Process medium transport structure and semiconductor process equipment

Abstract

The utility model provides a process medium transport structure and semiconductor process equipment, the process medium transport structure comprises a liquid storage part, a gas storage part and a first pressure measuring part, the liquid storage part is communicated with the gas storage part and is used for being communicated with a process medium source, the liquid storage part is used for storing a liquid process medium input by the process medium source, and the first pressure measuring part is used for measuring the pressure of the liquid storage part. The first pressure measuring component is communicated with the gas storage component and conveys process medium steam to the gas storage component, the gas storage component is selectively connected and disconnected with a process chamber of the semiconductor process equipment and is used for temporarily storing the process medium steam, and the first pressure measuring component is communicated with the gas storage component and is used for detecting the pressure of the process medium steam temporarily stored by the gas storage component. The process medium transport structure and the semiconductor process equipment provided by the utility model can enable the process medium steam to enter the process chamber at the gas speed meeting the semiconductor process requirement, thereby improving the semiconductor process result.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductors, and in particular to a process medium transport structure and semiconductor process equipment. Background Art

[0002] In some semiconductor processes, the process medium is stored in liquid form. The liquid process medium is heated to vaporize the liquid process medium to generate process medium vapor. The process medium can then be transported into the process chamber in gaseous form to react with the wafer to achieve semiconductor process processing of the wafer.

[0003] However, in the prior art, the pressure of process medium vapor generated by the vaporization of liquid process medium is relatively low. When the semiconductor process requires the process medium vapor to enter the process chamber at a higher gas velocity, the gas velocity of the process medium vapor cannot meet the requirements of the semiconductor process, thus affecting the semiconductor process results. Utility Model Content

[0004] The utility model aims to solve at least one of the technical problems existing in the prior art, and proposes a process medium transport structure and a semiconductor process equipment, which can enable the process medium vapor to enter the process chamber at a gas speed that meets the semiconductor process requirements, thereby improving the semiconductor process results.

[0005] In order to achieve the purpose of the utility model, a process medium transport structure is provided, including a liquid storage component, a gas storage component and a first pressure measuring component. The liquid storage component is connected to the gas storage component and is used to be connected to a process medium source. The liquid storage component is used to store liquid process medium input from the process medium source and transport process medium vapor to the gas storage component. The gas storage component can be selectively connected and disconnected to a process chamber of a semiconductor process equipment and is used to temporarily store the process medium vapor. The first pressure measuring component is connected to the gas storage component and is used to detect the pressure of the process medium vapor temporarily stored in the gas storage component.

[0006] Optionally, the process medium transport structure further includes a first transport main line and a first on-off component, the first transport main line is connected to the gas storage component and the process chamber respectively, and the first on-off component is arranged on the first transport main line.

[0007] Optionally, the first pressure measuring component is connected to the first transport main line, and the connection between the first pressure measuring component and the first transport main line is located between the gas storage component and the first on-off component, and is used to detect the pressure of the process medium steam temporarily stored in the gas storage component by detecting the pressure of the first transport main line.

[0008] Optionally, the process medium transport structure also includes a second transport main line, a first discharge branch line and a drainage on-off assembly, the liquid storage component is connected to the process medium source through the second transport main line, the second transport main line can extend into the liquid process medium stored in the liquid storage component, the first discharge branch line is connected to the second transport main line and can be connected to the outside world, and the drainage on-off assembly is arranged on the first discharge branch line.

[0009] Optionally, the drainage on-off component includes a second on-off component and / or a first blocking component, the second on-off component is arranged on the first discharge branch pipe, and the first blocking component can be opened and closed to block the end of the first discharge branch pipe connected to the outside.

[0010] Optionally, the process medium transport structure also includes a first purge pipeline and a third on-off component and / or a fourth on-off component arranged on the first purge pipeline, the first purge pipeline is connected to the second transport main pipeline and is used to be connected to a first purge gas source, the first purge pipeline is used to transport the first purge gas to the second transport main pipeline, and the third on-off component and the fourth on-off component are automatic control and manual control components, respectively.

[0011] Optionally, when the process medium transport structure includes the third on-off component and the fourth on-off component, the fourth on-off component is closer to the second transport main pipeline than the third on-off component.

[0012] Optionally, the process medium transport structure also includes a third transport main line and a leak detection component, the third transport main line is connected to the liquid storage component and the gas storage component respectively, and the leak detection component is arranged in cooperation with the third transport main line to detect whether the third transport main line is leaking.

[0013] Optionally, the leak detection component includes a second pressure measuring component, which is connected to the third main transport line and is used to detect the pressure of the third main transport line.

[0014] Optionally, the process medium transport structure further includes a third pressure measuring component, which is connected to the third transport main pipeline and is used to detect the pressure of the process medium steam flowing through the third transport main pipeline.

[0015] Optionally, the process medium transport structure further includes a fifth on-off component and / or a sixth on-off component arranged on the second transport main line, and the fifth on-off component and the sixth on-off component are automatic control components and manual control components, respectively.

[0016] Optionally, when the process medium transporting structure includes the fifth on-off component and the sixth on-off component, the fifth on-off component is closer to the liquid storage component than the sixth on-off component.

[0017] The utility model also provides a semiconductor process equipment, comprising a process chamber and the process medium transport structure provided by the utility model, wherein the process medium transport structure is connected to the process chamber and is used for transporting process medium vapor to the process chamber.

[0018] The utility model has the following beneficial effects:

[0019] The process medium transport structure provided by the utility model can make the process medium steam generated by the liquid process medium stored in the liquid storage component be transported to the gas storage component first by arranging a liquid storage component to be connected with the gas storage component, and the gas storage component and the process chamber can be selectively connected and disconnected, and a first pressure measuring component to be connected with the gas storage component can be arranged, so that the process medium steam generated by the liquid process medium stored in the liquid storage component can be transported to the gas storage component first, and the gas storage component can be isolated from the process chamber so that the gas storage component can temporarily store the process medium steam, and the pressure of the process medium steam temporarily stored in the gas storage component is detected by the first pressure measuring component. When the pressure of the process medium steam temporarily stored in the gas storage component detected by the first pressure measuring component meets the semiconductor process requirements, the process medium steam temporarily stored in the gas storage component can be transported to the process chamber by connecting the gas storage component with the process chamber, so that the process medium steam can enter the process chamber at a gas speed that meets the semiconductor process requirements, thereby improving the semiconductor process results.

[0020] The semiconductor process equipment provided by the utility model can transport process medium vapor to the process chamber by means of the process medium transport structure provided by the utility model, so that the process medium vapor can enter the process chamber at a gas speed that meets the semiconductor process requirements, thereby improving the semiconductor process results. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 A schematic diagram of a structure of a process medium transport structure and a semiconductor process equipment provided by an embodiment of the utility model;

[0022] Figure 2 Another structural schematic diagram of a process medium transport structure and a semiconductor process equipment provided by an embodiment of the utility model;

[0023] Figure 3 A schematic diagram of another structure of the process medium transport structure and semiconductor process equipment provided by the embodiment of the utility model;

[0024] Figure 4 A schematic diagram of another structure of a process medium transport structure and a semiconductor process equipment provided by an embodiment of the utility model;

[0025] Figure 5 A schematic diagram of another structure of the process medium transport structure and semiconductor process equipment provided by the embodiment of the utility model;

[0026] Description of reference numerals:

[0027] 101-first transport main pipeline; 102-second transport main pipeline; 103-third transport main pipeline; 104-first branch pipeline; 105-second branch pipeline; 106-third branch pipeline; 107-first purge main pipeline; 108-first purge branch pipeline; 109-second purge branch pipeline; 110-second purge main pipeline; 111-third purge branch pipeline; 112-first discharge branch pipeline; 113-first discharge main pipeline; 114-second discharge branch pipeline pipeline; 115-third discharge branch pipeline; 116-intake pipe; 117-exhaust pipe; 201-first on-off component; 202-second on-off component; 203-third on-off component; 204-fourth on-off component; 205-fifth on-off component; 206-sixth on-off component; 207-seventh on-off component; 208-eighth on-off component; 209-ninth on-off component; 210-tenth on-off component; 211-eleventh on-off component; 212-twelfth On-off component; 213-13th on-off component; 214-14th on-off component; 215-15th on-off component; 216-16th on-off component; 217-17th on-off component; 218-18th on-off component; 219-19th on-off component; 301-liquid storage component; 302-gas storage component; 303-first pressure measuring component; 304-second pressure measuring component; 305-third pressure measuring component; 306-first heating component; 307-second heating component Component; 308-first plugging component; 309-second plugging component; 310-first flow detection component; 311-first flow control component; 312-second flow control component; 313-fourth pressure measuring component; 314-first pressure regulating component; 315-first pressure difference detection component; 316-second pressure difference detection component; 317-vaporization chamber; 401-process medium source; 402-process chamber; 403-suction component; 404-exhaust treatment device. DETAILED DESCRIPTION

[0028] In order to enable those skilled in the art to better understand the technical solution of the present invention, the process medium transport structure and semiconductor process equipment provided by the present invention are described in detail below in conjunction with the accompanying drawings.

[0029] like Figure 1As shown, an embodiment of the utility model provides a process medium transport structure, including a liquid storage component 301, a gas storage component 302 and a first pressure measuring component 303. The liquid storage component 301 is connected to the gas storage component 302 and is used to be connected to a process medium source 401 (Auto Refill System). The liquid storage component 301 is used to store liquid process medium input by the process medium source 401 and transport process medium vapor to the gas storage component 302. The gas storage component 302 and the process chamber 402 of the semiconductor process equipment can be selectively connected and disconnected for temporarily storing the process medium vapor. The first pressure measuring component 303 is connected to the gas storage component 302 for detecting the pressure of the process medium vapor temporarily stored in the gas storage component 302.

[0030] The process medium transport structure provided by the embodiment of the utility model can make the process medium vapor generated by the liquid process medium stored in the liquid storage part 301 be transported to the gas storage part 302 first, by setting the liquid storage part 301 to be connected with the gas storage part 302, and setting the gas storage part 302 to be selectively connected and disconnected with the process chamber 402, and setting the first pressure measuring part 303 to be connected with the gas storage part 302, so that the process medium vapor generated by the liquid process medium stored in the liquid storage part 301 can be transported to the gas storage part 302 first, and by isolating the gas storage part 302 from the process chamber 402, the gas storage part 302 can temporarily store the process medium vapor, so as to The first pressure measuring component 303 is assisted to detect the pressure of the process medium vapor temporarily stored in the gas storage component 302. When the pressure of the process medium vapor temporarily stored in the gas storage component 302 detected by the first pressure measuring component 303 meets the semiconductor process requirements, the process medium vapor temporarily stored in the gas storage component 302 can be transported to the process chamber 402 by connecting the gas storage component 302 with the process chamber 402, so that the process medium vapor can enter the process chamber 402 at a gas speed that meets the semiconductor process requirements, thereby improving the semiconductor process results.

[0031] Specifically, in practical applications, when the semiconductor process starts, the gas storage component 302 can be isolated from the process chamber 402, and the liquid process medium provided by the process medium source 401 can be first transported to the liquid storage component 301 and stored in the liquid storage component 301. Afterwards, when the liquid process medium stored in the liquid storage component 301 is vaporized to generate process medium vapor, the process medium vapor in the liquid storage component 301 can be transported to the gas storage component 302. Since the gas storage component 302 is isolated from the process chamber 402 at this time, the process medium vapor transported to the gas storage component 302 can be temporarily stored in the gas storage component 302 at this time, and the first pressure measuring component 303 can detect the pressure at this time. The pressure of the process medium vapor temporarily stored in the gas storage component 302. Later, when the pressure of the process medium vapor temporarily stored in the gas storage component 302 detected by the first pressure measuring component 303 meets the requirements of the semiconductor process, the gas storage component 302 can be connected with the process chamber 402 to allow the process medium vapor temporarily stored in the gas storage component 302 to be transported to the process chamber 402. At this time, the process medium vapor transported from the gas storage component 302 to the process chamber 402 can be transported at a pressure that meets the requirements of the semiconductor process. Therefore, the process medium vapor entering the process chamber 402 at this time can enter at a gas speed that meets the requirements of the semiconductor process, thereby improving the semiconductor process results.

[0032] Optionally, the gas storage component 302 may include a gas storage cavity.

[0033] Optionally, the liquid storage component 301 may include a liquid storage cavity.

[0034] like Figure 1 As shown, in one embodiment of the utility model, the process medium transport structure may also include a first transport main line 101 and a first on-off component 201, the first transport main line 101 is connected to the gas storage component 302 and the process chamber 402 respectively, and the first on-off component 201 is arranged on the first transport main line 101.

[0035] In practical applications, the first on-off component 201 can be used to control the on-off of the first transport main line 101, so that the gas storage component 302 and the process chamber 402 can be selectively on-off. When the first on-off component 201 controls the first transport main line 101 to be cut off, the gas storage component 302 and the process chamber 402 are cut off by the first on-off component 201, and the gas storage component 302 can temporarily store the process medium vapor. When the first on-off component 201 controls the first transport main line 101 to be connected, the gas storage component 302 and the process chamber 402 can be connected through the first transport main line 101, and the process medium vapor temporarily stored in the gas storage component 302 can be transported to the process chamber 402 through the first transport main line 101.

[0036] In one embodiment of the utility model, the first pressure measuring component 303 can be connected to the first transport main line 101, and the connection point between the first pressure measuring component 303 and the first transport main line 101 is located between the gas storage component 302 and the first on-off component 201, and is used to detect the pressure of the process medium steam temporarily stored in the gas storage component 302 by detecting the pressure of the first transport main line 101.

[0037] In practical applications, when the first on-off component 201 controls the first transport main line 101 to be cut off, since the gas storage component 302 can be connected to the portion of the first transport main line 101 located between the gas storage component 302 and the first on-off component 201, the process medium steam transported from the liquid storage component 301 to the gas storage component 302 can be transported not only to the gas storage component 302, but also to the portion of the first transport main line 101 located between the gas storage component 302 and the first on-off component 201. Therefore, by setting the first pressure measuring component 303 is connected with the first transport main line 101, and the connection point between the first pressure measuring component 303 and the first transport main line 101 is located between the gas storage component 302 and the first on-off component 201, so that the first pressure measuring component 303 can be connected with the gas storage component 302 through the part of the first transport main line 101 located between the gas storage component 302 and the first on-off component 201, so that the pressure of the process medium steam temporarily stored in the gas storage component 302 can be detected by detecting the pressure of the first transport main line 101 with the help of the first pressure measuring component 303.

[0038] Optionally, the measuring range of the first pressure measuring component 303 may be 1000 Torr.

[0039] like Figures 1 to 5 As shown, in one embodiment of the utility model, the process medium transport structure may also include a second transport main line 102, a first discharge branch line 112 and a liquid discharge on-off assembly. The liquid storage component 301 is connected to the process medium source 401 through the second transport main line 102. The second transport main line 102 can extend into the liquid process medium stored in the liquid storage component 301. The first discharge branch line 112 is connected to the second transport main line 102 and can be connected to the outside world. The liquid discharge on-off assembly is arranged on the first discharge branch line 112.

[0040] In actual applications, the liquid process medium provided by the process medium source 401 can be transported to the liquid storage component 301 through the second transport main line 102. Since the liquid process medium may have dangerous characteristics such as self-ignition, corrosiveness, toxicity, etc. Therefore, when the vaporization device leaks, it is necessary to discharge the liquid process medium remaining in the second transport main line 102 and the liquid storage component 301 as soon as possible to avoid dangerous injuries caused by leakage of the liquid process medium. And when the vaporization device needs to be repaired, maintained or replaced, in order to ensure the safety of the repair, maintenance and replacement personnel, it is necessary to purge the second transport main line 102 and the liquid storage component 301 to avoid liquid process medium remaining in the second transport main line 102 and the liquid storage component 301.

[0041] However, in the prior art, when a leak occurs in the vaporization device or the vaporization device needs to be repaired, maintained or replaced, a purge gas is transported to the liquid storage component 301 through the second transport main line 102, and the liquid process medium remaining in the second transport main line 102 is purged through the liquid storage component 301 to the exhaust gas treatment device 404 (Exhaust, abbreviated as EXH) of the semiconductor factory with the help of the purge gas. In addition, the liquid storage component 301 needs to be heated with the help of the vaporization heating component of the vaporization device to vaporize the liquid process medium remaining in the liquid storage component 301 to generate process medium vapor, so that the purge gas transported to the liquid storage component 301 through the second transport main line 102 can carry the process medium vapor to purge the liquid process medium remaining in the liquid storage component 301 to the exhaust gas treatment device 404 of the semiconductor factory. However, due to the large distance between the second transport main line 102 and the liquid storage component 301 and the exhaust gas treatment device 404 of the semiconductor factory, it takes a long time for the liquid process medium remaining in the second transport main line 102 and the liquid storage component 301 to be purged to the exhaust gas treatment device 404 of the semiconductor factory. As a result, when the vaporization device leaks, the liquid process medium remaining in the second transport main line 102 and the liquid storage component 301 cannot be discharged in time. In addition, if the heating function of the vaporization heating component of the vaporization device fails or cannot be used, the liquid process medium remaining in the liquid storage component 301 cannot be vaporized to produce process medium steam. When the vaporization device leaks and the vaporization device needs to be repaired, maintained or replaced, the liquid process medium remaining in the liquid storage component 301 cannot be completely purged by the purge gas, and liquid process medium will remain in the liquid storage component 301, resulting in poor safety in use.

[0042] The process medium transport structure provided in the embodiment of the utility model is connected with the second transport main pipeline 102 by setting a first discharge branch pipeline 112, and the first discharge branch pipeline 112 can be connected with the outside, and a drainage on-off component is set on the first discharge branch pipeline 112, and the on-off of the first discharge branch pipeline 112 can be controlled by means of the drainage on-off component. Since the second transport main line 102 can extend into the liquid process medium stored in the liquid storage component 301, when the vaporization device leaks or the vaporization device needs to be repaired, maintained or replaced, the liquid storage component 301 can be pressurized, and the first discharge branch line 112 can be controlled to be connected by means of the liquid discharge on-off component, so that the liquid process medium remaining in the liquid storage component 301 can flow back to the second transport main line 102, and flow to the first discharge branch line 112 through the second transport main line 102, and then discharged to the outside through the first discharge branch line 112. In other words, the first discharge branch line 112 can discharge the liquid process medium that flows back from the liquid storage component 301 to the second transport main line 102 to the outside. In actual applications, a container can be used to receive the liquid process medium discharged to the outside from the first discharge branch line 112, so that the liquid process medium remaining in the second transport main line 102 and the liquid storage component 301 can be discharged. When the vaporization device is in normal use, the first discharge branch pipe 112 can be isolated by means of the liquid discharge on-off component, so that the liquid process medium provided by the process medium source 401 can be transported to the liquid storage component 301 through the second transport main pipe 102, and will not be discharged to the outside through the first discharge branch pipe 112.

[0043] Since the first discharge branch pipeline 112 is connected to the second transport main pipeline 102, the distance between the liquid storage component 301 and the first discharge branch pipeline 112 is small, so that the time for the liquid process medium remaining in the second transport main pipeline 102 and the liquid storage component 301 to be discharged to the outside through the first discharge branch pipeline 112 is short. In other words, the liquid process medium remaining in the second transport main pipeline 102 and the liquid storage component 301 can be quickly discharged to the outside through the first discharge branch pipeline 112, so that when the vaporization device leaks, the liquid process medium remaining in the second transport main pipeline 102 and the liquid storage component 301 can be discharged as soon as possible to avoid dangerous injuries caused by leakage of the liquid process medium. Furthermore, since the liquid process medium remaining in the liquid storage component 301 flows back to the second transport main line 102 under the action of pressure, there is no need to heat the liquid storage component 301 with the aid of the vaporization heating component of the vaporization device to vaporize the liquid process medium remaining in the liquid storage component 301 to generate process medium steam. In other words, even if the heating function of the vaporization heating component of the vaporization device fails or cannot be used, the liquid process medium remaining in the liquid storage component 301 can still be discharged smoothly, thereby improving the safety of use.

[0044] like Figure 1As shown, in one embodiment of the utility model, the liquid discharge on-off component may include a second on-off component 202 and / or a first blocking component 308, the second on-off component 202 is arranged on the first discharge branch pipe 112, and the first blocking component 308 can be opened and closed to block the end of the first discharge branch pipe 112 that is connected to the outside.

[0045] In practical applications, the on-off of the first discharge branch pipeline 112 can be controlled by means of the second on-off component 202. When the first discharge branch pipeline 112 needs to be controlled to be cut off, the first discharge branch pipeline 112 can be controlled to be cut off by the second on-off component 202, and / or the first blocking component 308 can be closed so that the first blocking component 308 blocks the end of the first discharge branch pipeline 112 connected to the outside world. When the first discharge branch pipeline 112 needs to be controlled to be connected, the first discharge branch pipeline 112 can be controlled to be connected by the second on-off component 202, and / or the first blocking component 308 can be opened so that the first blocking component 308 cancels the blocking of the end of the first discharge branch pipeline 112 connected to the outside world. By providing both the second on-off component 202 and the first blocking component 308, the stability of controlling the on-off of the first discharge branch pipeline 112 can be improved.

[0046] Optionally, the first blocking component 308 may include a plug.

[0047] like Figure 2 As shown, in one embodiment of the utility model, the process medium transport structure may also include a first purge pipeline and a third on-off component 203 and / or a fourth on-off component 204 arranged on the first purge pipeline. The first purge pipeline is connected to the second transport main pipeline 102 and is used to be connected to a first purge gas source (not shown in the figure). The first purge pipeline is used to transport the first purge gas to the second transport main pipeline 102. The third on-off component 203 and the fourth on-off component 204 are automatic control and manual control components, respectively.

[0048] In practical applications, the on-off of the first purge pipeline can be controlled by means of the third on-off component 203 and / or the fourth on-off component 204. Taking the third on-off component 203 and the fourth on-off component 204 provided on the first purge pipeline as an example, when the vaporization device needs to be overhauled, maintained or replaced, or the process medium transport structure is used for the first time, or the process medium transport structure is used for the first time after the overhaul, maintenance or replacement of the vaporization device is completed, the first purge pipeline can be controlled to be connected by means of the third on-off component 203 and the fourth on-off component 204, so that the first purge gas provided by the first purge gas source can be transported to the second transport main pipeline 102 through the first purge pipeline, and then transported to various parts of the process medium transport structure through the second transport main pipeline 102, so that various parts of the process medium transport structure can be purged with the first purge gas. When the vaporization device is in normal use, since there is no need to use the first purge gas provided by the first purge gas source, the first purge pipeline can be isolated by the third on-off component 203 and the fourth on-off component 204, and the process medium can be prevented from flowing to the first purge gas source through the first purge pipeline and contaminating the first purge pipeline and the first purge gas.

[0049] Since the third on-off component 203 is opened only when the vaporization device needs to be overhauled, maintained or replaced, or when the process medium transport structure is used for the first time, or when the process medium transport structure is used for the first time after the vaporization device is overhauled, maintained or replaced, and the automatically controlled third on-off component 203 may leak internally when not in operation for a long time, when the process medium source 401 transports liquid process medium to the liquid storage component 301 through the second transport main line 102, the process medium may flow to the first purge gas source through the first purge line due to the internal leakage of the third on-off component 203, thereby contaminating the first purge line and the first purge gas, thereby causing the first purge gas provided by the first purge gas source to purge various parts of the process medium transport structure through the first purge line and the second transport main line 102 when the process medium transport structure is used for the first time, or when the process medium transport structure is used for the first time after the vaporization device is overhauled, maintained or replaced. This will cause pollution to various parts of the process medium transport structure and affect the semiconductor process results.

[0050] The process medium transport structure provided by the embodiment of the utility model can control the on-off of the first purge pipeline by means of the manually controlled fourth on-off component 204 and the automatically controlled third on-off component 203 respectively by respectively arranging the manually controlled fourth on-off component 204 and the automatically controlled third on-off component 203 on the first purge pipeline. By controlling the on-off of the first purge pipeline by means of the manually controlled fourth on-off component 204, the internal leakage of the automatically controlled third on-off component 203 caused by long-term non-operation can be compensated, thereby reducing the possibility of the process medium entering the first purge pipeline and the first purge gas source from the second transport main line 102, and then reducing the possibility of the first purge pipeline and the first purge gas source being contaminated, and then reducing the possibility of the first purge gas provided by the first purge gas source causing contamination to various parts of the process medium transport structure after purging various parts of the process medium transport structure through the first purge pipeline and the second transport main line 102, thereby improving the stability of the semiconductor process results.

[0051] like Figure 2 As shown, in one embodiment of the present invention, the process medium transport structure may include a third on-off component 203 and a fourth on-off component 204 , and the fourth on-off component 204 may be closer to the second transport main line 102 relative to the third on-off component 203 .

[0052] In this way, the process medium flowing from the second transport main pipeline 102 to the first purge pipeline needs to pass through the fourth on-off component 204 before reaching the third on-off part, thereby further reducing the possibility of the process medium contaminating the first purge pipeline.

[0053] like Figure 2 As shown, optionally, the first purge pipeline may include a first purge main pipeline 107 and a first purge branch pipeline 108, the first purge main pipeline 107 is used to be connected to the first purge gas source, the first purge branch pipeline 108 is respectively connected to the first purge main pipeline 107 and the second transport main pipeline 102, and the third on-off component 203 and the fourth on-off component 204 are respectively arranged on the first purge branch pipeline 108.

[0054] In practical applications, the on-off of the first purge pipeline can be controlled by controlling the on-off of the first purge branch pipeline 108 by means of the third on-off component 203 and the fourth on-off component 204 .

[0055] In practical applications, when the third on-off component 203 and the fourth on-off component 204 respectively control the first purge branch pipeline 108 to be connected, the first purge main pipeline 107 and the second transport main pipeline 102 can be connected through the first purge branch pipeline 108, and the first purge gas provided by the first purge gas source can first enter the first purge main pipeline 107, then enter the first purge branch pipeline 108 through the first purge main pipeline 107, and then enter the second transport main pipeline 102 through the first purge branch pipeline 108. Main pipeline 102, when the third on-off component 203 and the fourth on-off component 204 respectively control the isolation of the first purge branch pipeline 108, the first purge branch pipeline 108 is isolated by the third on-off component 203 and the fourth on-off component 204, the first purge main pipeline 107 and the second transport main pipeline 102 cannot be connected through the first purge branch pipeline 108, and the first purge gas in the first purge main pipeline 107 cannot enter the second transport main pipeline 102 through the first purge branch pipeline 108.

[0056] like Figure 2 As shown, in one embodiment of the utility model, the process medium transport structure may also include a third transport main line 103 and a leak detection component, the third transport main line 103 is connected to the liquid storage component 301 and the gas storage component 302 respectively, and the leak detection component is arranged in conjunction with the third transport main line 103 to detect whether the third transport main line 103 is leaking.

[0057] In practical applications, the process medium vapor generated by the vaporization of the liquid process medium in the liquid storage component 301 can first enter the third transport main line 103 from the liquid storage component 301, and then enter the gas storage component 302 through the third transport main line 103, that is, the liquid storage component 301 can transport the process medium vapor to the gas storage component 302 through the third transport main line 103. With the help of the leak detection component, whether the third transport main line 103 is leaking can be detected. When the leak detection component detects that the third transport main line 103 is leaking, the liquid storage component 301 can stop transporting the process medium vapor to the gas storage component 302 through the third transport main line 103, so as to avoid the process medium vapor from continuously leaking from the third transport main line 103 and causing dangerous injuries.

[0058] like Figure 2 As shown, in one embodiment of the present invention, the leak detection component may include a second pressure detection component 304 , which is connected to the third main transport line 103 and is used to detect the pressure in the third main transport line 103 .

[0059] In actual applications, when the semiconductor process is carried out, the liquid storage component 301 transports the process medium vapor to the gas storage component 302 through the third transport main line 103. At this time, the pressure in the process chamber 402 is known, and the process chamber 402 is connected to the third transport main line 103. Therefore, the pressure in the third transport main line 103 is roughly equal to the pressure in the process chamber 402. The pressure in the third transport main line 103 is detected by the second pressure measuring component 304, and then the pressure in the third transport main line 103 detected by the second pressure measuring component 304 is compared with the pressure in the process chamber 402. It can be determined whether the third transport main line 103 is leaking.

[0060] Optionally, the range of the second pressure measuring component 304 can be 10Torr. In this way, the accuracy of the second pressure measuring component 304 in detecting the pressure in the third transport main line 103 can be improved, thereby improving the accuracy and timeliness of detecting whether the third transport main line 103 is leaking, and then the third transport main line 103 can be cut off in time, and the liquid storage component 301 can be stopped from transporting the process medium tangent to the gas storage component 302 through the third transport main line 103 in time, thereby reducing the possibility of causing dangerous harm to personnel. If the range of the second pressure measuring component 304 is larger (for example, 1000Torr), the second pressure measuring component 304 cannot accurately and timely detect the slight leakage of the third transport main line 103 when detecting whether the third transport main line 103 is leaking, thereby causing the slight leakage of the third transport main line 103 to continue, causing dangerous harm to personnel.

[0061] like Figure 2 As shown, in one embodiment of the present invention, the process medium transport structure may further include a third pressure measuring component 305 , which is connected to the third transport main line 103 and is used to detect the pressure of the process medium steam flowing through the third transport main line 103 .

[0062] Optionally, the third pressure measuring component 305 may be closer to the liquid storage component 301 relative to the second pressure measuring component 304 .

[0063] Optionally, the measuring range of the third pressure measuring component 305 may be 1000 Torr.

[0064] like Figure 2 As shown, in one embodiment of the utility model, the process medium transport structure may also include a fifth on-off component 205 and / or a sixth on-off component 206 arranged on the second transport main line 102, and the fifth on-off component 205 and the sixth on-off component are automatic control and manual control components respectively.

[0065] In practical applications, the on-off of the second main transport line 102 can be controlled by means of the fifth on-off component 205 and / or the sixth on-off component 206. Taking the case where the fifth on-off component 205 and the sixth on-off component 206 are provided on the second main transport line 102 as an example, when the fifth on-off component 205 and the sixth on-off component 206 respectively control the connection of the second main transport line 102, the liquid process medium provided by the process medium source 401 can be transported to the liquid storage component 301 through the second main transport line 102, and when the fifth on-off component 205 and the sixth on-off component 206 respectively control the isolation of the second main transport line 102, the liquid process medium provided by the process medium source 401 cannot be transported to the liquid storage component 301 through the second main transport line 102.

[0066] like Figure 2 As shown, in one embodiment of the present invention, the process medium transport structure may include a fifth on-off component 205 and a sixth on-off component 206 , and the fifth on-off component 205 is closer to the liquid storage component 301 than the sixth on-off component 206 .

[0067] Since the reliability of the manually controlled sixth on-off component 206 is higher than that of the automatically controlled fifth on-off component 205, by making the automatically controlled fifth on-off component 205 closer to the liquid storage component 301 relative to the manually controlled sixth on-off component 206, that is, the manually controlled sixth on-off component 206 is closer to the process medium source 401 relative to the automatically controlled fifth on-off component 205, the reliability of control over whether the liquid process medium provided by the process medium source 401 can enter the second transport main line 102 can be improved.

[0068] Optionally, the fifth on-off component 205 may be located away from the liquid storage component 301 relative to the connection point between the first purge branch pipeline 108 and the second transport main pipeline 102 .

[0069] like Figure 3 As shown, optionally, the process medium transport structure may also include a first branch pipeline 104 and a seventh on-off component 207, the first branch pipeline 104 being connected to the first transport main pipeline 101 and the first pressure measuring component 303 respectively, and the connection point between the first branch pipeline 104 and the first transport main pipeline 101 is located between the gas storage component 302 and the first on-off component 201, and the seventh on-off component 207 is arranged on the first branch pipeline 104.

[0070] In practical applications, the opening and closing of the first branch pipeline 104 can be controlled by means of the seventh on-off component 207. When the seventh on-off component 207 controls the first branch pipeline 104 to be connected, the first pressure measuring component 303 can be connected with the first main transport pipeline 101 through the first branch pipeline 104, and can detect the pressure of the first main transport pipeline 101. When the seventh on-off component 207 controls the first branch pipeline 104 to be cut off, the first pressure measuring component 303 cannot be connected with the first main transport pipeline 101 through the first branch pipeline 104, and cannot detect the pressure of the first main transport pipeline 101.

[0071] like Figure 3 As shown, optionally, the process medium transport structure may further include a second branch pipeline 105 and an eighth on-off component 208 , the second branch pipeline 105 being respectively connected to the third transport main pipeline 103 and the second pressure measuring component 304 , and the eighth on-off component 208 being disposed on the second branch pipeline 105 .

[0072] In practical applications, the on-off of the second branch pipeline 105 can be controlled by means of the eighth on-off component 208. When the eighth on-off component 208 controls the second branch pipeline 105 to be connected, the second pressure measuring component 304 can be connected to the third main transport pipeline 103 through the second branch pipeline 105, and can detect the pressure of the third main transport pipeline 103. When the eighth on-off component 208 controls the second branch pipeline 105 to be cut off, the second pressure measuring component 304 cannot be connected to the third main transport pipeline 103 through the second branch pipeline 105, and cannot detect the pressure of the third main transport pipeline 103.

[0073] like Figure 3 As shown, optionally, the process medium transport structure may also include a third branch pipeline 106 and a ninth on-off component 209 , the third branch pipeline 106 is respectively connected to the third transport main pipeline 103 and the third pressure measuring component 305 , and the ninth on-off component 209 is arranged on the third branch pipeline 106 .

[0074] In practical applications, the on-off of the third branch pipeline 106 can be controlled by means of the ninth on-off component 209. When the ninth on-off component 209 controls the third branch pipeline 106 to be connected, the third pressure measuring component 305 can be connected with the third main transport pipeline 103 through the third branch pipeline 106, and can detect the pressure in the third main transport pipeline 103. When the eighth on-off component 208 controls the third branch pipeline 106 to be cut off, the third pressure measuring component 305 cannot be connected with the third main transport pipeline 103 through the third branch pipeline 106, and cannot detect the pressure in the third main transport pipeline 103.

[0075] like Figure 3As shown, optionally, the first purge pipeline may also include a second purge branch pipeline 109 and a tenth on-off component 210 , the second purge branch pipeline 109 is respectively connected to the first purge main pipeline 107 and the third transport main pipeline 103 , and the tenth on-off component 210 is arranged on the second purge branch pipeline 109 .

[0076] In practical applications, the on-off state of the second purge branch pipeline 109 can be controlled by means of the tenth on-off component 210 .

[0077] like Figure 3 As shown, optionally, the process medium transport structure may also include a second purge pipeline and an eleventh on-off component 211, the second purge pipeline is connected to the third transport main pipeline 103, and is used to be connected to a second purge gas source (not shown in the figure), and the eleventh on-off component 211 is arranged on the second purge pipeline.

[0078] In practical applications, the on-off of the second purge pipeline can be controlled by means of the eleventh on-off component 211 .

[0079] like Figure 3 As shown, optionally, the second purge pipeline may include a second purge main pipeline 110 and a third purge branch pipeline 111, the second purge main pipeline 110 is used to connect with the second purge gas source, the third purge branch pipeline 111 is respectively connected with the second purge main pipeline 110 and the third transport main pipeline 103, and the eleventh on-off component 211 is arranged on the third purge branch pipeline 111.

[0080] In practical applications, the on-off of the second purge pipeline can be controlled by controlling the on-off of the third purge branch pipeline 111 with the help of the eleventh on-off component 211 .

[0081] like Figure 3 As shown, optionally, the process medium transport structure may also include a first heating component 306 and / or a second heating component 307, the first heating component 306 is arranged in cooperation with the second purge branch pipeline 109, and is used to heat the first purge gas provided by the first purge gas source flowing through the second purge branch pipeline 109, and the second heating component 307 is arranged in cooperation with the third purge branch pipeline 111, and is used to heat the second purge gas provided by the second purge gas source flowing through the third purge branch pipeline 111.

[0082] Such a design is due to the fact that the first purge gas passing through the second purge branch pipeline 109 and the second purge gas passing through the third purge branch pipeline 111 are both transported to the third transport main pipeline 103, mainly for purging the process medium vapor remaining in the third transport main pipeline 103. The first heating component 306 heats the first purge gas provided by the first purge gas source flowing through the second purge branch pipeline 109, and the second heating component 307 heats the second purge gas provided by the second purge gas source flowing through the third purge branch pipeline 111. This can avoid the first purge gas and the second purge gas entering the third transport main pipeline 103 from having too low a temperature, causing the process medium vapor remaining in the third transport main pipeline 103 to liquefy and condense in the third transport main pipeline 103 due to the decrease in temperature, thereby improving the purge effect.

[0083] Optionally, the first purge gas and / or the second purge gas may include nitrogen.

[0084] Optionally, the first heating component 306 and / or the second heating component 307 may include a heat exchanger.

[0085] like Figure 3 As shown, optionally, the process medium transport structure may also include at least one of a twelfth on-off component 212, a thirteenth on-off component 213 and a fourteenth on-off component 214, the twelfth on-off component 212 is arranged on the second transport main line 102, and the twelfth on-off component 212 is close to the liquid storage component 301 relative to the connection between the first discharge branch line 112 and the second transport main line 102, the thirteenth on-off component 213 is arranged on the third transport main line 103, and the thirteenth on-off component 213 is close to the liquid storage component 301 relative to the connection between the second purge branch line 109 and the third transport main line 103, the fourteenth on-off component 214 is arranged on the third transport main line 103, and the fourteenth on-off component 214 is far away from the liquid storage component 301 relative to the connection between the second purge branch line 109 and the third transport main line 103, and is close to the liquid storage component 301 relative to the connection between the third purge branch line 111 and the third transport main line 103.

[0086] In practical applications, the twelfth on-off component 212 can be used to control the on-off of the second main transport path 102, the thirteenth on-off component 213 can be used to control the on-off of the third main transport path 103, and the fourteenth on-off component 214 can be used to control the on-off of the third main transport path 103.

[0087] like Figure 3 As shown, optionally, the process medium transport structure may further include a first flow detection component 310 , which is arranged in cooperation with the third transport main line 103 to detect the flow of gas in the third transport main line 103 .

[0088] Optionally, the first flow detection component 310 can be far away from the liquid storage component 301 relative to the connection between the second purge branch line 109 and the third transport main line 103 , and can be close to the liquid storage component 301 relative to the connection between the third purge branch line 111 and the third transport main line 103 .

[0089] Optionally, the first flow detection component 310 may include a mass flow meter (Mass Flow Controller, abbreviated as MFC).

[0090] like Figure 3 As shown, optionally, the process medium transport structure may further include a first pressure difference detection component 315 , which may be disposed outside the liquid storage component 301 and communicated with the inside of the liquid storage component 301 for detecting the pressure difference between the inside and outside of the liquid storage component 301 .

[0091] like Figure 4 As shown, optionally, the process medium transport structure may also include a vaporization device, which may include a vaporization chamber 317, a liquid storage component 301 and a vaporization heating component (not shown in the figure), the liquid storage component 301 may be disposed in the vaporization chamber 317, and the heater may be disposed in the vaporization chamber 317, for heating the liquid storage component 301, so as to vaporize the liquid process medium stored in the liquid storage component 301 to generate process medium steam.

[0092] Optionally, a portion of the second transport main line 102, a portion of the second purge branch line 109 and a portion of the third transport main line 103 can be arranged in the vaporization chamber 317, and the tenth on-off component 210, the twelfth on-off component 212, the thirteenth on-off component 213, the first flow detection component 310 and the first pressure difference detection component 315 can be arranged in the vaporization chamber 317.

[0093] like Figure 4 As shown, optionally, the process medium transport structure may also include an air inlet pipe 116, an air outlet pipe 117 and a pressure regulating assembly, wherein the air inlet pipe 116 is connected to the vaporization chamber 317 for conveying gas into the vaporization chamber 317, and the air outlet pipe 117 is connected to the vaporization chamber 317 for discharging the gas in the vaporization chamber 317, and the pressure regulating assembly is respectively arranged in cooperation with the air inlet pipe 116 and the air outlet pipe 117 for controlling the pressure in the vaporization chamber 317 by respectively controlling the flow rates of the air inlet pipe 116 and the air outlet pipe 117.

[0094] This design is because the components in the vaporization chamber 317, such as part of the second transport main line 102, part of the second purge branch line 109, part of the third transport main line 103, the tenth on-off component 210, the twelfth on-off component 212, the thirteenth on-off component 213, the first flow detection component 310 and the first pressure difference detection component 315, need to be in a pressure environment that meets the use requirements. If the pressure in the vaporization chamber 317 is lower than the pressure required for use, the vaporization device will be in an unsafe state, which may cause dangerous harm to personnel. Therefore, the process medium transport structure provided in the embodiment of the utility model is respectively arranged in cooperation with the air inlet pipe 116 and the air outlet pipe 117 by setting a pressure regulating component. The pressure in the vaporization chamber 317 can be controlled by controlling the flow of the air inlet pipe 116 and the air outlet pipe 117 respectively with the help of the pressure regulating component, so that the pressure in the vaporization chamber 317 can always meet the pressure required for use, thereby improving the safety of use and reducing the possibility of causing dangerous harm to personnel.

[0095] Optionally, the air inlet pipe 116 may deliver nitrogen into the vaporization chamber 317 .

[0096] like Figure 4 As shown, optionally, the pressure regulating component may include a first flow control component 311 and a second flow control component 312, the first flow control component 311 is arranged in cooperation with the air inlet pipe 116 to control the flow of the air inlet pipe 116, and the second flow control component 312 is arranged in cooperation with the air outlet pipe 117 to control the flow of the air outlet pipe 117.

[0097] Optionally, the first flow control component 311 may include a float-type flowmeter (FM).

[0098] Optionally, the second flow control component 312 may include a needle valve (NV).

[0099] like Figure 4 As shown, optionally, the process medium transport structure may also include at least one of a fourth pressure measuring component 313, a first pressure regulating component 314, a fifteenth on-off component 215 and a second pressure difference detection component 316, the fourth pressure measuring component 313 is connected to the air inlet pipe 116, and is used to detect the pressure of the air inlet pipe 116, the first pressure regulating component 314 is connected to the air inlet pipe 116, and is used to adjust the pressure of the gas flowing through the air inlet pipe 116, the fifteenth on-off component 215 is arranged on the air inlet pipe 116, and the second pressure difference detection component 316 is respectively connected to the air outlet pipe 117 and the outside, and is used for the pressure difference inside and outside the air outlet pipe 117.

[0100] In practical applications, the fifteenth on-off component 215 can be used to control the on-off of the intake pipe 116 .

[0101] Optionally, the fourth pressure measuring component 313 may include a pressure sensor (Pressure Transducer, abbreviated as PT).

[0102] Optionally, the first pressure regulating component 314 may include a pressure regulating valve (Regulator, abbreviated as REG).

[0103] Optionally, the first differential pressure detection component 315 and / or the second differential pressure detection component 316 may include a differential pressure gauge (abbreviated as PS).

[0104] like Figure 5 As shown, optionally, the process medium transport structure may further include a first discharge main pipeline 113, a second discharge branch pipeline 114, a third discharge branch pipeline 115, a sixteenth on-off component 216, a seventeenth on-off component 217, an eighteenth on-off component 218, a nineteenth on-off component 219 and a second blocking component 309, one end of the second discharge branch pipeline 114 is connected to the first transport main pipeline 101, and the connection point between the second discharge branch pipeline 114 and the first transport main pipeline 101 is close to the gas storage component 302 relative to the first on-off component 201, the second blocking component 309 blocks the other end of the second discharge branch pipeline 114, one end of the third discharge branch pipeline 115 is connected to the second transport main pipeline 102, and the other end is connected to the second discharge branch pipeline 114, and the connection point between the third discharge branch pipeline 115 and the second transport main pipeline 102 is located at the fifth on-off component 209. 05 and the sixth on-off component 206, one end of the first discharge main pipeline 113 is connected to the second discharge branch pipeline 114, and the other end is used to communicate with the suction component 403, and the connecting point of the first discharge main pipeline 113 and the second discharge branch pipeline 114 is close to the first transport main pipeline 101 relative to the connecting point of the third discharge branch pipeline 115 and the second discharge branch pipeline 114, the sixteenth on-off component 216 is arranged on the second discharge branch pipeline 114, and the sixteenth on-off component 216 is close to the first transport main pipeline 101 relative to the connecting point of the first discharge main pipeline 113 and the second discharge branch pipeline 114, the seventeenth on-off component 217 is arranged on the first discharge main pipeline, the eighteenth on-off component 218 is arranged at the connecting point of the third discharge branch pipeline 115 and the second discharge branch pipeline 114, and the nineteenth on-off component 219 is arranged on the third discharge branch pipeline 115.

[0105] In actual application, the on-off of the second discharge branch pipeline 114 can be controlled by means of the sixteenth on-off component 216, the on-off of the first discharge main pipeline 113 can be controlled by means of the seventeenth on-off component 217, the on-off between the third discharge branch pipeline 115 and the second discharge branch pipeline 114 can be controlled by means of the eighteenth on-off component 218, and the on-off of the third discharge branch pipeline 115 can be controlled by means of the nineteenth on-off component 219.

[0106] Optionally, the suction component 403 may include a vacuum pump.

[0107] In practical applications, each tube can be a stainless steel tube that has been electrochemically polished, and a metal face seal (Vacuum Coupling Radius Seal, abbreviated as VCR) joint or a ferrule joint can be welded on the stainless steel tube that has been electrochemically polished to connect it to components such as on-off components, pressure measuring components, flow control components, and pressure regulating components through the metal face seal joint or the ferrule joint.

[0108] Optionally, the internal roughness of each tube and the sealing joint may be less than or equal to 0.13 μm.

[0109] like Figure 5 As shown, optionally, the second on-off component 202 , the third on-off component 203 , the fourth on-off component 204 and the sixth on-off component 206 may all include hand valves (Hand valve, abbreviated as HV).

[0110] like Figure 5 As shown, optionally, the first on-off component 201, the fifth on-off component 205, the seventh on-off component 207, the eighth on-off component 208, the ninth on-off component 209, the tenth on-off component 210, the eleventh on-off component 211, the twelfth on-off component 212, the thirteenth on-off component 213, the fourteenth on-off component 214, the fifteenth on-off component 215, the sixteenth on-off component 216, the seventeenth on-off component 217, the eighteenth on-off component 218 and the nineteenth on-off component 219 can all include pneumatic valves (Pneumatic Valve, abbreviated as PV).

[0111] like Figure 5 As shown, optionally, the first pressure measuring component 303, the second pressure measuring component 304 and the third pressure measuring component 305 may all include a vacuum gauge (abbreviated as VG).

[0112] Several usages of the process medium transport structure provided by the embodiments of the present utility model are introduced below. However, the usages of the process medium transport structure provided by the embodiments of the present utility model are not limited thereto.

[0113] like Figure 5As shown, in actual application, after each semiconductor process is completed for the wafer in the process chamber 402, the liquid process medium can be transported to the liquid storage component 301. Specifically, the fifth on-off component 205, the sixth on-off component 206 and the twelfth on-off component 212 can be opened to put the second main transport path 102 in a connected state, so that the liquid process medium provided by the process medium source 401 can pass through the sixth on-off component 206, the fifth on-off component 205 and the twelfth on-off component 212 in sequence, flow through the second main transport path 102 and be transported to the liquid storage component 301.

[0114] In practical applications, after each semiconductor process is completed for the wafer in the process chamber 402, part of the pipeline of the process medium transport structure can be purged. Specifically, the eleventh on-off component 211, the sixteenth on-off component 216 and the seventeenth on-off component 217 can be opened, and the first on-off component 201 and the fourteenth on-off component 214 can be closed, so that the second purge gas provided by the second purge gas source can pass through the second heating component 307, the eleventh on-off component 211, the sixteenth on-off component 216 and the seventeenth on-off component 217 in sequence, and can flow through the second purge main line 110, the third purge branch line 111, the third transport main line 103, the second exhaust branch line 114 and the first exhaust main line 113 in sequence, and be sucked by the suction component 403 to the exhaust gas treatment device 404 of the factory service, so that part of the third transport main line 103 can be purged.

[0115] In practical applications, part of the pipeline of the process medium transport structure can be purged when the process medium transport structure is used for the first time, or when the process medium transport structure is used for the first time after the vaporization device is overhauled, maintained or replaced. Specifically, the third on-off component 203, the fourth on-off component 204, the fifth on-off component 205, the twelfth on-off component 212, the thirteenth on-off component 213, the fourteenth on-off component 214, the sixteenth on-off component 216 and the seventeenth on-off component 217 can be opened to allow the first purge gas provided by the first purge gas source to pass through the third on-off component 203, the fourth on-off component 204, the fifth on-off component 205, the twelfth on-off component 212, the thirteenth on-off component 213, the fourteenth on-off component 214, the sixteenth on-off component 216 and the seventeenth on-off component 217 in sequence. The gas of the first on-off component 213, the fourteenth on-off component 214, the sixteenth on-off component 216 and the seventeenth on-off component 217 can flow through the first purge main line 107, the first purge branch line 108, the second transport main line 102, the liquid storage component 301 and the third transport main line 103 in sequence and be sucked by the suction component 403 to the exhaust gas treatment device 404 of the plant service, so as to purge part of the second transport main line 102, the liquid storage component 301 and the third transport main line 103.

[0116] In actual application, when the vaporization device needs to be repaired, maintained or replaced, the pipelines of the process medium transport structure can be purged in sequence. Specifically, first, the sixth on-off component 206, the nineteenth on-off component 219, the eighteenth on-off component 218 and the seventeenth on-off component 217 can be opened, and the fifth on-off component 205 can be closed, and the purge gas is introduced from the process medium source 401, so that the purge gas can pass through the sixth on-off component 206, the nineteenth on-off component 219, the eighteenth on-off component 218 and the seventeenth on-off component 217 in sequence, and can flow through part of the second transport main line 102, the third discharge branch line 115, part of the second discharge branch line 114 and the first discharge main line 113 in sequence, and be sucked by the suction component 403 to the exhaust gas treatment device 404 of the plant service, so that part of the second transport main line 102 can be purged.

[0117] Afterwards, the third on-off component 203, the fourth on-off component 204, the fifth on-off component 205, the nineteenth on-off component 219, the eighteenth on-off component 218 and the seventeenth on-off component 217 can be opened, and the sixth on-off component 206 and the twelfth on-off component 212 can be closed, so that the first purge gas provided by the first purge gas source can pass through the third on-off component 203, the fourth on-off component 204, the fifth on-off component 205, the nineteenth on-off component 219, the eighteenth on-off component 218 and the seventeenth on-off component 217 in sequence, and can flow through the first purge main line 107, the first purge branch line 108, part of the second transport main line 102, the third discharge branch line 115, part of the second discharge branch line 114 and the first discharge main line 113 in sequence, and be sucked by the suction component 403 to the exhaust gas treatment device 404 of the factory, so that part of the second transport main line 102 can be purged.

[0118] After that, the third on-off component 203, the fourth on-off component 204, the twelfth on-off component 212, the thirteenth on-off component 213, the fourteenth on-off component 214, the sixteenth on-off component 216 and the seventeenth on-off component 217 can be opened, and the first on-off component 201 and the fifth on-off component 205 can be closed, and the liquid storage component 301 is heated to allow the liquid process medium in the liquid storage component 301 to vaporize and generate process medium steam, so that the first purge gas provided by the first purge gas source can pass through the third on-off component 203, the fourth on-off component 204, the twelfth on-off component 212 in sequence. The thirteenth on-off component 213, the fourteenth on-off component 214, the sixteenth on-off component 216 and the seventeenth on-off component 217 can flow through the first purge main line 107, the first purge branch line 108, part of the second transport main line 102, the liquid storage component 301, part of the third transport main line 103, part of the second discharge branch line 114 and the first discharge main line 113 in sequence, and be sucked by the suction component 403 to the exhaust gas treatment device 404 of the factory, so as to purge part of the second transport main line 102, the liquid storage component 301 and part of the third transport main line 103. When performing this step, if the liquid storage part 301 cannot be heated because, for example, the heating function of the vaporization heating part of the vaporization device fails or cannot be used, then before purging, the tenth on-off part 210, the thirteenth on-off part 213, the twelfth on-off part 212, the second on-off part 202 and the first blocking part 308 can be opened, and the fourteenth on-off part 214, the fourth on-off part 204 and the fifth on-off part 205 can be closed, and the first blocking part 308 can be opened, so that the first purge gas provided by the first purge gas source can be The liquid medium can pass through the first heating component 306, the tenth on-off component 210, the thirteenth on-off component 213, the twelfth on-off component 212 and the second on-off component 202 in sequence, and can flow through the first purge main line 107, the second purge branch line 109, part of the third transport main line 103, the liquid storage component 301, part of the second transport main line 102 and the first discharge branch line 112 in sequence to be discharged to the outside, so that the liquid process medium remaining in the liquid storage component 301 can be discharged to the outside through the first discharge branch line 112 first.

[0119] Afterwards, the tenth on-off component 210, the fourteenth on-off component 214, the sixteenth on-off component 216 and the seventeenth on-off component 217 can be opened, and the first on-off component 201 and the thirteenth on-off component 213 can be closed, so that the first purge gas provided by the first purge gas source can pass through the first heating component 306, the tenth on-off component 210, the fourteenth on-off component 214, the sixteenth on-off component 216 and the seventeenth on-off component 217 in sequence, and can flow through the first purge main line 107, the second purge branch line 109, a part of the third transport main line 103, a part of the second discharge branch line 114 and the first discharge main line 113 in sequence, and be sucked by the suction component 403 to the exhaust gas treatment device 404 of the factory, so that part of the third transport main line 103 can be purged.

[0120] like Figure 1-Figure 5 As shown, an embodiment of the present invention further provides a semiconductor process equipment, including a process chamber 402 and a process medium transport structure as provided in an embodiment of the present invention, the process medium transport structure and the process chamber 402 can be selectively connected and disconnected, and is used to transport process medium vapor to the process chamber 402.

[0121] The present invention provides a semiconductor process equipment of an embodiment. By means of the process medium transport structure provided in the embodiment of the present invention, process medium vapor is transported to the process chamber 402, so that the process medium vapor can enter the process chamber 402 at a gas speed that meets the semiconductor process requirements, thereby improving the semiconductor process results.

[0122] Alternatively, the process chamber 402 may include a vertical furnace.

[0123] The vertical furnace can perform, for example, an atomic layer deposition process (ALD), in which process medium vapor can enter the process chamber 402 in a pulsed alternating manner and chemically adsorb and react on the wafer surface to form a thin film.

[0124] In an embodiment of the present invention, the semiconductor process equipment may further include a process medium source 401, which is selectively connectable and disconnectable to the process medium transport structure and is used to provide liquid process medium to the process medium transport structure.

[0125] In summary, the process medium transport structure and semiconductor process equipment provided by the embodiments of the present invention can enable process medium vapor to enter the process chamber at a gas velocity that meets the semiconductor process requirements, thereby improving semiconductor process results.

[0126] It is understood that the above embodiments are merely exemplary embodiments used to illustrate the principles of the present invention, but the present invention is not limited thereto. For those skilled in the art, various modifications and improvements can be made without departing from the spirit and essence of the present invention, and these modifications and improvements are also considered to be within the scope of protection of the present invention.

Claims

1. A process medium transport structure, characterized in that: The invention comprises a liquid storage component, a gas storage component and a first pressure measuring component. The liquid storage component is connected to the gas storage component and is used to be connected to a process medium source. The liquid storage component is used to store liquid process medium input from the process medium source and transport process medium vapor to the gas storage component. The gas storage component can be selectively connected and disconnected to a process chamber of a semiconductor process equipment and is used to temporarily store the process medium vapor. The first pressure measuring component is connected to the gas storage component and is used to detect the pressure of the process medium vapor temporarily stored in the gas storage component.

2. The process medium transport structure according to claim 1, characterized in that: The process medium transport structure further includes a first transport main line and a first on-off component. The first transport main line is communicated with the gas storage component and the process chamber respectively. The first on-off component is disposed on the first transport main line.

3. The process medium transport structure according to claim 2, characterized in that: The first pressure measuring component is connected to the first transport main line, and the connection point between the first pressure measuring component and the first transport main line is located between the gas storage component and the first on-off component, and is used to detect the pressure of the process medium steam temporarily stored in the gas storage component by detecting the pressure of the first transport main line.

4. The process medium transport structure according to claim 1, characterized in that: The process medium transport structure also includes a second transport main line, a first discharge branch line and a liquid discharge on-off assembly. The liquid storage component is connected to the process medium source through the second transport main line. The second transport main line can extend into the liquid process medium stored in the liquid storage component. The first discharge branch line is connected to the second transport main line and can be connected to the outside world. The liquid discharge on-off assembly is arranged on the first discharge branch line.

5. The process medium transport structure according to claim 4, characterized in that: The liquid discharge on-off component includes a second on-off component and / or a first blocking component. The second on-off component is arranged on the first discharge branch pipe. The first blocking component can be opened and closed to block the end of the first discharge branch pipe connected to the outside.

6. The process medium transport structure according to claim 4, characterized in that: The process medium transport structure also includes a first purge pipeline and a third on-off component and / or a fourth on-off component arranged on the first purge pipeline. The first purge pipeline is connected to the second transport main pipeline and is used to be connected to a first purge gas source. The first purge pipeline is used to transport the first purge gas to the second transport main pipeline. The third on-off component and the fourth on-off component are automatic control and manual control components, respectively.

7. The process medium transport structure according to claim 6, characterized in that: When the process medium transporting structure includes the third on-off component and the fourth on-off component, the fourth on-off component is closer to the second transport main line than the third on-off component.

8. The process medium transport structure according to claim 1, characterized in that: The process medium transport structure also includes a third transport main line and a leak detection component. The third transport main line is connected to the liquid storage component and the gas storage component respectively. The leak detection component is arranged in cooperation with the third transport main line to detect whether the third transport main line leaks.

9. The process medium transport structure according to claim 8, characterized in that: The leak detection component includes a second pressure detection component, which is connected to the third main transport line and is used to detect the pressure of the third main transport line.

10. The process medium transport structure according to claim 8, characterized in that: The process medium transport structure further includes a third pressure measuring component, which is connected to the third transport main pipeline and is used to detect the pressure of the process medium steam flowing through the third transport main pipeline.

11. The process medium transport structure according to claim 4, characterized in that: The process medium transport structure further comprises a fifth on-off component and / or a sixth on-off component arranged on the second transport main pipe, wherein the fifth on-off component and the sixth on-off component are automatic control components and manual control components respectively.

12. A semiconductor process equipment, characterized in that: It comprises a process chamber and a process medium transport structure as described in any one of claims 1 to 11, wherein the process medium transport structure is connected to the process chamber and is used to transport process medium vapor to the process chamber.

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