Embedded ultrathin packaging circuit board

Abstract

An embedded ultrathin packaging circuit board comprises a first board body, a second board body and a plurality of packaging chips. A first step is arranged on the right side of the bottom of the first plate body, a first clamping block protruding downwards and a first clamping through hole penetrating up and down are arranged on the first step, and a first mounting groove with an opening in one side is further formed in the first clamping block; a second step is arranged on the left side of the top of the second plate body, a second clamping block protruding upwards and a second clamping through hole penetrating up and down are arranged on the second step, and a second mounting groove with an opening in one side is further formed in the second clamping block. According to the embedded circuit board, the first board body and the second board body of which the two ends are connected in a clamping manner are designed, and the clamping ends are embedded into the packaging chip to form the whole circuit board, so that the overall thickness of the embedded circuit board is optimized and thinned, and the circuit board assembled in a clamping manner is easier to produce, assemble or disassemble and maintain; the utility model has the advantages of strong practicability and strong popularization significance.

Description

Technical Field

[0001] The utility model relates to a circuit board, in particular to an embedded ultra-thin packaged circuit board. Background Art

[0002] Circuit board, also known as printed circuit board or printed circuit board, PCB in English, is an important electronic component, a support for electronic components, and a carrier for electrical connection of electronic components. Before the emergence of circuit boards, the interconnection between electronic components was completed by direct connection of wires. Nowadays, wires are only used for experimental applications in laboratories, and circuit boards have occupied an absolute dominant position in the electronics industry.

[0003] In order to embed electronic components such as chips, existing embedded package circuit boards often adopt a multi-layer circuit board structure design, embedding chips and other electronic components between the layers of the circuit board and then stacking and pressing them into shape. However, this type of circuit board is not only thicker, but also has a very complicated production and processing process. More importantly, when the embedded chips and other electronic components are damaged, it is even more difficult to remove them from the circuit board for repair. Utility Model Content

[0004] Based on this, it is necessary to provide an embedded ultra-thin packaging circuit board to address the deficiencies in the prior art.

[0005] An embedded ultra-thin packaged circuit board comprises a first plate body, a second plate body and a plurality of packaged chips. A first step is provided on the right side of the bottom of the first plate body, and a first snap-fit ​​block protruding downward and a first snap-fit ​​through hole penetrating from top to bottom are provided on the first step, and a first mounting groove with an opening on one side is also provided in the first snap-fit ​​block. A second step is provided on the left side of the top of the second plate body, and a second snap-fit ​​block protruding upward and a second snap-fit ​​through hole penetrating from top to bottom are provided on the second step, and a second mounting groove with an opening on one side is also provided in the second snap-fit ​​block. The first step is seamlessly spliced ​​with the second step, and the first snap-fit ​​block is just snap-fitted into the second snap-fit ​​through hole, and the second snap-fit ​​block is just snap-fitted into the first snap-fit ​​through hole, and a plurality of packaged chips are snap-fitted and installed in the first mounting groove and the second mounting groove, respectively.

[0006] Furthermore, the first plate body and the second plate body are respectively provided with a plurality of first heat dissipation through holes and a plurality of second heat dissipation through holes. The plurality of first heat dissipation through holes are distributed on the upper and lower surfaces of the first plate body and are respectively connected to the first mounting groove and the outside, and the plurality of second heat dissipation through holes are distributed on the upper and lower surfaces of the second plate body and are respectively connected to the second mounting groove and the outside.

[0007] Furthermore, the first heat dissipation through hole and the second heat dissipation through hole are both designed in a conical structure, and the diameter of the inner end is larger than the diameter of the outer end.

[0008] Furthermore, the embedded ultra-thin package circuit board also includes a plurality of fixing pins, and the first step and the second step are respectively provided with a plurality of first fixing through holes and second fixing through holes that penetrate up and down. The plurality of fixing pins are respectively passed through the plurality of first fixing through holes and the second fixing through holes to connect and fix the first board body and the second board body.

[0009] Furthermore, the embedded ultra-thin packaged circuit board also includes two groups of fixing rings, and the two groups of fixing rings are respectively hooped and sleeved on the left edge and the right edge of the first step and the second step.

[0010] To sum up, the beneficial effects of the embedded ultra-thin packaging circuit board of the utility model are: by designing a first plate body and a second plate body that are snap-connected at both ends, and embedding the packaging chip at the snap-fitting end to form the entire circuit board, not only the overall thickness of the embedded circuit board is optimized and thinned, but also the snap-fitted assembled circuit board is easier to produce, assemble or disassemble and repair; multiple heat dissipation holes are designed on the circuit board, which can better dissipate heat for the embedded packaging chip and greatly reduce the risk of burning the packaging chip due to long-term high temperature; fixing pins and fixing rings are designed on the assembled circuit board to strengthen the snap-fit ​​connection, so that the overall structural strength of the circuit board is higher, and the problem of circuit board connection breakage due to external force is greatly reduced; the utility model is highly practical and has a strong promotional significance. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] Figure 1 This is a schematic diagram of the structure of an embedded ultra-thin packaged circuit board of the utility model;

[0012] Figure 2 for Figure 1 Schematic diagram of the decomposition structure;

[0013] Figure 3 for Figure 2 A schematic diagram of the reverse structure of the first plate body;

[0014] Figure 4 for Figure 2 Schematic diagram of the front structure of the second plate body. DETAILED DESCRIPTION

[0015] In order to make the purpose, technical solution and advantages of the utility model more clear, the utility model is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the utility model and are not used to limit the utility model.

[0016] like Figures 1 to 4 As shown, the utility model provides an embedded ultra-thin packaged circuit board 100 , which includes a first board body 10 , a second board body 20 and a plurality of packaged chips 30 .

[0017] A first step 11 is provided on the right side of the bottom of the first plate body 10, and a first engaging block 12 protruding downward and a first engaging through hole 13 penetrating from top to bottom are provided on the first step 11, and a first mounting groove 14 with an opening on one side is provided in the first engaging block 12. A second step 21 is provided on the left side of the top of the second plate body 20, and a second engaging block 22 protruding upward and a second engaging through hole 23 penetrating from top to bottom are provided on the second step 21, and a second mounting groove 24 with an opening on one side is provided in the second engaging block 22.

[0018] When assembling the circuit board, it is only necessary to make the first step 11 and the second step 21 seamlessly connected, and the first engaging block 12 is exactly engaged in the second engaging through hole 23, the second engaging block 22 is exactly engaged in the first engaging through hole 13, and a plurality of packaged chips 30 are respectively engaged and installed in the first mounting groove 14 and the second mounting groove 24, and the overall forming of the circuit board can be completed. The circuit board with the horizontal engaging structure further optimizes the overall thickness of the circuit board compared to the conventional upper and lower stacking pressing structure, and the engaging assembly or separation and disassembly of the circuit board is also simpler, which can greatly improve the production efficiency of the circuit board and facilitate the removal and maintenance of the packaged chips 30 embedded in the circuit board.

[0019] The first plate body 10 and the second plate body 20 are also provided with a plurality of first heat dissipation through holes 15 and a plurality of second heat dissipation through holes 25, respectively. The plurality of first heat dissipation through holes 15 are distributed on the upper and lower surfaces of the first plate body 10 and are respectively connected to the first mounting groove 14 and the outside, and the plurality of second heat dissipation through holes 25 are distributed on the upper and lower surfaces of the second plate body 20 and are respectively connected to the second mounting groove 24 and the outside. Specifically, in the present embodiment, the first heat dissipation through holes 15 and the second heat dissipation through holes 25 are both designed in a conical structure, and the diameter of the inner end thereof is greater than the diameter of the outer end.

[0020] The first heat dissipation through hole 15 and the second heat dissipation through hole 25 can respectively strengthen the airflow and heat exchange between the first mounting groove 14 and the second mounting groove 24 and the outside, so that the heat accumulated by the packaged chip 30 embedded in the circuit board during operation can be dissipated more efficiently, avoiding the problem that the circuit board temperature is too high and affects the function or even causes damage. The conical structure design of the heat dissipation through hole can reduce the risk of external dirt entering the inner side of the mounting groove, thereby affecting the normal operation of the circuit board.

[0021] The embedded ultra-thin packaged circuit board 100 further includes a plurality of fixing pins 40, and the first step 11 and the second step 21 are respectively provided with a plurality of first fixing through holes 16 and second fixing through holes 26 that penetrate up and down. The plurality of fixing pins 40 are respectively passed through the plurality of first fixing through holes 16 and the second fixing through holes 26 to connect and fix the first board body 10 and the second board body 20. The embedded ultra-thin packaged circuit board 100 further includes two sets of fixing ring sleeves 50, and the two sets of fixing ring sleeves 50 are respectively hooped and sleeved at the left edge and the right edge of the first step 11 and the second step 21.

[0022] The fixing pin 40 can be snap-connected to the middle of the step of the first plate body 10 and the second plate body 20, making the snap-fit ​​assembly between the two plates more secure and less likely to loosen, while the fixing ring sleeve 50 can fix the step edge of the first plate body 10 and the second plate body 20, avoiding the problem of warping or even breaking of the circuit board at the connection after snap-fit ​​assembly.

[0023] In summary, the beneficial effects of the embedded ultra-thin packaged circuit board 100 of the utility model are: by designing a first plate body 10 and a second plate body 20 that are snap-connected at both ends, and embedding a packaged chip 30 at the snap-fitting end to form the entire circuit board, not only the overall thickness of the embedded circuit board is optimized and thinned, but also the snap-fitted assembled circuit board is easier to produce, assemble, or disassemble and repair; multiple heat dissipation holes are designed on the circuit board, which can better dissipate heat from the embedded packaged chip 30 and greatly reduce the risk of burning the packaged chip 30 due to long-term high temperature; fixing pins 40 and fixing ring sleeves 50 are designed on the assembled circuit board to strengthen the snap-fit ​​connection, so that the overall structural strength of the circuit board is higher, and the problem of circuit board connection breakage due to external force is greatly reduced; the utility model is highly practical and has a strong promotional significance.

[0024] The above-mentioned embodiment only expresses one implementation method of the utility model, and its description is relatively specific and detailed, but it cannot be understood as limiting the scope of the utility model patent. It should be pointed out that for ordinary technicians in this field, several modifications and improvements can be made without departing from the concept of the utility model, which all belong to the protection scope of the utility model. Therefore, the protection scope of the utility model patent shall be based on the attached claims.

Claims

1. An embedded ultra-thin packaged circuit board, characterized in that: The invention comprises a first plate body, a second plate body and a plurality of packaged chips; a first step is provided on the right side of the bottom of the first plate body, a first clamping block protruding downward and a first clamping through hole penetrating from top to bottom are provided on the first step, and a first mounting groove with an opening on one side is also provided in the first clamping block; a second step is provided on the left side of the top of the second plate body, a second clamping block protruding upward and a second clamping through hole penetrating from top to bottom are provided on the second step, and a second mounting groove with an opening on one side is also provided in the second clamping block; the first step is seamlessly spliced ​​with the second step, and the first clamping block is just clamped in the second clamping through hole, and the second clamping block is just clamped in the first clamping through hole, and a plurality of packaged chips are respectively clamped and installed in the first mounting groove and the second mounting groove.

2. The embedded ultra-thin packaged circuit board according to claim 1, characterized in that: The first plate body and the second plate body are also respectively provided with a plurality of first heat dissipation through holes and a plurality of second heat dissipation through holes; the plurality of first heat dissipation through holes are distributed on the upper and lower surfaces of the first plate body and are respectively connected to the first mounting groove and the outside world, and the plurality of second heat dissipation through holes are distributed on the upper and lower surfaces of the second plate body and are respectively connected to the second mounting groove and the outside world.

3. The embedded ultra-thin packaged circuit board according to claim 2, characterized in that: The first heat dissipation through hole and the second heat dissipation through hole are both designed in a conical structure, and the diameter of the inner end is larger than the diameter of the outer end.

4. The embedded ultra-thin packaged circuit board according to claim 1, characterized in that: It also includes a plurality of fixing pins, and the first step and the second step are respectively provided with a plurality of first fixing through holes and second fixing through holes penetrating up and down; the plurality of fixing pins are respectively passed through the plurality of first fixing through holes and the second fixing through holes to connect and fix the first plate body and the second plate body.

5. The embedded ultra-thin packaged circuit board according to claim 1, characterized in that: It also includes two groups of fixing rings, which are respectively hooped and sleeved on the left edge and the right edge of the first step and the second step.

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