Optical module and optical communication equipment

Abstract

The embodiment of the utility model discloses an optical module and optical communication equipment. The optical module comprises a shell, a substrate and a device, wherein the substrate and the device are located in the shell; the substrate is fixedly connected with the shell, the plurality of devices are arranged on the substrate, and the devices are jointed with the inner wall of the shell, so that the working heat of the device side is exchanged to the shell side; at least the shell part, connected with the device, of the shell is provided with a hollow cavity for containing a phase change working medium, so that an integrated two-phase heat exchange shell is formed. According to the arrangement, heat generated by the device side is conducted to the shell side, the phase change working medium in the hollow cavity can be heated and vaporized, and the cavity is filled with the gas working medium carrying heat, and the gas working medium makes contact with the low-temperature side wall face forming the hollow cavity and is rapidly condensed. Based on the integrated two-phase heat exchange shell structure, the heat conduction efficiency of the shell can be improved, and the temperature equalization capability of the optical module shell is enhanced. On the whole, the heat dissipation capability of the optical module can be effectively improved.

Description

Technical Field

[0001] The embodiments of the present application relate to the field of optical communications, and in particular, to an optical module and an optical communication device. Background Art

[0002] With the rapid development of communication technology and the growing demand for cloud computing, the speed of optical modules is also constantly improving, and is gradually developing towards high power consumption and high density. Good heat dissipation capacity has become one of the important determinants affecting the stable operation of optical modules.

[0003] In the related art, the heat dissipation method of the optical module is mainly to form heat transfer through the contact between the optical module housing and the external heat sink to reduce or control the temperature of the optical module housing. The common optical module housing molding process is metal die casting or machined parts. Limited by the intrinsic thermal conductivity of the metal, the heat transfer capacity of the optical module housing has a physical upper limit and cannot effectively transfer heat to the external heat sink (radiator), resulting in overheating of the optical module temperature, which makes the optical module power increase have a development bottleneck. Utility Model Content

[0004] The embodiments of the present application provide an optical module and an optical communication device, which improve the heat dissipation capability of the optical module through structural optimization.

[0005] A first aspect of an embodiment of the present application provides an optical module, which includes a housing, a substrate and a device, wherein the substrate and the device are located inside the substrate, the substrate is fixedly connected to the housing, a plurality of devices are arranged on the substrate, and the devices are engaged with the inner wall of the housing to exchange the working heat generated by the device side to the housing side; wherein at least the shell portion where the housing is engaged with the device has a hollow cavity for accommodating a phase change working medium to form an integrated two-phase heat exchange shell.

[0006] During operation, the heat generated on the device side is transferred to the shell side, the phase change medium in the hollow cavity can be heated and vaporized, the gas medium carrying heat fills the cavity, contacts the low-temperature side wall of the hollow cavity, condenses quickly, and enters the next heated vaporization cycle. Based on this integrated two-phase heat exchange shell structure, the heat conduction efficiency of the shell can be improved, and the temperature equalization ability of the optical module shell can be enhanced. Overall, it can effectively improve the heat dissipation capacity of the optical module.

[0007] In addition, compared with the structure of configuring a temperature-averaging strengthening layer on the inner wall of the shell, the embodiment of the present application adopts an integrated two-phase heat exchange shell structure to improve the temperature-averaging capability, which can avoid the introduction of thermal resistance and affect the actual heat dissipation capacity of the shell, and can also avoid the temperature-averaging strengthening layer occupying the internal space and affecting the reasonable layout. In addition, there is no need to use welding, bonding or pressing and embedding processes, and the consistency of batch products can be improved.

[0008] Exemplarily, the device is engaged with the inner wall of the upper shell of the optical module housing, and the upper shell of the housing has a hollow cavity. That is, the upper shell is the housing part where the optical module housing is engaged with the device.

[0009] In practical applications, the device can be joined to the inner wall of the housing through a thermal pad or thermally conductive adhesive, so that a close contact is formed between the device and the housing to avoid the presence of a joint air gap that affects the heat transfer efficiency.

[0010] Based on the first aspect, the embodiment of the present application also provides a first implementation of the first aspect: a capillary structure is provided in the hollow cavity, and the capillary structure is located on the inner surface of the cavity near the device side. With such a configuration, as the liquid working medium in the cavity area corresponding to the device is continuously heated, volatilized and reduced, under the action of the capillary structure, the peripheral phase change working medium can be quickly absorbed into the area with reduced liquid volume, making full use of the ability of the phase change working medium to absorb latent heat by vaporization, ensuring the maximum heat exchange in the area, and further enhancing the temperature uniformity of the optical module housing.

[0011] Exemplarily, the capillary structure can be formed on a capillary structure layer, and then the capillary structure layer is fixedly disposed on the inner surface of the cavity near the device side, for example but not limited to, the capillary structure layer is made of copper material and fixed by welding.

[0012] In other exemplary embodiments, the capillary structure may be integrally formed with the inner surface of the cavity.

[0013] Based on the first aspect, or the first implementation of the first aspect, the embodiment of the present application further provides a second implementation of the first aspect: a support body is provided in the hollow cavity, and the support body is located between the wall surface of the hollow cavity close to the device and the wall surface far from the device. In this way, an effective support is formed between the two opposite walls, so that the hollow cavity maintains a volume size that can form a working medium circulation, meeting the functional requirements of the phase change working medium circulation flow.

[0014] In practical applications, the support body is provided in multiple numbers, and multiple support bodies are arranged in the hollow cavity at intervals. In this way, within the width range of the hollow cavity, each support body is arranged in the hollow cavity at intervals, and effective support is formed without affecting the flow of the phase change medium. The force formed by vacuuming and the force applied by the assembly production line operation can form an effective support that can prevent the cavity from collapsing.

[0015] Based on the first aspect, or the first implementation of the first aspect, or the second implementation of the first aspect, the embodiment of the present application further provides a third implementation of the first aspect: the width range of the hollow cavity corresponds to the first device setting among the multiple devices. In practical applications, the power consumption of the first device can be higher than that of other devices among the multiple devices, or the heat dissipation requirements of other devices among the multiple devices are lower and do not need or cannot participate in the heat conduction of the shell.

[0016] In this way, for multiple devices connected to the housing, the integrated two-phase heat exchange housing can achieve rapid heat dissipation for the first device and avoid other devices with relatively low power consumption or that do not require rapid heat dissipation. In other words, based on the functional needs of different devices, heat dissipation conditions that meet actual needs are provided in a targeted manner. It has good adaptability.

[0017] Based on the first aspect, or the first implementation of the first aspect, or the second implementation of the first aspect, the embodiment of the present application also provides a fourth implementation of the first aspect: there are multiple hollow cavities, and the width range of the hollow cavities is set in a one-to-one correspondence with the devices. In this way, the volume of the cavity is configured according to the differentiated heat dissipation requirements of each device to meet the heat dissipation needs of different devices, for example but not limited to, by reasonably controlling the volume of each hollow cavity and the configuration form of the capillary structure, corresponding heat dissipation capabilities are provided for each device.

[0018] Based on the first aspect, or the first implementation of the first aspect, or the second implementation of the first aspect, the embodiment of the present application further provides a fifth implementation of the first aspect: there are multiple hollow cavities, the width range of some of the hollow cavities is set to correspond to one device, and the width range of another part of the hollow cavities is set to correspond to at least two devices. In this way, the hollow cavities can be configured more reasonably, and the process implementation cost can be reduced on the basis of meeting the heat dissipation needs of different devices.

[0019] Based on the first aspect, or the first embodiment of the first aspect, or the second embodiment of the first aspect, or the third embodiment of the first aspect, or the fourth embodiment of the first aspect, or the fifth embodiment of the first aspect, the embodiment of the present application also provides a sixth embodiment of the first aspect: the inner wall of the housing that is engaged with the device has a boss, and the second device among the multiple devices is engaged with the boss. Exemplarily, the height dimension of the second device is smaller than that of the other devices among the multiple devices. In this way, the boss protruding from the inner wall of the housing is used to establish a fitting relationship with the device. For devices of different height dimensions arranged on the substrate, the boss can be engaged with the housing side to establish a reliable heat exchange path for the device to exchange heat. The heat on each device side can be exchanged to the housing side to the maximum extent, and a good heat dissipation capacity is obtained through the integrated two-phase heat exchange shell structure.

[0020] In practical applications, for the differences in the size specifications of the components on the substrate, the position and size of the boss structure are determined on the inner wall where the shell and the component meet to adapt to components of different heights. This has good adaptability.

[0021] Based on the first aspect, or the first embodiment of the first aspect, or the second embodiment of the first aspect, or the third embodiment of the first aspect, or the fourth embodiment of the first aspect, or the fifth embodiment of the first aspect, or the sixth embodiment of the first aspect, the embodiment of the present application further provides a seventh embodiment of the first aspect: the shell portion having a hollow cavity includes an upper wall surface and a lower wall surface, and the upper wall surface and the lower wall surface enclose a hollow cavity. The structure is simple and reliable, and has good processability.

[0022] Based on the seventh implementation of the first aspect, the embodiment of the present application also provides an eighth implementation of the first aspect: a first groove is provided on the opposite side of the lower wall surface and the upper wall surface, a hollow cavity is formed based on the first groove, and a capillary structure is provided at the bottom of the first groove. The structure is simple and easy to implement, and under the action of the capillary structure, the peripheral phase change medium can be quickly absorbed to the area with reduced liquid volume, making full use of the ability of the phase change medium to absorb latent heat by vaporization, and enhancing the temperature uniformity ability of the optical module housing.

[0023] Based on the eighth implementation of the first aspect, the embodiment of the present application also provides a ninth implementation of the first aspect: a second groove is provided on the opposite side of the upper wall surface and the lower wall surface, the second groove on the upper wall surface is connected with the first groove on the lower wall surface to form a hollow cavity, and a support body is provided at the bottom of the second groove, and the support body is against the capillary structure at the bottom of the first groove. In this way, the upper wall surface is used to form a hollow cavity that meets the heat exchange requirements, and effective support is formed based on the setting of the support body, so that the hollow cavity maintains a volume size that can form a working medium circulation, meeting the functional requirements of the phase change working medium circulation flow.

[0024] Based on the seventh implementation of the first aspect, or the eighth implementation of the first aspect, or the ninth implementation of the first aspect, the embodiment of the present application further provides a tenth implementation of the first aspect: the upper wall surface and the lower wall surface are made of the same metal material. In this way, the processing cost can be reasonably controlled, and at the same time, assembly stress can be avoided to ensure product processing accuracy.

[0025] The second aspect of the embodiment of the present application provides an optical communication device, including a device chassis and a mainboard arranged in the device chassis, and also including the optical module as described above, the optical module is connected to the mainboard. In a specific application, the optical module can convert an electrical signal into an optical signal for output, or convert an optical signal into an electrical signal for output, or convert an electrical signal into an optical signal for output, and convert an optical signal into an electrical signal for output at the same time.

[0026] Exemplarily, the optical communication device may be a server computer, a router or a switch. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] Figure 1This is a schematic diagram of the principle of a typical optical module heat dissipation structure;

[0028] Figure 2 This is a schematic diagram of the principle of another typical optical module heat dissipation structure;

[0029] Figure 3 A schematic diagram of the structure of an optical module provided in an embodiment of the present application;

[0030] Figure 4 for Figure 3 A top view of the positional relationship between the upper housing and various components shown in FIG.

[0031] Figure 5 for Figure 3 A side cross-sectional view of the light cross-block housing shown in;

[0032] Figure 6 A schematic diagram of the structure of an upper shell provided in an embodiment of the present application;

[0033] Figure 7 for Figure 6 An exploded schematic diagram of the assembly of the upper housing shown in FIG.

[0034] Figure 8 for Figure 6 An exploded schematic diagram of the assembly formed by another angle of the upper housing shown in FIG.

[0035] Fig. 9 for Figure 6 AA section view in;

[0036] Fig.10 A temperature test simulation diagram obtained by testing the embodiments of the present application and the comparative examples;

[0037] Fig.11 A schematic diagram of the structure of another optical module provided in an embodiment of the present application;

[0038] Fig.12 for Fig.11 A top view of the positional relationship between the upper housing and various components shown in FIG.

[0039] Fig.13 A schematic diagram of the structure of another optical module provided in an embodiment of the present application;

[0040] Fig.14 A schematic diagram of the structure of an optical communication device provided in an embodiment of the present application. DETAILED DESCRIPTION

[0041] The embodiment of the present application provides a heat dissipation structure of an optical module, which effectively improves the heat dissipation capacity of the optical module by improving the thermal conductivity of the module housing, ensures the efficient and stable operation of the optical module, and increases the service life of the optical module.

[0042] In the prior art, the optical module is an important component in the field of optical communication, including an electrical signal interface and an optical signal interface. The electrical signal interface is used to mate with the socket on the circuit board provided in the communication device, and the optical signal interface is used to connect the optical fiber. In different application scenarios, the optical module can convert the electrical signal input by the electrical signal interface into an optical signal output by the optical signal interface, or convert the optical signal input by the optical signal interface into an electrical signal output by the electrical signal interface, or convert the electrical signal input by the electrical signal interface into an optical signal output by the optical signal interface, and at the same time convert the optical signal input by the optical signal interface into an electrical signal output by the electrical signal interface.

[0043] In actual scenarios, the demand for high-bandwidth and high-speed data transmission is gradually increasing, and it is necessary to provide good heat dissipation capabilities for optical modules to ensure the stable operation of optical module components.

[0044] See also Figure 1 , this figure is a schematic diagram of the principle of a typical optical module heat dissipation structure. Inside the optical module, the components 50' (A / B / C) on the single board 10' are in contact with the optical module housing 30' through the thermal pad 20' respectively, and the upper part of the housing 30' is connected to the heat sink 40' by crimping; when the optical module is working, the components A / B / C generate heat, which is transferred to the housing 30' through the thermal pad 20', and then transferred from the housing 30' to the side of the heat sink 40' connected thereto, and finally dissipated to the ambient heat sink. Based on this heat dissipation structure, the thermal conductivity of the housing 30' directly affects the heat exchange efficiency. The thermal conductivity of the housing 30' is low, and the heat cannot be quickly and effectively transferred to the heat sink 40', causing the components A / B / C to fail due to over-temperature, resulting in damage to the module.

[0045] Taking the use of die-cast aluminum and die-cast zinc to make the optical module housing as an example, when the power consumption of the optical module is less than 10W, the thermal conductivity of the housing 30' can meet the heat dissipation requirements of the components A / B / C, thereby ensuring the stable and reliable operation of the optical module; taking the use of pure copper to make the optical module housing as an example, when the power consumption of the optical module is less than 20W, the thermal conductivity of the housing 30 can meet the heat dissipation requirements of the components A / B / C, thereby ensuring the stable and reliable operation of the optical module. When the power consumption of the optical module is greater than 20W, traditional metal structural parts cannot effectively transfer heat, and there is a risk of overheating of the device.

[0046] In addition, due to the limitation of the single board layout, the radiator cannot cover Figure 1 The housing area above the device A shown in the figure causes poor heat dissipation of the device A. The housing has a poor temperature uniformity effect, and the device heat cannot be effectively transferred to the efficient heat dissipation area outside the board, affecting the overall heat dissipation effect.

[0047] See also Figure 2, this figure is a schematic diagram of the principle of another typical optical module heat dissipation structure. In order to improve the thermal conductivity of the optical module metal shell, a temperature-averaging strengthening layer 60' is fixed on the inner wall of the optical module shell 30', for example, the temperature-averaging strengthening layer 60' is fixed by welding, bonding or pressing and embedding process. The device 50' (A / B / C) is fixed to the temperature-averaging strengthening layer 60' through the thermal pad 20' respectively; when the optical module is working, the device A / B / C generates heat, and a heat transfer path is established through the thermal pad 20' and the temperature-averaging strengthening layer 60' to transfer it to the optical module shell 30'. The thermal conductivity of the material of the temperature-averaging strengthening layer 60' is greater than the thermal conductivity of the shell material, which can improve the equivalent thermal conductivity of the optical module shell, thereby improving the heat transfer between the shell areas and improving the heat dissipation capacity of the optical module shell.

[0048] However, the use of welding, bonding or pressing and embedding processes will introduce contact or interface thermal resistance between the temperature-uniformizing strengthening layer 60′ and the shell 30′, thereby affecting the actual heat dissipation capacity of the shell 30′; at the same time, due to the characteristics of the welding, bonding or pressing and embedding processes, the consistency of batch products cannot be guaranteed.

[0049] Based on this, an embodiment of the present application provides an optical module, which includes a housing, a substrate and a device located in the housing, the substrate is fixedly connected to the housing, the device is arranged on the substrate, and the device is engaged with the inner wall of the housing to exchange the working heat of the device side to the housing side. At least the housing part where the housing and the device are engaged has a hollow cavity, and the hollow cavity is used to accommodate a phase change working medium to form an integrated two-phase heat exchange housing.

[0050] With this arrangement, the heat from the device side is transferred to the shell side, the phase change medium in the hollow cavity can be heated and vaporized, the gas medium carrying heat fills the cavity, and contacts the low-temperature side wall that forms the hollow cavity to quickly condense. After condensation, the liquid medium falls back and enters the next heated vaporization cycle. Based on this integrated two-phase heat exchange shell structure, the heat conduction efficiency of the shell can be improved, and the temperature uniformity of the optical module shell can be enhanced. Overall, the heat dissipation capacity of the optical module can be effectively improved.

[0051] In addition, compared with the structure of configuring a temperature-averaging strengthening layer on the inner wall of the shell, this embodiment adopts an integrated two-phase heat exchange shell structure to enhance the temperature-averaging capability, which can avoid the introduction of thermal resistance affecting the actual heat dissipation capacity of the shell, and can also avoid the problem of the temperature-averaging strengthening layer occupying the internal space and affecting the layout of the optical module. In addition, there is no need to use welding, bonding or pressing and embedding processes, and the consistency of batch products can be improved.

[0052] In order to better understand the technical solution and technical effects of the present application, without loss of generality, a specific embodiment will be described in detail below in conjunction with the drawings and using the upper shell of the optical module as an integrated two-phase heat exchange shell structure.

[0053] See also Figure 3 , Figure 4 and Figure 5 ,in, Figure 3 A schematic diagram of the structure of an optical module provided in an embodiment of the present application is shown in FIG. Figure 4 for Figure 3 The top view of the positional relationship between the upper housing and each device is shown in FIG. Figure 5 for Figure 3 A side cross-sectional view of the light cross-block housing shown in FIG.

[0054] like Figure 3 As shown, a substrate 2 is disposed in the housing 1 of the optical module 10, and a plurality of devices 3 are disposed on the substrate 2. Each device 3 can be a same or different type of energy-consuming and heat-generating device, such as but not limited to an optical chip, etc. The selection of a specific device type and the layout of the board can be determined according to the overall design of the product, and the embodiment of the present application is not limited thereto. For ease of description, three devices 3 (device A, device B, and device C) are illustrated in the figure.

[0055] The housing 1 includes an upper housing 11, a lower housing 12, a left housing 13 and a right housing 14. The left housing 13 and the right housing 14 are relatively arranged between the upper housing 11 and the lower housing 12, and enclose an inner cavity for assembling components inside the optical module. Each device 3 is joined to the inner wall of the upper housing 11 through a thermal pad 4 to form a close contact to avoid the existence of a joint air gap that affects the heat transfer efficiency between the device and the housing. In a specific implementation, the device 3 can also be joined to the inner wall of the upper housing 11 through a thermally conductive adhesive.

[0056] In a possible implementation, the device 3 may also be directly coupled to the inner wall of the upper housing 11 (not shown in the figure), as long as the heat transfer efficiency between the two can be guaranteed. Of course, in other possible implementations, according to the layout requirements of the optical module, the device 3 may also be coupled to the lower housing 12, the left housing 13 or the right housing 14 (not shown in the figure), and the device working heat can also be exchanged to the outer shell side. This is not limited to the embodiments of the present application.

[0057] In this embodiment, the upper shell 11 is a part of the shell connected to the device 3, and has a hollow cavity for accommodating the phase change medium. Its inner wall is connected to the device 3 for heat exchange, and its outer surface away from the device 3 is connected to the heat sink 5 to achieve contact heat exchange, so as to dissipate heat to the ambient heat sink. Figure 6 and Figure 7 ,in, Figure 6 A schematic diagram of the structure of an upper shell provided in an embodiment of the present application is shown in FIG. Figure 7 for Figure 6 Schematic diagram of the assembly explosion of the upper housing shown in .

[0058] The upper housing 11 includes an upper wall 111 and a lower wall 112. A first groove 1121 is provided on the opposite side of the lower wall 112 and the upper wall 111. The two are assembled and fixed to form a hollow cavity a based on the first groove 1121. Here, the shape of the first groove 1121 is not limited to Figure 2 As shown in , it should be understood that the location and shape of the first groove 1121 on the upper housing 11 can be determined in combination with factors such as the external assembly relationship and the internal device layout of the optical module.

[0059] The molding process of the upper wall surface 111 and the lower wall surface 112 can be selected as needed, for example but not limited to, by die casting, stamping, machining or forging. After the two are formed separately, they are welded to form a complete upper shell 11. In this embodiment, the upper wall surface 111 and the lower wall surface 112 can be made of the same metal material or different metal materials. In comparison, the two are made of the same material, which can reasonably control the processing cost, and at the same time can avoid the generation of assembly stress and ensure the processing accuracy of the product.

[0060] In a specific implementation, an injection process port (not shown in the figure) can be provided on the upper shell 11, and the opening position of the process port can be selected according to the overall structural layout, for example but not limited to, the process port is configured at the head or tail in the length direction of the upper shell. After the working fluid is injected through the process port, the corresponding vacuum and sealing treatment are performed to form an integrated two-phase heat exchange shell structure.

[0061] In other specific implementations, the groove forming the hollow cavity a may also be provided on the upper wall surface 111, in other words, the groove is provided on the opposite side of the upper wall surface 111 and the lower wall surface 112. Alternatively, grooves may also be provided on both the upper wall surface 111 and the lower wall surface 112. Figure 8 , the figure is Figure 6 Schematic diagram of assembly explosion formed by another angle of the upper shell shown in . Figure 8 As shown in , a second groove 1111 is opened on the upper wall 111. After assembly, the second groove 1111 on the upper wall 111 and the first groove 1121 on the lower wall 112 together form a hollow cavity for accommodating two-phase working fluid.

[0062] For the second groove 1111 on the upper wall surface 111 and the first groove 1121 on the lower wall surface 112, the groove wall profiles of the two grooves can be the same, and the groove wall profiles of the two grooves are basically aligned after assembly, which can reduce the process difficulty. It is understandable that in other possible implementations, the groove wall profiles of the second groove 1111 and the lower first groove 1121 may not be completely consistent, as long as the two are connected after assembly and form a hollow cavity that can accommodate two-phase working fluids. This embodiment of the application is not limited.

[0063] In order to further improve the heat exchange capacity of the working fluid in the hollow cavity, a capillary structure can be provided on the inner surface of the cavity near the device side of the hollow cavity. Figure 7 and Fig. 9 ,in, Fig. 9 for Figure 6 AA section view in.

[0064] like Figure 7 As shown, the upper housing 11 also includes a capillary structure 113 disposed at the bottom of the first groove 1121, that is, the capillary structure 113 is constructed on the bottom wall of the hollow cavity a. With such a configuration, as the liquid working medium in the area corresponding to the device 3 is continuously heated and volatilized and reduced, the peripheral phase change working medium can be quickly absorbed to the area with reduced liquid volume under the action of the capillary structure of the bottom wall of the hollow cavity a, making full use of the overall heat exchange capacity of the phase change working medium, ensuring the maximum heat exchange capacity of the area, and further enhancing the temperature uniformity of the optical module housing.

[0065] In a specific implementation, the capillary structure 113 may be Figure 7 The independently processed capillary structure layer shown in the figure, for example but not limited to, uses copper parts in different forms, controls the sintering temperature to form a layer structure of disordered capillary structure with different porosity and permeability, and then fixes it on the bottom of the first groove 1121 of the lower wall surface 112. In other possible implementations, the capillary structure 113 can also be integrally processed and formed on the bottom of the first groove 1121 of the lower wall surface 112. It should be understood that as long as the phase change working medium can be quickly absorbed to the area with reduced liquid volume, the embodiment of the present application is not limited.

[0066] Further optionally, in order to make the hollow cavity a maintain the volume size required for the working medium circulation, in a specific implementation, a support body 1112 may be provided in the hollow cavity a. Figure 8 and Fig. 9 As shown, a plurality of support bodies 1112 are arranged on the upper wall surface 111 and abut against the lower wall surface 112; specifically, the support body 1112 is arranged at the bottom of the second groove 1111 on the upper wall surface 111, and abuts against the capillary structure 2 located in the first groove 1121. In other words, the support body 1112 is arranged between the wall surface of the hollow cavity a near the device 3 and the wall surface away from the device 3. Within the width range of the hollow cavity a, each support body 1112 is arranged at intervals in the hollow cavity a, and an effective support is formed without affecting the flow of the phase change working medium. The "width range" here refers to the outer contour of the hollow cavity on the outer shell body to establish a heat exchange area. In different scenarios, based on the setting of the support body 1112, the force formed by vacuuming and the force applied by the assembly production line operation can form an effective support that can prevent the cavity from collapsing.

[0067] In the case where the device 3 is connected to other partial shells such as the lower shell 12, the left shell 13 or the right shell 14, a hollow cavity (not shown in the figure) for accommodating the phase change medium can be provided in the corresponding partial shell, which can also enhance the temperature uniformity of the optical module housing. This embodiment of the application is not limited.

[0068] In other possible implementations, the shell portion of the housing 1 that is not joined to the device 3 may also have a hollow cavity for accommodating the phase-change medium, such as but not limited to the left shell or the right shell, to further improve the overall heat exchange capacity.

[0069] For the embodiments of this application Figure 3 The optical module housing described above is tested for housing temperature uniformity using the existing conventional die-cast zinc as a comparative example. Fig.10 As shown, Fig.10 Figure (a) shows a temperature test simulation diagram of a die-cast zinc alloy shell. Fig.10 Figure (b) shows Figure 3 A simulation diagram of the temperature test of the optical module housing described.

[0070] Combination Fig.10 As shown in the test data in Figure (a), the temperature of the head of the die-cast zinc alloy shell increased by 56.3°C, the temperature of the tail increased by 73.6°C, and the temperature difference between the head and the tail was 17.3°C. Fig.10 As shown in the test data in Figure (b), the temperature of the head of the shell of the present application solution increases by 69°C, and the temperature of the tail increases by 70.5°C. The temperature difference between the head and the tail is 1.5°C. The temperature difference on the shell surface is only about 1 / 10 of that of traditional die-cast zinc.

[0071] In addition, based on the optical module housing provided in the embodiment of the present application, two conventional die-cast zinc materials were used as two groups of comparative examples to conduct device temperature tests. Figure 3 Five samples of the optical module housing described in the embodiment were tested, and compared with the second group of comparative examples, Figure 3 Three samples of the optical module housing described in the test were tested. The power consumption of device A was 10.8W, the power consumption of device B was 4.8W, and the power consumption of device C was 2.75W, and the relevant tests were carried out at the same air volume and ambient temperature. The details are shown in Table 1 below:

[0072] Table 1:

[0073]

[0074] The test air volume is 12CFM (cubic feet per minute) and the ambient temperature is 25℃. From the data in the above table, it can be seen that compared with the temperature of device C in the second group of comparative examples, the temperature of device C in the second group 1# sample increased by 0.6℃, and the temperature of device C in the second group 2# sample increased by 1 device C℃. The temperatures of other samples are significantly lower than those of the corresponding comparative examples. Overall, compared with the traditional die-cast housing comparative example, the average gain in the measured device temperature is 5.43℃.

[0075] In the above embodiment, Figure 4 As shown, the width of the hollow cavity a covers all devices 3 (device A, device B and device C) connected to the upper shell 11. In other specific implementations, the width of the hollow cavity a can selectively cover part of the devices connected to the shell. Fig.11 and Fig.12 ,in, Fig.11 A schematic diagram of the structure of another optical module provided in an embodiment of the present application, Fig.12 for Fig.11 In order to clearly illustrate the difference and connection between this embodiment and the aforementioned implementation scheme, the same functional components or structures are indicated in the figure with the same mark.

[0076] like Fig.11 and Fig.12 As shown, the power consumption of each device 3 in the housing 1 of the optical module 10 is different, and the heat generation in the operating state may also be different. For example, device B in the figure is a device with relatively low power consumption, and accordingly, the heat dissipation requirement of device B may be different from that of other devices (device A and device C). In this embodiment, the hollow cavity a provided on the upper housing 11 does not cover the area joined to device B within its width range. In this way, for device B that does not need or cannot participate in the heat conduction of the housing, heat dissipation conditions that meet its functional requirements are provided.

[0077] For the convenience of description, device A and device C are defined as the first device. The width range of the hollow cavity a corresponds to the setting of device A and device C. In a specific implementation, it can be as follows Fig.12 The outer contour shown in the figure constructs the hollow cavity a, and the phase change medium in the cavity can avoid the area where the upper shell 11 is connected to the device B. In addition, an isolation structure (not shown in the figure) can also be provided in the hollow cavity a, so that the internal phase change medium can avoid the area connected to the device B.

[0078] In addition, in other specific implementations, in order to match the temperature specification differences of the components inside the module, multiple hollow cavities (not shown in the figure) can be formed on the housing. Fig.12The device A and device C shown in the figure are respectively provided with a hollow cavity in a one-to-one correspondence, so as to configure the volume of the cavity according to the differentiated heat dissipation requirements of each device, so as to meet the heat dissipation needs of different devices. In other possible implementation schemes, a hollow cavity can also be configured for the bonding area with more than two devices, that is, a cavity can provide heat dissipation for multiple devices. This is not limited to the embodiments of the present application.

[0079] In addition, in view of the differences in the size specifications of the components on the substrate 2, the inner wall of the upper housing 11 that is connected to the component 3 can be provided with a boss structure to adapt to components of different heights. Fig.13 , which is a schematic diagram of the structure of another optical module provided in an embodiment of the present application. In order to clearly illustrate the difference and connection between this embodiment and the aforementioned implementation scheme, the components or structures with the same functions are indicated with the same mark in the figure.

[0080] like Fig.13 As shown, the sizes of the components 3 in the housing 1 of the optical module 10 are different. For example, the component C in the figure is a relatively low-height component. In this embodiment, the upper housing 11 has a boss 114 at the joint position with the component C to engage with the component C with a relatively low height.

[0081] For the convenience of description, device C is defined as the second device. Of course, the location of the boss 114 is determined by the size difference of each device set on the substrate 2, and a reliable heat exchange path is established for the device to be exchanged. In addition, the inner wall of the shell can provide a joint surface that matches the surface of the device for the device to be dissipated, so that the heat on each device side can be exchanged to the shell side to the maximum extent, and a good heat dissipation capacity is obtained through the integrated two-phase heat exchange shell structure.

[0082] The present application also provides an optical communication device, see Fig.14 , which is a schematic diagram of the structure of the optical communication device provided by the embodiment of the present application. As shown in the figure, the optical communication device 100 includes a device chassis 30 and a mainboard 20 arranged in the device chassis 30, and also includes an optical module 10. The optical module 10 is connected to the mainboard 20 through its electrical signal interface to convert electrical signals into optical signals for output, or to convert optical signals into electrical signals for output, or to convert electrical signals into optical signals for output, and to convert optical signals into electrical signals for output at the same time. The optical module can be as described above Figure 3 , Fig.11 and Fig.13 The optical module described in .

[0083] Based on the improvement of the heat dissipation capacity of the optical module, it provides technical support for meeting the power increase of the optical module. In practical applications, the optical communication equipment can be a server computer, router or switch and other product types, especially suitable for high-power, high-integration, ultra-large-scale data center servers. It can be determined that the optoelectronic component can realize the transmission and reception of optical signals and the mutual conversion of optoelectronic signals, and can be widely used in the field of data communication, including data centers, base stations, 5G, networks and other application scenarios.

[0084] It should be understood that other functional components of the corresponding optical communication equipment are not the core invention points of this application, so they will not be elaborated in this article.

[0085] The above are only preferred embodiments of the present invention. It should be pointed out that, for ordinary technicians in this technical field, several improvements and modifications can be made without departing from the principles of the present invention. These improvements and modifications should also be regarded as the scope of protection of the present invention.

Claims

1. An optical module, characterized in that: It includes a housing, and a substrate and a device located in the housing; The substrate is fixedly connected to the shell, a plurality of the devices are arranged on the substrate, and the devices are joined to the inner wall of the shell; wherein at least the shell portion where the shell is joined to the devices has a hollow cavity for accommodating the phase change medium.

2. The optical module according to claim 1, characterized in that: A capillary structure is arranged in the hollow cavity, and the capillary structure is located on the inner surface of the cavity near the device side.

3. The optical module according to claim 2, characterized in that: A capillary structure layer is fixedly disposed on the inner surface of the cavity, and the capillary structure is formed on the capillary structure layer; or, the capillary structure and the inner surface of the cavity are integrally formed.

4. The optical module according to claim 2, characterized in that: A support body is arranged in the hollow cavity, and the support body is located between a wall surface of the hollow cavity close to the device and a wall surface far from the device.

5. The optical module according to claim 4, characterized in that: The supporting bodies are provided in plurality, and the plurality of supporting bodies are arranged in the hollow cavity at intervals.

6. The optical module according to any one of claims 1 to 5, characterized in that: The width range of the hollow cavity corresponds to the first device arrangement among the plurality of devices.

7. The optical module according to claim 6, characterized in that: The first device has a higher power consumption than other devices among the plurality of devices.

8. The optical module according to any one of claims 1 to 5, characterized in that: There are multiple hollow cavities, and the width ranges of the hollow cavities are arranged in one-to-one correspondence with the devices.

9. The optical module according to any one of claims 1 to 5, characterized in that: There are a plurality of hollow cavities, and the width range of some of the hollow cavities is set to correspond to one of the devices, and the width range of another part of the hollow cavities is set to correspond to at least two of the devices.

10. The optical module according to any one of claims 1 to 5, characterized in that: The inner wall of the housing engaging with the device has a boss, and a second device among the plurality of devices engages with the boss.

11. The optical module according to claim 10, characterized in that: The height dimension of the second device is smaller than that of other devices in the plurality of devices.

12. The optical module according to any one of claims 1 to 5, characterized in that: The device is engaged with an inner wall of an upper shell of the housing, the upper shell of the housing having the hollow cavity.

13. The optical module according to claim 1, characterized in that: The shell portion having the hollow cavity comprises an upper wall surface and a lower wall surface, and the upper wall surface and the lower wall surface enclose the hollow cavity.

14. The optical module according to claim 13, characterized in that: The lower wall surface has a first groove on the side opposite to the upper wall surface, the hollow cavity is formed based on the first groove, and a capillary structure is provided at the bottom of the first groove.

15. The optical module according to claim 14, characterized in that: A second groove is provided on the opposite side of the upper wall surface and the lower wall surface. The second groove on the upper wall surface is connected to the first groove on the lower wall surface. A support body is provided at the bottom of the second groove. The support body abuts against the capillary structure at the bottom of the first groove.

16. The optical module according to any one of claims 13 to 15, characterized in that: The upper wall surface and the lower wall surface are made of the same metal material.

17. The optical module according to any one of claims 1 to 5, characterized in that: The device is bonded to the inner wall of the housing through a thermal pad.

18. An optical communication device, characterized in that: The optical module comprises a mainboard and the optical module according to any one of claims 1 to 17, wherein the optical module is arranged on the mainboard.

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