 is provided with a lifting component 5, the inner side of the processing pool 2 is provided with a cleaning component 6, and the front of the gold sinking device body 1 is connected with The heating box 7 is provided with a drying component 8 in front of the heating box 7. The upper end of the main body 1 of the gold sinking device is provided with a gold sinking pool 9. The horizontal position of the PCB board can be easily changed by the positioning component 4, so as to switch between the processing pool 2 and the gold sinking pool 9. The height of the PCB board can be changed by the lifting component 5. The PCB board can be cleaned by the cleaning component 6, and the PCB board can be dried by the drying component 8. Compared with the traditional gold sinking method, the device has a cleaning system. The positioning component 4 includes a driving motor 401, a screw rod 402, and a plurality of screws 403. , sleeve 403, a driving motor 401 is installed on the outer side of the support frame 3, a screw rod 402 is connected to the right side of the driving motor 401, and the right end of the screw rod 402 is connected to the sleeve 403. The driving motor 401 provides power, so that the screw rod 402 can rotate in the sleeve 403 to change the horizontal position of the gold sinking basket 503. The positioning component 4 also includes a first movable seat 404 and a movable platform 405. The surface of the screw rod 402 is connected to the first movable seat 404, and the first movable seat 404 is threadedly connected to the screw rod 402. The upper end of the first movable seat 404 is fixed with an movable The movable platform 405 can be directedly moved by rotating the screw rod 402 so that the gold sinking basket 503 can be switched between the treatment pool 2 and the gold sinking pool 9. The positioning component 4 also includes a second movable seat 406 and a light rod 407. The second movable seat 406 is fixed to the lower end of the movable platform 405. The second movable seat 406 is slidably connected to the light rod 407. The light rod 407 is fixed to the inner side of the support frame 3. The second movable seat 406 slides left and right on the light rod 407, so that the movable platform 405 can stably move laterally and play a guiding role.
[0021] See also Figure 3-4In this embodiment, the lifting component 5 includes a pneumatic cylinder 501, a piston rod 502, a gold sinking basket 503, and a PCB board slot 504. The pneumatic cylinder 501 is installed on the upper end of the movable table 405, and the lower end of the pneumatic cylinder 501 is connected to the piston rod 502, and the lower end of the piston rod 502 is connected to the gold sinking basket 503. The inner side of the gold sinking basket 503 is provided with a PCB board slot 504. By starting the pneumatic cylinder 501, the gold sinking basket 503 can be raised or lowered to facilitate gold sinking pre-treatment or gold sinking treatment. The cleaning component 6 includes a water inlet pipe 601, a valve 602, a branch pipe 603, and a nozzle 604. The bottom of the treatment pool 2 is provided with a water inlet pipe 601, and the left side of the water inlet pipe 601 is provided with a valve 60 2. The upper end of the water inlet pipe 601 is connected with a branch pipe 603, and the upper end of the branch pipe 603 is installed with a nozzle 604. The nozzles 604 are evenly spaced. By opening the valve 602, clean water can pass through the water inlet pipe 601 and the branch pipe 603, and finally be sprayed out from the nozzle 604 to remove pollutants and residues on the surface of the PCB. The drying component 8 includes a fan 801, a heating plate 802, and a ventilation net 803. The fan 801 is installed in front of the heating box 7, and the heating plate 802 is installed on the inner side of the heating box 7. The ventilation net 803 is arranged on the back of the heating box 7. The heating plate 802 is used for heating and the wind force of the fan 801 is used to drive the rapid flow of hot air, thereby ensuring that the surface of the PCB board is thoroughly dried.
[0022] When using the gold sinking device for PCB board surface treatment processing according to the technical solution, first insert the PCB board to be processed into the PCB board slot 504, then start the pneumatic cylinder 501, drive the gold sinking basket 503 to descend in the treatment pool 2 through the piston rod 502, and open the valve 602 to allow clean water to pass through the water inlet pipe 601 and the branch pipe 603 in sequence, and finally spray out from the nozzle 604, so as to remove pollutants and residues on the PCB surface, then close the valve 602 and turn on the fan 801 and the heating plate 802, and use the wind force to drive the rapid flow of hot air, so as to dry the PCB board.
[0023] Then, the gold sinking basket 503 is raised and reset by driving the pneumatic cylinder 501. Secondly, the driving motor 401 is started, and the screw rod 402 rotates in the sleeve 403, so that the first movable seat 404 can move right. At the same time, the second movable seat 406 slides right on the light rod 407, which can drive the gold sinking basket 503 under the movable platform 405 to move right stably until it moves to the gold sinking pool 9. Finally, the gold sinking basket 503 is lowered to facilitate the gold sinking reaction.
[0024] Through the above steps, the height of the PCB board is first controlled by the lifting component 5, and then the PCB board can be cleaned by the cleaning component 6, and then the PCB board is dried by the drying component 8, and finally the horizontal position of the PCB board is changed by the positioning component 4 for gold immersion.
[0025] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.
Claims
1. A gold immersion device for surface treatment of a PCB board, comprising a gold immersion device body (1), characterized in that: The invention also comprises a treatment pool (2), a support frame (3), a positioning component (4), a lifting component (5), a cleaning component (6), a heating box (7), a drying component (8), and a gold sinking pool (9); the treatment pool (2) is arranged at the upper end of the gold sinking device body (1); the support frame (3) is fixed to the upper end of the gold sinking device body (1); the positioning component (4) is arranged on the outer side of the support frame (3); the lifting component (5) is arranged on the upper end of the positioning component (4); the cleaning component (6) is arranged on the inner side of the treatment pool (2); the heating box (7) is connected to the front of the gold sinking device body (1); the drying component (8) is arranged in front of the heating box (7); and the gold sinking pool (9) is arranged at the upper end of the gold sinking device body (1).
2. The gold sinking device for surface treatment of PCB board according to claim 1, characterized in that: The positioning assembly (4) comprises a driving motor (401), a screw rod (402), and a sleeve (403). The driving motor (401) is installed on the outer side of the support frame (3). The right side of the driving motor (401) is connected to the screw rod (402), and the right end of the screw rod (402) is connected to the sleeve (403).
3. The gold sinking device for surface treatment of PCB board according to claim 1, characterized in that: The positioning assembly (4) also includes a first movable seat (404) and a movable platform (405). The surface of the screw rod (402) is connected to the first movable seat (404). The first movable seat (404) is threadedly connected to the screw rod (402). The upper end of the first movable seat (404) is fixed with the movable platform (405).
4. The gold sinking device for surface treatment of a PCB board according to claim 3, characterized in that: The positioning assembly (4) also includes a second movable seat (406) and a polished rod (407). The second movable seat (406) is fixed at the lower end of the movable platform (405). The second movable seat (406) is slidably connected to the polished rod (407). The polished rod (407) is fixed on the inner side of the support frame (3).
5. The gold sinking device for surface treatment of PCB board according to claim 1, characterized in that: The lifting assembly (5) comprises a pneumatic cylinder (501), a piston rod (502), a gold sinking basket (503), and a PCB board slot (504). The pneumatic cylinder (501) is installed on the upper end of the movable platform (405), the lower end of the pneumatic cylinder (501) is connected to the piston rod (502), the lower end of the piston rod (502) is connected to the gold sinking basket (503), and the inner side of the gold sinking basket (503) is provided with a PCB board slot (504).
6. The gold sinking device for surface treatment of PCB board according to claim 1, characterized in that: The cleaning component (6) comprises a water inlet pipe (601), a valve (602), a branch pipe (603), and a nozzle (604). The water inlet pipe (601) is arranged at the bottom of the treatment pool (2), a valve (602) is arranged on the left side of the water inlet pipe (601), the upper end of the water inlet pipe (601) is connected to the branch pipe (603), and the upper end of the branch pipe (603) is installed with a nozzle (604), and the nozzles (604) are distributed at equal intervals.
7. The gold sinking device for surface treatment of PCB board according to claim 1, characterized in that: The drying assembly (8) comprises a fan (801), a heating plate (802), and a ventilation net (803); the fan (801) is installed in front of the heating box (7), the heating plate (802) is installed inside the heating box (7), and the ventilation net (803) is arranged on the back of the heating box (7).