Device for packaging semiconductor chip

Abstract

The utility model discloses a device for packaging a semiconductor chip, which relates to the technical field of semiconductor chips, is suitable for gluing when the semiconductor chip is packaged, and comprises a workbench, the transmission belt is arranged in the workbench and is used for transmission; the clamping unit is arranged on the outer surface of the workbench and used for clamping; the adhesive dispensing unit is arranged on the outer surface of the workbench and used for packaging, and the clamping unit comprises a telescopic assembly arranged on the outer surface of the workbench. According to the utility model, the fixing plate, the hydraulic cylinder I, the telescopic limiting rod I, the moving frame, the hydraulic cylinder III, the limiting rod, the moving block, the buffer spring column and the clamping plate are matched with one another, so that a semiconductor chip can be conveniently clamped and fixed; through cooperation of the supporting frame, the driving motor, the second limiting sliding rod, the lead screw, the moving plate, the second hydraulic cylinder, the second telescopic limiting rod, the mounting support, the gluing machine, the glue storage tank and the connecting pipe, the position of the gluing machine can be conveniently and flexibly adjusted, and then gluing and packaging of a chip are facilitated.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor chips, in particular to a device for semiconductor chip packaging. Background Art

[0002] Semiconductors are part of circuit boards. The core units of many electronic products, such as computers, mobile phones, and digital recorders, use changes in the conductivity of semiconductors to process information. Common semiconductor materials include silicon, germanium, gallium arsenide, etc. Semiconductors are packaged using semiconductor dispensing machines.

[0003] In the prior art, a patent document with announcement number CN219615937U proposes a dispensing device for semiconductor chip packaging, which relates to the field of semiconductor chips, including a fixed plate, a first motor is arranged at the top of the fixed plate, a first power rod is fixedly installed at the output end of the first motor, the other end of the first power rod passes through the fixed plate and is fixedly installed with a first bevel gear, a second bevel gear is arranged next to the first bevel gear, the second bevel gear is meshed with the first bevel gear, a rotating rod is fixedly installed on the second bevel gear, the rotating rod passes through the second bevel gear, a first arc plate is fixedly installed at one end of the rotating rod, a support rod is rotatably connected to the other end of the rotating rod, a bottom plate is fixedly installed at the other end of the support rod, a second arc plate is arranged below the first arc plate, a baffle is fixedly installed on the bottom of the second arc plate, a dispensing device is arranged at the bottom of the baffle, a spring and a slider are respectively sleeved on the dispensing device, and the cooperation of the first arc plate and the second arc plate improves the dispensing efficiency of the dispensing device, which can effectively improve the work efficiency.

[0004] The existing technology has the following problems:

[0005] The device is not convenient for fixing the chip device during use, and the position of the glue dispensing device cannot be flexibly adjusted, thereby reducing the practicality of the packaging device. Utility Model Content

[0006] The purpose of the utility model is to provide a semiconductor chip packaging device to solve the problems raised in the above background technology.

[0007] In order to solve the above technical problems, the technical solution adopted by the utility model is:

[0008] A device for semiconductor chip packaging, suitable for glue application during semiconductor chip packaging, includes a workbench; a transmission belt arranged inside the workbench for transmission; a clamping unit arranged on the outer surface of the workbench for clamping; and a glue dispensing unit arranged on the outer surface of the workbench for packaging, the clamping unit includes a telescopic component arranged on the outer surface of the workbench and a clamping component arranged on the outer surface of the telescopic component, and the glue dispensing unit includes an adjustment component arranged on the outer surface of the workbench and a packaging component arranged on the outer surface of the adjustment component.

[0009] A further improvement of the technical solution of the utility model is that the telescopic assembly includes a fixed plate, the base of the fixed plate is detachably connected to the outer surface of the workbench, one side of the fixed plate is detachably connected to a hydraulic cylinder, the telescopic end of the hydraulic cylinder is detachably connected to a movable frame, and one side of the movable frame is detachably connected to a telescopic limit rod detachably connected to the outer surface of the fixed plate.

[0010] By adopting the above technical solution, the position of the movable frame can be conveniently adjusted by using the cooperation of the fixed plate, the hydraulic cylinder 1 and the telescopic limit rod 1.

[0011] A further improvement of the technical solution of the utility model is that: one side of the movable frame is detachably connected to a hydraulic cylinder three, one side of the hydraulic cylinder three is detachably connected to the outer surface of the movable frame, the telescopic end of the hydraulic cylinder three is detachably connected to a movable block, and the inner wall of the movable block is slidably connected to a limiting rod detachably connected to the inner wall of the movable frame.

[0012] By adopting the above technical solution, the position of the moving block can be conveniently adjusted by the cooperation between the hydraulic cylinder 3, the limit rod and the moving block.

[0013] A further improvement of the technical solution of the utility model is that the clamping assembly includes a buffer spring column, one side of the buffer spring column is detachably connected to the outer surface of the moving block, and the other end of the buffer spring column is fixedly connected to the clamping plate.

[0014] By adopting the above technical solution, the chip can be conveniently clamped and fixed by the cooperation between the buffer spring column and the clamping plate.

[0015] A further improvement of the technical solution of the utility model is that: the adjustment component includes a support frame, the base of the support frame is detachably connected to the upper surface of the workbench, the outer surface of the support frame is detachably connected to a drive motor, the driving end of the drive motor is fixedly connected to a screw rod rotatably connected to the inner wall of the support frame, the outer surface of the screw rod is threadedly connected to a movable plate, and the inner wall of the movable plate is slidably connected to a limiting slide rod 2 that is detachably connected to the inner wall of the support frame.

[0016] By adopting the above technical solution, the position of the movable plate can be conveniently adjusted by the cooperation of the driving motor, the second limiting slide bar and the movable plate.

[0017] A further improvement of the technical solution of the utility model is that: the upper surface of the movable plate is detachably connected to hydraulic cylinder 2, the telescopic end of the hydraulic cylinder 2 is detachably connected to a mounting bracket, and the top of the mounting bracket is detachably connected to telescopic limit rod 2 detachably connected to the outer surface of the movable plate.

[0018] By adopting the above technical solution, the position of the mounting bracket can be conveniently adjusted by using the cooperation of the second hydraulic cylinder, the second telescopic limit rod and the mounting bracket.

[0019] A further improvement of the technical solution of the utility model is that the packaging component includes a glue applicator and a glue storage tank, the bottom of the glue applicator is detachably connected to the outer surface of the mounting bracket, the input end of the glue applicator is detachably connected to a connecting pipe, the bottom of the glue storage tank is fixedly connected to the upper surface of the mounting bracket, and the output end of the glue storage tank is fixedly connected to one end of the connecting pipe.

[0020] By adopting the above technical solution, the outer surface of the chip can be easily glued by using the cooperation between the glue spraying machine and the glue storage tank.

[0021] Due to the adoption of the above technical solution, the utility model has achieved the following technical progress compared with the prior art:

[0022] The utility model provides a semiconductor chip packaging device, which can conveniently clamp and fix the semiconductor chip by using a fixed plate, a hydraulic cylinder, a telescopic limit rod, a movable frame, a hydraulic cylinder, a limit rod, a movable block, a buffer spring column and a clamping plate to cooperate with each other, thereby increasing the functionality of the semiconductor chip packaging device.

[0023] The utility model provides a device for semiconductor chip packaging, which adopts a support frame, a driving motor, two limit slide rods, a screw rod, a movable plate, two hydraulic cylinders, two telescopic limit rods, a mounting bracket, a glue machine, a glue storage tank and a connecting pipe. The mutual cooperation of the glue machine can conveniently and flexibly adjust the position of the glue machine, thereby facilitating the gluing and packaging of the chip. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 It is a schematic diagram of the structure of the utility model;

[0025] Figure 2 It is a front structural schematic diagram of the utility model;

[0026] Figure 3 This is a schematic diagram of the structure of the clamping unit of the utility model;

[0027] Figure 4This is a schematic diagram of the dispensing unit structure of the utility model;

[0028] Figure 5 It is a schematic diagram of the local structure of the dispensing unit of the utility model.

[0029] In the figure: 1. workbench; 2. transmission belt; 3. clamping unit; 31. fixed plate; 32. hydraulic cylinder 1; 33. telescopic limit rod 1; 34. moving frame; 35. hydraulic cylinder 3; 36. limit rod; 37. moving block; 38. buffer spring column; 39. clamping plate; 4. dispensing unit; 41. support frame; 42. drive motor; 43. limit slide rod 2; 44. moving plate; 45. hydraulic cylinder 2; 46. telescopic limit rod 2; 47. mounting bracket; 48. glue sprayer; 49. glue storage tank; 491. connecting pipe. DETAILED DESCRIPTION

[0030] The following is a further non-limiting detailed description of the technical solution of the utility model in conjunction with the preferred embodiments and the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0031] See also Figure 1-5 The utility model provides a technical solution: a device for semiconductor chip packaging, including a workbench 1; a transmission belt 2 arranged inside the workbench 1 for transmission; a clamping unit 3 arranged on the outer surface of the workbench 1 for clamping; and a dispensing unit 4 arranged on the outer surface of the workbench 1 for packaging, the clamping unit 3 includes a telescopic component arranged on the outer surface of the workbench 1 and a clamping component arranged on the outer surface of the telescopic component, the dispensing unit 4 includes an adjusting component arranged on the outer surface of the workbench 1 and a packaging component arranged on the outer surface of the adjusting component.

[0032] The telescopic assembly includes a fixed plate 31, the base of the fixed plate 31 is detachably connected to the outer surface of the workbench 1, one side of the fixed plate 31 is detachably connected to a hydraulic cylinder 32, the telescopic end of the hydraulic cylinder 32 is detachably connected to a moving frame 34, and one side of the moving frame 34 is detachably connected to a telescopic limit rod 33 detachably connected to the outer surface of the fixed plate 31.

[0033] One side of the movable frame 34 is detachably connected to a hydraulic cylinder three 35, one side of the hydraulic cylinder three 35 is detachably connected to the outer surface of the movable frame 34, the telescopic end of the hydraulic cylinder three 35 is detachably connected to a movable block 37, and the inner wall of the movable block 37 is slidably connected to a limit rod 36 detachably connected to the inner wall of the movable frame 34.

[0034] The clamping assembly includes a buffer spring column 38 , one side of which is detachably connected to the outer surface of the moving block 37 , and the other end of the buffer spring column 38 is fixedly connected to a clamping plate 39 .

[0035] When using the semiconductor chip packaging device, first place the semiconductor chip to be packaged on the outer surface of the transmission belt 2 for transmission. When the infrared detector detects that the chip is transported between the clamping units 3, it will trigger the start of the hydraulic cylinder 32. The telescopic end of the hydraulic cylinder 32 drives the moving frame 34 to move under the limit of the telescopic limit rod 33, thereby driving the clamping plates 39 to approach each other, so as to clamp and fix the chip. Then, the outer surface of the chip is glued and packaged using the glue dispensing unit 4. During the gluing process, if the horizontal position of the chip needs to be adjusted, the hydraulic cylinder 3 35 is started, and the telescopic end of the hydraulic cylinder 3 35 drives the moving block 37 to move under the limit of the limit rod 36, thereby facilitating the adjustment of the position of the chip.

[0036] The adjustment component includes a support frame 41, the base of the support frame 41 is detachably connected to the upper surface of the workbench 1, the outer surface of the support frame 41 is detachably connected to a drive motor 42, the driving end of the drive motor 42 is fixedly connected to a screw rod rotatably connected to the inner wall of the support frame 41, the outer surface of the screw rod is threadedly connected to a moving plate 44, and the inner wall of the moving plate 44 is slidably connected to a limit slide rod 43 detachably connected to the inner wall of the support frame 41.

[0037] The upper surface of the movable plate 44 is detachably connected to a hydraulic cylinder 45 , the telescopic end of the hydraulic cylinder 45 is detachably connected to a mounting bracket 47 , and the top of the mounting bracket 47 is detachably connected to a telescopic limiting rod 46 detachably connected to the outer surface of the movable plate 44 .

[0038] The packaging component includes a glue applicator 48 and a glue storage tank 49. The bottom of the glue applicator 48 is detachably connected to the outer surface of the mounting bracket 47. The input end of the glue applicator 48 is detachably connected to a connecting pipe 491. The bottom of the glue storage tank 49 is fixedly connected to the upper surface of the mounting bracket 47. The output end of the glue storage tank 49 is fixedly connected to one end of the connecting pipe 491.

[0039] After the chip is fixed, by starting the hydraulic cylinder 45, the telescopic end of the hydraulic cylinder 45 drives the mounting bracket 47 to rise and fall under the limit of the telescopic limit rod 46, thereby assisting in adjusting the position of the glue machine 48, and cooperating with the glue storage tank 49 and the connecting pipe 491 to glue the chip. During the gluing process, when it is necessary to adjust the horizontal position of the glue machine 48, the driving motor 42 is started, and the driving end of the driving motor 42 drives the screw rod to rotate, thereby driving the movable plate 44 to move under the limit of the limit slide rod 43, thereby facilitating the adjustment of the horizontal position of the glue machine 48, thereby flexibly adjusting the position of the glue machine 48 to glue and package the chip.

[0040] The working principle of the semiconductor chip packaging device will be described in detail below.

[0041] like Figure 1-5 As shown, when using the semiconductor chip packaging device, the semiconductor chip to be packaged is first placed on the outer surface of the transmission belt 2 for transmission. When the infrared detector detects that the chip is transported between the clamping units 3, the hydraulic cylinder 32 is triggered to start, and the telescopic end of the hydraulic cylinder 32 drives the moving frame 34 to move under the limit of the telescopic limit rod 33, thereby driving the clamping plates 39 to approach each other, so as to clamp and fix the chip, and then the glue dispensing unit 4 is used to glue the outer surface of the chip for packaging. During the glue dispensing process, if it is necessary to adjust the horizontal position of the chip, the hydraulic cylinder 3 35 is started, and the telescopic end of the hydraulic cylinder 35 drives the moving block 37 to move under the limit of the limit rod 36. Move, so as to facilitate the adjustment of the position of the chip. After the chip is fixed, by starting the hydraulic cylinder 2 45, the telescopic end of the hydraulic cylinder 2 45 drives the mounting bracket 47 to rise and fall under the limit of the telescopic limit rod 2 46, thereby assisting in adjusting the position of the glue machine 48, and cooperating with the glue storage tank 49 and the connecting pipe 491 to glue the chip. During the gluing process, when it is necessary to adjust the horizontal position of the glue machine 48, by starting the driving motor 42, the driving end of the driving motor 42 drives the screw to rotate, thereby driving the moving plate 44 to move under the limit of the limit slide rod 2 43, thereby facilitating the adjustment of the horizontal position of the glue machine 48, thereby flexibly adjusting the position of the glue machine 48 to glue and package the chip.

[0042] The above generally describes the present invention in detail, but it is obvious to a person skilled in the art that some modifications or improvements can be made to the present invention. Therefore, modifications or improvements that do not deviate from the spirit of the present invention are within the scope of protection of the present invention.

Claims

1. A device for semiconductor chip packaging, suitable for applying glue when semiconductor chip packaging, comprising a workbench (1); A transmission belt (2) arranged inside the workbench (1) for transmission; A clamping unit (3) disposed on the outer surface of the workbench (1) for clamping; and a glue dispensing unit (4) for packaging, which is arranged on the outer surface of the workbench (1), and is characterized in that: The clamping unit (3) comprises a telescopic component arranged on the outer surface of the workbench (1) and a clamping component arranged on the outer surface of the telescopic component, and the dispensing unit (4) comprises an adjustment component arranged on the outer surface of the workbench (1) and a packaging component arranged on the outer surface of the adjustment component.

2. The semiconductor chip packaging device according to claim 1, wherein: The telescopic assembly comprises a fixed plate (31), a base of the fixed plate (31) being detachably connected to the outer surface of the workbench (1), a hydraulic cylinder (32) being detachably connected to one side of the fixed plate (31), a telescopic end of the hydraulic cylinder (32) being detachably connected to a moving frame (34), and a telescopic limit rod (33) detachably connected to the outer surface of the fixed plate (31) being detachably connected to one side of the moving frame (34).

3. The semiconductor chip packaging device according to claim 2, wherein: One side of the movable frame (34) is detachably connected to a hydraulic cylinder three (35), one side of the hydraulic cylinder three (35) is detachably connected to the outer surface of the movable frame (34), the telescopic end of the hydraulic cylinder three (35) is detachably connected to a movable block (37), and the inner wall of the movable block (37) is slidably connected to a limit rod (36) detachably connected to the inner wall of the movable frame (34).

4. The semiconductor chip packaging device according to claim 3, wherein: The clamping assembly comprises a buffer spring column (38), one side of the buffer spring column (38) is detachably connected to the outer surface of the moving block (37), and the other end of the buffer spring column (38) is fixedly connected to a clamping plate (39).

5. The semiconductor chip packaging device according to claim 1, wherein: The adjustment assembly comprises a support frame (41), the base of the support frame (41) is detachably connected to the upper surface of the workbench (1), the outer surface of the support frame (41) is detachably connected to a drive motor (42), the drive end of the drive motor (42) is fixedly connected to a screw rod rotatably connected to the inner wall of the support frame (41), the outer surface of the screw rod is threadedly connected to a moving plate (44), and the inner wall of the moving plate (44) is slidably connected to a second limit slide rod (43) detachably connected to the inner wall of the support frame (41).

6. The semiconductor chip packaging device according to claim 5, characterized in that: The upper surface of the movable plate (44) is detachably connected to a second hydraulic cylinder (45), the telescopic end of the second hydraulic cylinder (45) is detachably connected to a mounting bracket (47), and the top of the mounting bracket (47) is detachably connected to a second telescopic limiting rod (46) detachably connected to the outer surface of the movable plate (44).

7. The semiconductor chip packaging device according to claim 6, wherein: The packaging component comprises a glue sprayer (48) and a glue storage tank (49); the bottom of the glue sprayer (48) is detachably connected to the outer surface of the mounting bracket (47); the input end of the glue sprayer (48) is detachably connected to a connecting pipe (491); the bottom of the glue storage tank (49) is fixedly connected to the upper surface of the mounting bracket (47); and the output end of the glue storage tank (49) is fixedly connected to one end of the connecting pipe (491).

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