Technological frame structure capable of effectively releasing dam stress

Abstract

The utility model discloses a process frame structure capable of effectively releasing dam stress, which is positioned on a ceramic substrate and comprises a ceramic frame body and a metal dam, the surface of the ceramic substrate is provided with an effective area, and the ceramic frame body is the outer periphery of the ceramic substrate; the metal box dam is formed on the surface of the ceramic frame body and located on the periphery of the effective area. A plurality of stress release notches are formed in the side edge of the metal box dam, and each stress release notch penetrates from the surface of the metal box dam to the surface of the ceramic frame body. The plurality of stress release notches are formed in the side edge of the metal box dam, stress release can be carried out by utilizing the plurality of stress release notches, the pulling effect of stress on the surface of the ceramic substrate is reduced, and the phenomenon that the whole ceramic substrate is easy to warp is avoided, so that subsequent product processing is ensured, meanwhile, the copper laying area of a frame can be reduced, and the production cost is reduced. Therefore, the electroplating uniformity of the effective area is enhanced, and the product quality is greatly improved.

Description

Technical Field

[0001] The utility model relates to the field of ceramic substrate technology, in particular to a process frame structure which can effectively release the stress of the surrounding dam. Background Art

[0002] Based on the thin film circuit process, the ceramic surface is metallized by magnetron sputtering, and the copper layer thickness is greater than 10 microns by electroplating. That is DPC (Direct Plate Copper). The thin film method is the main method for metal film deposition in microelectronics manufacturing, among which direct copper plating is the most representative. Direct copper plating (DPC) mainly uses surface deposition processes such as evaporation and magnetron sputtering to metallize the substrate surface. First, titanium is sputtered under vacuum conditions, then copper particles, and finally electroplating thickening. Then the circuit is completed by ordinary PCB process, and finally the thickness of the circuit is increased by electroplating / chemical plating deposition. The preparation method of DPC includes vacuum coating, wet coating, exposure and development, etching and other process links, so the price of its products is relatively high. The DPC process is suitable for most ceramic substrates.

[0003] In order to facilitate chip packaging, a metal dam is usually formed on the surface periphery of the ceramic substrate through multiple thickening electroplating. In the prior art, the inner and outer edges of the metal dam are flat structures, lacking a stress release structure. Since the DPC ceramic dam board process frame is thickened by more than 100μm as a whole, the stress after the block copper electroplating is relatively large, causing the ceramic substrate as a whole to be prone to warping. Since the ceramic substrate is fragile, the warping is not conducive to the processing of subsequent products. Therefore, it is necessary to study a solution to solve the above problems. Utility Model Content

[0004] In view of this, the present invention aims to address the deficiencies in the prior art, and its main purpose is to provide a process frame structure that can effectively release dam stress, which can effectively solve the problem that ceramic substrates are prone to warping after electroplating, resulting in subsequent inability to produce.

[0005] In order to achieve the above purpose, the utility model adopts the following technical solutions:

[0006] A process frame structure capable of effectively releasing dam stress is located on a ceramic substrate and comprises a ceramic frame body and a metal dam; an effective area is provided on the surface of the ceramic substrate, and the ceramic frame body is the outer periphery of the ceramic substrate; the metal dam is formed on the surface of the ceramic frame body and is located at the periphery of the effective area; a plurality of stress release notches are formed on the side edge of the metal dam, each stress release notch penetrates from the surface of the metal dam to the surface of the ceramic frame body, and the plurality of stress release notches are arranged at intervals along the length of the metal dam.

[0007] As a preferred solution, the multiple stress release notches are all located at the inner edge of the metal dam, so that the stress release notches are not exposed to avoid affecting the appearance of the product.

[0008] As a preferred solution, the stress release notch is rectangular and extends along the width of the metal dam, and the length of the stress release notch is greater than half the width of the metal dam to better release stress.

[0009] As a preferred solution, the ceramic frame body is square, which is formed by four side edges connected end to end. The metal dam is composed of four dam bodies, which are respectively formed on the surfaces of the four side edges. The connection between two adjacent dam bodies is disconnected, and each dam body is formed with multiple stress release grooves for stress release.

[0010] As a preferred solution, the metal dam is made of copper-plated material.

[0011] As a preferred solution, the metal dam is provided with alignment points for alignment installation with the outside.

[0012] Compared with the prior art, the utility model has obvious advantages and beneficial effects. Specifically, it can be seen from the above technical solution that:

[0013] By forming a plurality of stress release notches on the side edges of the metal dam, stress can be released by utilizing the plurality of stress release notches, thereby reducing the pulling effect of stress on the surface of the ceramic substrate and preventing the ceramic substrate from being easily warped as a whole, thereby ensuring the processing of subsequent products and reducing the copper plating area of ​​the frame, thereby enhancing the uniformity of electroplating in the effective area and greatly improving the quality of the product.

[0014] In order to more clearly illustrate the structural features and functions of the present invention, the present invention is described in detail below in conjunction with the accompanying drawings and specific embodiments. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 It is a top view of a preferred embodiment of the utility model.

[0016] Description of the accompanying drawings:

[0017] 10. Ceramic substrate 11. Ceramic frame body

[0018] 111, side 12, effective area

[0019] 20. Metal enclosure 21. Dam body

[0020] 201. Stress relief notch 202. Alignment point. DETAILED DESCRIPTION

[0021] Please refer to Figure 1 As shown, it shows the specific structure of a preferred embodiment of the utility model, which is located on a ceramic substrate 10 and includes a ceramic frame body 11 and a metal dam 20.

[0022] The surface of the ceramic substrate 10 has an effective area 12, and the ceramic frame body 11 is the outer periphery of the ceramic substrate 10. The effective area 12 is used to form circuits and package electronic devices. The effective areas 12 are four arranged in an array, but are not limited to this. In addition, the ceramic frame body 11 is square and is formed by four side edges 111 connected end to end.

[0023] The metal dam 20 is formed on the surface of the ceramic frame body 11 and is located at the periphery of the effective area 12; a plurality of stress release notches 201 are formed on the side edge of the metal dam 20, each of which runs from the surface of the metal dam 20 to the surface of the ceramic frame body 11, and the plurality of stress release notches 201 are arranged at intervals along the length of the metal dam 20. In this embodiment, the metal dam 20 is made of copper-plated material. The plurality of stress release notches 201 are all located at the inner edge of the metal dam 20 so that the stress release notches 201 are not exposed to avoid affecting the appearance of the product, while reducing the copper plating area of ​​the frame and enhancing the uniformity of the electroplating of the effective area 12. The stress release notch 201 is rectangular, extending along the width of the metal dam 20, and the length of the stress release notch 201 is greater than half of the width of the metal dam 20, so as to better release stress. The width of the stress release notch 201 is 1 mm, and the distance between two adjacent stress release notches 201 is 9 mm. Furthermore, the metal dam 20 is composed of four sections of dam bodies 21, which are respectively formed on the surfaces of the four side edges 111, and the connection between two adjacent dam bodies 21 is disconnected for stress release, and a plurality of stress release notches 201 are formed on each dam body 21. In addition, the metal dam 20 is provided with alignment points 202 for alignment installation with the outside.

[0024] The production process of this embodiment is described in detail as follows:

[0025] Take a ceramic substrate 10, stick a dam layer film frame on the ceramic frame body 11, design a vertical sawtooth pattern on the dam layer film frame, and then electroplate the metal dam 20. During the electroplating process, multiple stress release notches 201 are formed, and stress cannot be formed continuously, thereby ensuring the flatness of the surface of the ceramic substrate 10.

[0026] The design focus of the utility model is that a plurality of stress release notches are formed on the side edges of the metal dam, and stress can be released by utilizing the plurality of stress release notches, thereby reducing the pulling effect of stress on the plate surface of the ceramic substrate, and preventing the ceramic substrate from being easily warped as a whole, thereby ensuring the processing of subsequent products, and at the same time reducing the copper plating area of ​​the frame, thereby enhancing the uniformity of electroplating in the effective area, and greatly improving the quality of the product.

[0027] The above description is only a preferred embodiment of the present invention and does not limit the technical scope of the present invention. Therefore, any slight modifications, equivalent changes and modifications made to the above embodiments based on the technical essence of the present invention are still within the scope of the technical solution of the present invention.

Claims

1. A process frame structure capable of effectively releasing dam stress, which is located on a ceramic substrate and includes a ceramic frame body and a metal dam; the surface of the ceramic substrate has an effective area, and the ceramic frame body is the outer periphery of the ceramic substrate; the metal dam is formed on the surface of the ceramic frame body and is located at the periphery of the effective area; characterized in that: A plurality of stress release notches are formed on the side edge of the metal dam, each of which penetrates from the surface of the metal dam to the surface of the ceramic frame body, and the plurality of stress release notches are arranged at intervals along the length of the metal dam.

2. The process frame structure capable of effectively releasing dam stress according to claim 1, characterized in that: The plurality of stress release notches are all located at the inner edge of the metal dam.

3. The process frame structure capable of effectively releasing dam stress according to claim 1 is characterized in that: The stress release slot is rectangular and extends along the width of the metal dam, and the length of the stress release slot is greater than half of the width of the metal dam.

4. The process frame structure capable of effectively releasing dam stress according to claim 1 is characterized in that: The ceramic frame body is square, formed by four sides connected end to end. The metal dam consists of four dam bodies, which are respectively formed on the surfaces of the four sides. The connection between two adjacent dam bodies is disconnected, and each dam body is formed with multiple stress release grooves.

5. The process frame structure capable of effectively releasing dam stress according to claim 1, characterized in that: The metal dam is made of copper-plated material.

6. The process frame structure capable of effectively releasing dam stress according to claim 1, characterized in that: The metal dam is provided with a counterpoint.

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