Wafer surface roughness detection device

Abstract

The utility model discloses a wafer surface roughness detection device, and relates to the field of wafer detection devices. The wafer surface roughness detection device comprises an objective lens and a moving table which are arranged at the top of a detection machine, a storage plate is arranged at the top of the moving table, a fixing mechanism is arranged in the storage plate, and the fixing mechanism comprises an arc-shaped plate arranged at the top of the storage plate and used for clamping and fixing a wafer; a worm wheel and a worm are arranged in the storage plate, the worm wheel is used for moving the arc-shaped plate, and the worm is used for rotating the worm wheel. According to the wafer surface roughness detection device, the fixing mechanism is arranged on the object placing plate, the arc-shaped plate can be moved by rotating the worm on the fixing mechanism to clamp and fix the wafer, the situation that the wafer is prone to deviation in the position adjusting process is avoided, meanwhile, the clamping piece is arranged, the worm can be limited, and the detection accuracy is improved. And the worm is prevented from rotating randomly when being touched by mistake.

Description

Technical Field

[0001] The utility model relates to the technical field of wafer detection, in particular to a wafer surface roughness detection device. Background Art

[0002] A wafer refers to a silicon chip used to make silicon semiconductor circuits. Its raw material is silicon. High-purity polycrystalline silicon is dissolved and mixed with silicon crystal seeds, which are then slowly pulled out to form cylindrical single crystal silicon. The silicon crystal rod is then ground, polished, and sliced ​​to form a silicon wafer.

[0003] The surface of the inspection platform on the existing inspection machine is relatively smooth. When the inspection platform is moved to adjust the position of the wafer, the wafer is easily displaced due to inertia, causing the wafer to slide off the inspection platform.

[0004] The reason for this problem is that the roughness of the wafer surface is an important parameter for measuring the quality of the wafer. Therefore, the surface roughness of the processed wafer is usually tested. Since the current wafers are usually placed on the detection platform of the detection machine for detection, in order to ensure the accuracy of wafer detection, the detection platform is usually moved to adjust the position of the wafer so that the objective lens can illuminate different positions. In order to avoid scratches and other damages to the surface of the wafer, the surface of the detection platform is set to be relatively smooth, so that the wafer is easily displaced under the inertia of the moving detection platform, causing the wafer to slip off the detection platform and cause damage. In view of the shortcomings of the existing technology, we propose a wafer surface roughness detection device to solve the above problems. Utility Model Content

[0005] In view of the shortcomings of the prior art, the utility model provides a wafer surface roughness detection device, which solves the problem that the surface of the detection platform on the current detection machine is relatively smooth. When the detection platform is moved to adjust the position of the wafer, the wafer is easily displaced due to inertia, causing the wafer to slide off the detection platform.

[0006] To achieve the above objectives, the utility model is implemented through the following technical solutions: a wafer surface roughness detection device, including an objective lens and a moving stage arranged on the top of a detection machine, a placement plate is arranged on the top of the moving stage, a fixing mechanism is arranged inside the placement plate, and the fixing mechanism includes:

[0007] An arc-shaped plate, which is arranged on the top of the storage plate, and is used to clamp and fix the wafer;

[0008] The turbine and the worm are arranged inside the storage plate, the turbine is used to move the arc plate, and the worm is used to rotate the turbine.

[0009] Preferably, a groove is provided on the top of the storage plate, and the arc-shaped plate is slidably connected inside the groove.

[0010] Preferably, a circular plate is fixedly connected to the top of the turbine, and the circular plate is installed inside the storage plate.

[0011] Preferably, a slide groove is provided on the top of the circular plate, and the bottom of the storage plate is slidably connected to the inside of the slide groove.

[0012] Preferably, the fixing mechanism further comprises:

[0013] A clamping member, which is arranged on the side wall of the storage plate, and is used to fix the worm;

[0014] A spring is fixedly connected to the bottom of the clamp, and the spring is used to reset the clamp.

[0015] Preferably, the turbine is meshed with a worm, the worm penetrates the side wall of the storage plate, the end of the worm is fixedly connected to a rotating plate, the outer peripheral wall of the rotating plate is provided with multiple groups of latching teeth, and the latching member is latched inside the latching teeth.

[0016] Preferably, a square opening is formed on the side wall of the storage plate, the clamp is slidably connected inside the square opening, and the bottom of the spring is fixedly connected to the square opening.

[0017] The utility model discloses a wafer surface roughness detection device, which has the following beneficial effects: the wafer surface roughness detection device, by arranging a fixing mechanism on a placement plate, can move an arc plate to clamp and fix the wafer by rotating a worm on the fixing mechanism, thereby avoiding the wafer from easily deviating during the process of adjusting the position, and at the same time arranging a clamping piece to limit the worm, thereby avoiding the worm from rotating at will when an accidental touch occurs. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0019] Figure 1 It is a structural schematic diagram of the mobile station of the utility model;

[0020] Figure 2 This is a schematic diagram of the structure of the storage plate of the utility model;

[0021] Figure 3 It is a structural schematic diagram of the fixing mechanism of the utility model;

[0022] Figure 4It is a structural schematic diagram of the card component of the utility model.

[0023] In the figure: 1, moving platform; 101, objective lens; 2, storage plate; 201, fixing mechanism; 202, square mouth; 203, groove; 3, arc plate; 4, round plate; 401, slide groove; 402, turbine; 403, worm; 5, rotating plate; 501, tooth; 502, clamp; 503, spring. DETAILED DESCRIPTION

[0024] In order to make the purpose, technical solution and advantages of the embodiments of the utility model clearer, the technical solution in the embodiments of the utility model is described clearly and completely. Obviously, the described embodiments are part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0025] The embodiment of the present application provides a wafer surface roughness detection device, which solves the problem that the surface of the detection platform on the current detection machine is relatively smooth. When the detection platform is moved to adjust the position of the wafer, the wafer is easily displaced due to inertia, causing the wafer to slip off the detection platform.

[0026] In order to better understand the above technical solution, the above technical solution will be described in detail below in conjunction with the accompanying drawings and specific implementation methods.

[0027] The utility model embodiment discloses a wafer surface roughness detection device.

[0028] According to the attached Figure 1-4 As shown, a wafer surface roughness detection device includes an objective lens 101 and a moving platform 1 arranged on the top of a detection machine, a placement plate 2 is arranged on the top of the moving platform 1, and a fixing mechanism 201 is arranged inside the placement plate 2. The fixing mechanism 201 includes:

[0029] The arc plate 3 is arranged on the top of the placement plate 2, and the arc plate 3 is used to clamp and fix the wafer;

[0030] The turbine 402 and the worm 403 are arranged inside the storage plate 2 . The turbine 402 is used to move the arc plate 3 , and the worm 403 is used to rotate the turbine 402 .

[0031] The specific functions and detection of the wafer inspection machine can refer to the wafer inspection equipment model AWL046.

[0032] A groove 203 is formed on the top of the storage plate 2 , and the arc plate 3 is slidably connected inside the groove 203 .

[0033] A circular plate 4 is fixedly connected to the top of the turbine 402 , and the circular plate 4 is installed inside the storage plate 2 .

[0034] A slide groove 401 is provided at the top of the circular plate 4, and the bottom of the storage plate 2 is slidably connected to the inside of the slide groove 401. By rotating the worm 403, the turbine 402 and the circular plate 4 can be driven to rotate. The rotation of the circular plate 4 can drive the arc plate 3 to slide inside the slide groove 401 and the groove 203.

[0035] The fixing mechanism 201 further includes:

[0036] A clamp 502, which is arranged on the side wall of the storage plate 2, and is used to fix the worm 403;

[0037] The spring 503 is fixedly connected to the bottom of the clamp 502 , and is used to reset the clamp 502 .

[0038] The turbine 402 is meshed with the worm 403, and the worm 403 passes through the side wall of the storage plate 2. The end of the worm 403 is fixedly connected to the rotating plate 5. The outer wall of the rotating plate 5 is provided with multiple groups of latch teeth 501, and the latch 502 is latched inside the latch teeth 501. By pulling the latch 502 upward until the latch 502 slides out of the latch teeth 501, the rotating plate 5 and the worm 403 can be rotated.

[0039] A square opening 202 is formed on the side wall of the storage plate 2, and a clamp 502 is slidably connected to the inside of the square opening 202. The bottom of the spring 503 is fixedly connected to the square opening 202. After the clamp 502 is released, the clamp 502 will move downward due to the pulling force of the spring 503 and be inserted into the clamping tooth 501 for fixation.

[0040] When the utility model is in use, the wafer is first placed on the top of the placement plate 2, and then the clamping member 502 is pulled upward until the clamping member 502 slides out of the clamping tooth 501. At this time, the rotating plate 5 and the worm 403 can be rotated, and the worm 403 can drive the turbine 402 and the circular plate 4 to rotate. The rotation of the circular plate 4 can push the arc plate 3 to slide in the groove 203 until the arc plate 3 clamps and fixes the wafer. Secondly, the placement plate 2 can be moved by the moving platform 1, and the surface roughness of the wafer can be detected in cooperation with the objective lens 101.

[0041] In summary, compared with the prior art, the present invention has the following beneficial effects: by setting a fixing mechanism 201 on the placement plate 2, the arc plate 3 can be moved to clamp and fix the wafer by rotating the worm 403 on the fixing mechanism 201, thereby avoiding the wafer from being easily offset during the process of adjusting the position; and at the same time, a clamp 502 is provided to limit the worm 403, thereby avoiding the worm 403 from rotating at will when an accidental touch occurs.

[0042] The above shows and describes the basic principle and main features of the utility model and the advantages of the utility model. Those skilled in the art should understand that the utility model is not limited by the above embodiments. The above embodiments and descriptions are only for explaining the principle of the utility model. Without departing from the spirit and scope of the utility model, the utility model may have various changes and improvements, which fall within the scope of the utility model to be protected. The scope of protection claimed by the utility model is defined by the attached claims and their equivalents.

Claims

1. A wafer surface roughness detection device, comprising an objective lens (101) and a moving platform (1) arranged on the top of a detection machine, characterized in that: A storage plate (2) is arranged on the top of the mobile platform (1), and a fixing mechanism (201) is arranged inside the storage plate (2), wherein the fixing mechanism (201) comprises: An arc-shaped plate (3) is arranged on the top of the storage plate (2), and the arc-shaped plate (3) is used to clamp and fix the wafer; A turbine (402) and a worm (403), wherein the turbine (402) and the worm (403) are arranged inside the storage plate (2), the turbine (402) is used to move the arc plate (3), and the worm (403) is used to rotate the turbine (402).

2. A wafer surface roughness detection device according to claim 1, characterized in that: A groove (203) is provided on the top of the storage plate (2), and the arc-shaped plate (3) is slidably connected inside the groove (203).

3. The wafer surface roughness detection device according to claim 1, characterized in that: A circular plate (4) is fixedly connected to the top of the turbine (402), and the circular plate (4) is installed inside the storage plate (2).

4. The wafer surface roughness detection device according to claim 3, characterized in that: A sliding groove (401) is provided on the top of the circular plate (4), and the bottom of the storage plate (2) is slidably connected inside the sliding groove (401).

5. The wafer surface roughness detection device according to claim 1, characterized in that: The fixing mechanism (201) further comprises: A clamp (502) disposed on a side wall of the storage plate (2), the clamp (502) being used to fix the worm (403); A spring (503) is fixedly connected to the bottom of the clamp (502), and the spring (503) is used to reset the clamp (502).

6. The wafer surface roughness detection device according to claim 5, characterized in that: The turbine (402) is meshed with a worm (403), the worm (403) penetrates the side wall of the storage plate (2), the end of the worm (403) is fixedly connected to a rotating plate (5), the outer peripheral wall of the rotating plate (5) is provided with a plurality of groups of latching teeth (501), and the latching member (502) is latched inside the latching teeth (501).

7. The wafer surface roughness detection device according to claim 6, characterized in that: The side wall of the storage plate (2) is provided with a square opening (202), the clamping member (502) is slidably connected inside the square opening (202), and the bottom of the spring (503) is fixedly connected to the square opening (202).

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