Electronic component

Abstract

An electronic assembly includes a first housing portion having one or more recesses along at least a portion of a perimeter of the first housing portion. The second housing portion has one or more arms extending from a body of the second housing portion to engage the recess in a snap-in connection. A cavity is formed between the first housing portion and the second portion. The circuit board is located in the cavity; the circuit board has a conductive trace facing the first housing portion at a metallic conductive region, with a snap connection forming an electrical and mechanical connection between the conductive trace and the metallic conductive region.

Description

[0001] Related Applications

[0002] This application claims priority to U.S. Provisional Application No. 63 / 510,256, filed on June 26, 2023, which is hereby incorporated by reference into this document. Technical Field

[0003] The present disclosure relates to an electronic assembly having a compression-type electrical connection between a circuit board and a housing. Background Art

[0004] In some prior art electronic housings, a reliable electrical connection is required between a circuit board and a housing. In one example, a conductive fastener (such as a bolt or screw) forms a mechanical and electrical connection between an annular metal pad around a hole (e.g., a metal-plated through hole) in a circuit board and a metal housing portion. However, variations in manufacturing tolerances may make the circuit board susceptible to mechanical stress and cracks around the conductive fastener. In another example, a conductive spring forms a mechanical and electrical connection between a metal pad on a circuit board and a metal housing portion. However, the conductive spring is prone to positional changes. Therefore, an electronic component with a compression-type electrical connection between a circuit board and a housing is required. Utility Model Content

[0005] According to one embodiment, an electronic assembly includes a first housing portion having one or more recesses along at least a portion of a perimeter of the first housing portion. A second housing portion has one or more arms extending from a body of the second housing portion to engage the recesses in a snap-fit ​​or clamp-fit ​​manner. A cavity is formed between the first housing portion and the second portion. A circuit board is located in the cavity; the circuit board has conductive traces facing the first housing portion at a metal conductive area, wherein a snap-fit ​​or clamp-fit ​​connection forms an electrical and mechanical connection between the conductive traces and the metal conductive area of ​​the first housing portion. BRIEF DESCRIPTION OF THE DRAWINGS

[0006] Figure 1 is a perspective view of the upper side of a first embodiment of an electronic assembly.

[0007] Figure 2 is a perspective view of the upper side of a first embodiment of an electronic assembly with a portion broken away.

[0008] Figure 3 is an exploded perspective view of the underside of a first embodiment of an electronic assembly.

[0009] Figure 4 is an exploded perspective view of the upper side of a first embodiment of an electronic assembly.

[0010] Figure 5 is a first embodiment of an electronic assembly along Figure 1 A cross section of reference line 5-5.

[0011] Figure 6 yes Figure 5 An enlarged view of the right side of the cross section.

[0012] Figure 7 yes Figure 5 Magnified view of the central area of ​​the cross section.

[0013] Figure 8 yes Figure 1 A perspective view of the interior of the second housing part.

[0014] Fig. 9 is a perspective view of the upper side of a second embodiment of an electronic assembly.

[0015] Fig.10 is a perspective view of the upper side of a second embodiment of an electronic assembly with the electronic assembly cut away to expose a circuit board.

[0016] Fig.11 is a second embodiment of the electronic assembly along Fig.10 A cross section of reference line 11-11.

[0017] In any group of two or more drawings, like reference numerals indicate like elements, features, or steps. DETAILED DESCRIPTION

[0018] According to one embodiment, Figure 1 A top perspective view of an electronic assembly 111 is illustrated, which includes a first housing portion 12 having one or more recesses 16 along at least a portion of an outer perimeter 17 of the first housing portion 12. A second housing portion 10 has one or more arms 14 extending from a body of the second housing portion 10, the one or more arms 14 terminating in a mating protrusion 15. One or more arms 14 or one or more mating protrusions 15, or both arms 14 and mating protrusions 15 engage with the recess 16 (e.g., groove) in a snap-fit ​​connection of a mechanical clamp or snap connector 19.

[0019] A cavity 23, such as an interior, is formed between the first housing portion 12 and the second housing portion 10. Figure 2 In the embodiment, the second housing member 10 is cut open to expose the circuit board 45 located in the cavity 23; Figure 5As illustrated in the cross-section, the circuit board 45 has a conductive trace 52 (e.g., a metal pad) that faces the first housing portion 12 at the metal conductive area 13, wherein a snap connector 19 or a mechanical clamp forms an electrical and mechanical connection between the conductive trace 52 and the metal conductive area 13.

[0020] In one embodiment, the snap connector 19 includes a combination of snap arms 14, mating protrusions 15, and corresponding recesses 16 to fixedly or removably connect the first housing portion 12 to the second housing portion 10. In addition, the snap connector 19 or its snap arms 14 provide a compressive or clamping force between the conductive traces 52 and the metallic conductive areas 13 while the snap connector 19 fixedly or removably connects the first housing portion 12 to the second housing portion 10.

[0021] In an alternative embodiment, one or more snap connectors 19 can be replaced by an articulated compression clamp (e.g., a toggle latch clamp) mounted on the outside of one housing portion (e.g., 10, 110, 12, 112) to engage a catch or protrusion on the opposite housing portion of the electronic component (111, 211). For example, the articulated compression clamp has a fixed base mounted (e.g., fastened) to one housing portion and a fixed catch mounted (e.g., fastened) to the opposite housing portion, wherein the fixed base has a lever that is pivotally or rotatably mounted to the fixed base via a first hinge. At the same time, the lever has a latch or latching member that is pivotally or rotatably mounted to the lever via a second hinge, wherein the latching member terminates in a hook that can engage a capturing portion to clamp, fix or lock the housing portions (e.g., 10 and 12, or 110 and 112) of the electronic component (111, 211) together.

[0022] In one embodiment, the first housing portion 12 includes a metal base having an outer surface 22. For example, the first housing portion 12 is formed of an extruded metal or an extruded alloy, and the first housing portion 12 has a set of longitudinal ridges 24 on the outer surface 22, wherein the longitudinal ridges 24 can increase structural integrity and promote heat dissipation of heat-generating components. The first housing portion 12 is formed of an extruded metal or alloy and has a set of longitudinal ridges 24 and a foot 26 portion, wherein the longitudinal ridges 24 extend along or parallel to the longitudinal axis 78.

[0023] Alternatively, the first housing portion 12 may be cast from a metal or alloy, or molded from a composite material, plastic, or polymer with surface metallization to form a conductive area (e.g., metal conductive area 13) that interfaces with conductive traces 52 (e.g., metal pads) of the circuit board 45.

[0024] In the electronic assembly 111, one or more heat generating components are mounted on one or both sides of the circuit board 45. For example, the heat generating components include the capacitor 46, the semiconductor switch (81, 82, 83), and other electric or electronic devices of the electronic assembly 111.

[0025] The second housing portion 10 includes a cover, wherein the cover is composed of a plastic, polymer, or composite material. For example, for a composite material, the cover can be formed of a plastic or a polymer matrix with a filler (e.g., carbon fiber, glass fiber, etc.). In one embodiment, the arm 14 (of the second housing portion 10), or both the arm 14 and the mating protrusion 15, are composed of some flexible or elastically deformable plastic, polymer, or composite material to support the snap connector 19.

[0026] In one embodiment, the one or more recesses 16 include a first groove in a corresponding first outer side 61 of the first shell portion 12 (e.g., the first outer wall 18) and a second groove in a corresponding second outer side 62 of the first shell portion 12, wherein the first outer side 61 is opposite to the second outer side 62 (e.g., the second outer wall 20).

[0027] Each arm 14 terminates in a protrusion 15 that is sized and shaped to engage or mate with a corresponding recess 16 (e.g., groove or slot) in the second housing portion 10. Each recess 16 (e.g., groove) has a cross-section or profile configured to receive the protrusion 15 at the end of the corresponding arm 14. In addition, each arm 14 can be elastically deformed before engaging the corresponding recess 16 (e.g., groove). Figure 5 As shown, the outer perimeter (surface) 17 of the first housing portion 12 is generally tapered downwardly and outwardly to maximize elastic deformation of each arm 14 during assembly and before the mating protrusions engage or interlock with the recesses 16 (eg, grooves).

[0028] In addition, the air gap 21 between the outer perimeter (surface) 17 and the arm 14 supports the removal of the first shell portion 12 from the second shell portion 10 by allowing the end user to insert a tool (e.g., a screwdriver or a pry bar) into the air gap to elastically extract the protrusion 15 from the recess 16, while temporarily elastically deforming the arm 14 so that the protrusion 15 is no longer obstructed by the first shell portion 12.

[0029] In one embodiment, the second housing portion 10 has a first array of arms 14 extending from the second housing portion 10 (e.g., at Figure 1 and Figure 8) to engage one or more corresponding recesses 16, such as a first groove or a first set of grooves spaced apart from each other. At the same time, the second housing portion 10 has a second set of arms 14 extending from the second housing portion 10 (e.g., Figure 1 and Figure 8 ) to engage one or more recesses 16, such as a second recess or a second set of recesses spaced apart from each other. Figure 1 As illustrated, the recess 16 in the first housing portion 12 includes first and second continuous grooves, wherein each groove has a cross-section (eg, an upper surface or lip) that can receive a lug, protrusion, or hook.

[0030] In an alternative embodiment, the recess 16 in the first housing portion 12 may include a discrete set of first grooves and a discrete set of second grooves.

[0031] The second housing portion 10 has a protrusion or post 51 extending in the cavity 23 and above (e.g., downwardly) the circuit board 45. In one embodiment, the second housing portion 10 has a protrusion or post 51 that contacts the opposite side of the circuit board 45 opposite the conductive trace 52, and wherein the first housing portion 12 has a conductive protrusion (e.g., conductive ridge) associated with the metal conductive area 13 to contact the conductive trace 52 on the circuit board 45. For example, the conductive protrusion or conductive ridge of the first housing portion 12 can be formed of solder, such as solder that is applied and reflowed before assembling the circuit board 45 in the cavity of the housing established by mating the first housing portion 12 with the second housing portion 10. In one embodiment, the post 51 projects downwardly: (a) to a degree greater than the gap or spacing between the lower interior surface of the second housing portion 10 and the top or upper surface of the circuit board 45; (b) to a degree that causes physical interference between the printed circuit board (45, 145) and its upper surface; or both, thereby causing the second housing portion 10 to be preloaded with a biasing force to clamp or compress the conductive traces or pads on the circuit board 45 (opposite the contact point of the post 51) toward the conductive protrusion inside the first housing portion 12 (e.g., when the second housing portion 10 is fully engaged or connected to the first housing portion 10). The arms 14 terminating in the protrusion 15 form a snap connector 19 or clamp that allows the center of the second housing portion 10 to be spring-like biased or preloaded along the central axis 75 of the second housing portion 10.

[0032] Before the first housing portion 12 and the second housing portion 10 are fastened by one or more snap connectors 19, the second housing portion 10 includes a cover or lid that bulges or arches downward toward the first housing portion 12. The second housing portion is configured or designed to apply a compressive or clamping force to the circuit board (45, 145). The compressive or clamping force is applied to the circuit board (45, 145) by the second housing portion 10 to potentially deform the solder. The second housing portion has sufficient strength, flexibility and elasticity to maintain contact between the conductive traces of the circuit board 45, the solder and the housing of the electronic component 111.

[0033] In reference Figure 2 In the illustrated alternative embodiment, prior to coupling the first housing portion 12 and the second housing portion 10 together, the second housing portion 10 may be arched downwardly (e.g., preloaded in a convex manner with a resilient bias) along the transverse axis 71 and over the post 51 proximate a central portion 73 (e.g., having an overall spring-like bias) of the second housing portion 10, the post 51 extending downwardly from the central portion 73. For example, prior to engaging or locking the first housing portion 12 with the second housing portion 10, a gap may exist between the first housing portion 12 and the second housing portion 10 at opposite sides (72, 74). However, when or simultaneously with the second housing portion 10 being fully connected to the first housing portion 12 via the snap connector 19, the second housing portion 10 is elastically deformed or biased (in a compressive manner) such that one or more of the following occurs: (a) the gap disappears, wherein the mating portion of the second housing portion 10 is generally flat and fits into the first housing portion 12 (e.g., at the sides (72, 74)); (b) the second housing portion 10 is spread out about the transverse axis 71 to eliminate the appearance of any protrusion or gap; (c) the second housing portion 10 is configured to apply a compressive or clamping force between the opposite side of the circuit board 45 opposite the conductive trace 52 and the metal conductive area 13. The above-mentioned protrusion can be applied to one or more posts 51 near or around the center portion of the second housing portion 10.

[0034] In yet another alternative embodiment, the solder of the metal conductive area is associated with solder flow through the circuit board (45, 145) during reflow in the oven to create a solder tip on one side (e.g., the underside) of the circuit board (45, 145). For example, the alternative embodiment can be a design improvement to any circuit board manufactured or produced by single-sided reflow.

[0035] like Figure 5As shown, the conductive trace 52 on the circuit board 45 and the first housing portion 12 are electrically grounded through the above-mentioned electrical contact and mechanical contact between the conductive trace 52 and the metal conductive area 13 or the conductive protrusion associated with the metal conductive area 13. The conductive ridge includes a solder bump. The conductive ridge includes one or more of the following: a generally flat surface, a wavy surface, a dotted surface, or a grooved surface. For example, in one embodiment, the conductive ridge has a wavy surface in which rows of peaks 53 are separated by intermediate valleys 55.

[0036] exist Figure 2 , the first semiconductor switch 81 may include a first pair consisting of a low-side semiconductor switch and a high-side semiconductor switch. The second pair of semiconductor switches 82 may include a second pair consisting of a low-side semiconductor switch and a high-side semiconductor switch. The third pair of semiconductor switches 83 may include a third pair consisting of a low-side semiconductor switch and a high-side semiconductor switch.

[0037] like Figure 2 , Figure 3 and Figure 4 As illustrated, a dielectric seal or dielectric sealant is applied, dispensed, placed or configured for a corresponding target area or area of ​​a first volume or first region 47 between the second housing portion 10 and the circuit board 45, and for a corresponding target area or area of ​​a second volume or second region 50. In one embodiment, the dielectric seal or dielectric sealant comprises a thermally conductive material having a thermal conductivity exceeding a threshold value. In one configuration, the dielectric seal or dielectric sealant may comprise an elastomer, a polymer adhesive, a latex adhesive or other suitable material that is bonded to, adhered to, covers, contacts or interfaces with one or more of the following: the first housing portion 12, the second housing portion 10, the circuit board 45 or a heat generating component associated with the circuit board 45 or the electronic component 111. For example, a dielectric seal or dielectric sealant can form a barrier to prevent moisture, salt, fog, contaminants, or debris from entering a cavity 23 formed by a first shell portion 12 connected to a second shell portion 10 (e.g., by elastically compressing the dielectric seal or sealant via a snap connector 19, fasteners, or attachments, alone or in combination with an adhesive bond or adhesion).

[0038] like Figure 3 As illustrated, for the first region 47, the dielectric seal or dielectric sealant includes one or more of the following: one or more first rings 41, one or more second rings 40, perimeter barrier 42, connector seal 49, and component thermal interface 43. For the second region 50, the dielectric seal or dielectric sealant includes a thermal interface, such as a board thermal interface.

[0039] In alternative embodiments, the circuit board 45 may be divided or separated into portions defined by boundary lines along the axes ( 76 , 77 ).

[0040] exist Figure 4 In the embodiment of the present invention, the circuit board 45 includes a first power electronic module 91 in a first area of ​​the circuit board 45, a second power electronic module area 92 in a second area of ​​the circuit board 45, and a third power electronic module area 93 in a third area of ​​the circuit board 45. Each of the first power electronic module 91, the second power electronic module 92, and the third power electronic module 93 includes a circuit (e.g., an inverter or an electric motor controller), wherein each circuit has a set of alternating current (AC) terminals (31, 32, 33) mounted on the circuit board 45 and extending through one or more openings 88 in the second housing portion 10. In addition, the first power electronic module 91, the second power electronic module 92, and the third power electronic module 93 share a common set of direct current (DC) terminals 30 (e.g., DC terminals of the third power electronic module 93) outside the second housing portion 10. The axis (76, 77) defines the boundary between the first power electronic module 91, the second power electronic module 92, and the third power electronic module 93.

[0041] Fig. 9 2 is a perspective view of the upper side of a second embodiment of an electronic assembly 211. The electronic assembly 211 is similar to the electronic assembly 111, except that the electronic assembly 211 includes a first power electronic module 91 (of the corresponding first region) separated or separated from a second power electronic module 92 of the corresponding second region and a third power electronic module 93 of the corresponding third region; therefore, the electronic assembly 211 is different from the electronic assembly 111 as follows: (a) the electronic assembly 211 replaces the circuit board 45 of the electronic assembly 111 with a circuit board 145; (b) the circuit board 145 is similar to the first power electronic module 91 of the corresponding first region of the circuit board 45; (c) the circuit board 145 is similar to the first power electronic module 91 of the corresponding first region of the circuit board 45; 145 is filled with electronic components similar to circuit board 45, such as heating elements, capacitors, and semiconductor switches; (d) circuit board 145 has conductive traces and a board layout similar to the first area of ​​circuit board 45; (c) the first housing portion and the second housing portion are reduced in size or volume to accommodate, encapsulate and protect circuit board 145 and its electronic components from the ingress of moisture, salt, fog, and debris; (f) common design features or reusable design features of circuit board 145 are based on circuit board 45 (for example, to facilitate efficient manufacturing, design, and testing of electronic assembly 211). Figure 1 and Fig. 9 Like reference numbers in the drawings indicate like elements or features.

[0042] As described above, first housing portion 112 of electronic assembly 211 is similar to first housing portion 12 of electronic assembly 111, except that the first housing portion is reduced in size or volume to accommodate (e.g., within a reduced cavity) circuit board 145. Similarly, second housing portion 110 for electronic assembly 111 is similar to second housing portion 10 of electronic assembly 111, except that the second housing portion is reduced in size or volume to accommodate (e.g., within a reduced cavity) circuit board 145. Fig.10 As illustrated, when the first housing portion 112 and the second housing portion 110 are connected to each other, the perimeter seal 142 or perimeter sealant provides a barrier (e.g., a water-resistant or waterproof barrier) and a thermal interface (e.g., a thermally conductive interface) between the first housing portion 112 and the second housing portion 110. At the same time, the thermally conductive interface 150 provides or enhances thermal communication between one or more heat-generating components of the circuit board 145 and the surrounding environment through the first housing portion 112.

[0043] Fig.10 is a perspective view of the upper side of a second embodiment of an electronic assembly with the electronic assembly cut away to expose a circuit board.

[0044] Fig.11 is a second embodiment of the electronic assembly along Fig.10 A cross section of reference line 11-11.

[0045] In one configuration, the first power electronic module region 91 and the second power electronic module 92 share a common control terminal of the connector 25, wherein the first region of the first power electronic module 91 and the second region of the second power electronic module 92 are adjacent to each other. In addition, in one configuration, the third region of the third power electronic module 93 is detachable, separable from the first power electronic module 91, or removable from the first power electronic module 91; the second power electronic module 92 and the third power electronic module 93 have auxiliary control terminals of the connector 28 that are separate from the common control terminal 25. The first power electronic module 91 is Figures 9 to 11 are shown as separate modules.

[0046] The present disclosure is well suited to reducing or eliminating one or more screws, one or more deflectable spring contacts, and any attendant installation costs that would otherwise be required to create an electrical connection between a conductive trace of a circuit board and a cavity of a housing (e.g., at an electrical or chassis ground). Instead, an electrical connection is established by securing or engaging a first housing portion (12, 112) to a second housing portion (10, 110) via one or more snap connectors 19 or clamps and other features to establish contact between a conductive trace on a circuit board and a corresponding conductive area of ​​the first housing portion (12, 112). For example, the housing facilitates the use of an extruded aluminum design for the first housing portion without requiring any ground screws to connect to an electrical or chassis ground, and without requiring any spring-biased electrical connection to connect to an electrical or chassis ground.

[0047] Although the present disclosure has been illustrated and described in detail in the drawings and the foregoing description, the illustration and description should be regarded as exemplary rather than limiting in nature, and it should be understood that illustrative embodiments have been shown and described, and it is desired to protect all changes and modifications that fall within the spirit of the present disclosure. It should be noted that alternative embodiments of the present disclosure may not include all of the features described, but still benefit from at least some of the advantages of these features. Those of ordinary skill in the art can easily conceive of their own embodiments that combine one or more features of the present disclosure and fall within the spirit and scope of the present invention as defined by the appended claims.

Claims

1. An electronic component, characterized in that: The electronic components include: a first housing portion having one or more recesses along at least a portion of a perimeter of the first housing portion; a second housing portion having one or more arms extending from a body of the second housing portion to engage the recess; a cavity formed between the first housing portion and the second housing portion; and A circuit board is located in the cavity, the circuit board has a conductive trace at a metal conductive area facing the first housing portion, and a snap connection forms an electrical connection and a mechanical connection between the conductive trace and the metal conductive area.

2. The electronic component according to claim 1, characterized in that The arms making the snap connection provide a compressive force between the conductive trace and the metallic conductive area.

3. The electronic component according to claim 1, characterized in that The first housing portion includes a metal base.

4. The electronic component according to claim 1, characterized in that The second housing portion includes a cover, and the cover is formed from a plastic, a polymer, or a composite material.

5. The electronic component according to claim 2, characterized in that: The second housing portion includes a cover and the arm is constructed from a plastic, polymer or composite material.

6. The electronic component according to claim 1, characterized in that The first housing portion is formed from an extruded metal or alloy and has a set of longitudinal ridges.

7. The electronic component according to claim 1, characterized in that: The first housing portion is formed of extruded metal or alloy and has a set of longitudinal ridges and a foot portion.

8. The electronic component according to claim 1, characterized in that: The circuit board includes a first power electronic module, a second power electronic module and a third power electronic module; each of the first power electronic module, the second power electronic module and the third power electronic module includes an inverter, each inverter has a set of AC terminals, the set of AC terminals are mounted on the circuit board and extend through the second housing part, and the first power electronic module, the second power electronic module and the third power electronic module share a set of common DC terminals on the outside of the second housing part.

9. The electronic component according to claim 1, characterized in that: The one or more recesses include a first groove in a corresponding first outer side of the first housing portion and a second groove in a corresponding second outer side of the first housing portion, the first outer side being opposite to the second outer side.

10. The electronic component according to claim 9, characterized in that The second housing portion has a first array of arms extending downwardly from the second housing portion to engage the first groove, and the second housing portion has a second set of arms extending downwardly from the second housing portion to engage the second groove.

11. The electronic component according to claim 1, characterized in that: The conductive traces on the circuit board and the first housing portion are electrically grounded by contact.

12. The electronic component according to claim 1, characterized in that The second housing portion has a post that contacts an opposite side of the circuit board opposite the conductive trace, and the first housing portion has a conductive ridge associated with the metallic conductive area for contacting the conductive trace on the circuit board.

13. The electronic component according to claim 12, characterized in that: The conductive ridges include solder bumps.

14. The electronic component according to claim 12, characterized in that: The conductive ridge includes a wavy surface, a dotted surface, or a grooved surface.

15. The electronic component according to claim 8, characterized in that The first power electronic module and the second power electronic module share a common control terminal, and the first power electronic module and the second power electronic module are adjacent to each other.

16. The electronic component according to claim 15, characterized in that The third power electronic module is separable from the first power electronic module and the second power electronic module, and has an auxiliary control terminal separate from the common control terminal.

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