Camera module and electronic device

Abstract

A camera module and an electronic device comprising the camera module are used for reducing the height of the camera module, the camera module comprises a photosensitive component, the photosensitive component comprises a circuit board, a reinforcing member and a photosensitive chip, the circuit board is provided with a through hole, the reinforcing member is arranged on one side of the circuit board and covers the through hole, and the photosensitive chip is arranged on the reinforcing member and is accommodated in the through hole; the lens assembly comprises a lens base and a lens, the lens base is arranged on the side, away from the reinforcing piece, of the circuit board, the lens is installed on the lens base, and the lens and the photosensitive chip are correspondingly arranged in the optical axis direction of the lens; the support comprises a supporting piece and a bearing piece, the supporting piece is arranged on the side, facing the lens, of the circuit board and provided with a supporting groove, the supporting groove penetrates through the supporting piece in the optical axis direction of the lens, the supporting groove and the photosensitive chip are correspondingly arranged in the optical axis direction of the lens, and the bearing piece is connected to the inner wall of the supporting groove and arranged in the circumferential direction of the supporting groove. At least part of the bearing piece is accommodated in the through hole; the optical filter is arranged on the bearing piece and contained in the supporting groove.

Description

Technical Field

[0001] The utility model relates to the technical field of imaging devices, and in particular to a camera module and an electronic device. Background Art

[0002] At present, the lens assembly, filter assembly, photosensitive chip and circuit board in the camera module are mostly stacked along the optical axis. However, since the height of each component is relatively fixed, the adjustable range of the overall height of the camera module is limited. Therefore, the arrangement of the above-mentioned camera module limits the development of electronic equipment equipped with the camera module to be thinner and lighter. Utility Model Content

[0003] In view of the above, it is necessary to provide a camera module and an electronic device to reduce the height of the camera module.

[0004] The present invention provides a camera module, comprising:

[0005] The photosensitive component comprises a circuit board, a reinforcing member and a photosensitive chip, wherein the circuit board is provided with a through hole, the reinforcing member is arranged on one side of the circuit board and covers the through hole, and the photosensitive chip is arranged on the reinforcing member and received in the through hole;

[0006] A lens assembly, comprising a lens seat and a lens, wherein the lens seat is arranged on a side of the circuit board away from the reinforcing member, the lens is mounted on the lens seat, and the lens and the photosensitive chip are arranged correspondingly in the optical axis direction of the lens;

[0007] A bracket, comprising a support member and a bearing member, wherein the support member is arranged on a side of the circuit board facing the lens and is provided with a support groove, the support groove penetrates the support member along the optical axis direction of the lens, and the support groove and the photosensitive chip are arranged correspondingly in the optical axis direction of the lens, the bearing member is connected to the inner wall of the support groove and is arranged along the circumference of the support groove, and at least a part of the bearing member is received in the through hole;

[0008] The optical filter is arranged on the carrier and received in the supporting groove.

[0009] In the above-mentioned camera module, the setting of the reinforcement can form a support for the circuit board, so that the camera module has the required strength. The photosensitive chip is arranged in the through hole, and at least a part of the carrier that carries the filter is received in the through hole, so that the photosensitive chip, the filter, and the circuit board are in a mutually embedded structure, which is beneficial to reduce the overall height of the camera module, thereby realizing the miniaturization of the camera module.

[0010] In some embodiments, the reinforcing member and the supporting member are both plate-shaped structures and are parallel to each other.

[0011] Therefore, the photosensitive chip placed on the reinforcement member and the filter placed on the carrier are parallel to each other, so that the photosensitive chip and the filter have good flatness, which is beneficial to improving the imaging quality of the camera module.

[0012] In some embodiments, the support member and the bearing member are an integral structure.

[0013] Therefore, the integrated structure of the support member and the bearing member can simplify the processing technology of the bracket, thereby helping to reduce the manufacturing cost of the bracket.

[0014] In some embodiments, a heat dissipation groove is formed on a side of the support member facing the circuit board, and the heat dissipation groove is connected to the through hole.

[0015] Therefore, the heat dissipation groove can increase the heat dissipation space of the heat generated by the photosensitive chip, which is beneficial to the heat dissipation of the photosensitive chip, thereby avoiding damage to the photosensitive chip and the reinforcement part caused by untimely heat dissipation of the photosensitive chip.

[0016] In some embodiments, the heat dissipation groove is arranged along the periphery of the supporting groove.

[0017] Therefore, the heat dissipation groove is similar in structure to the supporting groove, so that the periphery of the photosensitive chip has a heat dissipation channel, which is beneficial to improving the uniformity of heat dissipation of the photosensitive chip.

[0018] In some embodiments, the photosensitive chip and the inner wall of the through hole are spaced apart in a direction perpendicular to the optical axis direction of the lens.

[0019] Therefore, a gap is formed between the photosensitive chip and the circuit board in the direction perpendicular to the optical axis of the lens. The gap can provide installation space for the gold wire, thereby reducing the space occupied by the gold wire in the height direction of the camera module. The gap can also form a channel for heat dissipation of the photosensitive chip, which is beneficial to improving the heat dissipation efficiency of the photosensitive chip.

[0020] In some embodiments, the filter and the support are spaced apart in a direction perpendicular to the optical axis direction of the lens.

[0021] Therefore, a movable space is formed between the optical filter and the support member to facilitate the placement of the optical filter, which is beneficial to improving the efficiency of installing the optical filter on the carrier.

[0022] In some embodiments, a guide groove is provided on the periphery of the support member, the lens holder includes a main body and a support body, the lens is mounted on the main body, the main body is disposed on the support member, the support body is connected to the main body and disposed on the circuit board, and the support body is received in the guide groove.

[0023] Therefore, the support body can be guided to be arranged on the circuit board through the guide groove, thereby improving the efficiency of installing the mirror holder on the bracket.

[0024] In some embodiments, the photosensitive chip and the reinforcing member, the circuit board and the reinforcing member, and the filter and the carrier are all connected via an adhesive layer.

[0025] Therefore, the cost of the adhesive layer is low, and the operation of connecting the above components using the adhesive layer is simple, which is beneficial to reducing the production cost of the camera module.

[0026] The present invention also provides an electronic device, including:

[0027] The camera module described in any of the above embodiments;

[0028] A housing, wherein the camera module is installed on the housing.

[0029] In the above-mentioned electronic device, the setting of the reinforcement part can form a support for the circuit board, so that the camera module has the required strength. The photosensitive chip is arranged in the through hole, and at least a part of the carrier that carries the filter is received in the through hole, so that the photosensitive chip, the filter, and the circuit board are in a mutually embedded structure, which can reduce the overall height of the electronic device equipped with the camera module, thereby facilitating the development of lightweight and thin electronic devices. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] Figure 1 It is a schematic structural diagram of a camera module according to an embodiment of the utility model.

[0031] Figure 2 for Figure 1 The exploded schematic diagram of the camera module shown.

[0032] Figure 3 for Figure 1 The cross-sectional schematic diagram of the camera module shown is along the AA direction.

[0033] Figure 4 It is a structural schematic diagram of an electronic device according to an embodiment of the utility model.

[0034] Main component symbols

[0035] Camera module 100

[0036] Photosensitive component 110

[0037] Reinforcement 111

[0038] Circuit board 112

[0039] Through hole 112a

[0040] Photosensitive chip 113

[0041] Bracket 120

[0042] Support member 121

[0043] Support groove 121a

[0044] Heat sink 121b

[0045] Guide groove 121c

[0046] Carrier 122

[0047] Filter 130

[0048] Lens assembly 140

[0049] Mirror mount 141

[0050] Main body 1411

[0051] Support 1412

[0052] Shot 142

[0053] Electronic device 1000

[0054] Housing 200 DETAILED DESCRIPTION

[0055] The embodiments of the present invention are described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and cannot be understood as limiting the present invention.

[0056] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the term "connection" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection, an electrical connection, or mutual communication; it can be a direct connection, or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0057] The following is a detailed description of various embodiments of the present invention in conjunction with the accompanying drawings.

[0058] See also Figure 1 and Figure 2The embodiment of the utility model provides a camera module 100, including a photosensitive component 110, a bracket 120, a filter 130 and a lens component 140. The photosensitive component 110 includes a reinforcing member 111, a circuit board 112 and a photosensitive chip 113. The circuit board 112 is provided with a through hole 112a. The reinforcing member 111 is arranged on one side of the circuit board 112 to support the circuit board 112, and the reinforcing member 111 covers the through hole 112a. The photosensitive chip 113 is arranged on the reinforcing member 111 and is received in the through hole 112a. The lens component 140 includes a lens seat 141 and a lens 142. The lens seat 141 is arranged on a side of the circuit board 112 away from the reinforcing member 111. The lens 142 is installed on the lens seat 141, and the lens 142 and the photosensitive chip 113 are in the optical axis direction of the lens 142. Correspondingly, the bracket 120 includes a support member 121 and a carrier member 122. The support member 121 is arranged on the side of the circuit board 112 facing the lens 142 and is provided with a support groove 121a. The support groove 121a passes through the support member 121 along the optical axis direction of the lens 142, and the support groove 121a and the photosensitive chip 113 are arranged correspondingly in the optical axis direction of the lens 142. The carrier member 122 is connected to the inner wall of the support groove 121a and is arranged along the circumference of the support groove 121a, and at least a part of the carrier member 122 is received in the through hole 112a. The filter 130 is arranged on the carrier member 122 and received in the support groove 121a.

[0059] In this embodiment, the circuit board 112 may be a rigid circuit board, a flexible circuit board, or a rigid-flexible circuit board.

[0060] In the above-mentioned camera module 100, the setting of the reinforcement member 111 can form a support for the circuit board 112, so that the camera module 100 has the required strength. The photosensitive chip 113 is set in the through hole 112a, and at least a part of the carrier 122 that carries the filter 130 is received in the through hole 112a, so that the photosensitive chip 113, the filter 130, and the circuit board 112 are in a mutually embedded structure, which is beneficial to reduce the overall height of the camera module 100, thereby realizing the miniaturization of the camera module 100.

[0061] See also Figure 2 and Figure 3 In some embodiments, the reinforcing member 111 and the bearing member 122 are both plate-shaped structures and are parallel to each other.

[0062] In this embodiment, the reinforcing member 111 is a steel sheet. The reinforcing member 111 and the bearing member 122 are parallel to each other, so that the bearing member 122 is completely received in the through hole 112a. In other embodiments, when the reinforcing member 111 and the bearing member 122 are not parallel, the bearing member 122 can be completely received in the through hole 112a, or can be partially received in the through hole 112a.

[0063] Therefore, the photosensitive chip 113 placed on the reinforcement 111 and the filter 130 placed on the carrier 122 are parallel to each other, so that the photosensitive chip 113 and the filter 130 have good flatness, which is beneficial to improving the imaging quality of the camera module 100.

[0064] See also Figure 3 In some embodiments, the support member 121 and the bearing member 122 are an integral structure.

[0065] Therefore, the integrated structure of the support member 121 and the bearing member 122 can simplify the processing technology of the bracket 120 , thereby helping to reduce the manufacturing cost of the bracket 120 .

[0066] See also Figure 3 In some embodiments, a heat dissipation groove 121 b is formed on a side of the support member 121 facing the circuit board 112 , and the heat dissipation groove 121 b is connected to the through hole 112 a .

[0067] Therefore, the heat dissipation groove 121b can increase the heat dissipation space of the heat generated by the photosensitive chip 113, which is beneficial to the heat dissipation of the photosensitive chip 113, thereby avoiding damage to the photosensitive chip 113 and the reinforcing component 111 caused by untimely heat dissipation of the photosensitive chip 113.

[0068] In some embodiments, the heat dissipation groove 121b is disposed along the periphery of the supporting groove 121a.

[0069] Therefore, the heat dissipation groove 121 b has a similar structure to the supporting groove 121 a , so that the periphery of the photosensitive chip 113 has a heat dissipation channel, which is beneficial to improving the uniformity of heat dissipation of the photosensitive chip 113 .

[0070] See also Figure 3 In some embodiments, the photosensitive chip 113 and the inner wall of the through hole 112 a are spaced apart in a direction perpendicular to the optical axis direction of the lens 142 .

[0071] Therefore, a gap is formed between the photosensitive chip 113 and the circuit board 112 in the direction perpendicular to the optical axis of the lens 142. The gap can provide installation space for the gold wire, thereby reducing the space occupied by the gold wire in the height direction of the camera module 100. The gap can also form a channel for heat dissipation of the photosensitive chip 113, which is beneficial to improving the heat dissipation efficiency of the photosensitive chip 113.

[0072] See also Figure 3 In some embodiments, the filter 130 and the support member 121 are spaced apart in a direction perpendicular to the optical axis direction of the lens 142 .

[0073] Therefore, a movable space is formed between the optical filter 130 and the support member 121 for facilitating the placement of the optical filter 130 , which is beneficial to improving the efficiency of installing the optical filter 130 on the carrier 122 .

[0074] See also Figure 2 In some embodiments, a guide groove 121c is opened on the periphery of the support member 121, the lens holder 141 includes a main body 1411 and a support body 1412, the lens 142 is installed on the main body 1411, the main body 1411 is arranged on the support member 121, the support body 1412 is connected to the main body 1411 and is arranged on the circuit board 112, and the support body 1412 is received in the guide groove 121c.

[0075] In this embodiment, the support member 121 and the main body 1411 are both roughly square structures, and there are two guide grooves 121c and two support bodies 1412. The two guide grooves 121c are respectively located at two adjacent end corners of the support member 121, and the two support bodies 1412 are respectively located at two adjacent end corners of the main body 1411, and the two support bodies 1412 are respectively received in the two guide grooves 121c.

[0076] In this embodiment, the main body 1411 may be a composite structure having a voice coil motor to achieve automatic focusing of the lens 142 .

[0077] Therefore, the support body 1412 can be guided to be disposed on the circuit board 112 through the guide groove 121 c, thereby improving the efficiency of installing the mirror holder 141 on the bracket 120 .

[0078] In some embodiments, the photosensitive chip 113 is connected to the reinforcing member 111 through an adhesive layer (not shown), the circuit board 112 is connected to the reinforcing member 111 through an adhesive layer (not shown), and the filter 130 is connected to the carrier 122 through an adhesive layer (not shown). In this embodiment, the adhesive layer can be formed by solidifying glue or a double-sided tape.

[0079] Therefore, the cost of the adhesive layer is low, and the operation of connecting the above components using the adhesive layer is simple, which is beneficial to reducing the production cost of the camera module 100.

[0080] See also Figure 4 The embodiment of the utility model further provides an electronic device 1000, comprising a housing 200 and the camera module 100 of the above embodiment, wherein the camera module 100 is mounted on the housing 200. The electronic device 1000 may be a mobile phone, a tablet, etc., and correspondingly, the housing 200 may be a mobile phone back panel, a tablet back panel, etc.

[0081] In the above-mentioned electronic device 1000, the setting of the reinforcement member 111 can form a support for the circuit board 112, so that the camera module 100 has the required strength, the photosensitive chip 113 is set in the through hole 112a, and at least a part of the carrier 122 that carries the filter 130 is received in the through hole 112a, so that the photosensitive chip 113, the filter 130, and the circuit board 112 are in a mutually embedded structure, which can reduce the overall height of the electronic device 1000 installed with the camera module 100, thereby facilitating the lightweight development of the electronic device 1000.

[0082] It is obvious to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above, and that the present invention can be implemented in other specific forms without departing from the spirit or basic features of the present invention. Therefore, no matter from which point of view, the embodiments should be regarded as exemplary and non-restrictive, and the scope of the present invention is defined by the appended claims rather than the above description, and it is intended that all changes falling within the meaning and scope of the equivalent elements of the claims are included in the present invention.

[0083] Finally, it should be noted that the above embodiments are only used to illustrate the technical solution of the utility model rather than to limit it. Although the utility model has been described in detail with reference to the preferred embodiments, ordinary technicians in the field should understand that the technical solution of the utility model can be modified or replaced by equivalents without departing from the spirit and scope of the technical solution of the utility model.

Claims

1. A camera module, characterized in that: include: The photosensitive component comprises a circuit board, a reinforcing member and a photosensitive chip, wherein the circuit board is provided with a through hole, the reinforcing member is arranged on one side of the circuit board and covers the through hole, and the photosensitive chip is arranged on the reinforcing member and received in the through hole; A lens assembly, comprising a lens seat and a lens, wherein the lens seat is arranged on a side of the circuit board away from the reinforcing member, the lens is mounted on the lens seat, and the lens and the photosensitive chip are arranged correspondingly in the optical axis direction of the lens; A bracket, comprising a support member and a bearing member, wherein the support member is arranged on a side of the circuit board facing the lens and is provided with a support groove, the support groove penetrates the support member along the optical axis direction of the lens, and the support groove and the photosensitive chip are arranged correspondingly in the optical axis direction of the lens, the bearing member is connected to the inner wall of the support groove and is arranged along the circumference of the support groove, and at least a part of the bearing member is received in the through hole; The optical filter is arranged on the carrier and received in the supporting groove.

2. The camera module according to claim 1, characterized in that: The reinforcing member and the bearing member are both plate-shaped structures and are parallel to each other.

3. The camera module according to claim 1, characterized in that: The supporting member and the bearing member are an integrated structure.

4. The camera module according to claim 1, characterized in that: A heat dissipation groove is formed on one side of the support member facing the circuit board, and the heat dissipation groove is connected to the through hole.

5. The camera module according to claim 4, characterized in that: The heat dissipation groove is arranged along the periphery of the supporting groove.

6. The camera module according to claim 1, characterized in that: The photosensitive chip and the inner wall of the through hole are spaced apart in a direction perpendicular to the optical axis direction of the lens.

7. The camera module according to claim 1, wherein: The filter and the support are spaced apart in a direction perpendicular to the optical axis of the lens.

8. The camera module according to claim 1, wherein: A guide groove is provided on the periphery of the support member; The lens holder comprises a main body and a supporting body, the lens is mounted on the main body, the main body is arranged on the supporting member, the supporting body is connected to the main body and arranged on the circuit board, and the supporting body is received in the guiding groove.

9. The camera module according to claim 1, characterized in that: The photosensitive chip and the reinforcing component, the circuit board and the reinforcing component, and the filter and the carrier are all connected via an adhesive layer.

10. An electronic device, characterized in that: include: The camera module as claimed in any one of claims 1 to 9; A housing, wherein the camera module is installed on the housing.

Images