Semiconductor wafer fixing and processing device convenient to replace

Abstract

The utility model discloses a semiconductor wafer fixing and processing device convenient to replace, which comprises a die bonder main body, a driving mechanism is fixedly connected in the die bonder main body, a mechanical arm is arranged at the top of the driving mechanism, an air cylinder is fixedly arranged at the other end of the mechanical arm, a buffer part is arranged at the bottom of the air cylinder, and the buffer part is fixedly connected with the die bonder main body. And a material taking head is fixedly mounted at the bottom of the buffering part. According to the utility model, the mechanical arm is started to drive the wafer on the material taking head to be placed at the designated position of the welding plate for welding, the operation is repeated, the wafer is contacted, buffered and protected through the buffer part during material taking, and the horizontal driving rail is started to adjust the position of the movable carrying disc so as to facilitate material taking of the mechanical arm; meanwhile, after the wafers on the wafers are taken out, the adsorption mechanism is closed, and the wafers are reversely blown to be lifted, so that the wafers can be conveniently taken out from the inner part of the placing groove, and the device has the advantages that the wafers can be conveniently taken out, the operation is more flexible and convenient, and the wafers are not easy to damage.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor wafer production, and more specifically to a semiconductor wafer fixing and processing device which is easy to replace. Background Art

[0002] Wafer refers to the silicon wafer used to make silicon semiconductor circuits. Its original material is silicon. High-purity polycrystalline silicon is dissolved and doped with silicon crystal seeds, and then slowly pulled out to form cylindrical single crystal silicon. After grinding, polishing and slicing, the silicon crystal rod forms a silicon wafer, that is, a wafer. The main function of the wafer is to be processed into various circuit components.

[0003] Among them, the crystal bonding machine is mainly used for the lead cabinet frame pressing plate of various gold wire ultrasonic welding equipment, as well as various suction nozzles, ejectors, dispensing heads, porcelain nozzles, pass needles, motors, carbon brushes, encoders, transmission belts of various chip mounting equipment, various spare parts of automation equipment, instruments, meters, etc.

[0004] However, during the processing of the crystal solidifying machine in the prior art, the wafer needs to be fixed first. Since the wafer is relatively thin, and the current placement structure generally has a groove, the wafer is placed and fixed in the groove. When the surface wafer is used up and the wafer needs to be taken out and replaced, the removal operation is inconvenient, and since the groove has a depth, the wafer substrate may be damaged when it is taken out, and it is inconvenient to retract and release, which is not conducive to operation. Utility Model Content

[0005] In view of the problems existing in the prior art, the purpose of the utility model is to provide a semiconductor wafer fixing processing device that is easy to replace, has the advantages of being easy to take out the wafer, being more flexible and convenient to operate, and not easily damaging the wafer.

[0006] In order to solve the background technical problems, the utility model adopts the following technical solutions.

[0007] A semiconductor wafer fixing processing device that is easy to replace, includes a crystal solidification machine body, a driving mechanism is fixedly connected to the inside of the crystal solidification machine body, a mechanical arm is installed on the top of the driving mechanism, a cylinder is fixedly installed on the other end of the mechanical arm, a buffer part is installed on the bottom of the cylinder, a material picking head is fixedly installed on the bottom of the buffer part, a welding station is installed on the right side of the top of the crystal solidification machine body, a horizontal driving rail is installed on the left side of the top of the crystal solidification machine body, a movable carrier is movably installed on the horizontal driving rail, a placement groove is opened on the movable carrier, a rubber pad is fixedly connected to the inside of the placement groove, and an adsorption mechanism is installed between the movable carrier and the rubber pad.

[0008] As a further description of the above technical solution: the adsorption mechanism includes an air pump, an inner pipe, multiple groups of adsorption hoses and multiple groups of adsorption plates connected to the adsorption hoses. The air pump is fixedly connected to the interior of the mobile carrier, the input end of the air pump is fixedly connected to the inner pipe, the inner pipe is connected and fixed to the multiple groups of adsorption hoses, the top end of the adsorption hose is fixedly connected to the adsorption plate, and the top end of the adsorption plate extends to the top of the rubber pad and maintains the same plane.

[0009] As a further description of the above technical solution: the outer edge of the rubber pad is provided with empty grooves arranged at equal distances, and the inner edge of the placement groove is fixedly connected with an oblique spring piece that cooperates with the empty groove.

[0010] As a further description of the above technical solution: the buffer part includes a fixed sleeve, a spring and a sliding block, the top of the material taking head is inserted into the interior of the fixed sleeve and fixedly connected to the sliding block, the outer side of the sliding block is slidably connected to the interior of the fixed sleeve, and the top of the sliding block is elastically connected to the interior of the fixed sleeve through the spring.

[0011] As a further description of the above technical solution: the driving mechanism includes a servo motor, a transmission rod and a rotating block. The servo motor is fixedly installed inside the crystal solidification machine body, and the output end of the servo motor is fixedly connected to the transmission rod through a coupling. The top end of the transmission rod is inserted into the top of the crystal solidification machine body and fixedly connected to the rotating block. The bottom of the rotating block is rotatably connected to the raised portion of the crystal solidification machine body, and the outer side of the rotating block is fixedly connected to the robotic arm.

[0012] As a further description of the above technical solution: the outer sides of the placement grooves are provided with movable grooves arranged at equal distances, and the inclined spring pieces are located inside the movable grooves.

[0013] Compared with the prior art, the advantages of the present invention are:

[0014] This solution uses the buffer part to achieve buffering when taking and placing materials to protect the wafers, and uses the adsorption mechanism in conjunction with the inclined spring sheet to achieve efficient and convenient wafer removal, thereby achieving the advantages of the device being convenient for wafer removal, more flexible and convenient operation, and not prone to damage to the wafers. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 It is a front view cross-sectional structural schematic diagram of the utility model;

[0016] Figure 2 for Figure 1 A schematic diagram of the enlarged structure of the middle part A;

[0017] Figure 3 It is a schematic diagram of a partial top view cross-sectional structure of the utility model;

[0018] Figure 4 It is a partial three-dimensional structural schematic diagram of the utility model.

[0019] Description of the numbers in the figure:

[0020] 1. Crystal solidification machine body; 2. Driving mechanism; 21. Servo motor; 22. Transmission rod; 23. Rotating block; 3. Mechanical arm; 4. Cylinder; 5. Buffer; 51. Fixed sleeve; 52. Spring; 53. Sliding block; 6. Material pick-up head; 7. Welding station; 8. Horizontal driving rail; 9. Moving carrier; 10. Placement slot; 101. Oblique spring piece; 102. Movable slot; 11. Rubber pad; 111. Empty slot; 12. Adsorption mechanism; 121. Air pump; 122. Inner pipe; 123. Adsorption hose; 124. Adsorption plate. DETAILED DESCRIPTION

[0021] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the accompanying drawings in the embodiments of the present invention.

[0022] See also Figures 1 to 4 In the utility model, a semiconductor wafer fixing processing device which is easy to replace includes a crystal solidification machine body 1, a driving mechanism 2 is fixedly connected inside the crystal solidification machine body 1, a mechanical arm 3 is installed on the top of the driving mechanism 2, a cylinder 4 is fixedly installed on the other end of the mechanical arm 3, a buffer part 5 is installed at the bottom of the cylinder 4, a material taking head 6 is fixedly installed at the bottom of the buffer part 5, a welding station 7 is installed on the right side of the top of the crystal solidification machine body 1, a horizontal driving rail 8 is installed on the left side of the top of the crystal solidification machine body 1, a movable carrier 9 is movably installed on the horizontal driving rail 8, a placement groove 10 is opened on the movable carrier 9, a rubber pad 11 is fixedly connected inside the placement groove 10, and an adsorption mechanism 12 is installed between the movable carrier 9 and the rubber pad 11.

[0023] In the utility model, the crystal solidification machine body 1 is used as the device body. When in use, the wafer is first placed inside the placement groove 10, and then the adsorption mechanism 12 is started to adsorb the wafer and make it contact with the rubber pad 11 to achieve wafer positioning, so that the wafer is fixed on the movable carrier 9, and then the driving mechanism 2 is started to drive the mechanical arm 3 to rotate above the wafer, and then the mechanical arm 3 is started to drive the material picking head 6 on the buffer part 5 to pick up the wafer on the wafer, and then the driving mechanism 2 is started to drive the mechanical arm 3 to rotate to the welding station 7, and a welding plate is placed on it, and then the mechanical arm 3 is started to drive the wafer on the material picking head 6 to be placed at a designated position of the welding plate for welding, and the operation is repeated in this way, and the buffer part 5 is used to realize contact buffering and protection of the wafer during material picking. , and by starting the horizontal drive rail 8 to adjust the position of the mobile carrier 9, it is convenient for the robot arm 3 to pick up the material. At the same time, after the wafers on the wafer are taken out, the adsorption mechanism 12 is closed and the wafer is blown back to make it rise, so that it is convenient to take out the wafer from the inside of the placement groove 10, thereby realizing that the device has the advantages of convenient wafer removal, more flexible and convenient operation, and not easy to damage the wafer, which solves the problem of the need to fix the wafer first in the prior art. Since the wafer is thin, and the current placement structure generally has a groove, the wafer is placed in the groove and fixed. When the surface wafer is used up and the wafer needs to be taken out and replaced, the removal operation is inconvenient, and because the groove has a depth, the removal may cause damage to the wafer substrate, and the storage and release are inconvenient, which is not conducive to operation.

[0024] See also Figure 1 and Figure 2 , wherein: the adsorption mechanism 12 includes an air pump 121, an inner pipe 122, a plurality of adsorption hoses 123, and a plurality of adsorption plates 124 connected and matched with the adsorption hoses 123, the air pump 121 is fixedly connected to the inside of the mobile carrier 9, the input end of the air pump 121 is fixedly connected to the inner pipe 122, the inner pipe 122 is connected and fixed to the plurality of adsorption hoses 123, the top end of the adsorption hose 123 is fixedly connected to the adsorption plate 124, and the top end of the adsorption plate 124 extends to the top of the rubber pad 11 and maintains the same plane.

[0025] In the utility model, the air pump 121 is started to adsorb the inside of the inner pipe 122 to form a negative pressure, and then the bottom of the wafer is adsorbed at multiple points through the adsorption hose 123 and multiple groups of adsorption plates 124 to achieve fixed and stable placement, and when it needs to be taken out, the wafer is backblown for easy removal.

[0026] See also Figure 2 and Figure 4 , wherein: the outer edge of the rubber pad 11 is provided with equidistantly arranged empty grooves 111 , and the inner edge of the placement groove 10 is fixedly connected with an oblique spring piece 101 that cooperates with the empty groove 111 .

[0027] In the utility model, the hollow groove 111 cooperates with the inclined spring piece 101 so that the outer edge of the wafer always contacts and squeezes the inclined spring piece 101. When the adsorption plate 124 ends its adsorption force on the wafer, the inclined spring piece 101 will lift the wafer to separate it from the rubber pad 11, and then back-blow through the adsorption plate 124 to achieve efficient removal of the wafer.

[0028] See also Figure 1 , wherein: the buffer part 5 includes a fixed sleeve 51, a spring 52 and a sliding block 53, the top of the material taking head 6 is inserted into the interior of the fixed sleeve 51 and fixedly connected to the sliding block 53, the outer side of the sliding block 53 is slidably connected to the interior of the fixed sleeve 51, and the top of the sliding block 53 is elastically connected to the interior of the fixed sleeve 51 through the spring 52

[0029] In the present invention, when the material taking head 6 contacts the wafer, the force is reversely pressed against the sliding block 53 to compress the spring 52 inside the fixing sleeve 51 to achieve buffering, thereby protecting the wafer from damage due to excessive force.

[0030] See also Figure 1 , wherein: the driving mechanism 2 includes a servo motor 21, a transmission rod 22 and a rotating block 23, the servo motor 21 is fixedly installed inside the crystal bonding machine body 1, the output end of the servo motor 21 is fixedly connected to the transmission rod 22 through a coupling, the top end of the transmission rod 22 is plugged into the top of the crystal bonding machine body 1 and is fixedly connected to the rotating block 23, the bottom of the rotating block 23 is rotatably connected to the raised portion of the crystal bonding machine body 1, and the outer side of the rotating block 23 is fixedly connected to the mechanical arm 3

[0031] In the utility model, the servo motor 21 is started to drive the transmission rod 22 to rotate, so as to drive the rotating block 23 to rotate a fixed angle, so as to drive the mechanical arm 3 to reciprocate and change the angle, and realize the back and forth switching between continuous material taking and welding material discharge.

[0032] See also Figure 2 , wherein: the outer side of the placement groove 10 is provided with movable grooves 102 arranged at equal distances, and the inclined spring piece 101 is located inside the movable groove 102 .

[0033] In the utility model, the movement of the inclined spring piece 101 is not restricted by the movable groove 102, and the structure is more reasonable.

[0034] The above is only a preferred specific implementation of the utility model; however, the protection scope of the utility model is not limited thereto. Any technician familiar with the technical field can make equivalent replacements or changes according to the technical solution and improved ideas of the utility model within the technical scope disclosed by the utility model, which should be included in the protection scope of the utility model.

Claims

1. A semiconductor wafer fixing processing device that is easy to replace, comprising a wafer fixing machine body (1), characterized in that: The interior of the crystal solidification machine body (1) is fixedly connected to a driving mechanism (2); a mechanical arm (3) is installed on the top of the driving mechanism (2); a cylinder (4) is fixedly installed on the other end of the mechanical arm (3); a buffer portion (5) is installed on the bottom of the cylinder (4); a material taking head (6) is fixedly installed on the bottom of the buffer portion (5); a welding station (7) is installed on the right side of the top of the crystal solidification machine body (1); a horizontal driving rail (8) is installed on the left side of the top of the crystal solidification machine body (1); a movable carrier (9) is movably installed on the horizontal driving rail (8); a placement groove (10) is provided on the movable carrier (9); a rubber pad (11) is fixedly connected to the interior of the placement groove (10); an adsorption mechanism (12) is installed between the movable carrier (9) and the rubber pad (11).

2. The semiconductor wafer fixing processing device that is easy to replace according to claim 1 is characterized in that: The adsorption mechanism (12) comprises an air pump (121), an inner pipe (122), a plurality of groups of adsorption hoses (123), and a plurality of groups of adsorption plates (124) connected and matched with the adsorption hoses (123); the air pump (121) is fixedly connected to the interior of the movable carrier (9); the input end of the air pump (121) is fixedly connected to the inner pipe (122); the inner pipe (122) is connected and fixed to the plurality of groups of adsorption hoses (123); the top end of the adsorption hose (123) is fixedly connected to the adsorption plate (124); the top end of the adsorption plate (124) extends to the top of the rubber pad (11) and maintains the same plane.

3. The semiconductor wafer fixing processing device that is easy to replace according to claim 1 is characterized in that: The outer edge of the rubber pad (11) is provided with empty grooves (111) arranged at equal distances, and the inner edge of the placement groove (10) is fixedly connected with an inclined spring piece (101) that matches the empty grooves (111).

4. The semiconductor wafer fixing processing device that is easy to replace according to claim 1 is characterized in that: The buffer portion (5) comprises a fixed sleeve (51), a spring (52) and a sliding block (53); the top end of the material taking head (6) is inserted into the interior of the fixed sleeve (51) and fixedly connected to the sliding block (53); the outer side of the sliding block (53) is slidably connected to the interior of the fixed sleeve (51); and the top of the sliding block (53) is elastically connected to the interior of the fixed sleeve (51) via the spring (52).

5. The semiconductor wafer fixing processing device that is easy to replace according to claim 1 is characterized in that: The driving mechanism (2) comprises a servo motor (21), a transmission rod (22) and a rotating block (23); the servo motor (21) is fixedly installed inside the crystal bonding machine body (1); the output end of the servo motor (21) is fixedly connected to the transmission rod (22) via a coupling; the top end of the transmission rod (22) is plugged into the top of the crystal bonding machine body (1) and fixedly connected to the rotating block (23); the bottom of the rotating block (23) is rotatably connected to the raised portion of the crystal bonding machine body (1); and the outer side of the rotating block (23) is fixedly connected to the mechanical arm (3).

6. The semiconductor wafer fixing processing device that is easy to replace according to claim 3 is characterized in that: The outer sides of the placement grooves (10) are provided with movable grooves (102) arranged at equal distances, and the inclined elastic sheets (101) are located inside the movable grooves (102).

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