Communication connection device

Abstract

The application provides a communication connection device, comprising: a housing having a first cooling cavity, a second cooling cavity and a plurality of expansion slots, the plurality of expansion slots communicating with the middle area of the first cooling cavity; the second cooling cavity is communicated with the edge area of the first cooling cavity and is positioned on the outer side of the expansion slot; the second cooling cavity and the plurality of expansion slots are positioned on the same side of the first cooling cavity; the fan is positioned in one of the first cooling cavity and the second cooling cavity; the heat conduction part is positioned in one of the expansion slot, the first cooling cavity and the second cooling cavity; the shell is further provided with a ventilation hole communicated with the external environment, the ventilation hole is communicated with one of the first cooling cavity and the second cooling cavity, and the ventilation hole is located in an air outlet path of the draught fan. Through reasonable layout of the fan, the heat conduction piece and the ventilation holes, the heat dissipation capability of the communication connection equipment is effectively improved, heat is prevented from being accumulated in the shell, and therefore the heat dissipation efficiency of the communication connection equipment is improved.

Description

Technical Field

[0001] The present application relates to the field of communication technology, and in particular to a communication connection device. Background Art

[0002] With more and more new energy stations in the power industry, there is a demand for refined management of new energy stations. The construction and management of centralized control centers for new energy stations has become a research hotspot.

[0003] The communication connection device in the related technology provides expandable communication equipment for the needs of data collection and transmission in different scenarios through the design of expansion slots.

[0004] However, when the number of expanded communication devices is large, the heat dissipation capacity of the above communication connection device is insufficient, which will affect the performance of the communication connection device. Utility Model Content

[0005] In order to solve at least one of the problems mentioned in the background technology, the present application provides a communication connection device, which aims to solve the technical problem that when the number of expanded communication devices is large, the heat dissipation capacity of the communication connection device in the related technology is insufficient, which will affect the performance of the communication connection device.

[0006] In order to achieve the above object, the present application provides a communication connection device, including:

[0007] A housing having a first cooling cavity, a second cooling cavity and a plurality of expansion slots, wherein the plurality of expansion slots are arranged adjacent to each other in sequence, and the plurality of expansion slots are all connected to a middle area of ​​the first cooling cavity;

[0008] The second cooling cavity is connected to the edge area of ​​the first cooling cavity and is located outside the expansion slot; the second cooling cavity and the plurality of expansion slots are located on the same side of the first cooling cavity;

[0009] A power supply, located in the first cooling chamber;

[0010] A circuit board is located in the first cooling cavity, and the circuit board is electrically connected to the power supply;

[0011] A communication device and a control device, wherein the communication device and the control device are located in different expansion slots, and both the communication device and the control device are electrically connected to the circuit board;

[0012] a fan located in one of the first cooling chamber and the second cooling chamber;

[0013] a heat conducting member, located in one of the expansion slot, the first cooling cavity, and the second cooling cavity;

[0014] The housing further has a ventilation hole connected to the external environment, the ventilation hole is connected to one of the first cooling cavity and the second cooling cavity, and the ventilation hole is located on the air outlet path of the fan.

[0015] In the above-mentioned communication connection device, optionally, the second cooling cavity covers and communicates with a portion of the expansion slots.

[0016] In the above-mentioned communication connection device, optionally, there are multiple second cooling cavities, the multiple second cooling cavities are arranged adjacent to each other, and two adjacent second cooling cavities are connected.

[0017] In the above-mentioned communication connection device, optionally, the plurality of the second cooling chambers are connected to the plurality of the expansion slots in a one-to-one correspondence.

[0018] In the above communication connection device, optionally, a portion of the heat conductive member is located in the second cooling cavity, and another portion is located in the expansion slot, for conducting heat in the expansion slot.

[0019] In the above communication connection device, optionally, when the fan includes a first fan and a second fan, the number of the first fan is multiple;

[0020] The plurality of first fans are spaced apart and located in the first cooling cavity, and correspond one-to-one to the plurality of expansion slots, and are used to introduce heat in the expansion slots into the first cooling cavity;

[0021] The second fan is located in the second cooling cavity and close to the first cooling cavity, and the second fan is used for introducing heat in the first cooling cavity into the second cooling cavity.

[0022] In the above-mentioned communication connection device, optionally, when there are multiple second cooling cavities, multiple second fans correspond one-to-one to multiple second cooling cavities, and the second fans are located in the corresponding second cooling cavities.

[0023] In the above communication connection device, optionally, the heat conducting member includes a first heat conducting member and a second heat conducting member, and the number of the first heat conducting member is multiple;

[0024] The plurality of first heat-conducting members are spaced apart and located in the first cooling cavity, and correspond one-to-one to the plurality of expansion slots, and are used to conduct heat in the expansion slots into the first cooling cavity;

[0025] The second heat-conducting member is located in the second cooling cavity and close to the first cooling cavity. The second heat-conducting member is used to conduct heat in the first cooling cavity to the second cooling cavity.

[0026] In the above-mentioned communication connection device, optionally, the heat conductive member is a heat dissipation fin.

[0027] In the above-mentioned communication connection device, optionally, there are multiple communication devices, and the control device is plugged into the expansion slot at the center position.

[0028] The communication connection device provided by the present application effectively improves the heat dissipation capacity of the communication connection device by rationally arranging the fan, heat-conducting parts and ventilation holes, avoids heat accumulation in the housing, and thus improves the heat dissipation efficiency of the communication connection device. The improved communication connection device can effectively dissipate heat, avoid performance degradation caused by heat accumulation, and ensure that the communication connection device can maintain a stable working state when running under high load, thereby improving the reliability and service life of the communication connection device.

[0029] The structure of the present application and its other application objects and beneficial effects will be more clearly understood through the description of the preferred embodiments in conjunction with the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0031] Figure 1 A schematic diagram of a first top view structure of a communication connection device provided in an embodiment of the present application;

[0032] Figure 2 A second front view structural schematic diagram of a multi-layer circuit board provided in an embodiment of the present application;

[0033] Figure 3 A partially enlarged schematic diagram of a first top-down structure of a communication connection device provided in an embodiment of the present application.

[0034] Description of reference numerals:

[0035] 10- Communication connection equipment;

[0036] 100 - housing; 101 - first cooling cavity; 102 - second cooling cavity; 103 - expansion slot; 104 - ventilation hole;

[0037] 200-power supply; 300-circuit board; 400-communication device; 500-control device;

[0038] 600- fan; 610- first fan; 620- second fan;

[0039] 700 - heat conducting member; 710 - first heat conducting member; 720 - second heat conducting member.

[0040] The above drawings have shown clear embodiments of the present application, which will be described in more detail later. These drawings and text descriptions are not intended to limit the scope of the present application in any way, but to illustrate the concept of the present application to those skilled in the art by referring to specific embodiments. DETAILED DESCRIPTION

[0041] CN218413275U discloses a new energy intelligent communication device, including: a housing, a front cover, an upper cover, an expansion slot, an indication module, a communication module, a power module, a main control processing module and a heat dissipation module. The housing is in the shape of a cavity with an opening at the front end, the front cover is mounted on the housing and covers the opening, the indication module is mounted on the front cover, the expansion slot is mounted in the housing, the housing has a hollow corresponding to the position of the expansion slot, the upper cover covers the hollow and is detachably connected to the housing, the communication module includes a wired communication module and a wireless communication module, the indication module and the communication module are both connected to the main control processing module, and the power module supplies power to the remaining components. The heat dissipation module includes a fan and a heat dissipation plate, the fan and the heat dissipation plate are both mounted in the housing, the heat dissipation plate is attached to the main control processing module, the heat dissipation plate is provided with a notch for accommodating the fan, the housing has a number of ventilation holes at the position corresponding to the fan, and the fan is connected to the main control processing module.

[0042] However, when the number of expanded communication devices is large, heat is easily accumulated in the housing, and the heat dissipation capacity of the new energy intelligent communication device is insufficient, which will affect the performance of the new energy intelligent communication device.

[0043] Based on the above technical problems, an embodiment of the present application provides a communication connection device, including: a shell, having a first cooling cavity, a second cooling cavity and a plurality of expansion slots, the plurality of expansion slots are arranged adjacent to each other in sequence; the plurality of expansion slots are all connected to the middle area of ​​the first cooling cavity, and the expansion slots are used to connect the communication device; the second cooling cavity is connected to the edge area of ​​the first cooling cavity, and is located on the outside of the expansion slot; the second cooling cavity and the plurality of expansion slots are all located on the same side of the first cooling cavity; a power supply is located in the first cooling cavity; a circuit board is located in the first cooling cavity, and the circuit board is electrically connected to the power supply; a communication device and a control device, the communication device and the control device are located in different expansion slots, and the communication device and the control device are both electrically connected to the circuit board; a fan, located in one of the first cooling cavity and the second cooling cavity; a heat conductor, located in one of the first cooling cavity and the second cooling cavity; the shell also has a ventilation hole connected to the external environment, the ventilation hole is connected to one of the first cooling cavity and the second cooling cavity, and the ventilation hole is located on the air outlet path of the fan.

[0044] The communication connection device provided in the embodiment of the present application effectively improves the heat dissipation capacity of the communication connection device by rationally arranging the fan, heat conducting member and ventilation hole, avoids the accumulation of heat in the housing, and thus improves the heat dissipation efficiency of the communication connection device. The improved communication connection device can effectively dissipate heat, avoid the degradation of performance caused by heat accumulation, and ensure that the communication connection device can maintain a stable working state when running under high load, thereby improving the reliability and service life of the communication connection device.

[0045] In order to make the purpose, technical solutions and advantages of the present application clearer, the technical solutions in the embodiments of the present application will be described in more detail below in conjunction with the drawings in the preferred embodiments of the present application. In the drawings, the same or similar reference numerals throughout represent the same or similar structural parts or structural parts with the same or similar functions. The described embodiments are part of the structural embodiments of the present application, rather than the embodiments of the full structure. The embodiments described below with reference to the drawings are exemplary and are intended to be used to explain the present application, and should not be construed as limitations on the present application. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the present application. The embodiments of the present application are described in detail below in conjunction with the drawings.

[0046] Reference Figure 1-Figure 3 As shown, the present application provides a communication connection device 10 , including a housing 100 , a power supply 200 , a circuit board 300 , a communication device 400 , a control device 500 , a fan 600 and a heat conductor 700 .

[0047] The housing 100 has a first cooling cavity 101, a second cooling cavity 102 and a plurality of expansion slots 103. The power supply 200 is located in the first cooling cavity 101. For example, the power supply 200 module adopts AC / DC 220V power supply, and converts 220V strong electricity into 5V and 3.3V weak electricity through circuits such as a high-frequency transformer and a power supply 200 chip, thereby providing a stable power supply.

[0048] The circuit board 300 is located in the first cooling chamber 101, and the circuit board 300 is electrically connected to the power supply 200. The circuit board 300 can be electrically connected to multiple modules, such as a main control processing module, a wired communication module, and a wireless communication module. Exemplarily, the wired communication module includes a serial communication circuit, an SPI communication unit, an IC communication unit, and a USB communication unit, and the serial communication circuit, the SPI communication unit, the IC communication unit, and the USB communication unit are all connected to the communication end of the main control processing module; Exemplarily, the wireless communication module includes a wireless public network communication unit, a WiFi unit, and an Ethernet communication unit, and the wireless public network communication unit adopts a G / G / G wireless public network communication unit, and the wireless public network communication unit, the WiFi unit, and the Ethernet communication unit are all connected to the communication end of the main control processing module to realize wireless data transmission of the communication device.

[0049] It should be noted that each wired communication module may be formed with an interface, and the interface may be exposed in the expansion slot 103 .

[0050] The multiple expansion slots 103 are arranged adjacent to each other in sequence, and the multiple expansion slots 103 are all connected to the middle area of ​​the first cooling cavity 101; the second cooling cavity 102 is connected to the edge area of ​​the first cooling cavity 101 and is located outside the expansion slots 103; the second cooling cavity 102 and the multiple expansion slots 103 are all located on the same side of the first cooling cavity 101. The second cooling cavity 102 can be located above, below or to the side of the expansion slot 103.

[0051] It is understandable that the number of expansion slots 103 can be arbitrary. For example, the number of expansion slots 103 can be two, three, four, five, six, etc. The embodiment of the present application does not limit the specific number of expansion slots 103, nor is it limited to the above example.

[0052] The following description is made by taking the case where the number of the expansion slots 103 is five as an example.

[0053] The communication device 400 and the control device 500 are located in different expansion slots 103, and both the communication device 400 and the control device 500 are electrically connected to the circuit board 300. It is understandable that both the communication device 400 and the control device 500 have plugs corresponding to the above-mentioned interface to achieve electrical connection between the communication device 400, the control device 500 and the circuit board 300.

[0054] The first cooling cavity 101 includes a middle area and an edge area located around the middle area. It should be noted that the middle area is connected to the edge area.

[0055] The fan 600 is located in one of the first cooling cavity 101 and the second cooling cavity 102. The heat conducting member 700 is located in one of the expansion slot 103, the first cooling cavity 101 and the second cooling cavity 102.

[0056] It is understandable that the fan 600 can be used to conduct heat, and the heat conductive member 700 can be used to conduct heat. By arranging the fan 600 in one of the first cooling cavity 101 and the second cooling cavity 102, and arranging the heat conductive member 700 in one of the expansion slot 103, the first cooling cavity 101, and the second cooling cavity 102, the heat conduction rate of the first cooling cavity 101, the second cooling cavity 102, and the expansion slot 103 can be enhanced, thereby improving the heat dissipation capacity of the communication connection device 10.

[0057] The housing 100 also has a ventilation hole 104 connected to the external environment. It should be noted that the shape of the ventilation hole 104 can be arbitrary. Exemplarily, the shape of the ventilation hole 104 can be a regular polygon such as a circle, a square, a triangle, or an irregular shape. The embodiment of the present application does not limit the specific shape of the ventilation hole 104, nor is it limited to the above example.

[0058] The ventilation hole 104 is connected to one of the first cooling cavity 101 and the second cooling cavity 102 , and the ventilation hole 104 is located on the air outlet path of the fan 600 to conduct heat to the outside of the communication connection device 10 .

[0059] The communication connection device 10 provided in the embodiment of the present application effectively improves the heat dissipation capacity of the communication connection device 10 by rationally arranging the fan 600, the heat conducting member 700 and the ventilation hole 104, and avoids the accumulation of heat in the housing 100, thereby improving the heat dissipation efficiency of the communication connection device 10. The improved communication connection device 10 can effectively dissipate heat, avoid the degradation of performance caused by heat accumulation, and ensure that the communication connection device 10 can maintain a stable working state when operating under high load, thereby improving the reliability and service life of the communication connection device 10.

[0060] Reference Figure 1-Figure 3 As shown, as an optional implementation, the second cooling cavity 102 covers and communicates with a portion of the expansion slots 103 .

[0061] It is understandable that the number of expansion sockets covered and connected to the second cooling cavity 102 can be arbitrary and can be adjusted according to actual conditions.

[0062] When the second cooling cavity 102 covers the expansion slot 103 , the coverage area of ​​the second cooling cavity 102 is larger, and the contact area between the second cooling cavity 102 and the expansion slot 103 is larger, which is beneficial to heat conduction and heat dissipation.

[0063] Reference Figure 1-Figure 3 As shown, as an optional implementation, there are multiple second cooling cavities 102, and the multiple second cooling cavities 102 are adjacently arranged, and two adjacent second cooling cavities 102 are connected.

[0064] It is understandable that the number of the second cooling chambers 102 can be arbitrary and can be adjusted according to actual conditions.

[0065] Through the above-mentioned setting, when the adjacent second cooling chambers 102 are connected, the heat dissipation area and the number of heat dissipation channels can be effectively increased, the heat dissipation efficiency can be improved, and heat accumulation in the communication connection device 10 can be avoided, ensuring that the communication connection device 10 can maintain a stable working state during high-load operation, thereby improving the reliability and service life of the equipment.

[0066] Reference Figure 1-Figure 3 As shown, as an optional implementation, the plurality of second cooling chambers 102 are connected to the plurality of expansion slots 103 in a one-to-one correspondence.

[0067] It is understandable that the heat dissipation area can be effectively increased by connecting the plurality of second cooling chambers 102 to the plurality of expansion slots 103 in a one-to-one correspondence. Each second cooling chamber 102 and the corresponding expansion slot 103 form a heat dissipation channel, making it easier to conduct heat and improving heat dissipation efficiency.

[0068] Furthermore, adjacent second cooling chambers 102 are connected to form a larger heat dissipation channel, which is conducive to heat conduction, can effectively improve the heat dissipation efficiency, avoid heat accumulation in the communication connection device 10, and ensure that the communication connection device 10 maintains a stable working state when running under high load. In addition, by increasing the heat dissipation area and improving the heat dissipation efficiency, it is possible to avoid the performance degradation of the communication connection device 10 caused by heat accumulation, thereby improving the reliability and service life of the communication connection device 10.

[0069] Reference Figure 1-Figure 3 As shown, as an optional implementation, a portion of the heat conducting member 700 is located in the second cooling cavity 102 , and another portion is located in the expansion slot 103 , for conducting heat in the expansion slot 103 .

[0070] It can be understood that a portion of the heat conductive member 700 is located in the second cooling cavity 102, and can effectively absorb the heat generated in the second cooling cavity 102; another portion of the heat conductive member 700 is located in the expansion slot 103, and can conduct the absorbed heat from the second cooling cavity 102 to the expansion slot 103, thereby achieving effective heat extraction and dispersion.

[0071] It should be noted that conducting heat from the second cooling cavity 102 to the expansion slot 103 through the heat conductor 700 helps to dissipate the heat in the expansion slot 103, optimizes the heat conduction path, improves the heat dissipation efficiency, avoids heat accumulation in the expansion slot 103, and ensures that the communication connection device 10 maintains a stable working state when running under high load.

[0072] In addition, placing part of the heat conductor 700 in the second cooling cavity 102 and the expansion slot 103 helps to achieve balanced distribution and conduction of heat, avoid the generation of hot spots, reduce the risk of local overtemperature of the communication connection device 10, and improve the stability and reliability of the communication connection device 10.

[0073] Reference Figure 1-Figure 3 As shown, as an optional implementation, when the fan 600 includes a first fan 610 and a second fan 620, there are multiple first fans 610. It is understandable that the number of the first fans 610 can be arbitrary and can be adjusted according to actual conditions.

[0074] Among them, multiple first fans 610 are located in the first cooling cavity 101 at intervals and correspond one-to-one to multiple expansion slots 103, and are used to introduce the heat in the expansion slots 103 into the first cooling cavity 101. The heat in the expansion slots 103 can be effectively introduced into the first cooling cavity 101, which can improve the efficiency of heat extraction and is beneficial to heat conduction and heat dissipation.

[0075] The second fan 620 is located in the second cooling cavity 102 and close to the first cooling cavity 101 . The second fan 620 is used to introduce the heat in the first cooling cavity 101 into the second cooling cavity 102 .

[0076] Through the above configuration, the first fan 610 and the second fan 620 are in different cooling chambers, and heat conduction and synergy between the first cooling chamber 101 and the second cooling chamber 102 can be achieved. The first fan 610 introduces the heat in the expansion slot 103 into the first cooling chamber 101, and the second fan 620 introduces the heat in the first cooling chamber 101 into the second cooling chamber 102, which effectively improves the overall heat dissipation efficiency. In addition, through the synergy of the first fan 610 and the second fan 620, heat balance adjustment in different cooling chambers can be achieved to avoid excessively high or low local temperatures, maintain the stability of the internal temperature of the communication connection device 10, and improve the working efficiency and reliability of the communication connection device 10.

[0077] Reference Figure 1-Figure 3 As shown, as an optional implementation, when there are multiple second cooling chambers 102, it is understandable that the number of the second cooling chambers 102 can be arbitrary and can be adjusted according to actual conditions.

[0078] The plurality of second fans 620 correspond one-to-one to the plurality of second cooling chambers 102 , and the second fans 620 are located in the corresponding second cooling chambers 102 .

[0079] More heat dissipation channels can be formed by one-to-one correspondence between multiple second fans 620 and multiple second cooling chambers 102. Each second fan 620 and the corresponding second cooling chamber 102 form an independent heat dissipation system, which helps to improve heat conduction and heat dissipation efficiency.

[0080] In addition, the one-to-one correspondence between the multiple second fans 620 and the multiple second cooling chambers 102 can increase the heat dissipation area and improve the heat dissipation efficiency. The various heat dissipation systems are independent of each other and have good synergy, which can improve the overall heat dissipation efficiency.

[0081] Reference Figure 1-Figure 3 As shown, as an optional embodiment, the heat conducting member 700 includes a first heat conducting member 710 and a second heat conducting member 720, and the number of the first heat conducting member 710 is multiple. It is understandable that the number of the first heat conducting member 710 and the second heat conducting member 720 can be arbitrary and can be adjusted according to actual conditions.

[0082] The plurality of first heat conducting members 710 are spaced apart in the first cooling cavity 101 and correspond one to one with the plurality of expansion slots 103, and are used to conduct the heat in the expansion slots 103 into the first cooling cavity 101, so as to effectively conduct the heat in the expansion slots 103 into the first cooling cavity 101. The first heat conducting members 710 can improve the efficiency of heat conduction, which is beneficial to the conduction and heat dissipation of heat.

[0083] The second heat conducting member 720 is located in the second cooling cavity 102 and close to the first cooling cavity 101 . The second heat conducting member 720 is used to conduct heat in the first cooling cavity 101 to the second cooling cavity 102 .

[0084] Through the above configuration, the first heat conductive member 710 guides the heat in the expansion slot 103 into the first cooling cavity 101, and the second heat conductive member 720 guides the heat in the first cooling cavity 101 into the second cooling cavity 102, which effectively improves the overall heat dissipation efficiency, and can achieve heat conduction and synergy between the first cooling cavity 101 and the second cooling cavity 102. In addition, through the synergy of the first heat conductive member 710 and the second heat conductive member 720, the heat balance adjustment in different cooling cavities is achieved, which can avoid local temperature being too high or too low, maintain the stability of the internal temperature of the communication connection device 10, and improve the working efficiency and reliability of the communication connection device 10.

[0085] Reference Figure 1-Figure 3 As shown, as an optional implementation, the heat conducting member 700 is a heat dissipating fin.

[0086] It can be understood that the heat dissipation fins have a larger surface area, which can increase the contact area between the air and the heat dissipation surface, promote air convection, accelerate the conduction and heat dissipation of heat, and at the same time can effectively increase the heat dissipation area and increase the heat dissipation speed to improve the heat dissipation performance of the communication connection device 10.

[0087] Reference Figure 1-Figure 3 As shown, as an optional implementation, there are multiple communication devices 400, and the control device 500 is plugged into the expansion slot 103 at the central position. It can be understood that the number of communication devices 400 can be arbitrary and can be adjusted according to actual conditions.

[0088] Specifically, plugging the control device 500 into the expansion slot 103 at the central position is conducive to centralized management and control of multiple communication devices 400, and each communication device 400 can be monitored and operated more conveniently, thereby improving management efficiency.

[0089] Furthermore, plugging the control device 500 in the center position can effectively utilize the space, reduce the chaos of the layout of the communication connection device 10, make the layout of the communication connection device 10 more neat and compact, and thus improve the space utilization of the communication connection device 10.

[0090] By plugging the control device 500 into the expansion slot 103 at the central position, it is convenient for maintenance personnel to perform maintenance and replacement. In addition, the operation steps of the maintenance personnel can be reduced, thereby improving maintenance efficiency.

[0091] In the description of the embodiments of the present application, it should be understood that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, or it can be an indirect connection through an intermediate medium, it can be the connection of the structures inside two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0092] The terms "upper", "lower", "front", "back", "vertical", "horizontal", "top", "bottom", "inside", "outside" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific position, be constructed and operated in a specific position, and therefore cannot be understood as limiting the present application. In the description of the present application, "plurality" means two or more, unless otherwise specified.

[0093] The terms "first", "second", "third", "first", etc. in the specification and claims of the present application and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate, so that the embodiments of the present application described herein can be implemented in an order other than those illustrated or described herein. In addition, the terms "including" and "having" and any of their variations are intended to cover non-exclusive inclusions, for example, a process, method, system, product or device that includes a series of steps or units is not necessarily limited to those steps or units that are clearly listed, but may include other steps or units that are not clearly listed or inherent to these processes, methods, products or devices.

[0094] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit it. Although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for the structural or complete structural technical features therein. These modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present application.

Claims

1. A communication connection device, characterized in that: include: A housing having a first cooling cavity, a second cooling cavity and a plurality of expansion slots, wherein the plurality of expansion slots are arranged adjacent to each other in sequence, and the plurality of expansion slots are all connected to a middle area of ​​the first cooling cavity; The second cooling cavity is connected to the edge area of ​​the first cooling cavity and is located outside the expansion slot; the second cooling cavity and the plurality of expansion slots are located on the same side of the first cooling cavity; A power supply, located in the first cooling chamber; A circuit board is located in the first cooling cavity, and the circuit board is electrically connected to the power supply; A communication device and a control device, wherein the communication device and the control device are located in different expansion slots, and both the communication device and the control device are electrically connected to the circuit board; a fan located in one of the first cooling chamber and the second cooling chamber; a heat conducting member, located in one of the expansion slot, the first cooling cavity, and the second cooling cavity; The housing further has a ventilation hole connected to the external environment, the ventilation hole is connected to one of the first cooling cavity and the second cooling cavity, and the ventilation hole is located on the air outlet path of the fan.

2. The communication connection device according to claim 1, characterized in that: The second cooling cavity covers and communicates with a portion of the expansion slots.

3. The communication connection device according to claim 1, characterized in that: There are multiple second cooling cavities, and the multiple second cooling cavities are adjacently arranged, and two adjacent second cooling cavities are connected.

4. The communication connection device according to claim 3, characterized in that: The plurality of second cooling chambers are connected to the plurality of expansion slots in a one-to-one correspondence.

5. The communication connection device according to claim 4, characterized in that: A portion of the heat conducting member is located in the second cooling cavity, and another portion is located in the expansion slot, for conducting heat out of the expansion slot.

6. The communication connection device according to any one of claims 1 to 5, characterized in that: The fan comprises a first fan and a second fan, and the number of the first fan is multiple; The plurality of first fans are spaced apart and located in the first cooling cavity, and correspond one-to-one to the plurality of expansion slots, and are used to introduce heat in the expansion slots into the first cooling cavity; The second fan is located in the second cooling cavity and close to the first cooling cavity, and the second fan is used for introducing heat in the first cooling cavity into the second cooling cavity.

7. The communication connection device according to claim 6, characterized in that: When there are multiple second cooling cavities, the multiple second fans correspond to the multiple second cooling cavities one by one, and the second fans are located in the corresponding second cooling cavities.

8. The communication connection device according to any one of claims 1 to 4, characterized in that: The heat conducting member comprises a first heat conducting member and a second heat conducting member, and the number of the first heat conducting member is multiple; The plurality of first heat-conducting members are spaced apart and located in the first cooling cavity, and correspond one-to-one to the plurality of expansion slots, and are used to conduct heat in the expansion slots into the first cooling cavity; The second heat-conducting member is located in the second cooling cavity and close to the first cooling cavity. The second heat-conducting member is used to conduct heat in the first cooling cavity to the second cooling cavity.

9. The communication connection device according to any one of claims 1 to 4, characterized in that: The heat conducting member is a heat dissipating fin.

10. The communication connection device according to any one of claims 1 to 4, characterized in that: There are multiple communication devices, and the control device is plugged into the expansion slot at the center.

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