Semiconductor part cutting tool

Abstract

The semiconductor part cutting tool comprises a containing table, a supporting frame is welded to the top end of the containing table, a worm is rotationally connected to one side of the top end of the supporting frame through a support, a transmission motor is installed on one side of the top end of the supporting frame through a base, and a rotation limiting rail is welded to the middle of the top end of the supporting frame; a plurality of spherical wheels are placed on the inner side of the rotating limiting rail, a rotating ring tooth is welded to the top ends of the spherical wheels, a cross beam is welded to the middle of the inner side of the rotating ring tooth, and a horizontal adjusting motor is installed at one end of the inner side of the cross beam through a base. The horizontal adjusting mechanism is arranged at the top end of the cutting machine so that the cutting mechanism can adjust the cutting position, the rotating mechanism is arranged on the outer side of the horizontal adjusting mechanism so that the cutting angle of the cutting mechanism can be adjusted, and compared with the prior art, the cutting machine has the multi-angle adjusting function and can adapt to machining of more workpieces.

Description

Technical Field

[0001] The present application relates to the technical field of semiconductor cutting, and in particular to a semiconductor component cutting tool. Background Art

[0002] Semiconductor refers to a material whose electrical conductivity at room temperature is between that of a conductor and an insulator. Semiconductors are widely used in radios, televisions and temperature measurement. For example, a diode is a device made of semiconductors. Semiconductor refers to a material whose electrical conductivity can be controlled, ranging from an insulator to a conductor. Whether from the perspective of science and technology or economic development, semiconductors are of great importance. Semiconductor component cutting tooling is equipment specifically designed for the further processing of semiconductor components.

[0003] Compared with the actual use process, the existing semiconductor component cutting tooling currently has one type that uses a screw to drive the cutting mechanism to achieve cutting processing of semiconductor workpieces, but it cannot perform some non-horizontal or vertical cutting operations, which not only limits the use scope of the cutting equipment, but also reduces the processing efficiency.

[0004] Therefore, in order to solve the above problems, the present application provides a semiconductor component cutting tool.

[0005] The above information disclosed in the background technology is only used to increase the understanding of the background technology of the present application, and therefore, it may include information that does not constitute the prior art known to ordinary technicians in the field. Utility Model Content

[0006] In order to solve the problem of being unable to cut at multiple angles, the present application provides a semiconductor component cutting tool.

[0007] A semiconductor component cutting tool provided by the present application includes a placing table, a support frame welded to the top of the placing table, a worm gear is rotatably connected to one side of the top of the support frame through the bracket, a transmission motor is installed on one side of the top of the support frame through the base, a rotation limit rail is welded to the middle of the top of the support frame, a plurality of spherical wheels are placed on the inner side of the rotation limit rail, a rotating ring gear is welded to the top of the plurality of spherical wheels, a crossbeam is welded to the middle of the inner side of the rotating ring gear, a horizontal adjustment motor is installed at one end of the inner side of the crossbeam through the base, a transmission end of the horizontal adjustment motor is rotatably connected to a transmission screw on the inner side of the crossbeam, an extension frame is connected to the outer side of the transmission screw through a threaded sleeve, a cutting motor is installed at the outer bottom of one end of the extension frame through the base, and a cutting knife is rotatably connected to the transmission end of the cutting motor on the inner side of the extension frame.

[0008] Preferably, the outer side of the worm is meshed with the outer side of the rotating ring teeth.

[0009] Preferably, the transmission end of the transmission motor is connected to one end of the worm.

[0010] Preferably, the power input ends of the transmission motor, the level adjustment motor and the cutting motor are all connected to the power output end of the external control terminal.

[0011] Preferably, clamping frames are welded on both sides of the top of the placement table, and clamping screws are rotatably connected between the two clamping frames, and the connection between the clamping frames and the clamping screws is meshed with each other, and gaskets are welded on the clamping ends of the two clamping screws.

[0012] In summary, this application includes the following beneficial technical effects:

[0013] 1. A horizontal adjustment mechanism is arranged on the top of the cutting machine so that the cutting mechanism can adjust the cutting position, and a rotating mechanism is arranged outside the horizontal adjustment mechanism so that the cutting angle of the cutting mechanism can be adjusted. Compared with the prior art, it has a multi-angle adjustment function and can adapt to the processing of more workpieces. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 This is a schematic diagram of the installation structure of the placement table in Example 1 of the present application;

[0015] Figure 2 is a schematic diagram of the support frame installation structure in Example 1 of the present application;

[0016] Figure 3 It is a schematic diagram of the installation structure of the horizontal adjustment motor in Example 1 of the present application.

[0017] Explanation of the accompanying drawings: 1. placing table; 2. supporting frame; 3. worm; 4. transmission motor; 5. rotating limit rail; 6. spherical wheel; 7. rotating ring gear; 8. crossbeam; 9. horizontal adjustment motor; 10. transmission screw; 11. extension frame; 12. cutting motor; 13. cutting knife; 14. clamping and fixing frame; 15. clamping screw; 16. gasket. DETAILED DESCRIPTION

[0018] The following is combined with Figure 1-Figure 3 This application is described in further detail.

[0019] Embodiment 1

[0020] Reference Figure 1-Figure 3A semiconductor component cutting tool comprises a placing table 1, a supporting frame 2 is welded on the top of the placing table 1, a worm 3 is rotatably connected to one side of the top of the supporting frame 2 through a bracket, a transmission motor 4 is installed on one side of the top of the supporting frame 2 through a base, and a transmission end of the transmission motor 4 is connected to one end of the worm 3, a rotating limit rail 5 is welded in the middle of the top of the supporting frame 2, and a plurality of spherical wheels 6 are placed inside the rotating limit rail 5. In order to reduce the friction force of the angle adjustment function during transmission, a rotating ring gear 7 is welded on the top of the plurality of spherical wheels 6, and the outer side of the worm 3 is meshed with the outer side of the rotating ring gear 7. In order to realize the angle adjustment function of the cutting mechanism, a crossbeam 8 is welded in the middle of the inner side of the rotating ring gear 7, and a horizontal adjustment motor 9 is installed on one end of the inner side of the crossbeam 8 through the base, and the transmission end of the horizontal adjustment motor 9 is on the crossbeam 8 is rotatably connected to the inner side with a transmission screw 10. In order to realize the horizontal adjustment function of the cutting mechanism, an extension frame 11 is connected to the outer side of the transmission screw 10 through a threaded sleeve. A cutting motor 12 is installed at the outer bottom of one end of the extension frame 11 through a base. The transmission end of the cutting motor 12 is rotatably connected to the cutting knife 13 on the inner side of the extension frame 11. In order to realize the cutting function, the power input ends of the transmission motor 4, the horizontal adjustment motor 9 and the cutting motor 12 are all connected to the power output end of the external control terminal. Clamping frames 14 are welded on both sides of the top of the placement table 1. Clamping screws 15 are rotatably connected in the middle of the two clamping frames 14, and the connection between the clamping frames 14 and the clamping screws 15 is meshed with each other. Gaskets 16 are welded to the clamping ends of the two clamping screws 15 to realize the workpiece clamping function.

[0021] Working principle: First, the operator adjusts the clamping height of the workpiece according to the cutting requirements of the workpiece, and adjusts the clamping distance between the two clamping screws 15 by rotating the two clamping screws 15 until the workpiece is clamped and fixed. After the workpiece is clamped and fixed, the operator starts the cutting motor 12. The cutting motor 12 will drive the cutting knife 13 connected to its transmission end to rotate. Then the operator starts the horizontal adjustment motor 9. The horizontal adjustment motor 9 will drive the transmission screw 10 connected to its transmission end to rotate, and the transmission screw 10 will drive the extension frame 11 connected to its outer side through the threaded sleeve to move, thereby driving the cutting mechanism to move, so as to achieve cutting of the clamped workpiece;

[0022] During the cutting process, after one cutting operation is completed, a second cutting operation is required. The cutting direction of the cutting mechanism can be adjusted according to the position to be cut. During this period, the operator can start the transmission motor 4, and the transmission motor 4 will drive the worm 3 connected to its transmission end to rotate, and the worm 3 will drive the rotating ring gear 7 meshing with it to rotate. During this period, the rotating ring gear 7 will rotate inside the rotating limit rail 5 through a number of spherical wheels 6 welded at its bottom end, thereby driving the crossbeam 8 welded to it to rotate, and the crossbeam 8 will drive the transmission screw 10 connected to its inner side to rotate, thereby driving the cutting angle of the cutting mechanism sleeved on the outer side of the transmission screw 10 to rotate. In this way, the cutting direction of the equipment can be adjusted, so that the processing range of the equipment is wider and the processing efficiency is higher.

[0023] The above are all preferred embodiments of the present application, and the protection scope of the present application is not limited thereto. Therefore, any equivalent changes made according to the structure, shape, and principle of the present application should be included in the protection scope of the present application.

Claims

1. A semiconductor component cutting tool, comprising a placement table (1), characterized in that: A support frame (2) is welded to the top of the placement table (1), a worm (3) is rotatably connected to one side of the top of the support frame (2) through a bracket, a transmission motor (4) is installed on one side of the top of the support frame (2) through a base, a rotation limit rail (5) is welded to the middle of the top of the support frame (2), a plurality of spherical wheels (6) are placed inside the rotation limit rail (5), a rotation ring gear (7) is welded to the top of the plurality of spherical wheels (6), a crossbeam (8) is welded to the middle of the inside of the rotation ring gear (7), a horizontal adjustment motor (9) is installed at one end of the inside of the crossbeam (8) through the base, a transmission end of the horizontal adjustment motor (9) is rotatably connected to a transmission screw (10) inside the crossbeam (8), an extension frame (11) is sleeved on the outside of the transmission screw (10) through a threaded sleeve, a cutting motor (12) is installed at the bottom of the outside of one end of the extension frame (11) through the base, and a cutting knife (13) is rotatably connected to the transmission end of the cutting motor (12) inside the extension frame (11).

2. A semiconductor component cutting tool according to claim 1, characterized in that: The outer side of the worm (3) meshes with the outer side of the rotating ring gear (7).

3. The semiconductor component cutting tool according to claim 1, characterized in that: The transmission end of the transmission motor (4) is connected to one end of the worm (3).

4. The semiconductor component cutting tool according to claim 1, characterized in that: The power input ends of the transmission motor (4), the level adjustment motor (9) and the cutting motor (12) are all connected to the power output end of the external control terminal.

5. The semiconductor component cutting tool according to claim 1, characterized in that: A clamping frame (14) is welded on both sides of the top of the placement table (1), and a clamping screw (15) is rotatably connected between the two clamping frames (14). The connection between the clamping frame (14) and the clamping screw (15) is meshed with each other, and a gasket (16) is welded on the clamping ends of the two clamping screws (15).

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