CTP test base plate
By designing a CTP test base plate that integrates multiple TP chips, the complexity of test base plates for different models of display screens in the existing technology is solved, and an efficient test process is realized and the testing process is simplified.
Patent Information
- Application Number
- CN202420358314.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-02-26
- Publication Date
- 2025-01-14
- Estimated Expiration
- 2034-02-26
AI Technical Summary
In the prior art, the touch function test of the display screen requires different models of test base plates, resulting in a complex and inefficient testing process.
Design a CTP test base plate, integrate multiple TP chip chip placement areas of different models, electrically connect the main control chip to the TP chip, and electrically connect the interface components to the client, which can be compatible with multiple TP chips, simplifying the testing process.
By simultaneously compatible with multiple different types of TP chips with one test base, the test efficiency is significantly improved and the testing process is simplified. The test is completed by simply selecting the corresponding model of testing software.
Smart Images

Figure CN222353948U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of display screen testing, in particular to a CTP testing base plate. Background Art
[0002] Currently, most display screens have a touch function, which greatly facilitates use and operation.
[0003] In the related art, the touch function of the display screen needs to be tested before it leaves the factory. At present, different test boards are needed to test different types of display screens, and then the different test boards are inserted into the computer for testing. The above method is relatively complicated and the test efficiency is not high. Utility Model Content
[0004] The utility model aims to overcome the shortcomings of the prior art and provide a CTP test base plate, which can integrate chips of all different types of test base plates into one test base plate, thereby improving the test efficiency.
[0005] The purpose of this utility model is achieved through the following technical solutions:
[0006] The first aspect of the present application provides a CTP test base plate, comprising: a PCB board, a chip placement area is provided on the PCB board, and the chip placement area is used to set a TP chip; a main control chip, the main control chip is electrically connected to the TP chip; an interface component, the interface component is arranged on the main control chip; and a client, the client is electrically connected to the interface component.
[0007] The interface component includes a first plug interface, and the first plug interface is arranged on the main control chip.
[0008] The interface component also includes a second plug interface, and the second plug interface is arranged on the main control chip.
[0009] The interface component also includes a plug end, which is connected to the first plug interface and the second plug interface respectively, and the plug end is connected to the client.
[0010] The interface component also includes a first connection port, and the first connection port is arranged on the main control chip.
[0011] The interface component also includes a second connection port, and the second connection port is arranged on the main control chip.
[0012] It also includes a TP interface, and the TP interface is electrically connected to the first connection port and the second connection port respectively.
[0013] It also includes a connector, the TP interface is arranged on the connector, and the connector is arranged on the PCB board.
[0014] The interface component also includes a power interface, and the power interface is arranged on the main control chip.
[0015] It also includes a power module, which is electrically connected to the power interface.
[0016] Compared with the prior art, the utility model has at least the following advantages:
[0017] By setting a chip placement area, the chip placement area is used to set multiple TP chips, that is, multiple different types of TP chips can be compatible on a PCB board at the same time. When testing, you only need to insert the PCB board into the client and select the corresponding model of test software on the client to complete the test. Through the above method, the test method can be greatly simplified and the test efficiency can be greatly improved. BRIEF DESCRIPTION OF THE DRAWINGS
[0018] In order to more clearly illustrate the technical solutions of the embodiments of the present utility model, the drawings required for use in the embodiments are briefly introduced below.
[0019] Figure 1 This is a schematic diagram of the structure of a CTP test base plate in an embodiment of the utility model;
[0020] Figure 2 This is a circuit diagram of a main control chip in one embodiment of the utility model;
[0021] Figure 3 A circuit diagram of a TP interface and a connector in one embodiment of the present utility model;
[0022] Figure 4 FIG. 4 is a circuit diagram of a power module in an embodiment of the present utility model. DETAILED DESCRIPTION
[0023] The embodiments of the present application will be described in more detail below with reference to the accompanying drawings. Although the embodiments of the present application are shown in the accompanying drawings, it should be understood that the present application can be implemented in various forms and should not be limited by the embodiments described herein. On the contrary, these embodiments are provided to make the present application more thorough and complete, and to fully convey the scope of the present application to those skilled in the art.
[0024] It should be understood that although the terms "first", "second", "third", etc. may be used in this application to describe various information, this information should not be limited to these terms. These terms are only used to distinguish the same type of information from each other. For example, without departing from the scope of this application, the first information may also be referred to as the second information, and similarly, the second information may also be referred to as the first information. Thus, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of this application, the meaning of "multiple" is two or more, unless otherwise clearly and specifically defined.
[0025] Unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, or a detachable connection or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.
[0026] In the related art, the touch function of the display screen needs to be tested before it leaves the factory. At present, different test boards are needed to test different types of display screens, and then the different test boards are inserted into the computer for testing. The above method is relatively complicated and the test efficiency is not high.
[0027] In view of the above problems, an embodiment of the present application provides a CTP test baseboard, which can integrate chips of all different types of test baseboards into one test baseboard, thereby improving the test efficiency.
[0028] The technical solution of the embodiments of the present application is described in detail below with reference to the accompanying drawings.
[0029] See also Figure 1 A CTP test baseboard includes: a PCB board 100, a main control chip 200, an interface component and a client. The PCB board 100 is provided with a chip placement area 110, and the chip placement area 110 is used to set the TP chip; the main control chip 200 is electrically connected to the TP chip; the interface component is arranged on the main control chip; and the client is electrically connected to the interface component.
[0030] It should be noted that there are multiple chip placement areas 110 for placing different TP chips, and the client is a computer. Specifically, by setting the chip placement area 110, the chip placement area is used to set multiple TP chips, that is, multiple different types of TP chips can be compatible on a PCB board 100 at the same time. When testing, it is only necessary to insert the PCB board 100 into the client and select the corresponding model of test software on the client to complete the test. In this way, the test method can be greatly simplified and the test efficiency can be greatly improved.
[0031] See also Figure 2 In one embodiment, the interface component includes a first plug interface, and the first plug interface is arranged on the main control chip 200.
[0032] See also Figure 2 In one embodiment, the interface component further includes a second plug interface, and the second plug interface is disposed on the main control chip 200 .
[0033] See also Figure 2 In one embodiment, the interface component further includes a plug-in end, which is respectively connected to the first plug interface and the second plug interface, and the plug-in end is connected to the client.
[0034] It should be noted that the first plug interface is the interface 41 of the main control chip 200 , the second plug interface is the interface 42 of the main control chip 200 , and the plug end may be a USB cable.
[0035] See also Figure 2 In one embodiment, the interface component further includes a first connection port, and the first connection port is disposed on the main control chip 200 .
[0036] Specifically, the interface component further includes a second connection port, and the second connection port is arranged on the main control chip 200 .
[0037] See also Figure 3 In one embodiment, the TP interface is further included, and the TP interface is electrically connected to the first connection port and the second connection port respectively. Specifically, a connector is further included, and the TP interface is arranged on the connector, and the connector is arranged on the PCB board 100.
[0038] It should be noted that the first connection port is CTP_SDA, the second connection port is CTP_SCL, the TP interface is electrically connected to the touch screen, and the first connection port and the second connection port are used for TP interface connection to communicate with the touch screen.
[0039] See also Figure 1 In one implementation, the interface component further includes a power interface, and the power interface is disposed on the main control chip 200 .
[0040] See also Figure 4Specifically, it also includes a power module, which is electrically connected to the power interface.
[0041] It should be noted that the power module is used to supply power to the main control chip.
[0042] The scheme of the present application has been described in detail above with reference to the accompanying drawings. In the above embodiments, the descriptions of the various embodiments have their own emphasis. For parts that are not described in detail in a certain embodiment, reference can be made to the relevant descriptions of other embodiments. Those skilled in the art should also be aware that the actions and modules involved in the specification are not necessarily required for the present application. In addition, it can be understood that the steps in the method of the embodiment of the present application can be adjusted in order, merged and deleted according to actual needs, and the modules in the device of the embodiment of the present application can be merged, divided and deleted according to actual needs.
[0043] The embodiments of the present application have been described above, and the above description is exemplary, not exhaustive, and is not limited to the disclosed embodiments. Many modifications and changes will be apparent to those of ordinary skill in the art without departing from the scope and spirit of the described embodiments. The selection of terms used herein is intended to best explain the principles of the embodiments, practical applications, or improvements to the technology in the market, or to enable other persons of ordinary skill in the art to understand the embodiments disclosed herein.
Claims
1. A CTP test base plate, characterized in that: include: A PCB board, wherein a chip placement area is provided on the PCB board, and the chip placement area is used to place a TP chip; A main control chip, the main control chip is electrically connected to the TP chip; An interface component, wherein the interface component is arranged on the main control chip; A client is electrically connected to the interface component.
2. The CTP test base plate according to claim 1, characterized in that: The interface component includes a first plug interface, and the first plug interface is arranged on the main control chip.
3. The CTP test base plate according to claim 2, characterized in that: The interface component also includes a second plug interface, and the second plug interface is arranged on the main control chip.
4. The CTP test base plate according to claim 3, characterized in that: The interface component also includes a plug end, which is connected to the first plug interface and the second plug interface respectively, and the plug end is connected to the client.
5. The CTP test base plate according to claim 1, characterized in that: The interface component also includes a first connection port, and the first connection port is arranged on the main control chip.
6. The CTP test base plate according to claim 5, characterized in that: The interface component also includes a second connection port, and the second connection port is arranged on the main control chip.
7. The CTP test base plate according to claim 6, characterized in that: It also includes a TP interface, and the TP interface is electrically connected to the first connection port and the second connection port respectively.
8. The CTP test base plate according to claim 7, characterized in that: It also includes a connector, the TP interface is arranged on the connector, and the connector is arranged on the PCB board.
9. The CTP test base plate according to claim 1, characterized in that: The interface component also includes a power interface, and the power interface is arranged on the main control chip.
10. The CTP test base plate according to claim 9, characterized in that: It also includes a power module, which is electrically connected to the power interface.