Testing device of eMCP chip
By designing an eMCP chip test device including test base, human-computer interactive devices, memory and main controller, the problem of low efficiency and high cost caused by separate testing of eMMC and LPDDR in the prior art is solved, and efficient and comprehensive testing is achieved Effect.
Patent Information
- Application Number
- CN202420971547.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-05-07
- Publication Date
- 2025-01-10
- Estimated Expiration
- 2034-05-07
AI Technical Summary
The testing methods of existing eMCP chips require separate testing of the eMMC and LPDDR parts, resulting in low testing efficiency and high cost.
Design a test device including test base, human-computer interaction device, memory and main controller. Through the main controller, the eMMC and LPDDR parts are tested separately according to the test instructions sent by the human-computer interaction device, and the IMX6ULL main control chip and The communication interface module realizes independent communication connection, and is equipped with a temperature control module and a voltage stabilization circuit to provide a constant temperature and stable voltage environment.
It realizes efficient testing of the eMMC and LPDDR parts of the eMCP chip on one device, improving testing efficiency, accuracy and comprehensiveness and reducing testing costs.
Smart Images
Figure CN222337933U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of chip testing, in particular to a testing device for an eMCP chip. Background Art
[0002] eMCP (Embedded Multi-Chip Package) is a packaging format that combines eMMC (Embedded Multi Media Card, standard specification of embedded memory) and LPDDR (Low Power Double Data Rate, low-power memory) together. It is widely used in mobile devices, smart homes, automotive electronics and other fields.
[0003] While providing convenience, eMCP also brings some challenges, such as: testing difficulties. Since eMCP integrates eMMC and LPDDR, they need to be tested separately. Traditional testing methods require separate testing, which has the problems of low testing efficiency and high testing costs. Utility Model Content
[0004] The main purpose of the utility model is to provide a testing device for an eMCP chip, aiming to solve the problem that the eMMC part and the LPDDR part of the existing eMCP chip need to be tested separately, resulting in low testing efficiency.
[0005] To achieve the above object, the utility model provides a test device for an eMCP chip, which is used to test an eMCP chip to be tested having an eMMC part and an LPDDR part. The test device comprises:
[0006] Test socket, used to install the eMCP chip to be tested;
[0007] A human-computer interaction device, at least used for sending test instructions;
[0008] Memory, storing the embedded system;
[0009] The main controller is respectively connected to the human-machine interaction device and the memory for respectively testing the eMMC part and the LPDDR part of the eMCP chip to be tested installed on the test socket according to the test instruction sent by the human-machine interaction device.
[0010] Preferably, the main controller includes a main control chip and a communication interface module; the communication interface module includes a first communication interface module, a second communication interface module and a third communication interface module; wherein the first communication interface module is used to realize the communication connection between the memory and the main control chip; the second communication interface module is used to realize the communication connection between the eMMC part of the eMCP chip to be tested and the main control chip; the third communication interface module is used to realize the communication connection between the LPDDR part of the eMCP chip to be tested and the main control chip.
[0011] Preferably, the model of the main control chip is IMX6ULL.
[0012] Preferably, the memory has an eMMC chip independent of the eMCP chip to be tested.
[0013] Preferably, the testing device further comprises a temperature control module, which is communicatively connected to the human-machine interaction device and is used to provide an adjustable constant temperature testing environment for the eMCP chip to be tested.
[0014] Preferably, the temperature control module includes a single-chip microcomputer circuit and a heating sheet and a temperature sensor respectively communicatively connected to the single-chip microcomputer circuit.
[0015] Preferably, the testing device further comprises a voltage stabilizing circuit, which is communicatively connected to the human-machine interaction device and is used to provide stable and adjustable voltages for the eMMC part and the LPDDR part of the eMCP chip to be tested, respectively.
[0016] Preferably, the testing device further comprises a voltage conversion module, which is electrically connected between the voltage stabilizing circuit and the eMCP chip to be tested and is used for converting the operating voltage output by the voltage stabilizing circuit to the eMCP chip to be tested.
[0017] Preferably, the human-machine interaction device is provided with a communication serial port; and / or, the human-machine interaction device is also used to output the test result of the main controller on the eMCP chip to be tested.
[0018] Preferably, the human-computer interaction device includes a touch screen; or,
[0019] The human-computer interaction device includes a display screen, a keyboard and a mouse; or,
[0020] The human-computer interaction device includes a display screen and a voice interaction device.
[0021] The beneficial effect of the technical solution of the utility model is that the utility model provides a comprehensive and efficient eMCP testing device. After the eMCP chip to be tested is installed on the test socket, the human-computer interaction device obtains the test instruction sent by the user and sends the test instruction to the main controller. The main controller can test the eMMC part and the LPDDR part of the eMCP chip to be tested installed on the test socket respectively according to the test instruction sent by the human-computer interaction device, thereby realizing the testing of the eMMC part and the LPDDR part of the eMCP chip on one device at the same time, improving the efficiency, accuracy and comprehensiveness of the test and reducing the test cost. BRIEF DESCRIPTION OF THE DRAWINGS
[0022] Figure 1 This is a schematic diagram of the structure of the test device for the eMCP chip according to an embodiment of the utility model;
[0023] Figure 2 The figure is a schematic structural diagram of a testing device for an eMCP chip according to another preferred embodiment of the utility model. DETAILED DESCRIPTION
[0024] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the scheme in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.
[0025] It should be noted that all directional indications in the embodiments of the present invention (such as up, down, left, right, front, back, top, bottom, side...) are only used to explain the relative position relationship, movement status, etc. between the components under a certain specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indication will also change accordingly.
[0026] It should also be noted that when an element is referred to as being "fixed on" or "disposed on" another element, it may be directly on the other element or there may be an intermediate element at the same time. When an element is referred to as being "connected to" another element, it may be directly connected to the other element or there may be an intermediate element at the same time.
[0027] In addition, the descriptions involving "first", "second", etc. in the embodiments of the present invention are only for descriptive purposes and cannot be understood as indicating or suggesting their relative importance or implicitly indicating the number of the indicated technical features.
[0028] Regarding the technical defects in the relevant technologies, refer to Figure 1The utility model provides a test device for an eMCP chip, which is used to test an eMCP chip to be tested having an eMMC part and an LPDDR part. The test device comprises:
[0029] A test socket 10, used for mounting the eMCP chip to be tested;
[0030] A human-computer interaction device 20, at least used for sending a test instruction;
[0031] A memory 30 storing an embedded system;
[0032] The main controller 40 is respectively connected to the human-machine interaction device 20 and the memory 30 for respectively testing the eMMC part and the LPDDR part of the eMCP chip to be tested installed on the test socket 10 according to the test instruction sent by the human-machine interaction device 20.
[0033] In the present embodiment, a comprehensive and efficient eMCP testing device is provided. After the eMCP chip to be tested is installed on the test socket 10, the human-computer interaction device 20 obtains the test instruction sent by the user and sends the test instruction to the main controller 40. The main controller 40 can test the eMMC part of the eMCP chip to be tested installed on the test socket 10 in a bare metal test mode according to the test instruction sent by the human-computer interaction device 20, and test the LPDDR part of the eMCP chip to be tested installed on the test socket 10 in an embedded system test mode, thereby realizing the testing of the eMMC part and the LPDDR part of the eMCP chip on one device at the same time, thereby improving the efficiency, accuracy and comprehensiveness of the test and reducing the test cost.
[0034] In this embodiment, the embedded system may be a Linux system.
[0035] In some embodiments, reference Figure 2 The main controller 40 includes a main control chip 41 and a communication interface module 42; the communication interface module 42 includes a first communication interface module 421, a second communication interface module 422 and a third communication interface module 423; wherein the first communication interface module 421 is used to realize the communication connection between the memory 30 and the main control chip 41; the second communication interface module 422 is used to realize the communication connection between the eMMC part of the eMCP chip to be tested and the main control chip 41; the third communication interface module 423 is used to realize the communication connection between the LPDDR part of the eMCP chip to be tested and the main control chip 41.
[0036] Specifically, the communication interface built into the main controller 40 can provide an independent and stable communication connection between the main control chip 41 and the memory 30, the eMMC part of the eMCP chip to be tested, and the LPDDR part of the eMCP chip to be tested, thereby avoiding inaccurate test results caused by external interference in signal or command transmission during the test.
[0037] In some embodiments, the model of the main control chip 41 is IMX6ULL.
[0038] In this embodiment, IMX6ULL is used as the main control chip 41. The chip has low power consumption, powerful performance and rich peripheral interfaces. The chip can flexibly switch between bare metal test mode and embedded system test mode. In the bare metal test mode, the main control chip 41 directly communicates with the eMMC part of the eMCP chip to be tested, accesses the registers and controllers of the eMMC part of the eMCP chip to be tested, and verifies its basic functions, performance and reliability without relying on the support of the intermediate software layer or the operating system. When the main control chip 41 tests the LPDDR part of the eMCP chip to be tested in the embedded system test mode, An embedded system is composed of the IMX6ULL main control chip 41, the eMMC chip in the memory 30, and the LPDDR part of the eMCP chip to be tested, so as to test the LPDDR part of the eMCP chip to be tested; when the embedded system test is performed on the eMCP chip to be tested as a whole, the IMX6ULL main control chip 41, the eMMC part and the LPDDR part of the eMCP chip to be tested together form an embedded system, and the system is burned into the eMMC chip of the eMCP chip to be tested, so as to test the eMMC part and the LPDDR part of the eMCP chip to be tested respectively in the embedded system environment.
[0039] In some embodiments, the memory 30 has an eMMC chip independent of the eMCP chip to be tested.
[0040] In this embodiment, in the embedded system test mode, the embedded system is composed of the IMX6ULL main control chip 41, the eMMC chip in the memory 30, and the LPDDR part of the eMCP chip to be tested, and the system is stored in the eMMC chip of the memory 30. After receiving an instruction to test the LPDDR part of the eMCP chip to be tested, the LPDDR is stress tested by executing the memory test program of the embedded system, and the corresponding test results are obtained.
[0041] In some embodiments, the testing device further includes a temperature control module 50, which is communicatively connected to the human-machine interaction device 20 and is used to provide an adjustable constant temperature testing environment for the eMCP chip to be tested.
[0042] Specifically, since the test device of this embodiment adopts IMX6ULL as the main control chip 41, it needs to frequently switch between the bare metal test mode and the embedded system test mode, so it cannot stably control the temperature control module 50, and therefore requires an independent single-chip microcomputer circuit 51 for control. The single-chip microcomputer circuit 51 is directly connected to the human-computer interaction device 20 for communication. When the test instruction sent by the human-computer interaction device 20 is received, a stable constant temperature environment can be quickly achieved to provide a stable high-temperature test environment for the eMCP chip to be tested. In the process of testing the eMMC part of the eMCP chip to be tested, the eMMC part needs to be tested under different temperature conditions to evaluate its performance under different working environments. Therefore, the temperature control module 50 can also be used to adjust the test environment to different temperatures and maintain a constant temperature.
[0043] In some embodiments, the temperature control module 50 includes a single chip circuit 51 and a heating sheet 52 and a temperature sensor 53 respectively connected to the single chip circuit 51 for communication.
[0044] In this embodiment, when the single-chip microcomputer circuit 51 receives the test instruction sent by the human-computer interaction device 20, it sends a heating instruction to the heating plate 52, and detects the temperature of the test environment by sending a detection instruction to the temperature sensor 53, and receives the temperature data sent by the temperature sensor 53. When the received temperature data reaches the preset test temperature, the heating plate 52 is controlled to reduce the heating power to keep the test temperature constant.
[0045] In some embodiments, the test device further includes a voltage stabilizing circuit 60, which is communicatively connected to the human-machine interaction device 20 and is used to provide stable and adjustable voltages for the eMMC part and the LPDDR part of the eMCP chip to be tested.
[0046] Specifically, the voltage stabilizing circuit 60 is arranged between the main controller 40 and the eMCP chip to be tested, and is communicatively connected to the human-computer interaction device 20. After receiving the test instruction sent by the human-computer interaction device 20, the main controller 40 and the eMMC part and the LPDDR part of the eMCP chip to be tested are respectively powered to ensure that the main controller 40 and the eMCP chip to be tested can operate normally.
[0047] In some embodiments, since the operating voltages of the main controller 40 and the eMCP chip to be tested are different, the voltage output by the voltage stabilizing circuit 60 needs to be converted. Therefore, the testing device also includes a voltage conversion module, which is electrically connected between the voltage stabilizing circuit 60 and the eMCP chip to be tested, and is used to convert the operating voltage output by the voltage stabilizing circuit to the eMCP chip to be tested.
[0048] In some embodiments, the human-machine interaction device 20 is provided with a communication serial port; and / or, the human-machine interaction device 20 is also used to output the test result of the main controller 40 on the eMCP chip to be tested.
[0049] In this embodiment, the human-computer interaction device 20 is responsible for interacting with the user, sending test instructions and receiving test results, and in the embedded system test mode, the user can operate the Linux system through the communication serial port to perform tests, monitor tests, collect test data, summarize test results and feedback to the user.
[0050] In some embodiments, the human-computer interaction device 20 includes a touch screen; or,
[0051] The human-computer interaction device 20 includes a display screen, a keyboard and a mouse; or,
[0052] The human-machine interaction device 20 includes a display screen and a voice interaction device.
[0053] Specifically, the human-machine interaction device 20 can be a computer, a touch screen, or other portable mobile terminals. Taking a computer as an example, a host computer monitoring software can be installed on the computer, and a control parameter setting interface, an operating parameter display interface, and a test result query interface can be designed in the monitoring software.
[0054] The above description is only a partial or preferred embodiment of the present invention. Neither the text nor the drawings can limit the scope of protection of the present invention. All equivalent structural changes made by using the contents of the present invention specification and drawings under the overall concept of the present invention, or direct / indirect application in other related technical fields are included in the scope of protection of the present invention.
Claims
1. A test device for an eMCP chip, used for testing an eMCP chip to be tested having an eMMC part and an LPDDR part, characterized in that: The test setup includes: Test socket, used to install the eMCP chip to be tested; A human-computer interaction device, at least used for sending test instructions; Memory, storing the embedded system; The main controller is respectively connected to the human-machine interaction device and the memory for respectively testing the eMMC part and the LPDDR part of the eMCP chip to be tested installed on the test socket according to the test instruction sent by the human-machine interaction device.
2. The eMCP chip testing device according to claim 1, characterized in that: The main controller includes a main control chip and a communication interface module; the communication interface module includes a first communication interface module, a second communication interface module and a third communication interface module; wherein the first communication interface module is used to realize the communication connection between the memory and the main control chip; the second communication interface module is used to realize the communication connection between the eMMC part of the eMCP chip to be tested and the main control chip; the third communication interface module is used to realize the communication connection between the LPDDR part of the eMCP chip to be tested and the main control chip.
3. The eMCP chip testing device according to claim 2, characterized in that: The model of the main control chip is IMX6ULL.
4. The eMCP chip testing device according to claim 1, characterized in that: The memory has an eMMC chip which is independent of the eMCP chip to be tested.
5. The eMCP chip testing device according to claim 1, characterized in that: It also includes a temperature control module, which is communicatively connected to the human-computer interaction device and is used to provide an adjustable constant temperature test environment for the eMCP chip to be tested.
6. The eMCP chip testing device according to claim 5, characterized in that: The temperature control module includes a single chip circuit and a heating sheet and a temperature sensor which are respectively connected to the single chip circuit for communication.
7. The eMCP chip testing device according to claim 1, characterized in that: The test device also includes a voltage stabilizing circuit, which is communicatively connected to the human-machine interaction device and is used to provide stable and adjustable voltages for the eMMC part and the LPDDR part of the eMCP chip to be tested.
8. The eMCP chip testing device according to claim 7, characterized in that: The testing device also includes a voltage conversion module, which is electrically connected between the voltage stabilizing circuit and the eMCP chip to be tested and is used to convert the operating voltage output by the voltage stabilizing circuit to the eMCP chip to be tested.
9. The eMCP chip testing device according to claim 1, characterized in that: The human-machine interaction device is provided with a communication serial port; and / or, the human-machine interaction device is also used to output the test result of the main controller on the eMCP chip to be tested.
10. The eMCP chip testing device according to claim 1, characterized in that: The human-computer interaction device includes a touch screen; or, The human-computer interaction device includes a display screen, a keyboard and a mouse; or, The human-computer interaction device includes a display screen and a voice interaction device.