Plasma degumming rate test fixture for PCB (printed circuit board) industry

Abstract

The application discloses a Plasma degumming rate test fixture for PCB industry, which comprises a test fixture body, degumming rate sheets and a sealing cover, the test fixture body is provided with a plurality of test grooves, four corners of each test groove are provided with bearing sheets, the degumming rate sheets are placed on the bearing sheets, the upper part of each row of test grooves is provided with a sealing groove in a penetrating manner, and the sealing cover is arranged on the sealing groove. According to the adhesive removing rate testing device, the magnetic columns are mutually attracted and fixed, it is guaranteed that the adhesive removing rate piece does not fall off in the testing groove, the workload in the testing process is reduced, and meanwhile the accuracy of the adhesive removing rate is guaranteed.

Description

Technical Field

[0001] The present application relates to the technical field of adhesive removal rate testing, and in particular to a Plasma adhesive removal rate testing fixture for the PCB industry. Background Art

[0002] The production process of printed circuit boards (PCBs) involves a large number of chemical copper deposition processes. Before the chemical copper deposition process, the production board hole wall needs to be cleaned to remove the glue residue to improve the resin surface condition and ensure the copper deposition effect. In recent years, the emerging Plasma process has become popular. Plasma means "plasma etching". Its method is to fill CF4, O2, N2, H2 and other gases in a vacuumed closed container, and add RF (radio frequency) line high voltage to ionize the gas molecules to obtain highly active "free radicals", which further attack the resin part to achieve the purpose of etching the resin and remove the glue residue remaining on the production board hole wall.

[0003] The main function of Plasma is to remove the glue residue remaining on the hole wall of the production board. Therefore, a glue removal rate test is required before normal production. The specification of the glue removal rate sheet is 10cm*10cm, and the test frequency is once a day. At present, the PCB industry mostly uses special fixtures for glue removal rate tests. The fixture is made of stainless steel. There are multiple 11cm*11cm test holes on the stainless steel plate. The four corners of the glue removal rate sheet are glued and fixed in the test holes by tape. More glue removal rate sheets need to be glued at a time, and the tape is glued to the surface of the glue removal rate sheet. This kind of glue removal rate test fixture has a large workload during the test, and the tape remaining on the surface of the glue removal rate sheet will affect the glue removal rate result, resulting in a decrease in the reference significance of the test result.

[0004] The information disclosed in this background technology section is only intended to enhance the understanding of the overall background of the application and should not be regarded as an admission or any form of suggestion that the information constitutes the prior art already known to ordinary technicians in the field. Summary of the invention

[0005] The purpose of this application is to provide a Plasma degumming rate test fixture for the PCB industry, which uses magnet columns to attract and fix each other to ensure that the degumming rate sheet does not fall in the test slot, thereby reducing the workload of the testing process and ensuring the accuracy of the degumming rate.

[0006] In order to achieve the above objectives, this application is implemented by adopting the following technical solutions:

[0007] A Plasma glue removal rate test fixture for the PCB industry comprises a test fixture body, a glue removal rate sheet and a sealing cover, wherein the test fixture body is provided with a plurality of test slots, the four corners of the test slots are provided with carrier sheets, the glue removal rate sheet is placed on the carrier sheet, a sealing slot is provided through the upper part of each row of the test slots, fixture magnet columns are buried at the bottom of both ends of the sealing slot, and sealing cover magnet columns are buried at both ends of the sealing cover.

[0008] Optionally, the test fixture body is 100 cm long, 80 cm high, and 80 mil thick, the internal material is PC, 70 mil thick, and the surface material is copper, 5 mil thick.

[0009] Optionally, the degumming rate sheet is 10 cm long, 10 cm wide and 30 mil thick.

[0010] Optionally, the sealing cover is 80 cm long, 2 cm wide, and 20 mil high, the inner material is PC, the thickness is 10 mil, and the surface material is copper, the thickness is 5 mil.

[0011] Optionally, the test slot is 10.5 cm long, 10.5 cm wide, and 80 mil high.

[0012] Optionally, the carrier sheet has a double side length of 2 cm and a bottom side length of 2 cm, 15mil thick.

[0013] Optionally, the sealing groove is 80 cm long, 2 cm wide and 20 mil high.

[0014] Optionally, the fixture magnet column is 40 mil high and 2 cm in diameter, and the sealing cover magnet column is 20 mil high and 2 cm in diameter.

[0015] Optionally, the test fixture body is provided with nine test slots, three in one row, for a total of three rows.

[0016] Compared with the prior art, the present invention has the following beneficial effects:

[0017] A sealing groove is opened on the upper part of the test slot, which runs through each row of test slots. The glue removal rate sheet is placed in the test slot, and then the sealing cover is placed in the sealing groove. The magnet columns are used to attract and fix each other to ensure that the rate sheet does not fall in the test slot, which greatly reduces the workload of the test process and ensures the accuracy of the glue removal rate. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the embodiments of the present disclosure or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present disclosure. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0019] Figure 1 : An embodiment of the present invention provides a structural schematic diagram of a new type of Plasma degumming rate process test fixture for the PCB industry.

[0020] Description of reference numerals:

[0021] 1. Test fixture body; 2. Test slot; 3. Carrying sheet; 4. Fixture magnet column; 5. Sealing slot; 6. Sealing cover; 7. Sealing cover magnet column; 8. Glue removal rate sheet. DETAILED DESCRIPTION

[0022] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. The following description of at least one exemplary embodiment is actually only illustrative and is by no means intended to limit the present application and its application or use. Example

[0023] A test fixture for the plasma degumming rate used in the PCB industry, such as Figure 1 As shown, it includes a test fixture body 1, a degumming rate sheet 8 and a sealing cover 6. A plurality of test slots 2 are opened on the test fixture body 1. Carrier sheets 3 are provided at the four corners of the test slots 2. The degumming rate sheet 8 is placed on the carrier sheet 3. A sealing slot 5 is provided through the upper part of each row of test slots 2. A fixture magnet column 4 is buried at the bottom of both ends of the sealing slot 5. Sealing cover magnet columns 7 are buried at both ends of the sealing cover 6. Before the Plasma degumming rate test, the baked degumming rate sheet 8 is prepared, the sealing cover 6 on the test fixture body 1 is opened, the degumming rate sheets 8 are placed in the test slots 2 one by one, and then the sealing cover 6 is placed in the sealing slot 5. The fixture magnet column 4 and the sealing cover magnet column 7 are attracted to each other to complete the sealing. After the sealing is completed, the process test fixture carrying the degumming rate sheet 8 is placed in the Plasma device.

[0024] like Figure 1 As shown, the test fixture body 1 is 100 cm long, 80 cm high, and 80 mil thick. The internal material is PC, 70 mil thick, and the surface material is copper, 5 mil thick.

[0025] like Figure 1 As shown, the degumming rate sheet 8 is 10 cm long, 10 cm wide and 30 mil thick.

[0026] like Figure 1 As shown, the sealing cover 6 is 80 cm long, 2 cm wide, and 20 mil high. The inner material is PC, 10 mil thick, and the surface material is copper, 5 mil thick.

[0027] like Figure 1 As shown, the test slot 2 is 10.5 cm long, 10.5 cm wide, and 80 mil high.

[0028] like Figure 1 As shown, the two sides of the carrier sheet 3 are 2 cm long and the bottom side is 2 cm, 15mil thick.

[0029] like Figure 1 As shown, the sealing groove 5 is 80 cm long, 2 cm wide and 20 mil high. Example

[0030] like Figure 1 As shown, the fixture magnet column 4 is 40 mil high and 2 cm in diameter, and the sealing cover magnet column 7 is 20 mil high and 2 cm in diameter.

[0031] By adopting the above scheme:

[0032] Nine test slots 2 are opened on the fixture by blind fishing process, three in a row, with a total of three rows. Carrying sheets 3 are left at the four corners of the bottom of the test piece, and a sealing groove 5 is opened on the upper part of each row of test slots 2. The sealing groove 5 runs through each row of test slots 2. The degumming rate sheet 8 is placed in the test slot 2, and then the sealing cover 6 is placed in the sealing groove 5. The fixture magnet column 4 and the sealing cover 6 magnet column are attracted and fixed to each other to ensure that the degumming rate sheet 8 does not fall in the test slot 2. This new Plasma degumming rate process test fixture in the PCB industry greatly reduces the workload of the testing process and ensures the accuracy of the degumming rate.

[0033] In the description of the present application, it should be understood that the terms "center", "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "inside", "outside", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the drawings, and are only used to explain the relative position relationship, movement, etc. between the components in a certain posture. If the specific posture changes, the directional indication will also change accordingly. It is only for the convenience of describing the present application and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation to the present application.

[0034] In addition, the terms "first", "second", etc. are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, a feature defined as "first", "second", etc. may explicitly or implicitly include one or more of the feature. In the description of this application, unless otherwise specified, "plurality" means two or more.

[0035] In the description of this application, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood by specific circumstances.

[0036] The above is only a preferred implementation of the present application. It should be pointed out that for ordinary technicians in this technical field, several improvements and modifications can be made without departing from the technical principles of the present application. These improvements and modifications should also be regarded as the scope of protection of the present application.

Claims

1. A Plasma degumming rate test fixture for the PCB industry, characterized by: The invention comprises a test fixture body (1), a degumming rate sheet (8) and a sealing cover (6); the test fixture body (1) is provided with a plurality of test slots (2); four corners of the test slots (2) are provided with carrier sheets (3); the degumming rate sheet (8) is placed on the carrier sheet (3); a sealing slot (5) is provided through the upper part of each row of the test slots (2); fixture magnet columns (4) are buried at the bottom of both ends of the sealing slots (5); and sealing cover magnet columns (7) are buried at both ends of the sealing cover (6).

2. The Plasma degumming rate test fixture for the PCB industry according to claim 1, characterized in that: The test fixture body (1) is 100 cm long, 80 cm high, and 80 mil thick. The inner material is PC, 70 mil thick, and the surface material is copper, 5 mil thick.

3. The Plasma degumming rate test fixture for the PCB industry according to claim 1, characterized in that: The degumming rate sheet (8) is 10 cm long, 10 cm wide and 30 mil thick.

4. The Plasma degumming rate test fixture for the PCB industry according to claim 1, characterized in that: The sealing cover (6) is 80 cm long, 2 cm wide, and 20 mil high. The inner material is PC, 10 mil thick, and the surface material is copper, 5 mil thick.

5. The Plasma degumming rate test fixture for the PCB industry according to claim 1, characterized in that: The test slot (2) is 10.5 cm long, 10.5 cm wide and 80 mil high.

6. The Plasma degumming rate test fixture for the PCB industry according to claim 1, characterized in that: The carrier sheet (3) has two sides 2 cm long and a bottom side 2 cm, 15mil thick.

7. The Plasma degumming rate test fixture for the PCB industry according to claim 1, characterized in that: The sealing groove (5) is 80 cm long, 2 cm wide and 20 mil high.

8. The Plasma degumming rate test fixture for the PCB industry according to claim 1, characterized in that: The fixture magnet column (4) is 40 mils high and 2 cm in diameter, and the sealing cover magnet column (7) is 20 mils high and 2 cm in diameter.

9. The Plasma degumming rate test fixture for the PCB industry according to claim 1, characterized in that: The test fixture body (1) is provided with nine test slots (2), three in a row, for a total of three rows.

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