Multilayer electronic circuit board and folded multilayer electronic circuit board
By setting folding grooves and positioning holes on the multi-layer electronic circuit board, the main board body is divided into a foldable panel, which solves the problem of double-panel shrinkage in traditional processes, achieving higher alignment accuracy and cost savings.
Patent Information
- Application Number
- CN202420485703.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-03-12
- Publication Date
- 2025-01-10
- Estimated Expiration
- 2034-03-12
AI Technical Summary
The unstable difference in the expansion and shrinkage between the double panels in the traditional multi-layer soft board production process leads to product quality and stability problems, and is costly, especially during large-scale production.
Design a multi-layer electronic circuit board. By setting folding grooves and positioning holes on the main board body, the main board body is divided into a foldable first panel and a second panel, and the folding grooves and electroplating connections are used to achieve synchronous expansion and shrinkage of the panel. Changes and saves equipment and labor costs during the production process.
It improves the panel alignment accuracy, reduces the abnormality rate during the manufacturing process, saves the process of cutting, drilling and making lines, and reduces equipment and labor costs.
Smart Images
Figure CN222339664U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of circuit boards, in particular to a multi-layer electronic circuit board and a folded multi-layer electronic circuit board. Background Art
[0002] At present, in the multi-layer flexible circuit board manufacturing process, such as the traditional 2+2 four-layer flexible circuit board manufacturing process, the current 2+2 four-layer flexible circuit board manufacturing process requires a lot of manual operation and equipment resource investment, resulting in high costs, especially in large-scale production, the cost pressure is more significant; secondly, due to the material and process limitations in the traditional production process, the expansion and contraction difference between the two double-sided boards is unstable, which may cause problems in the use of the produced double-sided boards, affecting product quality and stability. Utility Model Content
[0003] The utility model aims to provide a multi-layer electronic circuit board and a folded multi-layer electronic circuit board, so as to solve the technical problems of unstable expansion and contraction difference between double-sided boards and high production cost in the traditional double-sided board manufacturing process in the background technology.
[0004] To achieve the above-mentioned purpose, the technical solution of the first aspect of the utility model provides a multi-layer electronic circuit board, including a main board body, a folding groove and a positioning hole, wherein the main board body is arranged in a multi-layer structure, the folding groove is arranged on one side of the main board body and is located at the center of the main board, and the folding groove matches the width of the main board body; the main board body includes a first panel and a second panel, the positioning hole is arranged on the first panel and the second panel, and the positioning hole is used for positioning the first panel and the second panel after folding.
[0005] Furthermore, there are two folding grooves, which are respectively arranged on two sides of the main board body, and the sizes of the two folding grooves match each other.
[0006] Furthermore, the folding groove is formed by etching the metal material on the main body.
[0007] Furthermore, the main board body is a double-sided flexible circuit board, and the double-sided flexible circuit board includes a first metal layer, a PI insulating layer and a second metal layer connected in sequence.
[0008] Furthermore, conductive patterns are engraved on the first panel and the second panel.
[0009] Furthermore, the first panel and the second panel are electrically connected by electroplating.
[0010] Furthermore, there are four positioning holes, and the four positioning holes are evenly distributed around the main board body.
[0011] Furthermore, the width of the main board body is configured to be 500 mm.
[0012] Furthermore, a plurality of electronic components are arranged on the outer surface of the main board body.
[0013] The technical solution of the second aspect of the present invention provides a folded multilayer electronic circuit board, including the multilayer circuit board described in any one of the technical solutions of the first aspect of the present invention, wherein the first panel and the second panel are folded through a folding groove, and the first panel and the second panel are fixedly connected after folding.
[0014] The beneficial effects of the utility model include:
[0015] 1. The utility model provides a multi-layer electronic circuit board and a folded multi-layer electronic circuit board. A folding groove is set on a main board body, and the main board body is divided into a foldable first panel and a second panel by using the folding groove. The first panel and the second panel on the same main board body have higher alignment accuracy after folding. The first panel and the second panel can be used as the main board and the sub-board of the electronic circuit board. Since they are from the same main board body, the expansion and contraction changes between the first panel and the second panel during the manufacturing process are more synchronized and the abnormality rate is lower. On the other hand, compared with the traditional manufacturing process, the multi-layer electronic circuit board can save the process of cutting, punching and making circuits once during the manufacturing process, so the equipment and labor costs in its manufacturing process are lower. BRIEF DESCRIPTION OF THE DRAWINGS
[0016] In order to more clearly illustrate the technical solutions of the embodiments of the utility model, the drawings required for use in the embodiments of the utility model will be briefly introduced below. It should be understood that the following drawings only show certain embodiments of the utility model and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other relevant drawings can be obtained based on these drawings without paying creative work.
[0017] Figure 1 A schematic diagram of the structure of a multi-layer electronic circuit board provided in Embodiment 1 of the present utility model;
[0018] Figure 2 A schematic diagram of the multi-layer structure of the main board provided by an embodiment of the utility model;
[0019] Icon: 1-first panel, 2-second panel, 3-folding groove, 4-positioning hole, 6-first metal layer, 7-PI insulation layer, 8-second metal layer. DETAILED DESCRIPTION
[0020] The technical solutions in the embodiments of the present invention will be described below in conjunction with the accompanying drawings in the embodiments of the present invention.
[0021] It should be noted that similar numbers and letters represent similar items in the following drawings, so once an item is defined in one drawing, it does not need to be further defined and explained in subsequent drawings. It should be noted that the terms "upper", "lower", "left", "right", "vertical", "horizontal", "inside", "outside", etc. indicate the orientation or position relationship based on the orientation or position relationship shown in the drawings, or the orientation or position relationship in which the utility model product is usually placed when in use. It is only for the convenience of describing the present application and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present application. In addition, the terms "first", "second", "third", etc. are only used to distinguish the description, and cannot be understood as indicating or implying relative importance.
[0022] See also Figure 1 to Figure 2 As shown, at least one embodiment of the present disclosure provides a multi-layer electronic circuit board, including a main board body, a folding groove 3 and a positioning hole 4, wherein the main board body is a multi-layer structure, the folding groove 3 is arranged on one side of the main board body and is located at the center of the main board, and the folding groove 3 matches the width of the main board body; the main board body includes a first panel 1 and a second panel 2, the positioning hole 4 is arranged on the first panel 1 and the second panel 2, and the positioning hole 4 is used for positioning the first panel 1 and the second panel 2 after folding; specifically, the implementation of the multi-layer electronic circuit board can adopt a substrate material of a multi-layer structure as the main board body, such as glass fiber reinforced epoxy resin (FR-4) or other high-performance substrate materials, and then fix the multi-layer structure together through a lamination process. , forming a multi-layer structure of the main board body; a multi-layer electronic circuit board provided in this embodiment, by setting a folding groove 3 on the main board body, using the folding groove 3 to divide the main board body into a foldable first panel 1 and a second panel 2, the first panel 1 and the second panel 2 in the same main board body have higher alignment accuracy after folding, the first panel 1 and the second panel 2 can be used as the main board and the sub-board of the electronic circuit board, because they are from the same main board body, the expansion and contraction changes between the first panel 1 and the second panel 2 during the manufacturing process are more synchronized, and the abnormality rate is lower; on the other hand, compared with the traditional manufacturing process, the multi-layer electronic circuit board can save one process of cutting, punching, and making circuits during the manufacturing process, so the equipment and labor costs in its manufacturing process are lower
[0023] Preferably, the width of the main panel body is configured to be 500 mm, and it can be divided into two equal-sized first panels 1 and second panels 2 by the folding groove 3; the folded first panel 1 and second panel 2 can be calibrated by the positioning holes 4, and then connected by gluing; compared with the prior art, there is no need to make two panels separately;
[0024] Preferably, two folding grooves 3 are provided, and the two folding grooves 3 are respectively provided on the two sides of the main board body, and the sizes of the two folding grooves 3 match each other; the folding groove 3 is formed by etching the metal material on the main board body, wherein the folding groove 3 is specifically removed by etching during the process of making the circuit line on the main board body, such as copper, on the main board body, and the depth of the folding groove 3 is based on ensuring that the metal layer on the surface of the main board body is etched away; the part of the folding groove 3 after etching is easy to fold, and the folding groove 3 is formed by etching, so that the folding groove 3 can be made without affecting the circuit line, so that the structure of the circuit board is more compact.
[0025] Preferably, the main board body is a double-sided flexible circuit board, and the double-sided flexible circuit board includes a first metal layer 6, a PI insulating layer 7 and a second metal layer 8 connected in sequence; wherein, the first metal layer 6 and the second metal layer 8 can be made of copper; it should be noted that the main board can also be configured as a "1+1" or "1+2" multi-layer structure, that is, the first panel 1 and the second panel 2 are configured as a single-sided metal layer, or the first panel 1 and the second panel 2 are configured as a combination design of a single-sided metal layer and a double-sided metal layer, and only the exposure process of the circuit board circuit needs to be adjusted; PI is specifically a polyimide material, which is a flexible high-performance material, so when the metal layer on the outer surface of the main board body, such as a copper material, is etched, the exposed PI insulating layer 7 will be easier to fold and bend;
[0026] Preferably, conductive patterns are engraved on the first panel 1 and the second panel 2, and the first panel 1 and the second panel 2 are electrically connected by electroplating; a number of electronic components are arranged on the outer surface of the main panel body; specifically, during the design stage, it is necessary to design conductive patterns on the first panel 1 and the second panel 2, and these conductive patterns may be circuit connection lines, pads, electronic components, etc.; specifically, the conductive patterns need to consider the layout of the circuit connection and the requirements of circuit signal transmission, which are not elaborated here; electroplating means that a reliable electrical connection is formed between the two panels by electroplating on the conductive pattern outside the folding groove 3.
[0027] Preferably, there are four positioning holes 4, which are evenly distributed around the main board body; specifically, the four positioning holes 4 are used for matching and positioning the first panel 1 and the second panel 2, which can ensure the accuracy of the first panel 1 and the second panel 2 after folding, so that the folded circuit board remains consistent in shape and size.
[0028] The utility model also provides a folded multilayer electronic circuit board, including the multilayer circuit board described in any one of the above embodiments of the utility model, wherein the first panel 1 and the second panel 2 are folded through a folding groove 3, and the first panel 1 and the second panel 2 are fixedly connected after being folded; specifically, the first panel 1 and the second panel 2 can be connected by gluing after being folded.
[0029] In addition to the above description, there are a few points to note:
[0030] (1) The drawings of the embodiments of the present disclosure only relate to the structures related to the embodiments of the present disclosure, and other structures may refer to the general design;
[0031] (2) The electroplating, etching, and plating in this disclosure are all mature conventional technologies in the prior art. Those skilled in the art can realize the application of this utility model based on the principles of the same functions in the prior art. This part is not the innovative point of this utility model;
[0032] (3) In the absence of conflict, the embodiments of the present disclosure and the features therein may be combined with each other to obtain new embodiments.
[0033] The above is only a specific implementation of the utility model, but the protection scope of the utility model is not limited thereto. Any technician familiar with the technical field can easily think of changes or substitutions within the technical scope disclosed by the utility model, which should be included in the protection scope of the utility model. Therefore, the protection scope of the utility model should be based on the protection scope of the claims.
Claims
1. A multi-layer electronic circuit board, characterized in that: The invention comprises a main body, a folding groove (3) and a positioning hole (4); the main body is a multi-layer structure; the folding groove (3) is arranged on one side of the main body and is located at the center of the main body; the folding groove (3) matches the width of the main body; the main body comprises a first panel (1) and a second panel (2); the positioning hole (4) is arranged on the first panel (1) and the second panel (2); the positioning hole (4) is used for positioning the first panel (1) and the second panel (2) after folding.
2. A multilayer electronic circuit board according to claim 1, characterized in that: Two folding grooves (3) are provided, and the two folding grooves (3) are respectively provided on two sides of the main board body, and the sizes of the two folding grooves (3) match each other.
3. A multi-layer electronic circuit board according to claim 1, characterized in that: The folding groove (3) is formed by etching the metal material on the main body.
4. A multi-layer electronic circuit board according to claim 1, characterized in that: The main board body is a double-sided flexible circuit board, and the double-sided flexible circuit board comprises a first metal layer (6), a PI insulating layer (7) and a second metal layer (8) which are connected in sequence.
5. A multi-layer electronic circuit board according to claim 4, characterized in that: Conductive patterns are engraved on the first panel (1) and the second panel (2).
6. A multi-layer electronic circuit board according to claim 5, characterized in that: The first panel (1) and the second panel (2) are also electrically connected by electroplating.
7. A multilayer electronic circuit board according to any one of claims 1 to 6, characterized in that: There are four positioning holes (4), and the four positioning holes (4) are evenly distributed around the main board body.
8. A multi-layer electronic circuit board according to claim 7, characterized in that: The width of the main board body is configured to be 500 mm.
9. The multilayer electronic circuit board according to claim 8, characterized in that: A plurality of electronic components are arranged on the outer surface of the main board.
10. A folded multi-layer electronic circuit board, characterized in that: A multilayer circuit board comprising the multilayer circuit board as claimed in any one of claims 1 to 9, wherein the first panel (1) and the second panel (2) are folded in half via a folding groove (3), and the first panel (1) and the second panel (2) are fixedly connected after being folded.