Vacuum tip and pick-and-place tool

Abstract

The embodiment of the utility model provides a vacuum tip and a pick-and-place tool. The attachment and detachment of the integrated circuit die can be performed without deforming the die. In one embodiment, a vacuum tip for transporting integrated circuit dies is provided. The vacuum tip includes a body having a top surface and a bottom surface, and a plurality of grooves formed in the top surface and into the body, wherein the grooves extend radially outward from a center point of the body. The vacuum tip also includes a channel in the body, where the channel extends through the body from a bottom of the recess to a bottom surface of the body, and the channel and the body are substantially coaxial.

Description

Technical Field

[0001] The disclosed embodiments relate to a vacuum tip for transporting a die and a pick-and-place tool including the vacuum tip. Background Art

[0002] A common requirement for advanced electronic circuits, particularly those manufactured as integrated circuits (ICs) in semiconductor processes, is the use of equipment to transport circuit dies for various operations. Vacuum "pick and place" tools are commonly used for the transport of circuit dies. Vacuum pick and place tools typically use a tip to contact the die and apply a vacuum to attach the die to the tool. The die can be moved to other tools for various manufacturing processes. Once the die is placed in another processing tool or storage area, the vacuum is released and the tip is moved away from the die.

[0003] As die size decreases and semiconductor processing advances, the thickness of wafers and ultimately finished integrated circuit dies is also decreasing. Therefore, using conventional pick-and-place tools may cause the die to deform when attached to the vacuum tip. This deformation may result in uneven processing. Therefore, there is a need for an improved pick-and-place tool that can address the above issues. Utility Model Content

[0004] The purpose of the present disclosure is to provide a vacuum tip and a pick-and-place tool to solve at least one of the above problems.

[0005] Some embodiments of the present disclosure provide a vacuum tip for transporting integrated circuit dies. The vacuum tip comprises: a body having a top surface and a bottom surface; a plurality of grooves formed in the top surface and entering the body, the grooves extending radially outward from a center point of the body; and a channel disposed in the body and extending from the bottom of the groove through the body to the bottom surface of the body, and the channel and the body are substantially coaxial.

[0006] According to one embodiment of the present disclosure, each of the plurality of grooves has a first end and a second end, the first end being connected to the channel located at the center point, and the second end terminating at or near a periphery of the body.

[0007] According to one embodiment of the present disclosure, the plurality of grooves are equidistantly spaced around a circumference of the main body.

[0008] Some embodiments of the present disclosure provide a vacuum tip for transporting integrated circuit dies. The vacuum tip comprises: an outer ring body; an inner ring body, radially arranged inside the outer ring body, and coaxial with the inner ring body; and a plurality of support members, radially extending between the outer ring body and the inner ring body and contacting the outer ring body and the inner ring body, wherein the area inside the inner ring body forms a first vacuum port, and the area defined by the outer ring body, the inner ring body and the support members forms a plurality of second vacuum ports.

[0009] According to one embodiment of the present disclosure, the top surfaces of the outer ring body, the inner ring body and the plurality of support members are coplanar.

[0010] According to one embodiment of the present disclosure, it further includes: a mounting bracket coupled to a bottom surface of the outer ring body, wherein the mounting bracket has a vacuum hole extending through the mounting bracket and fluidly connected to the first vacuum port and the plurality of second vacuum ports.

[0011] According to one embodiment of the present disclosure, each of the plurality of support members tapers distally and outwardly, and each of the plurality of support members has relative side walls defining a taper angle in a range of 15 to 30 degrees.

[0012] Some embodiments of the present disclosure provide a pick-and-place tool, including a flipper. The flipper includes: a vacuum tip operable to pick up an object, the vacuum tip including: a body having a top surface and a bottom surface; a plurality of grooves formed in the top surface and entering the body, the grooves extending radially outward from a center point of the body; and a channel formed in the body and extending from the bottom of the grooves through the body to the bottom surface of the body; and an arm coupled to the vacuum tip and operable to move back and forth between a first position and a second position. The pick-and-place tool also includes a vacuum head operable to pick up an object from the flipper and move the object between a third position and a fourth position.

[0013] According to one embodiment of the present disclosure, the vacuum tip further includes: a mounting bracket coupled to the vacuum tip, wherein the mounting bracket has a vacuum hole aligned with and fluidically connected to the channel of the vacuum tip.

[0014] According to one embodiment of the present disclosure, the plurality of grooves are symmetrical with respect to a vertical line extending through the center point of the body. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] The concepts of the disclosed embodiments are better understood with reference to the following detailed description and the accompanying drawings. It should be noted that, according to standard practice in the industry, the various features in the drawings are not necessarily drawn to scale. In fact, the sizes of the various features may be arbitrarily enlarged or reduced to make the description clear.

[0016] Figure 1A schematic diagram showing a pick and place tool according to some embodiments of the present disclosure.

[0017] Figure 2A is a perspective view of a vacuum tip assembly according to some embodiments of the present disclosure.

[0018] Figure 2B is along Figure 2A A cross-sectional view of the vacuum tip assembly extracted in plane AA is shown in FIG.

[0019] Figure 3A According to some embodiments Figure 2A A stereogram of the vacuum tip.

[0020] Figure 3B yes Figure 3A The vacuum tip Figure 3A A perspective view of plane BB shown in FIG.

[0021] Figure 4A According to some embodiments Figure 3A Top view of the vacuum tip.

[0022] Figure 4B According to some embodiments Figure 4A Bottom view of the vacuum tip.

[0023] Figure 4C According to some embodiments Figure 4B A stereogram of the vacuum tip.

[0024] Figure 4D According to some embodiments Figure 4A A stereogram of the vacuum tip.

[0025] Figure 5 A schematic diagram showing a device die being picked up using a vacuum tip assembly according to some embodiments.

[0026] Fig. 6A is a top view of a vacuum tip according to some alternative embodiments.

[0027] Figure 6B According to some embodiments Fig. 6A A stereogram of the vacuum tip.

[0028] Fig. 7A is a top view of a vacuum tip according to some alternative embodiments.

[0029] Figure 7B According to some embodiments Fig. 7A A stereogram of the vacuum tip.

[0030] Fig. 8A is a top view of a vacuum tip according to some alternative embodiments.

[0031] Figure 8B According to some embodiments Fig. 8A A stereogram of the vacuum tip.

[0032] Figures 9 to 12 Shown are top views of vacuum tips according to various alternative embodiments.

[0033] The reference numerals are as follows:

[0034] 100: Pick and place tool

[0035] 101: Vacuum tip assembly

[0036] 102: Device Die / Die

[0037] 102t: Top

[0038] 102b: Bottom

[0039] 103: First position

[0040] 104: Flipper

[0041] 105: Second position

[0042] 106: Arm

[0043] 107: Third position

[0044] 108: Actuator

[0045] 109: Fourth position

[0046] 110: Vacuum tip

[0047] 112: Mounting bracket

[0048] 114:Joint head

[0049] 116: Processed wafer

[0050] 118: Mobile components

[0051] 120: rod

[0052] 121: Guide rail

[0053] 122: Substrate support

[0054] 124: Heater

[0055] 126: Grain

[0056] 201: Vacuum tip assembly

[0057] 203: Main body

[0058] 210: Vacuum tip

[0059] 210t: Top

[0060] 210b: Bottom

[0061] 212: Mounting bracket

[0062] 212t: Top

[0063] 212b: Bottom

[0064] 212d: Main body

[0065] 230,230a,230b,230c: groove

[0066] 231: Bottom

[0067] 232: Channel

[0068] 234: Vacuum hole

[0069] 540: Vacuum source

[0070] 610: Vacuum tip

[0071] 640: Outer ring

[0072] 641: Inner ring

[0073] 642,642a,642b,642c: Supporting member

[0074] 643: Vacuum port

[0075] 645: Vacuum port

[0076] 710: Vacuum tip

[0077] 740: Outer ring

[0078] 742,742a,742b,742c: Supporting member

[0079] 742-1: First End

[0080] 742-2: Second End

[0081] 743: Vacuum port

[0082] 745: Vacuum port

[0083] 810: Vacuum tip

[0084] 840: Outer ring

[0085] 842,842a,842b,842c: Supporting member

[0086] 845: Vacuum port

[0087] 910: Vacuum tip

[0088] 940: Outer ring

[0089] 942: Cross-shaped support member

[0090] 945a,945b,945c,945d: Vacuum port

[0091] 1010: Vacuum tip

[0092] 1040: Outer ring

[0093] 1042: Cross-shaped support member

[0094] 1043: Vacuum port

[0095] 1045a, 1045b, 1045c, 1045d: Vacuum port

[0096] 1110: Vacuum tip

[0097] 1140: Outer ring

[0098] 1141: Inner ring

[0099] 1142, 1142a, 1142b, 1142c, 1142d: Supporting member

[0100] 1143: Vacuum port

[0101] 1145a,1145b,1145c,1145d: Vacuum port

[0102] 1201: Main body

[0103] 1210: Vacuum tip

[0104] 1250a, 1250b, 1250c, 1250d: vacuum holes

[0105] D1: Outer diameter

[0106] D2: Diameter

[0107] D3:Outer diameter

[0108] D4:Inner diameter

[0109] H1,H2,H3,H4:Height

[0110] L1, L2: Length

[0111] W1,W2: Width

[0112] β: cone angle

[0113] AA: Planar

[0114] BB: Flat DETAILED DESCRIPTION

[0115] The following disclosure provides many different embodiments or examples to implement different features of the embodiments of the present disclosure. The following describes specific examples of components and configurations to simplify the description of the embodiments of the present disclosure. Of course, these specific examples are only for demonstration and are not intended to limit the embodiments of the present disclosure. For example, in the following description, it is mentioned that the first feature is formed on or above the second feature, which means that it may include an embodiment in which the first feature and the second feature are in direct contact, and may also include an embodiment in which an additional feature is formed between the first feature and the second feature, so that the first feature and the second feature may not be in direct contact. In addition, the present disclosure may repeat reference symbols and / or letters in various examples. This repetition is for the purpose of simplicity and clarity, and does not itself limit the relationship between the various embodiments and / or configurations described.

[0116] Furthermore, spatially relative terms, such as "below," "beneath," "lower," "above," "upper," and the like, may be used herein to describe the relationship of one element or feature to another element or feature(s) illustrated in the drawings. These spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the drawings. The device may be oriented differently (rotated 90 degrees or at other orientations) and the spatially relative terms used herein interpreted similarly.

[0117] Embodiments of the present disclosure provide novel die pick and place tools with improved vacuum tips that can perform attachment and separation of integrated circuit dies without deforming the dies, particularly for dies with a thickness of less than 10 mils. The novel die pick and place tools can be used with processes that use vacuum tools to pick and place dies, such as for transporting dies to a workstation for applying flux to solder bumps on the bottom surface of the die. In various embodiments, the vacuum tip is configured to make physical contact with the surface area of ​​the die. The vacuum tip has a plurality of grooves formed in the top surface of the vacuum tip. The grooves are fluidly connected to a vacuum channel that extends through the body of the vacuum tip. The grooves and the vacuum channel are in fluid communication with a vacuum source. The vacuum tip has an increased contact surface area that can provide greater and uniform support for the contact surface area of ​​the die. Therefore, horizontal deformation of the die is avoided. The vacuum tip of the embodiments of the present disclosure can be used in any process that performs pick and place operations, such as packaging, die stacking, solder bumps and flux, etc. Various aspects of the embodiments are discussed in more detail below.

[0118] Figure 1 A schematic diagram of a pick and place tool 100 is shown according to some embodiments of the present disclosure. The pick and place tool 100 may be used in the manufacturing process of integrated circuits, which typically involves bonding device dies to processed wafers, such as processed wafer 116. In a typical bonding process, the device die 102 is first picked up by a flipper (e.g., flipper 104) and then transported to one or more bonding heads 114 (only one is shown). The flipper 104 is operable to pick up device dies one by one from a wafer (not shown) that has been sawn into a plurality of dies. Although not shown, the flipper 104 may be configured to perform movement in at least one "horizontal" direction (X direction) and a "vertical" direction (Z direction). The wafer may be a device wafer, and the device die 102 may include integrated circuit devices (e.g., transistors) therein.

[0119] The flipper 104 has an arm 106 coupled to an actuator 108. The actuator 108 can rotate the arm 106 around the axis of the actuator 108 and move the arm 106 back and forth between a first position 103 (a position where the device die 102 is picked up) and a second position 105 (a position where the device die 102 is released). A vacuum tip assembly 101 is detachably coupled to the arm 106 of the flipper 104. The vacuum tip assembly 101 in principle includes a vacuum tip 110 and a mounting bracket 112. Applying a vacuum generated by a vacuum pump (not shown) allows the vacuum tip 110 to pick up the device die 102. The flipper 104 shown in dotted lines shows the position of the arm 106 and the flipper 104 for picking up the device die 102, while the flipper 104 shown in solid lines shows the position of the same flipper 104 for releasing the flipped device die 102.

[0120] The bonding head 114 is movable vertically relative to the flipper 104 and is used to move the device die 102 from the flipper 104 to the processed wafer 116. The processed wafer 116 may have a plurality of integrated circuit die (e.g., die 126) formed thereon. If desired, the processed wafer 116 may be replaced with a carrier wafer. The bonding head 114 may be a vacuum head capable of picking up a die (e.g., device die 102) by vacuum force. The bonding head 114 may be coupled to the moving member 118 by a rod 120. The moving member is operable to move the bonding head 114 toward the flipper 104 and pick up the flipped device die 102 from the flipper 104. The moving member 118 may move the bonding head 114 between a third position 107 (a position where the flipped device die is released from the flipper 104) and a fourth position 109 directly above the processed wafer 116 along the guide rail 121. The processed wafer 116 may be disposed on a substrate support 122. The substrate support 122 may be connected to a heater 124 that locally heats the processed wafer 116. A control unit (not shown) may be electrically connected to the flipper 104, the bond head 114, the moving member 118, and the heater 124 so that the movement of the bond head 114 and the flipper 104 may be controlled and synchronized with the movement of the wafer and the processed wafer.

[0121] In operation, the flipper 104 is directed to move the arm 106 to a first position 103 where a die is picked up from a wafer (not shown). The wafer may be moved in the X and Y directions so that each die in the wafer (e.g., die 102) is moved one at a time directly under the flipper 104. The flipper 104 may flip or move the arm 106 via the actuator 108 so that the vacuum tip 110 faces the front side of the device die 102. The flipper 104 then moves toward the device die 102 and contacts the device die 102 with the vacuum tip 110. Once the device die 102 is secured to the vacuum tip 110, the flipper 104 moves back and the arm 106 may flip or move again (from the first position 103 to the second position 105) so that the back side of the picked die 102 faces upward. Next, the moving member 118 moves the bonding head 114 toward the flipped device die 102 and contacts the back side of the flipped device die 102. Once the flipped device die 102 is secured to the bonding head 114, the vacuum applied to the front side of the device die 102 (by the flipper 104) is turned off, and the moving member 118 moves the bonding head 114 backward, with the front side of the device die 102 facing downward. The moving member 118 moves the bonding head 114 from the third position 107 to the fourth position 109, where the device die 102 will be placed on the processed wafer 116. At the same time. The flipper 104 can continue to pick up die from the wafer in a manner similar to that described above. The moving member 118 moves the bonding head 114 (carrying the device die 102) downward toward the die (e.g., die 126) on the processed wafer 116. After the plurality of device dies 102 are placed on the processed wafer 116, a heat treatment may be performed (by the heater 124) so ​​that the device dies (e.g., device dies 102) are bonded to corresponding dies (e.g., dies 126) on the processed wafer 116. The dies may be bonded together by fusion or hybrid bonding techniques, such as insulator-to-insulator, metal-to-metal, or insulator-to-metal bonding processes. The dies may be bonded face-to-face (F2F) or face-to-back (F2B). In the F2F bonding configuration, the active faces of the dies are bonded together, while in the F2B bonding configuration, the active face of one die is bonded to the back of another die. After the bonding is completed, the moving member 118 moves the bonding head 114 away from the processed wafer 116, and the moving member 118 moves the bonding head 114 back to the third position 107 to pick up another die from the flipper 104.

[0122] Figure 2A is a perspective view of a vacuum tip assembly 201 according to some embodiments of the present disclosure. The vacuum tip assembly 201 can be used to replace a flipper (e.g. Figure 11 . The vacuum tip assembly 201 of the flipper 104 of the pick-and-place tool 100 shown in FIG. The vacuum tip assembly 201 in principle includes a vacuum tip 210 and a mounting bracket 212. The vacuum tip 210 may be referred to as a pick-up head or a nozzle head. The vacuum tip 210 is detachably attached to the mounting bracket 212. In some embodiments, the vacuum tip 210 is permanently attached to the mounting bracket 212 by glue or the like. The vacuum tip 210 may be disposed in the center of the mounting bracket 212. The mounting bracket 212 may be a flat plate of any suitable shape, such as a square, rectangular, or circular shape, etc. In an exemplary embodiment, the mounting bracket 212 is a square plate having a size of 4 millimeters (mm) x 4 mm. However, these dimensions should not be construed as limiting and may vary depending on the size of the flipper 104.

[0123] Figure 2B is along Figure 2A 2. A cross-sectional view of the vacuum tip assembly 201 taken along plane AA shown in FIG. The vacuum tip 210 has a top surface 210t and a bottom surface 210b opposite the top surface 210t. The mounting bracket 212 has a top surface 212t and a bottom surface 212b opposite the top surface 212t. The bottom surface 210b of the vacuum tip 210 is attached to the top surface 212t of the mounting bracket 212. As will be seen in FIG. FIG. 3A to FIG. 3B As discussed in more detail in , the vacuum tip 210 may have a plurality of grooves 230 formed in the top surface 210t of the vacuum tip 210. The grooves 230 extend outward from the center of the vacuum tip 210 and are arranged in a manner to provide an equal vacuum force to the device die. In some embodiments, one end of each groove 230 merges or connects to each other.

[0124] The vacuum tip 210 also has a channel 232 extending vertically through a portion of the vacuum tip 210 and exposed at the bottom surface 210b of the vacuum tip 210. The channel 232 has a first end connected to the bottom of the groove 230 and a second end connected to the bottom surface 210b of the vacuum tip 210. The channel 232 is fluidly connected to the groove 230. Although one channel 232 is shown, in some embodiments, two or more channels may be provided and fluidly connected to each groove 230. The length of each groove 230 is greater than the diameter of the channel 232. In most embodiments, the top surface 210t of the vacuum tip 210 is smaller than the cross-sectional area of ​​the die. However, the top surface 210t of the vacuum tip 210 may vary with the size of the die and the semiconductor processing technology used to manufacture the die. In some embodiments, the top surface 210t of the vacuum tip 210 may have a cross-sectional area similar to or corresponding to the cross-sectional area of ​​the die.

[0125] The mounting bracket 212 has a vacuum hole 234 extending from the top surface 212t through the body 212d of the mounting bracket 212 to the bottom surface 212b. The vacuum hole 234 is aligned with the channel 232 of the vacuum tip 210. The vacuum hole 234 is in fluid communication with a vacuum source (not shown). The vacuum hole 234, the channel 232, and the groove 230 are fluidly connected and form a vacuum path for the vacuum tip assembly 201. The inner diameter of the vacuum hole 234 can be smaller than the outer diameter of the vacuum tip 210. In some embodiments, the inner diameter of the vacuum hole 234 can correspond to the inner diameter of the channel 232 of the vacuum tip 210. The mounting bracket 212 can be formed of a metal, an alloy, a plastic, or a composite material containing one or more of these materials.

[0126] Figure 3A According to some embodiments Figure 2A A perspective view of the vacuum tip 210 is shown. Figure 3B yes Figure 3A The vacuum tip 210 along Figure 3A A stereogram of plane BB shown in FIG. Figure 3A As shown in , the vacuum tip 210 has a cylindrical body 203. The vacuum tip 210 has a plurality of grooves 230 formed in a top surface 210t of the vacuum tip 210. The grooves 230 extend a certain thickness into the body 203 of the vacuum tip 210 and may be connected to a channel 232 located at the center of the vacuum tip 210. The channel 232 extends from a bottom 231 of the groove 230 through the body 203 and is exposed at a bottom surface 210b of the vacuum tip 210. The number of grooves 230 may vary between 3 and 10. However, depending on the surface area of ​​the vacuum tip 210, a greater number of grooves may be envisioned.

[0127] In various embodiments, the grooves 230 are arranged symmetrically with respect to a vertical line extending through the center point or channel 232 of the body 203. The grooves 230 are equally spaced (spaced) around the circumference of the body 203 or vacuum tip 210 so that a substantially equal vacuum force can be provided to the front side of the device die. Figure 3AIn an exemplary embodiment shown in , three grooves 230a, 230b, 230c are provided. In this case, the grooves 230a, 230b, 230c are separated from each other by 120 degrees. The grooves 230a, 230b, 230c may share a common ground. In some embodiments, the bottom of each groove 230a-230c is coplanar. The grooves 230a, 230b, 230c may extend radially outward from the channel 232. The first ends of the grooves 230a, 230b, 230c may merge or connect with each other, or overlap with the channel 232. The second end of each groove 230a-230c (i.e., the far end away from the channel 232) may terminate at or near the periphery of the body 203 or the vacuum tip 210. The grooves 230a, 230b, 230c thus form a closed fluid space. In some embodiments, the second end of each groove 230a - 230c is configured to have a semicircular edge, a square edge, or a polygonal edge.

[0128] The material between the grooves 230 forms a flat contact surface that will contact the surface of the device die and provide the required mechanical support for the die when a vacuum is applied. Therefore, when a vacuum is applied to the vacuum tip 210, the device die is supported and the device die does not deform or warp. The surface area of ​​the vacuum tip 210 that contacts the device die (i.e., the flat contact surface without the grooves 230a, 230b, 230c, or in other words, the top surface 210t of the vacuum tip 210 that will physically contact the device die) is about 30% to about 80% of the total surface area of ​​the top surface 210t (which is calculated in a manner that the grooves 230a-230c are not formed). Compared to a conventional vacuum tip having an annular contact surface, the vacuum tip 210 provides an increased contact surface area for the device die. This percentage may vary depending on the number of grooves formed in the top surface 210t of the vacuum tip 210 and / or the size of the grooves.

[0129] In some embodiments, the vacuum tip 210 may have an outer diameter D1 in the range of about 2 mm to about 12 mm. Each groove 230a-230c may have a width W1 in the range of about 0.1 mm to about 0.6 mm and a length L1 in the range of about 0.5 mm to about 6 mm. The length L1 and the outer diameter D1 may have a ratio (L1:D1) in the range of about 1:2 to about 1:13. The channel 232 may have a diameter D2 in the range of about 0.1 mm to about 0.6 mm (see Figure 3B). The width W1 may be greater than, equal to, or less than the diameter D2. The groove 230 extends into the body 203 of the vacuum tip 210 to a certain thickness. The thickness may have a height H1 measured from the top surface 210t to the bottom of the grooves 230a, 230b, 230c. In some embodiments, the height H1 is in the range of about 0.2 mm to about 2 mm. The channel 232 may have a height H2 measured from the bottom of the grooves 230a, 230b, 230c to the bottom surface 210b of the vacuum tip 210. The vacuum tip 210 may have a height H3 measured from the top surface 210t to the bottom surface 210b of the vacuum tip 210. The height H1 may be greater than or less than the height H2. In an embodiment, the height H1 is less than the height H2 and may have a ratio (H1:H2) in the range of about 1:4 to about 1:40. The height H1 and the height H3 may have a ratio (H1:H3) in the range of about 1:5 to about 1:50.

[0130] The vacuum tip 210 may be formed of any material suitable for contacting the device die. Examples of suitable materials include metals (e.g., aluminum), alloys, plastics, stainless steel, or composite materials containing one or more of these materials, or thermoplastics suitable for contacting the device die, such as polyamide (PA), polyethylene (PE), polyaryletherketone (PEAK), polyetheretherketone (PEEK), thermoplastic polyimide resin (TPI), ceramics, or rubber, etc.

[0131] Figure 4A According to some embodiments Figure 3A Top view of the vacuum tip 210. Figure 4B According to some embodiments Figure 4A Bottom view of the vacuum tip 210 . Figure 4C According to some embodiments Figure 4B A perspective view of the vacuum tip 210 is shown. Figure 4D According to some embodiments Figure 4A 2 is a perspective view of a vacuum tip 210. Although the vacuum tip 210 is shown as a cylindrical shape, any suitable shape is contemplated. For example, the vacuum tip 210 may have a circular, square, or polygonal shape.

[0132] Figure 5A schematic diagram is shown when picking up a device die 102 using a vacuum tip assembly 201 according to some embodiments. It can be seen that the top surface 210t of the vacuum tip 210 contacts the device die 102 during the pick and place operation. After contact is made, a vacuum force (as shown by the arrow) is applied to fix the device die 102 to the vacuum tip 210. Due to the vacuum force provided from the vacuum source 540, the device die 102 remains in contact with the top surface 210t of the vacuum tip 210. The downward vacuum force is applied through the vacuum holes 234, the channels 232, the grooves 230a, 230b, 230c and thus to the top surface 102t of the device die 102. The vacuum force has sufficient strength to firmly hold the device die 102 to the vacuum tip 210. When the device die 102 is to be released from the vacuum tip 210, as shown in FIG. Figure 5 At the stage shown in FIG. , the engagement head (e.g., Figure 1 102 , the bonding head 114 (shown in FIG. 104 ) contacts the bottom surface 102 b of the device die 102, and removes the vacuum force from the vacuum source 540, so that the vacuum tip 210 can be moved away from the device die 102 without further moving the device die 102. The symmetrical arrangement of the grooves 230 a, 230 b, 230 c allows the vacuum tip 210 to provide a uniform vacuum force to the device die 102 during the pick-and-place operation. In particular, the physical support of the device die 102 on the top surface 102 t prevents the device die 102 from deforming or warping when the vacuum is applied. Therefore, the entire device die 102 remains in close contact with the vacuum tip 210 during the movement, and a consistent vacuum force can be maintained between the vacuum tip 210 and the device die 102. In addition, because the entire device die 102 remains substantially flat before and during attachment to the bonding head, scratches are not caused to the edges of the bonding head and the edges of the vacuum tip 210, thereby not leaving crack particles or defects at the edge of the die. As a result, uniform process structures can be seen across the die, and yield issues observed with traditional vacuum tips are reduced or eliminated.

[0133] If the pick-and-place operation involves larger device dies, a vacuum tip with greater suction force may be required. Fig. 6A is a top view of a vacuum tip 640 according to some alternative embodiments. Figure 6B According to some embodiments Fig. 6A A perspective view of a vacuum tip 610 of FIG. 610 can be used to replace a vacuum tip, such as Figure 110. The vacuum tip 110 of the flipper 104 shown in . In this embodiment, the vacuum tip 610 is configured to have an outer ring body 640, an inner ring body 641 disposed inside the outer ring body 640 or radially disposed inside the outer ring body 640, and a plurality of support members 642 disposed or radially extending between the outer ring body 640 and the inner ring body 641 and in contact with the outer ring body 640 and the inner ring body 641. The outer ring body 640 is coaxial with the inner ring body 641. The outer ring body 640 and the inner ring body 641 both have a top surface and a bottom surface opposite to the top surface. The top surfaces of the outer ring body 640 and the inner ring body 641 are coplanar and are used to contact the device die. The bottom surface of the outer ring body 640 is coupled to a mounting bracket (not shown), for example Figure 2A and Figure 2B The mounting bracket 212 shown in FIG. In some embodiments, the bottom surfaces of the outer ring body 640 and the inner ring body 641 may not be coplanar. For example, the bottom surface of the inner ring body 641 may be higher than the bottom surface of the outer ring body 640.

[0134] The support member 642 is in the shape of a three-pointed star, defined by a first support member 642a, a second support member 642b, and a third support member 642c extending outward from the inner ring body 641. In some embodiments, each of the first support member 642a, the second support member 642b, and the third support member 642c tapers distally and outwardly. Alternatively, each of the first support member 642a, the second support member 642b, and the third support member 642c tapers distally and inwardly. The first support member 642a, the second support member 642b, and the third support member 642c (collectively referred to as support members 642) are equally spaced (spaced) around the circumference of the vacuum tip 610. The outer ring body 640, the inner ring body 641, and the support member 642 are coplanar. The top surfaces of the outer ring body 640, the inner ring body 641, and the support member 642 will contact the device die. The area within the inner ring 641 forms a vacuum port 643, and the area defined by the outer ring 640, the inner ring 641, and the support member 642 forms a plurality of vacuum ports 645 of the vacuum tip 610. During the pick-and-place operation, the vacuum ports 643 and 645 are both in contact with the vacuum ports (e.g., Figure 2BThe vacuum hole 234 of the mounting bracket 212 in the outer ring body 640 is fluidically connected to provide a vacuum force to the device die. The size of the vacuum hole 234 can vary according to the size of the outer ring body 640. In most cases, the vacuum hole 234 can correspond to at least the inner diameter of the outer ring body 640 to provide an appropriate vacuum force to the device die. Since the support members 642 are symmetrically arranged in the outer ring body 640, a substantially equal vacuum force can be provided to the device die. Compared with the vacuum tip 210, the vacuum tip 610 can provide greater suction due to the increased surface area of ​​the vacuum ports 643 and 645. The presence of the support member 642 and the inner ring body 641 also allows the vacuum tip 610 to pick up the device die with the minimum support required without deforming the device die.

[0135] In some embodiments, the vacuum tip 610 may have an outer diameter D3 in the range of about 2 mm to about 12 mm and a height H4 in the range of about 1 mm to about 10 mm. Each support member 642 may have a length L2 in the range of about 0.5 mm to about 6 mm. The inner ring body 641 may have an inner diameter D4 in the range of about 0.1 mm to about 0.6 mm (see Figure 6B ). The outer ring body 640 may have a width W2 in the range of about 0.05 mm to about 0.3 mm. Each support member 642 is tapered, and the opposing sidewalls of the support member 642 define a taper angle (acute angle) β. The taper angle β may be in the range of about 15 degrees to about 30 degrees. The larger the taper angle β, the greater the total surface area available for supporting the device die. Therefore, the taper angle β can be varied to increase or decrease the total surface area provided by the support member 642.

[0136] Fig. 7A is a top view of a vacuum tip 710 according to some alternative embodiments. Figure 7B According to some embodiments Fig. 7A 710. The vacuum tip 710 can be used to replace the vacuum tip, such as Figure 1 The vacuum tip 110 of the inverter 104 is shown in FIG. The vacuum tip 710 is similar to Fig. 6A 610, except that the inner ring body 641 is omitted. In this embodiment, the first support member 742a, the second support member 742b, and the third support member 742c (collectively referred to as the support members 742) can have a first end 742-1 and a second end 742-2, respectively. The first end of each of the first support member 742a, the second support member 742b, and the third support member 742c is bridged to define a vacuum port 743. The second end of each of the first support member 742a, the second support member 742b, and the third support member 742c is connected to the outer ring body 740. Similarly, the area defined by the outer ring body 740 and the support member 742 forms a plurality of vacuum ports 745.

[0137] During the pick and place operation, vacuum port 743 and vacuum port 745 are both in contact with a vacuum port (e.g., Figure 2B 745) to provide a vacuum force to the device die. Compared to vacuum tip 210, vacuum tip 710 can provide greater suction force due to the increased surface area of ​​vacuum ports 743, 745. The presence of support member 742 also allows vacuum tip 710 to pick up the device die with minimal support required without deforming the device die.

[0138] Fig. 8A is a top view of a vacuum tip 810 according to some alternative embodiments. Figure 8B According to some embodiments Fig. 8A A perspective view of a vacuum tip 810 of FIG. The vacuum tip 810 can be used to replace a vacuum tip, such as Figure 1 104 of the invertor 104 shown in FIG. The vacuum tip 810 is similar to the vacuum tip 710, except that the three-pointed star-shaped support member 842 within the outer ring body 840 is solidly formed, wherein no vacuum port is provided at the center of the vacuum tip 810. The area defined between the outer ring body 840 and the support members 842a, 842b, 842c forms a plurality of vacuum ports 845 of the vacuum tip 810. During the pick-and-place operation, the vacuum port 843 is in contact with the vacuum port (e.g., Figure 2B The vacuum hole 234 of the mounting bracket 212 is fluidly connected to provide vacuum force to the device die.

[0139] Figures 9 to 12 Shown are top views of vacuum tips according to various alternative embodiments. Figures 9 to 12 The embodiment shown in is similar to FIG. 6A to FIG. 8A Embodiments, except that the support members and / or vacuum ports are arranged in a different pattern. Figures 9 to 12 The vacuum tip shown in FIG. 2 may be made of the same materials as the vacuum tip 210 described above. Fig. 9 In the embodiment, the vacuum tip 910 in principle includes an outer ring 940 and a cross-shaped support member 942 disposed inside the outer ring 940. The top surfaces of the outer ring 940 and the cross-shaped support member 942 provide contact surfaces for the device die. The bottom surface of the outer ring 940 is coupled to a mounting bracket (not shown), such as Figure 2A and Figure 2B The mounting bracket 212 shown in FIG. A plurality of vacuum ports 945a, 945b, 945c, 945d are formed in the area defined between the outer ring body 940 and the cross-shaped support member 942. The vacuum ports 945a-945d extend through the body of the vacuum tip 910 and are connected to the vacuum ports (e.g., Figure 2BThe vacuum ports 945a-945d are symmetrically arranged relative to the cross-shaped support member 942 to provide uniform vacuum force to the device die during the pick-and-place operation without deforming the device die.

[0140] Fig.10 An embodiment similar to Fig. 9 The vacuum tip 910 of the embodiment of the present invention is provided with a central vacuum port 1043 in addition to the center of the cross-shaped support member 1042 of the vacuum tip 1010. A plurality of vacuum ports 1045a, 1045b, 1045c, and 1045d are formed in the area defined between the outer ring body 1040 and the cross-shaped support member 1042. The vacuum port 1043 and the vacuum ports 1045a-1045d extend through the main body of the vacuum tip 1010 and are connected to the vacuum ports (e.g., Figure 2B The vacuum ports 1045a-1045d are symmetrically arranged relative to the cross-shaped support member 1042 to provide uniform vacuum force to the device die during the pick-and-place operation without deforming the device die.

[0141] exist Fig.11 In principle, the vacuum tip 1110 includes an outer ring body 1140 and an inner ring body 1141 disposed inside the outer ring body 1140. The outer ring body 1140 and the inner ring body 1141 are coaxially disposed. Support members 1142a, 1142b, 1142c, 1142d (collectively referred to as support members 1142) are equidistantly distributed between the outer ring body 1140 and the inner ring body 1141 around the circumference of the vacuum tip 1110. The area within the inner ring body 1141 forms a vacuum port 1143, and the area defined by the outer ring body 1140, the inner ring body 1141, and the support member 1142 forms a plurality of vacuum ports 1145a, 1145b, 1145c, 1145d of the vacuum tip 1110. Vacuum port 1143 and vacuum ports 1145a-1145d extend through the body of vacuum tip 1110 and are in contact with vacuum ports (e.g., Figure 2B The vacuum ports 1145a-1145d are symmetrically arranged to provide uniform vacuum force to the device die during a pick and place operation without deforming the device die.

[0142] exist Fig.12, the vacuum tip 1210 in principle includes a body 1201 and a plurality of vacuum holes extending through the body 1201 of the vacuum tip 1210. In an exemplary embodiment, four vacuum holes 1250a, 1250b, 1250c, 1250d (collectively referred to as vacuum holes 1250) are provided. The vacuum holes 1250 are arranged in a manner similar to shirt buttons. Although four vacuum holes 1250a-1250d are shown, more or fewer vacuum holes may be used as long as a symmetrical arrangement is maintained. Likewise, the vacuum holes 1250 are symmetrically spaced from the vacuum ports (e.g., Figure 2B The vacuum holes 1250 are fluidly connected to the vacuum holes 234 of the mounting bracket 212 in the vacuum tip 1210. The vacuum holes 1250 are symmetrically arranged to provide a uniform vacuum force to the device die during the pick and place operation. The material between the vacuum holes 1250 forms a flat contact surface, which will contact the surface of the device die and provide the required mechanical support for the die when the vacuum is applied. Therefore, when the vacuum is applied to the vacuum tip 1210, the device die is supported and the device die does not deform or warp.

[0143] Embodiments of the present disclosure provide a die pick-and-place tool with an improved vacuum tip that can perform attachment and detachment of integrated circuit dies without deforming the die. The novel die pick-and-place tool can be used with a process that uses a vacuum tool to pick and place the die, for example, for transporting the die between workstations. In some embodiments, the vacuum tip has a plurality of grooves formed in the top surface of the vacuum tip. The grooves are symmetrically arranged and fluidly connected to a vacuum channel extending through the body of the vacuum tip. The grooves and the vacuum channel are in fluid communication with a vacuum source. The material between the grooves forms a flat contact surface that will contact the surface of the die and provide the required mechanical support for the die when a vacuum is applied. Therefore, when a vacuum is applied to the vacuum tip, the die is supported and the die does not deform or warp. In addition, since the entire die remains substantially flat before and during attachment to the bonding head, scratches are not caused to the edges of the bonding head and the edges of the vacuum tip, thereby leaving crack particles or defects at the edges of the die. Therefore, a uniform process structure can be seen across the entire die, and yield issues observed using conventional vacuum tips are reduced or eliminated.

[0144] Some embodiments relate to a vacuum tip for transporting integrated circuit dies. The vacuum tip includes a body having a top surface and a bottom surface, and a plurality of grooves formed in the top surface and into the body, wherein the grooves extend radially outward from a center point of the body. The vacuum tip also includes a channel in the body, wherein the channel extends from the bottom of the groove through the body to the bottom surface of the body, and the channel and the body are substantially coaxial.

[0145] In some embodiments, each of the grooves has a first end and a second end, the first end being connected to the channel at a central point and the second end terminating at or near the periphery of the body. In some embodiments, the second end of each of the grooves has a semicircular edge, a square edge, or a polygonal edge. In some embodiments, the grooves are equally spaced around the circumference of the body. In some embodiments, each of the grooves has a first height and the channel has a second height, the second height being greater than the first height. In some embodiments, the body is made of metal, alloy, plastic, rubber, stainless steel, ceramic, or a composite material. In some embodiments, the vacuum tip further includes a mounting bracket coupled to the bottom surface of the body, wherein the mounting bracket has a vacuum port extending through the mounting bracket and in fluid communication with the channel.

[0146] Other embodiments relate to a vacuum tip for transporting integrated circuit dies. The vacuum tip includes an outer ring body and an inner ring body radially disposed inside the outer ring body, wherein the outer ring body is coaxial with the inner ring body. The vacuum tip also includes a plurality of support members extending radially between the outer ring body and the inner ring body and contacting the outer ring body and the inner ring body, wherein an area inside the inner ring body forms a first vacuum port, and a plurality of areas defined by the outer ring body, the inner ring body, and the support members form a plurality of second vacuum ports.

[0147] In some embodiments, the top surfaces of the outer ring body, the inner ring body, and the support member are coplanar. In some embodiments, the vacuum tip further comprises a mounting bracket coupled to the bottom surface of the outer ring body, wherein the mounting bracket has a vacuum hole extending through the mounting bracket and in fluid communication with the first vacuum port and the second vacuum port. In some embodiments, each of the support members tapers distally and outwardly. In some embodiments, each of the support members has relative side walls defining a cone angle in the range of about 15 degrees to about 30 degrees. In some embodiments, the support members are equidistantly distributed around the circumference of the outer ring body. In some embodiments, the number of the support members is 3. In some embodiments, the outer ring body, the inner ring body, and the support member are made of metal, alloy, plastic, rubber, stainless steel, ceramic, or a composite material.

[0148] Other embodiments relate to a pick and place tool. The pick and place tool includes a flipper and a vacuum head, the vacuum head being operable to pick up an object from the flipper. The flipper includes a vacuum tip, operable to pick up an object, wherein the vacuum tip includes a body having a top surface and a bottom surface, and a plurality of grooves formed in the top surface and entering the body, wherein the grooves extend radially outward from a center point of the body. The vacuum tip also includes a channel formed in the body and extending from the bottom of the groove through the body to the bottom surface of the body. The flipper also includes an arm coupled to the vacuum tip and operable to move back and forth between a first position and a second position. The pick and place tool also includes a vacuum head, operable to pick up an object from the flipper and move the object between a third position and a fourth position.

[0149] In some embodiments, the pick and place tool further comprises a mounting bracket coupled to the vacuum tip, wherein the mounting bracket has a vacuum hole aligned with and fluidically connected to the channel of the vacuum tip. In some embodiments, the grooves are symmetrical with respect to a vertical line extending through a center point of the body. In some embodiments, each of the grooves has a first end and a second end, the first end being connected to the channel at the center point and the second end terminating at or near the periphery of the body. In some embodiments, the body is cylindrical.

[0150] The features of many embodiments are summarized above so that those skilled in the art to which the present disclosure belongs can better understand the various embodiments of the present disclosure. Those skilled in the art to which the present disclosure belongs should understand that other processes and structures can be easily designed or changed based on the embodiments of the present disclosure to achieve the same purpose and / or achieve the same advantages as the embodiments introduced herein. Those skilled in the art to which the present disclosure belongs should also understand that these equivalent structures do not deviate from the spirit and scope of the present disclosure. Various changes, substitutions and modifications may be made to the embodiments of the present disclosure without departing from the spirit and scope of the appended claims.

Claims

1. A vacuum tip for transporting integrated circuit dies, characterized in that: The vacuum tip includes: a main body having a top surface and a bottom surface; a plurality of grooves formed in the top surface and into the body, the plurality of grooves extending radially outward from a center point of the body; and A channel is disposed in the main body and extends from a bottom of the plurality of grooves through the main body to the bottom surface of the main body, and the channel and the main body are substantially coaxial.

2. The vacuum tip of claim 1, wherein each of the plurality of grooves has a first end and a second end, the first end connected to the channel at the center point and the second end terminating at or near a periphery of the body.

3. The vacuum tip of claim 1, wherein a plurality of said grooves are equally spaced around a circumference of said body.

4. A vacuum tip for transporting integrated circuit dies, characterized in that: The vacuum tip includes: an outer ring; an inner ring body, radially disposed inside the outer ring body, the outer ring body being coaxial with the inner ring body; and A plurality of support members radially extending between the outer ring body and the inner ring body and contacting the outer ring body and the inner ring body, A region within the inner ring body forms a first vacuum port, and a plurality of regions defined by the outer ring body, the inner ring body and a plurality of the supporting components form a plurality of second vacuum ports.

5. The vacuum tip of claim 4, wherein top surfaces of the outer ring, the inner ring, and the plurality of support members are coplanar.

6. The vacuum tip of claim 4, further comprising: A mounting bracket is coupled to a bottom surface of the outer ring body, wherein the mounting bracket has a vacuum hole extending through the mounting bracket and in fluid communication with the first vacuum port and the plurality of second vacuum ports.

7. The vacuum tip of claim 4, wherein each of the plurality of support members tapers distally and outwardly, and each of the plurality of support members has opposing sidewalls defining a taper angle in a range of 15 degrees to 30 degrees.

8. A pick-and-place tool, characterized in that: The pick and place tool includes: A flipper, comprising: A vacuum tip operable to pick up an object, the vacuum tip comprising: a main body having a top surface and a bottom surface; a plurality of grooves formed in the top surface and into the body, the plurality of grooves extending radially outward from a center point of the body; and a channel formed in the body and extending from a bottom of the plurality of recesses through the body to the bottom surface of the body; and an arm coupled to the vacuum tip and operable to move back and forth between a first position and a second position; and A vacuum head is operable to pick up the object from the inverter and move the object between a third position and a fourth position.

9. The pick-and-place tool of claim 8, further comprising: A mounting bracket is coupled to the vacuum tip, wherein the mounting bracket has a vacuum hole aligned with and fluidly connected to the channel of the vacuum tip.

10. The pick and place tool of claim 8, wherein a plurality of said grooves are symmetrical with respect to a vertical line extending through the center point of said body.

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